Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2012. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. 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Should you have any question or inquiry on this matter, please contact our sales staff. 13 MULTILAYER CERAMIC CAPACITORS MULTILAYER CERAMIC CAPACITRS WAVE REFLOW PARTS NUMBER J M K 3 1 6 CERAMIC CAPACITORS Rated voltage Code P A J L E T G U H Q S Series name Code M V W B J 1 0 6 M L T End termination Code K R Rated voltageVDC 2.5 4 6.3 10 16 25 35 50 100 250 630 A Dimensions LxWmm 042 0.4x0.2 063 0.6x0.3 1.0x0.5 105 0.52x1.0 1.6x0.8 107 0.8x1.6 2.0x1.25 212 1.25x2.0 316 3.2x1.6 325 3.2x2.5 432 4.5x3.2 Note : LW reverse typeWK only Type Lmm Standard Wmm Standard 0.60.05 1.00.10 1.60.15/0.05 0.30.05 0.50.10 0.80.15/0.05 212 2.00.15/0.05 1.250.15/0.05 316 3.20.20 1.250.20 325 105 3.20.30 1.00.15/0.05 2.50.30 0.50.15/0.05 107 1.60.20/0 0.80.20/0 212 2.00.20/0 1.250.20/0 316 105 3.20.30 1.60.30 1.00.20/0 0.50.20/0 Note: P.6 Standard external dimensions Temperature characteristics code High dielectric typeExcluding Super low distortion multilayer ceramic capacitorCFCAPTM Applicable Temperature Code Ref. Temp. Capacitance change standard range JIS B 25 85 20 10 EIA X5R 55 85 25 15 B7 EIA X7R 55125 25 15 C6 EIA X6S 55105 25 22 C7 EIA X7S 55125 25 22 LD() EIA X5R 55 85 25 15 BJ JIS F 25 85 20 EIA Y5V 30 85 25 Note : .LD Low distortion high value multilayer ceramic capacitor F EIAinch 01005 0201 0402 0204 0603 0306 0805 0508 1206 1210 1812 Tmm Standard 0.30.05 0.50.10 0.80.15/0.05 0.450.05 0.850.10 1.250.15/0.05 0.850.10 1.60.20 2.50.30 0.50.15/0.05 0.450.05 0.80.20/0 0.850.10 1.250.20/0 1.60.30 0.50.20/0 = Blank space B C End termination Plated High Reliability Application DimensionLxW Series name Multilayer ceramic capacitor Multilayer ceramic capacitor for high frequency LW reverse type multilayer capacitor Dimension tolerance Code Type ALL 063 105 107 Blank space 30/80 2282 Capacitance Tolerance tolerance code 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 10 K 20 M 80/20 Z 80/20 Z = Blank space This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 4 13 Temperature compensating type Applicable Code standard JIS CH CH CJ CK UK SL Ref. Temp. C0H JIS EIA JIS EIA JIS CJ C0J CK C0J UJ EIA U2J JIS EIA JIS UK U2K S Capacitance tolerance Code B C D F J K M Z 0120ppm/ 0.25pF C 0250ppm/ 0.25pF C 750120ppm/ 0.25pF 0.5pF 5 C D J 750250ppm/ 0.5pF C +3501000ppm/ 5 J 060ppm/ 25 55125 55125 55125 55125 55125 55125 20 25 20 25 20 25 20 25 20 Series code Super low distortion multilayer ceramic capacitorCFCAPTMonly Code Series code SD Standard Nominal capacitance Code example 0R5 010 100 101 102 103 104 105 106 107 Note : RDecimal point Tolerance code B C D F J K 20 55125 EIA Capacitance tolerance 0.1pF 0.25pF 0.5pF 1pF 5 10 Capacitance change Nominal capacitance 0.5pF 1pF 10pF 100p 1,000pF 10,000pF 0.1F 1.0F 10F 100F Thickness Code C D P T K V W A D F G L N Y M Thicknessmm 0.2 0.2(Temperature compensating of 042type) 0.3 0.45 0.5 0.8 0.85(212type or more) 1.15 1.25 1.6 1.9 2.0 max 2.5 Special code Code Capacitance tolerance 0.1pF 0.25pF 0.5pF 1pF 5 10 20 80/20 CERAMIC CAPACITORS UJ Temperature range Packaging Code F T Special code Standard Packaging 178mm Taping 2mm pitch 178mm Taping 4mm pitch 178mm Taping 4mm pitch, 1000 pcs/reel 325 typeThickness code M 178mm Taping1mm pitch042type only P W Internal code Code Internal code Standard This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 5 STANDARD EXTERNAL DIMENSIONS Type( EIA ) CERAMIC CAPACITORS e LW reverse type Dimension [mm] T MK04201005 0.40.02 0.20.02 0.20.02 MK0630201 0.60.03 0.30.03 0.30.03 MK1050402 1.00.05 0.50.05 VK1050402 WK1050204 1.00.05 0.520.05 0.50.05 1.00.05 MK1070603 1.60.10 0.80.10 MR1070603 WK1070306 1.60.10 0.80.10 0.80.10 1.60.10 MK2120805 2.00.10 1.250.10 MR2120805 WK2120508 2.00.10 1.250.15 1.250.10 2.00.15 MK3161206 3.20.15 1.60.15 MR3161206 3.20.15 1.60.15 MK3251210 3.20.30 2.50.20 MR3251210 3.20.30 2.50.20 MK4321812 4.50.40 Note : . LW reverse type, *1.Thickness code 3.20.30 0.20.02 0.30.03 0.50.05 0.50.05 0.30.05 0.450.05 0.80.10 0.80.10 0.50.05 0.450.05 0.850.10 1.250.10 1.250.10 0.850.1 0.850.10 1.150.10 1.250.10 1.60.20 1.60.20 0.850.10 1.150.10 1.90.20 1.9+0.1/-0.2 2.50.20 1.90.20 2.50.20 2.50.20 *1 C D P T C P V W P K A K D G D G L D F N Y M N M M e 0.10.03 0.150.05 0.250.10 0.250.10 0.180.08 0.350.25 0.10.6 0.250.15 0.50.25 0.250.75 0.30.2 0.5+0.35/-0.25 0.250.85 0.60.3 0.30.9 0.90.6 STANDARD QUANTITY Type EIAinch Dimension 042 01005 0.2 063 0201 0.3 105 0402 0.5 0204 107 0603 0306 212 0805 0508 316 325 0.2 0.3 1206 1210 432 1812 Note : .LW Reverse typeWK 0.30 0.45 0.8 0.50 0.45 0.85 1.25 0.85 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0 max 2.5 2.5 Code C D P T C P V W P K A V K D G D D F G L D F N Y M M Standard quantitypcs Paper tape Embossed tape 40000 15000 20000 15000 10000 4000 4000 4000 4000 4000 3000 3000 2000 2000 500T1000P 500 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 6 13 PARTS NUMBER Temperature Characteristic RH : RH/R2H 0.5mm thicknessW Part number 1 CERAMIC CAPACITORS UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 UVK105 Part number 2 RH0R5BW-F RH0R6BW-F RH0R7BW-F RH0R8BW-F RH0R9BW-F RH010BW-F RH1R1BW-F RH1R2BW-F RH1R3BW-F RH1R5BW-F RH1R6BW-F RH1R8BW-F RH020BW-F RH2R2JW-F RH2R4JW-F RH2R7JW-F RH030JW-F RH3R3JW-F RH3R6JW-F RH3R9JW-F RH4R3JW-F RH4R7JW-F RH5R1JW-F Rated voltage [V] 50 Temperature characteristics RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH RH R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H R2H Capacitance [F] 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 p p p p p p p p p p p p p p p p p p p p p p p Capacitance tolerance [] Q 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 0.1pF 5 5 5 5 5 5 5 5 5 5 410 412 414 416 418 420 422 424 426 430 432 436 440 444 448 454 460 466 472 478 486 494 502 HALT Rated voltage x 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Thickness*3 [mm] 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R R R R R R R Super Low Distortion Multilayer Ceramic CapacitorsCFCAPTM ) 105TYPE Temperature Characteristic SD : Standard 0.5mm thicknessV Part number 1 Part number 2 UMK105 SD391KV-F UMK105 SD471KV-F UMK105 SD561KV-F TMK105 SD681KV-F TMK105 SD821KV-F TMK105 SD102KV-F TMK105 SD122KV-F EMK105 SD152KV-F EMK105 SD182KV-F EMK105 SD222KV-F EMK105 SD272KV-F LMK105 SD332KV-F LMK105 SD392KV-F LMK105 SD472KV-F Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] Standard Type 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 10 10 10 10 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] 10 6.3 Standard Type 10 10 0.1 0.1 Capacitance [F] Capacitance tolerance [] tan [] 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 22000 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Rated voltage [V] 50 25 16 10 p p p p p p p p p p p p p p HALT Rated voltage x 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Thickness [mm] *3 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R Temperature Characteristic SD : Standard 0.3mm thicknessP Part number 1 Part number 2 LMK105 SD152KP-F JMK105 SD272KP-F 1500 p 2700 p HALT Rated voltage x 200 200 Thickness*3 [mm] 0.30.03 0.30.03 Soldering R:Reflow W:Wave R R 107TYPE Temperature Characteristic SD : Standard 0.8mm thicknessA Part number 1 Part number 2 UMK107 SD102KA-T UMK107 SD122KA-T UMK107 SD152KA-T UMK107 SD182KA-T UMK107 SD222KA-T UMK107 SD272KA-T UMK107 SD332KA-T TMK107 SD392KA-T TMK107 SD472KA-T EMK107 SD562KA-T EMK107 SD682KA-T EMK107 SD822KA-T EMK107 SD103KA-T LMK107 SD123KA-T LMK107 SD153KA-T LMK107 SD183KA-T LMK107 SD223KA-T Rated voltage [V] Temperature characteristics 50 Standard Type 25 16 10 Standard Type p p p p p p p p p p p p p p p p p HALT Rated voltage x 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 200 Thickness*3 [mm] 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 Soldering R:Reflow W:Wave R R R R R R R R R R R R R R R R R 212TYPE Temperature Characteristic SD : Standard 1.25mm thicknessG Part number 1 GMK212 SD183KG-T GMK212 SD223KG-T GMK212 SD273KG-T LMK212 SD683KG-T LMK212 SD823KG-T LMK212 SD104KG-T Part number 2 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] Standard Type 18000 22000 27000 68000 82000 0.1 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 35 10 p p p p p HALT Rated voltage x 200 200 200 200 200 200 Thickness [mm] *3 1.250.10 1.250.10 1.250.10 1.250.10 1.250.10 1.250.10 Soldering R:Reflow W:Wave R R R R R R This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 20 13 PARTS NUMBER Temperature Characteristic SD : Standard 0.85mm thicknessD Part number 1 Part number 2 UMK212 SD392KD-T UMK212 SD472KD-T UMK212 SD562KD-T UMK212 SD682KD-T UMK212 SD822KD-T UMK212 SD103KD-T GMK212 SD123KD-T GMK212 SD153KD-T EMK212 SD333KD-T LMK212 SD473KD-T Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] Standard Type 3900 4700 5600 6800 8200 10000 12000 15000 33000 47000 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 Rated voltage [V] Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] 25 Standard Type 82000 p 0.1 10 10 0.1 0.1 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] Standard Type 33000 39000 47000 56000 68000 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] X5R 1 1020 10 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] X5R X5R 1 2.2 1020 1020 10 10 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] X5R X5R X5R 1 4.7 10 1020 1020 1020 10 10 10 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] X5R 1 1020 10 Temperature characteristics Capacitance [F] Capacitance tolerance [] tan [] 1000 1500 2200 3300 4700 6800 10000 15000 22000 33000 0.1 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 1020 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 3.5 Rated voltage [V] 50 35 16 10 p p p p p p p p p p HALT Rated voltage x 200 200 200 200 200 200 200 200 200 200 Thickness [mm] *3 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 0.850.10 Soldering R:Reflow W:Wave R R R R R R R R R R 316TYPE Temperature Characteristic SD : Standard 1.6mm thicknessL Part number 2 TMK316 SD823KL-T TMK316 SD104KL-T HALT Rated voltage x 200 200 Thickness [mm] *3 1.60.20 1.60.20 Soldering R:Reflow W:Wave R R Temperature Characteristic SD : Standard 1.15mm thicknessF Part number 1 Part number 2 GMK316 SD333KF-T GMK316 SD393KF-T TMK316 SD473KF-T TMK316 SD563KF-T TMK316 SD683KF-T Rated voltage [V] 35 25 p p p p p HALT Rated voltage x 200 200 200 200 200 Thickness*3 [mm] 1.150.10 1.150.10 1.150.10 1.150.10 1.150.10 Soldering R:Reflow W:Wave R R R R R CERAMIC CAPACITORS Part number 1 Low Distortion High Value Multilayer Ceramic CapacitorsCFLD 107TYPE Temperature Characteristic LD : X5R 0.8mm thicknessA Part number 1 Part number 2 TMK107BLD105[]A-T Rated voltage [V] 25 HALT Rated voltage x 150 Thickness*3 [mm] 0.8+0.20/-0 Soldering R:Reflow W:Wave R 212TYPE Temperature Characteristic LD : X5R 1.25mm thicknessG Part number 1 Part number 2 GMK212 LD105[]G-T GMK212BLD225[]G-T Rated voltage [V] 35 316TYPE Temperature Characteristic LD : X5R 1.6mm thicknessL Rated voltage [V] Part number 1 Part number 2 UMK316 LD105[]L-T GMK316BLD475[]L-T TMK316BLD106[]L-T 50 35 25 HALT Rated voltage x 150 150 HALT Rated voltage x 150 150 150 Thickness [mm] *3 1.250.10 1.25+0.20/-0 Thickness*3 [mm] 1.60.20 1.60.30 1.60.30 Soldering R:Reflow W:Wave R R Soldering R:Reflow W:Wave R R R 325TYPE Temperature Characteristic LD : X5R 1.9mm thicknessN Part number 1 Part number 2 UMK325 LD105[]N-T Rated voltage [V] 50 HALT Rated voltage x 200 Thickness*3 [mm] 1.90.20 Soldering R:Reflow W:Wave R Medium-High Voltage Multilayer Ceramic Capacitor 107TYPE Temperature Characteristic BJ : B/X5R 0.8mm thicknessA Part number 1 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 HMK107 BJ102[]A-T BJ152[]A-T BJ222[]A-T BJ332[]A-T BJ472[]A-T BJ682[]A-T BJ103[]A-T BJ153[]A-T BJ223[]A-T BJ333[]A-T BJ104[]A-T Part number 2 Rated voltage [V] 100 B B B B B B B B B B B X5R*1 *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R *1 X5R p p p p p p p p p p HALT Rated voltage x 200 200 200 200 200 200 200 200 200 200 200 Thickness*3 [mm] 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 0.80.10 Soldering R:Reflow W:Wave R R R R R R R R R R R This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . 13 21 (EIA) MK042(01005) MK063(0201) WK105(0204) MK105(0402) VK105(0402) MK107(0603) WK107(0306) MR107(0603) MK212(0805) WK212(0508) MR212(0805) MK316(1206) MR316(1206) MK325(1210) MR325(1210) MK432(1812) LW mm 0.2 0.3 0.3 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.45 0.85 1.25 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0max. 2.5 2.5 code C, D P,T P C P V W K V A K D G D F G L D F N Y M M 15000 10000 20000 15000 [pcs] 40000 10000 4000 4000 4000 4000 3000 3000 2000 500T, 1000P 500 Web http://www.ty-top.com/ c_mlcc_pack_j-01 8mm 2mm (EIA) 0.37 MK063(0201) WK105(0204) MK105(0402) (*1 C) MK105(0402) (*1 P) 0.67 0.65 2.00.05 1.15 T1 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. *1 C0.2mmP0.3mm LW mm 2mm (EIA) MK105 (0402) VK105 (0402) 0.65 1.15 2.00.05 0.8max. 4mm (EIA) MK107(0603) WK107(0306) MR107(0603) 1.0 1.8 MK212(0805) 165 2.4 WK212(0508 MK316(1206) 2.0 3.6 LW 1.1max. 4.00.1 1.1max. mm Web http://www.ty-top.com/ c_mlcc_pack_j-01 4mm (EIA) MK042(01005) 0.23 0.43 1.00.02 K 0.5max. T 0.25max. mm 8mm (EIA) WK107(0306) MK212(0805) MR212(0805) MK316(1206) MR316(1206) MK325(1210) MR325(1210) LW 1.0 1.8 1.65 2.4 2.0 3.6 2.8 3.6 4.00.1 K 1.3max T 0.250.1 3.4max. 0.6max. mm 12mm (EIA) MK432(1812) 3.7 4.9 8.00.1 K 4.0max. T 0.6max. mm Web http://www.ty-top.com/ c_mlcc_pack_j-01 A 1782.0 B 50min. C 13.00.2 D 21.00.8 4mm 8mm 12mm t 1.5max. 2.5max. 2.5max. W 51.0 101.5 141.5 mm E 2.00.5 R 1.0 0.10.7N mm Web http://www.ty-top.com/ c_mlcc_pack_j-01 Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and High Reliability Application Multilayer Ceramic Capacitors are noted separately. Super Low Distortion Multilayer Ceramic Capacitors CFCAPTM RELIABILITY DATA 1. Operating Temperature Range Specified Value 55 to 125 2. Storage Temperature Range Specified Value 55 to 125 3. Rated Voltage Specified Value 6.3VDC, 10VDC, 16VDC, 25VDC, 35VDC, 50VDC 4. Dielectric Withstanding Voltage Between terminals Specified Value No breakdown or damage Test Methods and Remarks Applied voltage Duration Charge/discharge current : Rated voltagex3 : 1 to 5 sec. : 50mA max. Insulation Resistance Specified Value 10000 M or 500MF, whichever is smaller Test Methods and Remarks Applied voltage Duation Charge/discharge current : Rated voltage : 605 sec. : 50mA max. 6Capacitance Tolerance Specified Value 10 Test Methods and Remarks Measuring frequency Measuring voltage Bias application : 1kHz10% : 102Vrms : None Dissipation Factor Specified Value 0.1%max Test Methods and Remarks Measuring frequency Measuring voltage Bias application : 1kHz10% : 10.2Vrms : None 8Bending Strength Specified Value Test Methods and Remarks Appearance Capacitance change Warp Speed Duration Test board Thickness :N abnormality : 5% : 1mm : 0.5mm/second :10 seconds : glass epoxy resin substrate : 1.6mm Capacitance measurement shall be conducted with the board bent. 9Adhesive Force of Terminal Electrodes Specified Value Terminal electrodes shall be no exfoliation or a sign of exfoliation. Applied force Duration : 5N : 30 5 seconds Test Methods and Remarks This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_CFcap_reli_e-01 10Solderability Specified Value Test Methods and Remarks At least 95% of terminal electrode is covered by new solder. Eutectic solder H60A or H63A 2305 Solder type Solder temperature Duration Lead-free solder Sn-3.0Ag-0.5Cu 2453 41 sec. 11Resistance to Soldering Heat Specified Value Test Methods and Remarks Apearance Capacitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : 2.5% max. : Initial value : Initial value between terminals : No abnormality Solder temp. Duraton Preheating conditions Measurement shall be conducted : 270 5 : 3 0.5 sec. : 80 to 100, 2 to 5 min. or 5 to 10 min. 150 to 200, 2 to 5 min. or 5 to 10 min. : 242hrs under the standard condition Note1 12Temperature Cycle Thermal Shock Specified Value Test Methods and Remarks Appearance Capcitance change Dissipation factor Insulation resistance Withstanding voltage : No abnormality : 2.5%max : Initial value : Initial value between terminals: No abnormality Conditions for 1 cycle Step temperature 1 Minimum operating temperature 2 Normal temperature 3 Maximum operating temperature 4 Normal temperature Number of cycles: 5 times Measurement shall be conducted : 242hrs under the standard condition Timemin. 303 min. 2 to 3 min. 303 min. 2 to 3 min. Note1 13Humidity Steady state Specified Value Appearance Capacitance change Dissipation factor Insulation resistance : : : : No abnormality 5% max 0.5% max 50MF or 1000M, whichever is smaller Test Methods and Remarks Temperature Humidity Duration Measurement shall be conducted : : : : 402 90 to 95% RH 500 24/0 hrs 24 2hrs under the standard condition Note1 14Humidity Loading Specified Value Test Methods and Remarks Appearance Capacitance change Dissipation factor Insulation resistance : : : : No abnormality 7.5% max 0.5% max 25MF or 500M, whichever is smaller According to JIS C 5102 clause 9.9. Temperature Humidity Duration Applied voltage Charge/discharge current Measurement shall be conducted : 402 : 90 to 95% RH : 500 24/0 hrs : Rated voltage : 50mA max : 24 2hrs under the standard condition Note1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_CFcap_reli_e-01 15High Temperature Loading Specified Value Test Methods and Remarks Appearance Capacitance change Dissipation factor Insulation resistance : : : : No abnormality 3% max 0.35% max 50MF or 1000M, whichever is smaller According to JIS C 5102 clause 9.10. Temperature Duration Applied voltage Charge/discharge current Measurement shall be conducted : Maximum operating temperature : 1000 48/0 hrs : Rated voltage x 2 : 50mA max : 24 2hrs under the standard condition Note1 Note1 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 202, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_CFcap_reli_e-01 High Reliability Application Multilayer Ceramic Capacitors are noted separately. Precautions on the use of Multilayer Ceramic Capacitors PRECAUTIONS 1. Circuit Design Precautions Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Operating Voltage Verification of Rated voltage 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Precautions Pattern configurations Design of Land-patterns 1. When capacitors are mounted on PCBs, the amount of solder used size of fillet can directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: 1Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. 2When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. Pattern configurations Capacitor layout on PCBs After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.. For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Pattern configurations Design of Land-patterns The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. 1Recommended land dimensions for typical chip capacitors Land patterns for PCBs Multilayer Ceramic Capacitors : Recommended land dimensions unit: mm Wave-soldering Type 107 212 316 325 L 1.6 2.0 3.2 3.2 Size W 0.8 1.25 1.6 2.5 A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Technical considerations Reflow-soldering Type 042 063 105 L 0.4 0.6 1.0 Size W 0.2 0.3 0.5 A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 NoteRecommended land size might be different according 107 212 316 1.6 2.0 3.2 0.8 1.25 1.6 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 to the allowance of the size of the product. 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 LWDC: Recommended land dimensions for reflow-soldering unit: mm Type 105 107 212 L 0.52 0.8 1.25 Size W 1.0 1.6 2.0 A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7 B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5 C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 2Examples of good and bad solder application Items Not eommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded Components near mounted components Horizontal component placement Pattern configurations Capacitor layout on PCBs 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any stresses from board warp or deflection. Items Not recommended Recommended Deflection of board possible mechanical Place the product at a right angle to the direction of the anticipated mechanical stress. 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Precautions Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2. Maintenance and inspection of mounting machines shall be conducted periodically. Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Technical considerations Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. 1The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. 2The pressure of nozzle shall be adjusted between 1 and 3 N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 Items Not recommended Recommended Single-sided mounting Double-sided mounting 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. 1Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f. The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. 2The recommended amount of adhesives is as follows; After capacitors are bonded Amount adhesive Recommended condition Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120m c Adhesives shall not contact land 4. Soldering Precautions Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; 1Flux used shall be less than or equal to 0.1 wt% in Cl equivalent of halogenated content. Flux having a strong acidity content shall not be applied. 2When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. 3When water-soluble flux is used, special care shall be taken to properly clean the boards. Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Technical considerations Selection of Flux 1-1. When too much halogenated substanceChlorine, etc. content is used to activate flux, or highly acidic flux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. Soldering Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within 100 to 130. Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 Reflow soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering Caution The ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of a capacitor. Because excessive dwell times can adversely affect solderability, soldering duration shall be kept as close to recommended times as possible. Wave soldering Recommended conditions for eutectic soldering Recommended condition for Pb-free soldering Caution Wave soldering must not be applied to capacitors designated as for reflow soldering only. Hand soldering Recommended conditions for eutectic Recommended condition for Pb-free soldering soldering 316type or less T T150 325type or more T T130 Caution Use a 50W soldering iron with a maximum tip diameter of 1.0 mm. The soldering iron shall not directly touch capacitors. 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning. e.g. to remove soldering flux or other materials from the production process. 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical properties especially insulation resistance. 2. Inappropriate cleaning conditions insufficient or excessive cleaning may adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01 6. Resin coating and mold Precautions 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. 1If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. 2Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Precautions Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : Below 30 Humidity : Below 70% RH The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour. Technical considerations If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the capacitors. RCR-2335BSafety Application Guide for fixed ceramic capacitors for use in electronic equipmentis published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) . c_mlcc_prec_e-01