10 | 5 | 8 7 6 5 | 4 3 2 1 42,83 0.10 __= | = D115 +0.05 rc] { 41.55 0.30 40.05 ?* - ne 1,95 10.08 } | iF lliibll, o o se, St 7 pdf i Tl | J) Ua ; Dili i oo LH Ja | I 2.25 0.08 NS = \I 8.4 __ 4.25 20; i ] _-| 015 be 5.4 +0.08 nee [ 4,25 +045 | 0:35 +005 SECTION C-C 4.23 +0.05 ew, 4.754015 pa _ TRON SECTION A-A 7.60 MIN. |}+ 10.41+008 ~}> | | 16.9 761 be 15,69 (2X) =} [524] K+] | H 0.844005 0.15 10.86 el olo.75B| 0.804008 } be | 1.65 +015 = r mn! =| 2.38 [ CIA D | + 6.20 | | ecg feu _ J | : i 1 | I | } | 1 | So {| | L400 4.70 | 6.45 : : nos Loot Te MP ass oT jour r rere { 0.95 ] ~ fanaa > i r 0.45 0.10 CIA D []0.20/5] LL 2.65 40.08 LL 11.64 ous a SECTION B-B 1.79 +015 =| -~ Se s s QUALITY GENERAL TOLERANCES DIMENSION STYLE SCALE DESIGN UNITS THIRD NGLE c x See) ty LESS SPECRIED) MM ONLY st | metric [OC RGEAIGN { WW ~ Ss Ss Ss mm INCH DRAWN BY DATE TITLE =SQT8Siz W-0 Z4 PLACES |+--- +--- JENNY 2005/07/22 HIGH SPEED CONNECTOR ( - - 2.20 #0.08 39 & 3 PLACES|+--- _|[t--- __[-HECKED BY DATE 1.27MM PITCH VERTICAL Se. _|8/\/-0 [2 PLACES|+0.15_[4-- [RMA 2005/07/22 SMT SOLDER TAIL eaSe2o)y 1 PLACE [0.25 |i --- |APPROVED BY DATE AGES ANGULAR + 1 } tHE=9 R AP 2005/07/22 rfolex MOLEX INCORPORATED S S34 te MATERIAL NO. DOCUMENT NO. SHEET NO. SECTION D-D 5B. 2=5 DRAFT WHERE APPLICABLE] SEE SHEET2 | SD-47306-001 1 OF 2 <0 65 =< WITLIN DIMENSIONS [R23] THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX D ig VA SIINCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION ib _frame_A3_P_AM_T Rev. D 2004/06/28 9 8 | 7 | 6 5 | 4 | 3 | 2 | 'tb_frame_A3_P_AM_T 5 8 7 Rev. D 2004/06/28 NOTES: 4. MATERIAL: HOUSING: HIGH TEMPERATURE THERMAL PLASTIC, GLASS FILLED, 7.62 UL94V-0, COLOR: BLACK TERMINAL: BRASS 0.90 0.05 [~ , O.10]A POST: BRASS [o]o.10la CIRCUIT 1 2. TERMINAL PLATING: CONTACT AREA: (a) GOLD FLASH (b) GOLD, THICKNESS=0.76 MICRON MINIMUM | | | | (C) GOLD, THICKNESS=0.38 MICRON MINIMUM pal SOLDER TAIL: TIN, THICKNESS=1.27 MICRON MINIMUM | UNDER PLATE: NICKEL, THICKNESS=1.27 MICRON MINIMUM 9 40 #010 (IN | | | | \ 230 +005 3, POST PLATING: UNDER PLATE: NICKEL, THICKNESS=1.25 MICRON MINIMUM | LT i Py 400 2005 TIN, THICKNESS=1.9 MICRON MINMUM OVER ALL Lt | | | 4. PACKAGING: PK-47306-001 \ f 5, PRODUCT SPECIFICATION REFER TO PS-67491-001 | | | | 6. RECOMMENDED SOLDERING PROCESS: IR PROCESS Lh 4352005 12x) THE MYLAR STICKED ON THE HOUSING IS JUST USED FOR PICK-UP PLACE, AL PLEASE REMOVE IT AFTER REFLOW =| [127] = a > MYLAR 12.83 +010 A 1.00 REF +] 473065025 = RECOMMENDED P.C.B LAYOUT 473065022 3.45 | CONNECTOR SLE 473065021 SEE NOTE2(a) 473065015 SEE NOTE2(c) WITH 473065012 SEE NOTE2(b) | 3.05 473065011 SEE NOTE2a) 473065005 | SEE NOTE2(c) 473065002 | SEE NOTE2(b) | 2.65 773065001 SEE NOTEDIa) REFERENCE SCHEMATICS OF MYLAR 473062025 | SEE NOTE2(c) mes DIMENSION STYLE SCALE DESIGN UNITS 473062022 | SEE NOTEZ(b) | 3.45 SSS} QUALITY} GENERAL TOLERANCES THIRD. ANGLE ao S88) |sympacs) (UNLESS SPECIFIED) MM ONLY 5:1 METRIC OARS ECTION _ 473062021 SEE _NOTEZ(a) WW w~SBs| m mmm INCH _| DRAWN BY DATE TITLE 473062015 | SEE NOTE2(c) z=S SS S)ZINF-0 [2 PLACES|F--- [4--- PENNY 2005/07/22 HIGH SPEED CONNECTOR 473062012 | SEE NOTE2(b) | 3.05 | WITHOUT y Za a 3 PLACES|4-- |to-" _FHEEKED By oATE 1.27MM PITCH VERTICAL Sc _|S|\W/7-0 [ZPcacesito7s [4--- RMA 2005/07/22 SMT SOLDER TAIL 473062011 SEE NOTE2(a) resale = [<-> JaPPROVED BY DATE Se ze/ TPLACE 120.2915 fol& MOLEX INCORPORATED 473062005 SEE NOTE2(c) nu Soe ANGULAR + 1 AP 2005/07/22) eo Ts 473062002 SEE NOTE2b) 2.65 Oo 9 34 ce MATERIAL NO. BOCUMENT NO. SHEET NO. 73062001 SEE NOTEDa) Ojofxk DRAFT MERE APE GICABLE SEE TABLE |SD-47306-001 2 OF 2 0 GU tI _ WITHIN DIMENSIONS >E! THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX MATERIAL NO} PLATING TYPE | DIMA | MYLAR D i VA 3IINCORPORATED AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION 6 5 | 4 | 3 | 2 | 1