TECHNICAL DATA
491
Analog Multiplexer Demultiplexer
High-Perform ance Silicon-Gate C MOS
The IN74HC4051 utilize silicon-gate CMOS technology to achieve
fast propagation delays, low ON resistances, and low OFF leakage
currents. These analog multiplexers/demultiplexers control analog
voltages that may vary across the complete power supply range (from
VCC to VEE).
The Channel-Select inputs determine which one of the Analog
Inputs/Outputs is to be connected, by means of an analog switch, to the
Common Output/Input.When the Enable pin is high, all analog
switches are turned off.
The Channel-Select and Enable inputs are compatible with
standard CMOS outputs; with pullup resistors, they are compatible
with LS/ALSTTL outputs.
• Fast Switching and Pro pagation Speeds
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Analog Power Supply Range (VCC-VEE)=2.0 to 12.0 V
• Digital (Control) Power Supply Range (VCC-GND)=2.0 to 6.0 V
• Low Noise
IN74HC4051
ORDERING INFORMATION
IN74HC4051N Plastic
IN74HC4051DW SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
FUNCTION TABLE
Control Inputs ON
Enable Select Channels
CBA
LLLL X0
LLLH X1
LLHL X2
LLHH X3
LHLL X4
LHLH X5
LHHL X6
LHHH X7
HXXXNone
X = don’t care
LOGIC DIAGRAM
Single-Pole, 8 - Position Plus Co mmon Off
PIN 16 =VCC
PIN 7 = VEE
PIN 8 = GND
IN74HC4051
492
MAXIMUM RATINGS*
Symbol Parameter Value Unit
VCC Positive DC Supply Voltage (Referenced to GND)
(Referenced to VEE)-0.5 to +7.0
-0.5 to +14.0 V
VEE Negative DC Supply Voltage (Referenced to GND) -7.0 to +0.5 V
VIS Analog Input Voltage VEE - 0.5 to VCC+0.5 V
VIN Digital Input Voltage (Referenced to GND) -1.5 to VCC +1.5 V
I DC Input Current Into or Out of Any Pin ±25 mA
PDPower Dissipation in Still Air, Plastic DIP+
SOIC Package+ 750
500 mW
Tstg Storage Temperature -65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package) 260 °C
*Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive Supply Voltage (Referenced to GND)
(Referenced to VEE)2.0
2.0 6.0
12.0 V
VEE Negative DC Supply Voltage (Referenced to GND) - 6.0 GND V
VIS Analog Input Voltage VEE VCC V
VIN Digital Input Voltage (Referenced to GND) GND VCC V
VIO*Static or Dynamic Voltage Across Switch - 1.2 V
TAOperating Temperature, All Package Types -55 +125 °C
tr, tfInput Rise and Fall Time (Channel Select
or Enable Inputs) VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
0
0
0
1000
500
400
ns
* For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn;
i. e., the current out of the switch may contain both VCC and switch input components. The reliability of the
device will be unaffected unless the Maximum Ratings are exceeded.
Thi s device contains p rote ction c ircuitr y to guard a gainst damage due to hi gh static voltage s or electr ic
fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated
voltages to this high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range
indicated in the Recommended Operating Conditions..
Unused digital input pins must always be tied to an appropriate lo gic voltage level (e.g., either GND or
VCC). Unused Analog I/O pins may be left open or terminated.
IN74HC4051
493
DC ELECTRICAL CHARACTERISTICS Digital Section (Voltages Referenced to GND)
VEE=GND, Except Where Noted
VCC Guaranteed Limit
Symbol Parameter Test Conditions V 25 °C to
-55°C≤85
°C≤125
°CUnit
VIH Minimum High-Level
Input Voltage,
Channel-Select or
Enable Inputs
RON = Per Spec 2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL Maxi mum Low -Level
Input Voltage,
Channel-Select or
Enable Inputs
RON = Per Spec 2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
IIN Maximum Input
Leakage Current,
Channel-Select or
Enable Inputs
VIN=VCC or GND,
VEE=-6.0 V 6.0 ±0.1 ±1.0 ±1.0 µA
ICC Maximum Q uiescent
Supply Current (per
Package)
Channel Select = VCC or GND
Enable = VCC or GND
VIS = VCC or GND
VIO= 0 V VEE = GND
VEE = - 6.0 6.0
6.0 2
820
80 40
160
µA
DC ELECTRICAL CHARACTERISTICS Analog Section
VCC VEE Guaranteed Limit
Symbol Parameter Test Conditions V V 25 °C to
-55°C≤85
°C≤125
°CUnit
RON Maximum “ON ” Re sistance VIN=VIL or VIH
VIS = VCC or VEE
IS ≤ 2.0 mA(Figure 1)
4.5
4.5
6.0
0.0
-4.5
-6.0
190
120
100
240
150
125
280
170
140
Ω
VIN=VIL or VIH
VIS = VCC or VEE
(Endpoints)
IS ≤ 2.0 mA(Figure 1)
4.5
4.5
6.0
0.0
-4.5
-6.0
150
100
80
190
125
100
230
140
115
∆RON Maximum Dif fer enc e in
“ON” Resistance Between
Any Two Channels in the
Same Package
VIN=VIL or VIH
VIS = 1/2 (VCC- VEE)
IS ≤ 2.0 mA
4.5
4.5
6.0
0.0
-4.5
-6.0
30
12
10
35
15
12
40
18
14
Ω
IOFF Maximum Off- Channel
Leakage Current, Any One
Channel
VIN=VIL or VIH
VIO= VCC- VEE
Switch Off (Figure 2)
6.0 -6.0 0.1 0.5 1.0 µA
Maximum Off- Channel
Leakage Current, Common
Channel
VIN=VIL or VIH
VIO = VCC- VEE
Switch Off (Figure 3)
6.0 -6.0 0.2 2.0 4.0
ION Maximum On- Channel
Leakage Current, Channel to
Channel
VIN=VIL or VIH
Switch to Switch =
VCC- VEE (Fi gure 4)
6.0 -6.0 0.2 2.0 4.0 µA
IN74HC4051
494
AC ELECTRICAL CHARACTERISTICS(CL=50pF,Input tr=tf=6.0 ns)
VCC Guaranteed Limit
Symbol Parameter V 25 °C
to
-55°C
≤85°C≤125°CUnit
tPLH, tPHL Maximum Propagation Delay, Channel-Select to
Analog Output (Figures 8 and 9) 2.0
4.5
6.0
370
74
63
465
93
79
550
110
94
ns
tPLH, tPHL Maximum Propagation Delay , Analog Input to
Analog Output (Figures 10 and 11) 2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
tPLZ, tPHZ Maximum Propagation Delay , Enable to Analog
Output (Figures 12 and 13) 2.0
4.5
6.0
290
58
49
364
73
62
430
86
73
ns
tPZL, tPZH Maximum Propagation Delay , Enable to Analog
Output (Figures 12 and 13) 2.0
4.5
6.0
345
69
59
435
87
74
515
103
87
ns
CIN Maximum Input Capacitance, Channel-Select or
Enable Inputs -101010pF
CI/O Maximum Capacitanc e
Analog I/O All Switches Off -353535pF
Common O/I - 130 130 130
Feedthrough - 1.0 1.0 1.0
Power Dissipation Capacitance (Per Package)
(Figure 14) Typical @25°C,VCC=5.0 V, VEE=0
V
CPD Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
45 pF
IN74HC4051
495
ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0.0 V)
VCC VEE Limit*
Symbol Parameter Test Conditions V V 25 °CUnit
B W Maximum O n-
Channel
Bandwidth or
Minimum
Frequency
Response
(Figure 5)
fin=1 MHz Sine W ave
Adjus t fin Voltage to Obtain 0 dBm at VOS
Increase fin Frequence Until dB Meter
Reads -3 dB
RL =50 Ω, CL=10 pF
2.25
4.50
6.00
-2.25
-4.50
-6.00
80
80
80
MHz
- Off-Channel
Feedthrough
Isolation
(Figure 6)
fin= Sine Wave
Adjus t fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL =600 Ω, CL=50 pF 2.25
4.50
6.00
-2.25
-4.50
-6.00
-50
-50
-50
dB
fin = 1.0 MHz, RL =50 Ω, CL=10 pF 2.25
4.50
6.00
-2.25
-4.50
-6.00
-40
-40
-40
- Feedthrough
Noise, Channel
Select Input to
Common O/I
(Figure 7)
VIN≤ 1 Mhz Squa re Wave (tr = tf = 6 ns)
Adjus t RL at Setup so that IS= 0 A Enable =
GND
RL =600 Ω, CL=50 pF 2.25
4.50
6.00
-2.25
-4.50
-6.00
25
105
135
mVPP
RL =10 Ω, CL=10 pF 2.25
4.50
6.00
-2.25
-4.50
-6.00
35
145
190
THD Total Harmonic
Disto rtio n (Figur e
15)
fin= 1 kHz, RL =10 kΩ, CL=50 pF
THD = THDMeasured - THDSource
VIS =4.0 VPP sine wave
VIS =8.0 VPP sine wave
VIS =11.0 VPP sine wave
2.25
4.50
6.00
-2.25
-4.50
-6.00
0.10
0.08
0.05
%
* Limits not tested. Determined by design and verified by qualification.
Figure 1. On Resistance Test Set-Up
IN74HC4051
496
Figure 2. Maximum Off Channel Leakage
Current, Any One Channel, Test Set-UP
Figure 3. Maximum Off Channel Leakage Current,
Common Channel, Test Set-UP
Figure 4. Maximum On Channel Leakage
Current, Channel to Channel, Test Set-UP
* Includes all probe and jig capacitance.
Figure 5. Maximum On Channel Bandwidth,
Test Set-UP
* Includes all probe and jig capacitance.
Figure 6. Off Channel Feedthrough Isolation,
Test Set-UP
* Includes all probe and jig capacitance.
Figure 7.Feedthrough Noise, Channel Select to Common
Out, Test Set-UP
IN74HC4051
497
Figure 8. Switching Weveforms
* Includes all probe and jig capacitance.
Figure 9. Test Set-UP, Channel Select to Analog Out
Figure 10. Switching Weveforms
* Includes all probe and jig capacitance.
Figure 11. Test Set-UP, Analog In to Analog Out
Figure 12. Switching Weveforms Figure 13. Test Set-UP, Enable to Analog Out
IN74HC4051
498
Figure 14. Power Dissipation Capacitance,
Test Set-Up * Includes all probe and jig capacitance
Figure 15. Total Harmonic Distortion, Test Set-UP
EXPANDED LOGIC DIAGRAM
