Products Learn & Develop Support USA (English) Support Home Product Specifications Processors Intel(R) Xeon(R) Processor 5050 Search specifications Add to Compare 4M Cache, 3.00 GHz, 667 MHz FSB Specifications Essentials Export specifications Essentials Performance Supplemental Information Package Specifications Advanced Technologies Intel(R) Platform Protection Technology Product Collection Code Name Vertical Segment Processor Number Status Expected Discontinuance Ordering and Compliance Lithography Intel(R) Xeon(R) Processor 5000 Sequence Products formerly Dempsey Server 5050 End of Life Q1'2008 65 nm Recommended Customer Price Product Images Compatible Products Performance # of Cores Processor Base Frequency Cache 2 3.00 GHz 4 MB L2 Bus Speed 667 MHz FSB FSB Parity Yes TDP Scenario Design Power (SDP) VID Voltage Range 95 W 0W 1.075V-1.350V Supplemental Information Embedded Options Available Datasheet No View now Package Specifications Sockets Supported TCASE Package Size Processing Die Size PLGA771 67C 37.5mm x 37.5mm 162 mm2 # of Processing Die Transistors 376 million Low Halogen Options Available See MDDS Advanced Technologies Intel(R) Turbo Boost Technology No Intel(R) Hyper-Threading Technology Yes Intel(R) Virtualization Technology (VT-x) Yes Intel(R) VT-x with Extended Page Tables (EPT) No Intel(R) 64 Yes Instruction Set 64-bit Idle States No Enhanced Intel SpeedStep(R) Technology Yes Intel(R) Demand Based Switching No Intel(R) Platform Protection Technology Trusted Execution Technology No Execute Disable Bit Yes More support options for Intel(R) Xeon(R) Processor 5050 (4M Cache, 3.00 GHz, 667 MHz FSB) Product Support Downloads and Software Support Community Warranty and Replacement Need more help? 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Please work with your appropriate Intel representative to obtain a formal price quotation. System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used. Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment. For benchmarking data see http://www.intel.com/performance. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details. 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