FPF2174 IntelliMAXTM Advanced Load Management Products Features tm General Description 1.8 to 5.5V Input Voltage Range The FPF2174 is a load switch which combines the functionality of the IntelliMAXTM series load switch with a very low forward voltage drop Schottky barrier rectifier and a zener clamp at the output. The integrated solution provides full protection to systems and loads which may encounter large current conditions in a very compact MLP 3x3 package. This device contain a 0.125 current-limited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. The Schottky diode acts as a barrier so that no reverse current can flow when the MOSFET is off and the output voltage is higher than the input voltage. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous over-current condition causes excessive heating. Controlled Turn-On 200mA Current Limit Option Undervoltage Lockout Thermal Shutdown <1 A Shutdown Current Fast Current limit Response Time 3 s to Moderate Over Currents 20ns to Hard Shorts Integrated very low VF Schottky Diode for Reverse Current Blocking Integrated Zener Diode for Output Clamp RoHS Compliant When the switch current reaches the current limit, the part operates in a constant-current mode to prohibit excessive currents from causing damage. If the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The switch will remain off until the ON pin is cycled. The minimum current limit is 200mA. Applications PDAs Cell Phones GPS Devices MP3 Players These parts are available in a space-saving 6L MLP 3x3 package. Digital Cameras Peripheral Ports Hot Swap Supplies Typical Application Circuit TO LOAD VOUT VIN FPF2174 OFF ON ON FLAGB GND Ordering Information Part Current Limit Min [mA] Current Limit Blanking Time Typ [ms] Auto-Restart Time [ms] ON Pin Activity Top Mark FPF2174 200 10 NA Active HI 2174 (c)2008 Fairchild Semiconductor Corporation FPF2174 Rev. F 1 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products February 2009 VOUT VIN UVLO CONTROL LOGIC ON CURRENT LIMIT THERMAL SHUTDOWN FLAGB GND Pin Configuration 1 2 8 6 3 7 5 4 3x3 MLP BOTTOM VIEW Pin Description Pin Name 1 VIN Supply Input: Input to the power switch and the supply voltage for the IC 2 NC No Connect 3, 7 VOUT 4 GND 5 FLAGB 6 ON 8 PAD1 FPF2174 Rev. F Function Switch Output: Output of the power switch Ground Fault Output: Active LO, open drain output which indicates an over current supply, under voltage or over temperature state. ON Control Input IC substrate. Can be connected to GND. Do not connect to other pins. 2 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Functional Block Diagram Parameter Min Max Unit VIN, ON, FLAGB to GND -0.3 6 V VOUT to GND -0.3 20 V Power Dissipation @ TA = 25C (note 1) - 1.4 W Operating Temperature Range -40 85 C Storage Temperature -65 150 C - 70 C/W Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM 4000 - V MM 400 - V Recommended Operating Range Parameter Min Max Unit VIN 1.8 5.5 V Ambient Operating Temperature, TA -40 85 C Electrical Characteristics VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C. Parameter Symbol Conditions Min Typ Max Units V Basic Operation Operating Voltage 1.8 - 5.5 IOUT = 0mA VIN = 1.8 to 3.3V - 95 - VON ACTIVE VIN = 3.3 to 5.5V - 110 200 VIN Quiescent Current IQ Shutdown Current ISHDN VON = 0V, IOUT = 0mA - - 1 A Latch-off Current ILATCHOFF VON =VIN, after an overcurrent fault - 50 - A IR VOUT = 12V, VIN = VON = 0V, TA = 25C - - 10 A IOUT = 1mA - 15 - V TA = 25C, IOUT = 150mA - 0.3 0.4 0.23 - - 0.36 - Reverse Block Leakage Current Reverse Breakdown Voltage Dropout Voltage VDROP TA = 85C, IOUT = 150mA TA = -40C, IOUT = 150mA ON Input Logic High Voltage (ON) ON Input Logic Low Voltage VIH VIL ON Input Leakage Off Switch Leakage FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current FPF2174 Rev. F ISWOFF A V VIN = 1.8V 0.75 - - VIN = 5.5V 1.3 - - VIN = 1.8V - - 0.5 VIN = 5.5V - - 1.0 VON = VIN or GND - - 1 A 1 A 10 100 nA VON = 0V, VOUT = 0V @ VIN = 5.5V, TA = 85C VON = 0V, VOUT = 0V @ VIN = 3.3V, TA = 25C VIN = 5V, ISINK = 10mA - - 0.2 VIN = 1.8V, ISINK = 10mA - - 0.3 VIN = 5V, Switch on - - 1 3 V V V A www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Absolute Maximum Ratings VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C. Parameter Symbol Conditions Min Typ Max Units 200 300 400 mA - 140 - Return from Shutdown - 130 - Hysteresis - 10 - 1.5 1.6 1.7 V - 47 - mV Protections Current Limit ILIM VIN = 3.3V Shutdown Threshold Thermal Shutdown Under Voltage Shutdown UVLO VIN Increasing Under Voltage Shutdown Hysteresis C Zener Clamp Voltage VZ IZ = 1mA - 15.58 - V Zener Leakage IZ VZ = 12V - - 10 A Delay On Time tdON RL = 500 , CL = 0.1 F - 25 50 s Delay Off Time tdOFF RL = 500 , CL = 0.1 F - 20 40 s VOUT Rise Time tR RL = 500 , CL = 0.1 F - 14 30 s VOUT Fall Time tF RL = 500 , CL = 0.1 F Over Current Blanking Time tBLANK Dynamic Short Circuit Response Time - 126 250 s 5 10 20 ms VIN = VON = 3.3V. Moderate Over-Current Condition. - 3 - s VIN = VON = 3.3V. Hard Short. - 20 - ns Note 1: Package power dissipation on 1 square inch pad, 2 oz. copper board. FPF2174 Rev. F 4 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Electrical Characteristics Cont. 120 VIN = 5.5V VON = VIN 110 SUPPLY CURRENT (uA) SUPPLY CURRENT (uA) 120 100 90 80 70 60 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 110 VIN = 3.3V 100 90 VIN = 1.8V 80 70 60 -40 6.0 -15 SUPPLY VOLTAGE (V) 60 85 oC Figure 2. Quiescent Current vs. Temperature 0.6 2.0 SUPPLY CURRENT (uA) 1.8 SUPPLY CURRENT (uA) 35 TJ, JUNCTION TEMPERATURE Figure 1. Quiescent Current vs. Input Voltage 1.6 1.4 1.2 1.0 0.8 VIN = 5.5V 0.6 0.4 VIN = 3.3V 0.2 0.0 -40 -15 10 35 60 0.5 0.4 0.3 VIN = 5.5V 0.2 VIN = 3.3V 0.1 0.0 -40 85 TJ, JUNCTION TEMPERATURE oC Figure 3. ISHUTDOWN Current vs. Temperature 60 -15 10 35 60 TJ, JUNCTION TEMPERATURE oC 85 Figure 4. ISWITCH-OFF Current vs. Temperature 1.8 VIN = 3.3V 1.6 ON THRESHOLD (V) SUPPLY CURRENT (uA) 10 50 40 30 1.4 1.2 1.0 0.8 0.6 20 -40 -15 10 35 TJ, JUNCTION TEMPERATURE 60 0.4 1.5 85 Figure 5. Latchoff current vs. Temperature FPF2174 Rev. F 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VIN,INUT VOLTAGE (V) oC Figure 6. Input Voltage vs. On Threshold Voltage 5 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Typical Characteristics 400 375 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 400 350 325 300 275 250 225 200 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 350 300 250 200 -40 6.0 -15 Figure 7. Current Limit vs. Output Voltage DROPOUT VOLTAGE (mV) DROPOUT VOLTAGE (mV) 500 IOUT = 150mA 315 300 285 1 2 3 4 60 5 85 o C Figure 8. Current Limit vs. Temperature 330 270 35 TJ, JUNCTION TEMPERATURE V IN ,INUT VO LTAGE (V) 345 10 VIN = 3.3V IOUT = 150mA 450 400 350 300 250 200 150 100 -40 6 -15 VIN, INPUT VOLTAGE (V) 10 35 60 TJ,JUNCTION TEMPERATURE Figure 9. Drop Voltage vs. Input Voltage 85 o C Figure 10. Drop Voltage vs. Temperature 16.0 0.12 15.9 0.10 ZENER CURRENT (A) ZENER VOLTAGE (V) RZ = 75 15.8 15.7 15.6 15.5 15.4 0 5 10 15 0.06 0.04 0.02 0.00 20 15 16 17 18 19 20 21 ZENER VOLTAGE (V) ZENER CURRENT (mA) Figure 11. Zener Voltage vs. Zener Current FPF2174 Rev. F 0.08 Figure 12. Zener Diode Safe Operating Area 6 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Typical Characteristics 10000 40 35 DELAY TIMES (uS) PEAK POWER (W) 1000 100 10 30 Ttd ON ON 25 20 td TOFF OFF 15 1 -5 0.00001 10 -3 0.001 10 -4 0.0001 10 10 -40 -2 0.01 10 -15 PULSE WIDTH (sec) Figure 13. Single Pulse Maximum Power Dissipation of Zener Diode FLAG-BLANKING TIME (mS) DELAY TIMES (uS) 60 o 85 C 14 tTFALL FALL 100 tT RISE RISE 10 1 -40 -15 10 35 TJ, JUNCTION TEMPERATURE 60 13 11 10 9 8 -40 85 V IN = 3.3V 12 o C -15 10 35 T J , JUNCTION TEM PERATURE 60 o 85 C Figure 16. TBLANK vs. Temperature Figure 15. TRise/TFall vs. Temperature V DRV 2V/DIV VIN = VON = 3.3V CIN = 10 F CL = 0.1 F VON 2V/DIV IOUT 200mA/DIV VIN = 3.3V CIN = 10 F CL = 0.1 F RL = 500 IOUT 10mA/DIV VOUT 2V/DIV 5ms/DIV 100us/DIV Figure 18. TON Response Figure 17. TBLANK Response FPF2174 Rev. F 35 Figure 14. TON/TOff vs. Temperature 1000 FLAGB 2V/DIV 10 T J, JUNCTION TEMPERATURE 7 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Typical Characteristics VIN = 3.3V CIN = 10 F CL = 0.1 F RL = 500 VON 2V/DIV CIN = 10 F CL = 0.1 F VOUT 2V/DIV IOUT 5A/DIV IOUT 10mA/DIV VIN 2V/DIV 200ns/DIV 20 s/DIV Figure 20. Short Circuit Response Time (Output Shorted to GND) Figure 19. TOFF Response VIN 2V/DIV CIN = 10 F CL = 0.1 F VIN 2V/DIV CIN = 10 F CL = 0.1 F RL = 4.7 VON 2V/DIV IOUT 200mA/DIV IOUT 200mA/DIV 50 s/DIV 50 S/DIV Figure 21. Current Limit Response Time (Switch power up to hard short) FPF2174 Rev. F Figure 22. Current Limit Response Time (Output has a 4.7 load) 8 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Typical Characteristics Thermal Shutdown The FPF2174 is a current limited switch that protects systems and loads which can be damaged or disrupted by the application of high currents. The core of the device is a 0.125 P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V paired with a low forward voltage drop Schottky diode for reverse blocking and a 16V zener diode for output clamp. The controller protects against system malfunctions through current limiting, undervoltage lockout and thermal shutdown. The current limit is preset for 200mA. The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature. Transient Safe Operating Area of Zener Diode Integrated zener diode is designed to protect systems from a transient over voltage stress resulting from a flyback voltage (L*di/dt) such as connecting the output of switch to an active rails. On/Off Control When the transient voltage exceed the zener threshold (Vz) the zener starts conducting and prevents the output of loadswitch from experiencing those transient over voltages and protects any reverse current from flowing through the switch. For reliable operation, user should not exceed the SOA curve shown in Figure 13. The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no under-voltage on VIN or a junction temperature in excess of 150C. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals. When the MOSFET is off, the Schottky diode acts as a barrier so that no reverse current can flow when VOUT is greater than VIN. Fault Reporting Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. The FLAGB goes LO at the end of the blanking time and is latched LO and ON must be toggled to release it. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. Current Limiting The current limit guarantees that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current is 200mA and the maximum current is 400mA. The device has a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred. Under-Voltage Lockout The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots. FPF2174 Rev. F 9 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Description of Operation Typical Application To Load VOUT VIN FPF2174 Battery 5.5V OFF ON C1 = 4.7 F ON R1 = 100K FLAGB GND 5.5V MAX C2 = 0.1 F Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 4.7 F ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of C IN can be used to further reduce the voltage drop. Output Capacitor A 0.1uF capacitor C OUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. Power Dissipation During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be typically, P = I LIM x V DROP = 0.4 x 0.4 = 160mW (2) When using the part, attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. FPF2174 Rev. F 10 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products Application Information FPF2174 IntelliMAXTM Advanced Load Management Products Dimensional Outline and Pad Layout Package MLP06H FPF2174 Rev. 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Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I36 FPF2174 Rev. F 12 www.fairchildsemi.com FPF2174 IntelliMAXTM Advanced Load Management Products TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.