GMK212SD223KG-T - Taiyo Yuden Co., Ltd.

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CERAMIC CAPACITORS

MULTILAYER CERAMIC CAPACIT�RS

■PARTS NUMBER

J M K 3 1 6 △ B J 1 0 6 M L － T △ △＝Blank space

① ② ③ ④ ⑤ ⑥ ⑦ ⑧ ⑨ ⑩ ⑪ ⑫

①Rated voltage

Code Rated voltage［VDC］

P 2.5

A 4

J 6.3

L 10

E 16

T 25

G 35

U 50

H 100

Q 250

S 630

②Series name

Code Series name

M Multilayer ceramic capacitor

V Multilayer ceramic capacitor for high frequency

W LW reverse type multilayer capacitor

③End termination

Code End termination

K Plated

R High Reliability Application

④Dimension（L×W）

Type Dimensions

（L×W）［mm］ EIA（inch）

042 0.4×0.2 01005

063 0.6×0.3 0201

105 1.0×0.5 0402

0.52×1.0 ※ 0204

107 1.6×0.8 0603

0.8×1.6 ※ 0306

212 2.0×1.25 0805

1.25×2.0 ※ 0508

316 3.2×1.6 1206

325 3.2×2.5 1210

432 4.5×3.2 1812

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code Type L［mm］ W［mm］ T［mm］

△ ALL Standard Standard Standard

063 0.6±0.05 0.3±0.05 0.3±0.05

105 1.0±0.10 0.5±0.10 0.5±0.10

107 1.6＋0.15/－0.05 0.8＋0.15/－0.05 0.8＋0.15/－0.05

212 2.0＋0.15/－0.05 1.25＋0.15/－0.05

0.45±0.05

0.85±0.10

1.25＋0.15/－0.05

316 3.2±0.20 1.25±0.20 0.85±0.10

1.6±0.20

325 3.2±0.30 2.5±0.30 2.5±0.30

105 1.0＋0.15/－0.05 0.5＋0.15/－0.05 0.5＋0.15/－0.05

107 1.6＋0.20/－0 0.8＋0.20/－0 0.45±0.05

0.8＋0.20/－0

212 2.0＋0.20/－0 1.25＋0.20/－0 0.85±0.10

1.25＋0.20/－0

316 3.2±0.30 1.6±0.30 1.6±0.30

C 105 1.0＋0.20/－0 0.5＋0.20/－0 0.5＋0.20/－0

Note: P.6 Standard external dimensions △= Blank space

⑥Temperature characteristics code

■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAPTM））

Code Applicable

standard

Temperature

range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance

tolerance

Tolerance

code

JIS B －25～＋ 85 20 ±10％ ±10％ K

±20％ M

EIA X5R －55～＋ 85 25 ±15％ ±10％ K

±20％ M

B7 EIA X7R －55～＋125 25 ±15％ ±10％ K

±20％ M

C6 EIA X6S －55～＋105 25 ±22％ ±10％ K

±20％ M

C7 EIA X7S －55～＋125 25 ±22％ ±10％ K

±20％ M

LD(※) EIA X5R －55～＋ 85 25 ±15％ ±10％ K

±20％ M

△F JIS F －25～＋ 85 20 ＋30/－80％＋80/－20％ Z

EIA Y5V －30～＋ 85 25 ＋22－82％＋80/－20％ Z

Note : ※.LD Low distortion high value multilayer ceramic capacitor △= Blank space

MULTILAYER CERAMIC CAPACITORS

REFLOWWAV E

CERAMIC CAPACITORS

■Temperature compensating type

Code Applicable

standard

Temperature

range［℃］ Ref. Temp.［℃］ Capacitance change Capacitance

tolerance

Tolerance

code

JIS CH

－55～＋125

0±60ppm/℃

±0.1pF B

±0.25pF C

±0.5pF D

EIA C0H 25

1pF F

±5％ J

±10％ K

CJ JIS CJ －55～＋125 20 0±120ppm/℃ ±0.25pF C

EIA C0J 25

CK JIS CK －55～＋125 20 0±250ppm/℃ ±0.25pF C

EIA C0J 25

JIS UJ

－55～＋125

－750±120ppm/℃

±0.25pF C

EIA U2J 25 ±0.5pF D

±5％ J

UK JIS UK －55～＋125 20 －750±250ppm/℃ ±0.5pF C

EIA U2K －55～＋125 25

SL JIS S －55～＋125 20 +350～－1000ppm/℃ ±5％ J

⑥Series code

（Super low distortion multilayer ceramic capacitor（CFCAPTM）only）

Code Series code

SD Standard

⑦Nominal capacitance

Code

（example） Nominal capacitance

0R5 0.5pF

010 1pF

100 10pF

101 100p

102 1,000pF

103 10,000pF

104 0.1μF

105 1.0μF

106 10μF

107 100μF

Note : R＝Decimal point

⑧Capacitance tolerance

Code Capacitance tolerance

B ±0.1pF

C ±0.25pF

D ±0.5pF

F ±1pF

J ±5％

K ±10％

M ±20％

Z ＋80/－20％

⑨Thickness

Code Thickness［mm］

C 0.2

D 0.2(Temperature compensating of 042type)

P 0.3

K 0.45

V 0.5

A 0.8

D 0.85(212type or more)

F 1.15

G 1.25

L 1.6

N 1.9

Y 2.0 max

M 2.5

⑩Special code

Code Special code

－ Standard

⑪Packaging

Code Packaging

F φ178mm Taping （2mm pitch）

T φ178mm Taping （4mm pitch）

P φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

W φ178mm Taping（1mm pitch）042type only

⑫Internal code

Code Internal code

△ Standard

CERAMIC CAPACITORS

■STANDARD EXTERNAL DIMENSIONS

※ LW reverse type

Type( EIA ) Dimension [mm]

ＬＷ T *1 e

□MK042（01005） 0.4±0.02 0.2±0.02 0.2±0.02 C 0.1±0.03

□MK063（0201） 0.6±0.03 0.3±0.03 0.3±0.03 P 0.15±0.05

□MK105（0402） 1.0±0.05 0.5±0.05

0.2±0.02 C

0.25±0.10 0.3±0.03 P

0.5±0.05 V

□VK105（0402） 1.0±0.05 0.5±0.05 0.5±0.05 W 0.25±0.10

□WK105（0204）※ 0.52±0.05 1.0±0.05 0.3±0.05 P 0.18±0.08

□MK107（0603） 1.6±0.10 0.8±0.10 0.45±0.05 K 0.35±0.25

0.8±0.10 A

□MR107（0603） 1.6±0.10 0.8±0.10 0.8±0.10 Ａ 0.1～0.6

□WK107（0306）※ 0.8±0.10 1.6±0.10 0.5±0.05 Ｖ 0.25±0.15

□MK212（0805） 2.0±0.10 1.25±0.10

0.45±0.05 K

0.5±0.25 0.85±0.10 D

1.25±0.10 G

□MR212（0805） 2.0±0.10 1.25±0.10 1.25±0.10 Ｇ 0.25～0.75

□WK212（0508）※ 1.25±0.15 2.0±0.15 0.85±0.1 Ｄ 0.3±0.2

□MK316（1206） 3.2±0.15 1.6±0.15

0.85±0.10 D

0.5+0.35/-0.25

1.15±0.10 Ｆ

1.25±0.10 G

1.6±0.20 L

□MR316（1206） 3.2±0.15 1.6±0.15 1.6±0.20 Ｌ 0.25～0.85

□MK325（1210） 3.2±0.30 2.5±0.20

0.85±0.10 D

0.6±0.3

1.15±0.10 F

1.9±0.20 N

1.9+0.1/-0.2 Y

2.5±0.20 M

□MR325（1210） 3.2±0.30 2.5±0.20 1.9±0.20 N 0.3～0.9

2.5±0.20 M

□MK432（1812） 4.5±0.40 3.2±0.30 2.5±0.20 M 0.9±0.6

Note : ※. LW reverse type, *1.Thickness code

■STANDARD QUANTITY

Type EIA（inch） Dimension Standard quantity［pcs］

［ｍｍ］ Code Paper tape Embossed tape

042 01005 0.2 C － 40000

063 0201 0.3 P 15000 －

105 0402

0.2 C 20000 －

0.3 P 15000 －

0.5 V

10000 －

0204 ※ 0.30 P

107 0603 0.45 K 4000 －

0.8 A

0306 ※ 0.50 V － 4000

212 0805

0.45 K 4000 －

0.85 D

1.25 G － 3000

0508 ※ 0.85 D 4000 －

316 1206

0.85 D 4000 －

1.15 F － 3000

1.25 G

1.6 L － 2000

325 1210

0.85 D

－ 2000

1.15 F

1.9 N

2.0 max Y

2.5 M － 500（T），1000（P）

432 1812 2.5 M － 500

Note : ※.LW Reverse type（□WK）

CERAMIC CAPACITORS

■PARTS NUMBER

【Temperature Characteristic RH : RH/R2H】　0.5mm thickness（W）

HALT

Rated voltage x ％

UVK105 RH0R5BW-F RH R2H 0.5 p ±0.1pF 410 200 0.5±0.05 R

UVK105 RH0R6BW-F RH R2H 0.6 p ±0.1pF 412 200 0.5±0.05 R

UVK105 RH0R7BW-F RH R2H 0.7 p ±0.1pF 414 200 0.5±0.05 R

UVK105 RH0R8BW-F RH R2H 0.8 p ±0.1pF 416 200 0.5±0.05 R

UVK105 RH0R9BW-F RH R2H 0.9 p ±0.1pF 418 200 0.5±0.05 R

UVK105 RH010BW-F RH R2H 1 p ±0.1pF 420 200 0.5±0.05 R

UVK105 RH1R1BW-F RH R2H 1.1 p ±0.1pF 422 200 0.5±0.05 R

UVK105 RH1R2BW-F RH R2H 1.2 p ±0.1pF 424 200 0.5±0.05 R

UVK105 RH1R3BW-F RH R2H 1.3 p ±0.1pF 426 200 0.5±0.05 R

UVK105 RH1R5BW-F RH R2H 1.5 p ±0.1pF 430 200 0.5±0.05 R

UVK105 RH1R6BW-F RH R2H 1.6 p ±0.1pF 432 200 0.5±0.05 R

UVK105 RH1R8BW-F RH R2H 1.8 p ±0.1pF 436 200 0.5±0.05 R

UVK105 RH020BW-F RH R2H 2 p ±0.1pF 440 200 0.5±0.05 R

UVK105 RH2R2JW-F RH R2H 2.2 p ±5％ 444 200 0.5±0.05 R

UVK105 RH2R4JW-F RH R2H 2.4 p ±5％ 448 200 0.5±0.05 R

UVK105 RH2R7JW-F RH R2H 2.7 p ±5％ 454 200 0.5±0.05 R

UVK105 RH030JW-F RH R2H 3 p ±5％ 460 200 0.5±0.05 R

UVK105 RH3R3JW-F RH R2H 3.3 p ±5％ 466 200 0.5±0.05 R

UVK105 RH3R6JW-F RH R2H 3.6 p ±5％ 472 200 0.5±0.05 R

UVK105 RH3R9JW-F RH R2H 3.9 p ±5％ 478 200 0.5±0.05 R

UVK105 RH4R3JW-F RH R2H 4.3 p ±5％ 486 200 0.5±0.05 R

UVK105 RH4R7JW-F RH R2H 4.7 p ±5％ 494 200 0.5±0.05 R

UVK105 RH5R1JW-F RH R2H 5.1 p ±5％ 502 200 0.5±0.05 R

Super Low Distortion Multilayer Ceramic Capacitors�CFCAP

)

●105TYPE

【Temperature Characteristic SD : Standard】　0.5mm thickness（V）

HALT

Rated voltage x ％

UMK105 SD391KV-F 390 p ±10 0.1 200 0.5±0.05 R

UMK105 SD471KV-F 470 p ±10 0.1 200 0.5±0.05 R

UMK105 SD561KV-F 560 p ±10 0.1 200 0.5±0.05 R

TMK105 SD681KV-F 680 p ±10 0.1 200 0.5±0.05 R

TMK105 SD821KV-F 820 p ±10 0.1 200 0.5±0.05 R

TMK105 SD102KV-F 1000 p ±10 0.1 200 0.5±0.05 R

TMK105 SD122KV-F 1200 p ±10 0.1 200 0.5±0.05 R

EMK105 SD152KV-F 1500 p ±10 0.1 200 0.5±0.05 R

EMK105 SD182KV-F 1800 p ±10 0.1 200 0.5±0.05 R

EMK105 SD222KV-F 2200 p ±10 0.1 200 0.5±0.05 R

EMK105 SD272KV-F 2700 p ±10 0.1 200 0.5±0.05 R

LMK105 SD332KV-F 3300 p ±10 0.1 200 0.5±0.05 R

LMK105 SD392KV-F 3900 p ±10 0.1 200 0.5±0.05 R

LMK105 SD472KV-F 4700 p ±10 0.1 200 0.5±0.05 R

【Temperature Characteristic SD : Standard】　0.3mm thickness（P）

HALT

Rated voltage x ％

LMK105 SD152KP-F 10 1500 p ±10 0.1 200 0.3±0.03 R

JMK105 SD272KP-F 6.3 2700 p ±10 0.1 200 0.3±0.03 R

●107TYPE

【Temperature Characteristic SD : Standard】　0.8mm thickness（A）

HALT

Rated voltage x ％

UMK107 SD102KA-T 1000 p ±10 0.1 200 0.8±0.10 R

UMK107 SD122KA-T 1200 p ±10 0.1 200 0.8±0.10 R

UMK107 SD152KA-T 1500 p ±10 0.1 200 0.8±0.10 R

UMK107 SD182KA-T 1800 p ±10 0.1 200 0.8±0.10 R

UMK107 SD222KA-T 2200 p ±10 0.1 200 0.8±0.10 R

UMK107 SD272KA-T 2700 p ±10 0.1 200 0.8±0.10 R

UMK107 SD332KA-T 3300 p ±10 0.1 200 0.8±0.10 R

TMK107 SD392KA-T 3900 p ±10 0.1 200 0.8±0.10 R

TMK107 SD472KA-T 4700 p ±10 0.1 200 0.8±0.10 R

EMK107 SD562KA-T 5600 p ±10 0.1 200 0.8±0.10 R

EMK107 SD682KA-T 6800 p ±10 0.1 200 0.8±0.10 R

EMK107 SD822KA-T 8200 p ±10 0.1 200 0.8±0.10 R

EMK107 SD103KA-T 10000 p ±10 0.1 200 0.8±0.10 R

LMK107 SD123KA-T 12000 p ±10 0.1 200 0.8±0.10 R

LMK107 SD153KA-T 15000 p ±10 0.1 200 0.8±0.10 R

LMK107 SD183KA-T 18000 p ±10 0.1 200 0.8±0.10 R

LMK107 SD223KA-T 22000 p ±10 0.1 200 0.8±0.10 R

●212TYPE

【Temperature Characteristic SD : Standard】　1.25mm thickness（G）

HALT

Rated voltage x ％

GMK212 SD183KG-T 18000 p ±10 0.1 200 1.25±0.10 R

GMK212 SD223KG-T 22000 p ±10 0.1 200 1.25±0.10 R

GMK212 SD273KG-T 27000 p ±10 0.1 200 1.25±0.10 R

LMK212 SD683KG-T 68000 p ±10 0.1 200 1.25±0.10 R

LMK212 SD823KG-T 82000 p ±10 0.1 200 1.25±0.10 R

LMK212 SD104KG-T 0.1 μ ±10 0.1 200 1.25±0.10 R

Thickness

[mm]

Part number 1 Rated voltage [V]

Part number 1

Rated voltage [V]

Part number 2

Part number 1 Part number 2

Part number 2

Soldering

R:Reflow

W:Wave

Thickness

[mm]

Thickness

[mm]

tanδ

[％]

Capacitance

tolerance [％]

tanδ

[％]

Standard Type

Part number 1 Part number 2

Capacitance

[F]

Standard Type

Rated voltage [V] Temperature

characteristics

Capacitance

[F]

Standard Type

Part number 2 Rated voltage [V]

Capacitance

tolerance [％]

tanδ

[％]

Thickness

[mm]

Capacitance

tolerance [％] Q

tanδ

[％]

Capacitance

tolerance [％]

Capacitance

[F]

Soldering

R:Reflow

W:Wave

Soldering

R:Reflow

W:Wave

Soldering

R:Reflow

W:Wave

Standard Type

Soldering

R:Reflow

W:Wave

Thickness

[mm]

Temperature

characteristics

Temperature

characteristics

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

Capacitance

[F]

Temperature

characteristics

Rated voltage [V]Part number 1

CERAMIC CAPACITORS

󳓵󲺝󲺎󲺟󲺡󲺠󲹭󲺛󲺢󲺚󲺏󲺒󲺟

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹽󲹻󲺅󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺑󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺀󲺆󲹿󲺘󲺑󲹺󲺡 󲺀󲺆󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺁󲺄󲹿󲺘󲺑󲹺󲺡 󲺁󲺄󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺂󲺃󲹿󲺘󲺑󲹺󲺡 󲺂󲺃󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺃󲺅󲹿󲺘󲺑󲹺󲺡 󲺃󲺅󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺅󲹿󲹿󲺘󲺑󲹺󲺡 󲺅󲹿󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺢󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲹽󲺀󲺘󲺑󲹺󲺡 󲹾󲹽󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲹿󲺀󲺘󲺑󲹺󲺡 󲹾󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲹾󲺂󲺀󲺘󲺑󲹺󲺡 󲹾󲺂󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺒󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺀󲺀󲺀󲺘󲺑󲹺󲺡 󲹾󲺃 󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺙󲺚󲺘󲹿󲹾󲹿󲹭󲺠󲺑󲺁󲺄󲺀󲺘󲺑󲹺󲺡 󲹾󲹽 󲺁󲺄󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹽󲹻󲺅󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󳔤󲺀󲹾󲺃󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹾󲹻󲺃󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺙󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺅󲹿󲺀󲺘󲺙󲹺󲺡 󲺅󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟

󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲹾󲹽󲺁󲺘󲺙󲹺󲺡 󲹽󲹻󲹾 󳁼 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺠󲺑󲹭󲺇󲹭󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󳙨󳙘󲹾󲹻󲹾󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺓󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺔󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺀󲺀󲺀󲺘󲺓󲹺󲺡 󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺔󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺀󲺆󲺀󲺘󲺓󲹺󲺡 󲺀󲺆󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺁󲺄󲺀󲺘󲺓󲹺󲺡 󲺁󲺄󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺂󲺃󲺀󲺘󲺓󲹺󲺡 󲺂󲺃󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺡󲺚󲺘󲺀󲹾󲺃󲹭󲺠󲺑󲺃󲺅󲺀󲺘󲺓󲹺󲺡 󲺃󲺅󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽 󲹽󲹻󲹾 󲹿󲹽󲹽 󲹾󲹻󲹾󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺙󲺼󲻄󲹭󲺑󲺶󲻀󲻁󲺼󲺿󲻁󲺶󲺼󲺻󲹭󲺕󲺶󲺴󲺵󲹭󲺣󲺮󲺹󲻂󲺲󲹭󲺚󲻂󲺹󲻁󲺶󲺹󲺮󲻆󲺲󲺿󲹭󲺐󲺲󲺿󲺮󲺺󲺶󲺰󲹭󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺼󲺿󲻀󲹵󲺐󲺓󲺬󲺙󲺑󲹶

󳔤󲹾󲹽󲺄󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹽󲹻󲺅󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺎󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺡󲺚󲺘󲹾󲹽󲺄󲺏󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺎󲹺󲺡 󲹿󲺂 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹽󲹻󲺅󲹸󲹽󲹻󲹿󲹽󲹼󲹺󲹽 󲺟

󳔤󲹿󲹾󲹿󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲹿󲺂󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺔󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺔󲺚󲺘󲹿󲹾󲹿󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺔󲹺󲺡 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲹿󲺂󲻝󲹽󲹻󲹾󲹽 󲺟

󲺔󲺚󲺘󲹿󲹾󲹿󲺏󲺙󲺑󲹿󲹿󲺂󲺨󲺪󲺔󲹺󲺡 󲺥󲺂󲺟 󲹿󲹻󲹿 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲹿󲺂󲹸󲹽󲹻󲹿󲹽󲹼󲹺󲹽 󲺟

󳔤󲺀󲹾󲺃󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲺃󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺙󳞦

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪 󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺢󲺚󲺘󲺀󲹾󲺃󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺙󲹺󲺡 󲺂󲹽 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲹿󲹽 󲺟

󲺔󲺚󲺘󲺀󲹾󲺃󲺏󲺙󲺑󲺁󲺄󲺂󲺨󲺪󲺙󲹺󲺡 󲺀󲺂 󲺥󲺂󲺟 󲺁󲹻󲺄 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲺀󲹽 󲺟

󲺡󲺚󲺘󲺀󲹾󲺃󲺏󲺙󲺑󲹾󲹽󲺃󲺨󲺪󲺙󲹺󲺡 󲹿󲺂 󲺥󲺂󲺟 󲹾󲹽 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹾󲺂󲹽 󲹾󲹻󲺃󲻝󲹽󲹻󲺀󲹽 󲺟

󳔤󲺀󲹿󲺂󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺙󲺑󲹭󲺇󲹭󲺥󲺂󲺟󳙨󳙘󲹾󲹻󲺆󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺛󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺢󲺚󲺘󲺀󲹿󲺂󲹭󲺙󲺑󲹾󲹽󲺂󲺨󲺪󲺛󲹺󲺡 󲺂󲹽 󲺥󲺂󲺟 󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲹾󲹽 󲹿󲹽󲹽 󲹾󲹻󲺆󲻝󲹽󲹻󲹿󲹽 󲺟

󲺚󲺲󲺱󲺶󲻂󲺺󲹺󲺕󲺶󲺴󲺵󲹭󲺣󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺚󲻂󲺹󲻁󲺶󲺹󲺮󲻆󲺲󲺿󲹭󲺐󲺲󲺿󲺮󲺺󲺶󲺰󲹭󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺼󲺿

󳔤󲹾󲹽󲺄󲺡󲺦󲺝󲺒

󳙧󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲󲹭󲺐󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲹭󲺏󲺗󲹭󲺇󲹭󲺏󲹼󲺥󲺂󲺟󳙨󳙘󲹽󲹻󲺅󲺺󲺺󲹭󲻁󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀󳞥󲺎󳞦

󲺕󲺎󲺙󲺡

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲻅󲹭󳞣

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹾󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲺂󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹾󲺂󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹿󲹿󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹿󲹿󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺀󲺀󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲺀󲺀󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺁󲺄󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲺁󲺄󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺃󲺅󲹿󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲺃󲺅󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹾󲹽󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲺂󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹾󲺂󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹿󲹿󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹿󲹿󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲺀󲺀󲺀󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲺀󲺀󲹽󲹽󲹽 󲺽 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺕󲺚󲺘󲹾󲹽󲺄󲹭󲺏󲺗󲹾󲹽󲺁󲺨󲺪󲺎󲹺󲺡 󲺏󲺥󲺂󲺟

󲹷󲹾

󲹽󲹻󲹾 󳁼 󲻝󲹾󲹽󳞩󲻝󲹿󲹽 󲺀󲹻󲺂 󲹿󲹽󲹽 󲹽󲹻󲺅󲻝󲹽󲹻󲹾󲹽 󲺟

󲺂󲹽

󲺀󲺂

󲹿󲺂

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿

󲺀󲺂

󲹾󲹽󲹽

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲹿󲺂

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺠󲻁󲺮󲺻󲺱󲺮󲺿󲺱󲹭󲺡󲻆󲺽󲺲

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹾 󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿 󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺡󲺵󲺶󲺰󲺸󲺻󲺲󲻀󲻀

󲹷󲺀

󲺨󲺺󲺺󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺟󲺮󲻁󲺲󲺱󲹭󲻃󲺼󲺹󲻁󲺮󲺴󲺲󲹭󲺨󲺣󲺪

󲺡󲺲󲺺󲺽󲺲󲺿󲺮󲻁󲻂󲺿󲺲

󲺰󲺵󲺮󲺿󲺮󲺰󲻁󲺲󲺿󲺶󲻀󲻁󲺶󲺰󲻀

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺠󲺼󲺹󲺱󲺲󲺿󲺶󲺻󲺴

󲺟󲺇󲺟󲺲󲺳󲺹󲺼󲻄

󲺤󲺇󲺤󲺮󲻃󲺲

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿

󲻁󲺮󲺻󳁴

󲹭󲺨󳞣󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲹭󲺨󲺓󲺪

󲺐󲺮󲺽󲺮󲺰󲺶󲻁󲺮󲺻󲺰󲺲

󲻁󲺼󲺹󲺲󲺿󲺮󲺻󲺰󲺲󲹭󲺨󳞣󲺪

󲺝󲺮󲺿󲻁󲹭󲺻󲻂󲺺󲺯󲺲󲺿󲹭󲹿

▶ 当カタログには、紙面の都合上代表的な仕様しか記載しておりませんので、当社製品をご検討頂く際には、納入仕様書にて詳細な仕様の確認をお願いします。

また、各商品の詳細情報（特性グラフ、信頼性情報、使用上の注意事項など）につきましては、当社 Web サイト（http://www.ty-top.com/）に掲載しております。

c_mlcc_pack_j-01

積層セラミックコンデンサ

■包装

①最小受注単位数

●テーピング梱包

タイプ(EIA) 製品厚み標準数量 [pcs]

mm code 紙テープエンボステープ

□MK042(01005) 0.2 C, D － 40000

□MK063(0201) 0.3 P,T 15000

－

□WK105(0204) ※ 0.3 P 10000

□MK105(0402)

0.2 C 20000

0.3 P 15000

0.5 V 10000

□VK105(0402) 0.5 W

□MK107(0603)

□WK107(0306) ※

□MR107(0603)

0.45 K 4000

0.5 V － 4000

0.8 A

4000 －

□MK212(0805)

□WK212(0508) ※

□MR212(0805)

0.45 K

0.85 D

1.25 G － 3000

□MK316(1206)

□MR316(1206)

0.85 D 4000 －

1.15 F

－ 3000

1.25 G

1.6 L

2000

□MK325(1210)

□MR325(1210)

0.85 D

－

1.15 F

1.9 N

2.0max. Y

2.5 M 500（T）, 1000（P）

□MK432(1812) 2.5 M － 500

注： ※ LW 逆転タイプ

②テーピング材質

※プレスポケットタイプは、ボトムテープ無し。

●紙テープ

●エンボステープ

チップ詰め状態

c_mlcc_pack_j-01

③代表テーピング寸法

●紙テープ（8mm 幅）

●プレステープ（2mm ピッチ）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦＴ T1

□MK063(0201) 0.37 0.67

2.0±0.05

0.45max. 0.42max.

□WK105(0204) ※

0.65 1.15

□MK105(0402) (*1 C) 0.4max. 0.3max.

□MK105(0402) (*1 P) 0.45max. 0.42max.

注：*1 製品厚み、C：0.2mm、P：0.3mm。※ LW 逆転タイプ。単位：mm

●パンチテープ（2mm ピッチ）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦＴ

□MK105 (0402)

□VK105 (0402) 0.65 1.15 2.0±0.05 0.8max.

単位：ｍｍ

●パンチテープ（4mm ピッチ）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦＴ

□MK107(0603)

□WK107(0306) ※

□MR107(0603)

1.0 1.8

4.0±0.1

1.1max.

□MK212(0805)

□WK212(0508 ※ 165 2.4 1.1max.

□MK316(1206) 2.0 3.6

注：製品寸法によってテーピング寸法が異なる場合があります。※ LW 逆転タイプ。単位：mm

c_mlcc_pack_j-01

●エンボステープ（4mm 幅）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦ K T

□MK042(01005) 0.23 0.43 1.0±0.02 0.5max. 0.25max.

単位：mm

●エンボステープ（8mm 幅）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦ K T

□WK107(0306) ※ 1.0 1.8

4.0±0.1

1.3max 0.25±0.1

□MK212(0805)

□MR212(0805) 1.65 2.4

3.4max. 0.6max.

□MK316(1206)

□MR316(1206)

2.0 3.6

□MK325(1210)

□MR325(1210)

2.8 3.6

注：※ LW 逆転タイプ。単位：mm

●エンボステープ（12mm 幅）

タイプ(EIA) チップ挿入部挿入ピッチテープ厚み

ＡＢＦ K T

□MK432(1812) 3.7 4.9 8.0±0.1 4.0max. 0.6max.

単位：mm

④トレイル部／リーダー部

c_mlcc_pack_j-01

⑤リール寸法

A B C D E R

φ178±2.0 φ50min. φ13.0±0.2 φ21.0±0.8 2.0±0.5 1.0

t W

4mm 幅テープ 1.5max. 5±1.0

8mm 幅テープ 2.5max. 10±1.5

12mm 幅テープ 2.5max. 14±1.5 単位：mm

⑥トップテープ強度

トップテープのはがし力は下図矢印方向にて 0.1～0.7N となります。

⑦バルクカセット

個別仕様の取り交わしが必要になります。

必ず、正規販売チャンネルにお問合せください。

単位：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_CFcap_reli_e-01

Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Super Low Distortion Multilayer Ceramic Capacitors （CFCAPTM）

■RELIABILITY DATA

1. Operating Temperature Range

Specified Value －55 to ＋125℃

2. Storage Temperature Range

Specified Value －55 to ＋125℃

3. Rated Voltage

Specified Value 6.3VDC, 10VDC, 16VDC, 25VDC, 35VDC, 50VDC

4. Dielectric Withstanding Voltage （Between terminals）

Specified Value No breakdown or damage

Test Methods and

Remarks

Applied voltage : Rated voltage×3

Duration : 1 to 5 sec.

Charge/discharge current : 50mA max.

５．Insulation Resistance

Specified Value 10000 MΩ or 500MΩμF, whichever is smaller

Test Methods and

Remarks

Applied voltage : Rated voltage

Duation : 60±5 sec.

Charge/discharge current : 50mA max.

6．Capacitance （Tolerance）

Specified Value ±10％

Test Methods and

Remarks

Measuring frequency : 1kHz±10%

Measuring voltage : 102Vrms

Bias application : None

７．Dissipation Factor

Specified Value 0.1%max

Test Methods and

Remarks

Measuring frequency : 1kHz±10%

Measuring voltage : 1±0.2Vrms

Bias application : None

8．Bending Strength

Specified Value Appearance :N abnormality

Capacitance change : ±5%

Test Methods and

Remarks

Warp : 1mm

Speed : 0.5mm/second

Duration :10 seconds

Test board : glass epoxy resin substrate

Thickness : 1.6mm

Capacitance measurement shall be conducted with the board bent.

9．Adhesive Force of Terminal Electrodes

Specified Value Terminal electrodes shall be no exfoliation or a sign of exfoliation.

Test Methods and

Remarks

Applied force : 5N

Duration : 30 ±5 seconds

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_CFcap_reli_e-01

10．Solderability

Specified Value At least 95% of terminal electrode is covered by new solder.

Test Methods and

Remarks

Eutectic solder Lead-free solder

Solder type H60A or H63A Sn-3.0Ag-0.5Cu

Solder temperature 230±5℃ 245±3℃

Duration 4±1 sec.

11．Resistance to Soldering Heat

Specified Value

Apearance : No abnormality

Capacitance change : ±2.5% max.

Dissipation factor : Initial value

Insulation resistance : Initial value

Withstanding voltage （between terminals） : No abnormality

Test Methods and

Remarks

Solder temp. : 270 ±5℃

Duraton : 3 ±0.5 sec.

Preheating conditions : 80 to 100℃, 2 to 5 min. or 5 to 10 min.

150 to 200℃, 2 to 5 min. or 5 to 10 min.

Measurement shall be conducted : 24±2hrs under the standard condition Note1

12．Temperature Cycle （Thermal Shock）

Specified Value

Appearance : No abnormality

Capcitance change : ±2.5%max

Dissipation factor : Initial value

Insulation resistance : Initial value

Withstanding voltage （between terminals）: No abnormality

Test Methods and

Remarks

Conditions for 1 cycle

Step temperature（℃） Time（min.）

1 Minimum operating temperature 30±3 min.

2 Normal temperature 2 to 3 min.

3 Maximum operating temperature 30±3 min.

4 Normal temperature 2 to 3 min.

Number of cycles: 5 times

Measurement shall be conducted : 24±2hrs under the standard condition Note1

13．Humidity （Steady state）

Specified Value

Appearance : No abnormality

Capacitance change : ±5% max

Dissipation factor : 0.5% max

Insulation resistance : 50MΩμF or 1000MΩ, whichever is smaller

Test Methods and

Remarks

Temperature : 40±2℃

Humidity : 90 to 95% RH

Duration : 500 ＋24/－0 hrs

Measurement shall be conducted : 24 ±2hrs under the standard condition Note1

14．Humidity Loading

Specified Value

Appearance : No abnormality

Capacitance change : ±7.5% max

Dissipation factor : 0.5% max

Insulation resistance : 25MΩμF or 500MΩ, whichever is smaller

Test Methods and

Remarks

According to JIS C 5102 clause 9.9.

Temperature : 40±2℃

Humidity : 90 to 95% RH

Duration : 500 ＋24/－0 hrs

Applied voltage : Rated voltage

Charge/discharge current : 50mA max

Measurement shall be conducted : 24 ±2hrs under the standard condition Note1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_CFcap_reli_e-01

15．High Temperature Loading

Specified Value

Appearance : No abnormality

Capacitance change : ±3% max

Dissipation factor : 0.35% max

Insulation resistance : 50MΩμF or 1000MΩ, whichever is smaller

Test Methods and

Remarks

According to JIS C 5102 clause 9.10.

Temperature : Maximum operating temperature

Duration : 1000 ＋48/－0 hrs

Applied voltage : Rated voltage x 2

Charge/discharge current : 50mA max

Measurement shall be conducted : 24 ±2hrs under the standard condition Note1

Note1 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa

When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following

condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa

Unless otherwise specified, all the tests are conducted under the "standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

Precautions

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

Precautions

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

Technical

considerations

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

（unit: mm）

Wave-soldering

Type 107 212 316 325

Size L 1.6 2.0 3.2 3.2

W 0.8 1.25 1.6 2.5

A 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5

B 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7

C 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5

Land patterns for PCBs

Reflow-soldering

Type 042 063 105 107 212 316 325 432

Size L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 4.5

W 0.2 0.3 0.5 0.8 1.25 1.6 2.5 3.2

A 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5

B 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8

C 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5

Note：Recommended land size might be different according to the allowance of the size of the product.

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type 105 107 212

Size L 0.52 0.8 1.25

W 1.0 1.6 2.0

A 0.18 to 0.22 0.25 to 0.3 0.5 to 0.7

B 0.2 to 0.25 0.3 to 0.4 0.4 to 0.5

C 0.9 to 1.1 1.5 to 1.7 1.9 to 2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

（2）Examples of good and bad solder application

Items Not eommended Recommended

Mixed mounting of SMD and

leaded components

Component placement close to

the chassis

Hand-soldering of leaded

Components near mounted

components

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical

stresses from board warp or deflection.

Items Not recommended Recommended

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

Technical

considerations

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

Items Not recommended Recommended

Single-sided mounting

Double-sided mounting

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Figure 212/316 case sizes as examples

a 0.3mm min

b 100 to 120μm

c Adhesives shall not contact land

Amount adhesive

After capacitors are bonded

4. Soldering

Precautions

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

Technical

considerations

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

100 to 130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

［Reflow soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

Caution

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible.

［Wave soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only.

［Hand soldering］

【Recommended conditions for eutectic

soldering】

【Recommended condition for Pb-free

soldering】

⊿T

316type or less ⊿T≦150℃

⊿T

325type or more ⊿T≦130℃

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

Technical

considerations

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of the capacitors.

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the

cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall

be carefully checked;

Ultrasonic output : 20 W/ℓ or less

Ultrasonic frequency : 40 kHz or less

Ultrasonic washing period : 5 min. or less

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-01

6. Resin coating and mold

Precautions

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or

while left under normal storage conditions resulting in the deterioration of the capacitor's performance.

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

7. Handling

Precautions

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or components.

8. Storage conditions

Precautions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity : Below 70% RH

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so care shall be

taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at

150℃ for 1hour.

Technical

considerations

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.