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TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
14
・
001
1
16 15 14 13 12 11 10 9
78
56
342
VCC
VCC
VCC
μCOM
7 Circuits
Darlinton Transistor Array
BA12003B BA12003BF BA12004B BA12004BF
General Description
BA12003B/BF,BA12004B/BFare darlinton transistor array
consist of 7circuits, input resistor to limit base current and
output surge absorpti on cla mp diode.
Features
■ Built-i n 7 circui t s
■ High output break down voltage
■ High DC output current gain
■ Built-i n input res ist or to limit ba se curren t
■ Built-in output surge absorption clamp diode
Applications
■ Motor Drivers
■ LED Drivers
■ Solenoid Drivers
■ Low Side Switch
Typic al Application Circuit
Key Specifications
■ Output break down voltage： VCE=60V(max)
■ Output current： Io=500mA/ch(max)
■ Operating supply voltage range： -0.5V to +30V
■ Operating temperature range： -40°C to +85°C
■ DC current gain： hfe=1000(min)
■ Input resistor： BA12003B/BF Rin=2.7kΩ
BA12004B/BF Rin=10.5kΩ
Packages W(Typ) x D(Typ) x H(Max)
DIP16 19.40mm x 6.50mm x 7.95mm
SOP16 10.00mm x 6.20mm x 1.71mm
○
Product structure: Silicon monolithic integrated circuit
○
This product has not designed protection against radioactive rays
DIP16
BA12003B / BA12004B
BA12003BF / BA12004BF
Datashee
t
Not Recommended for
New Designs
2/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
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DIP16 / SOP16
(TOP VIEW)
16 15 14 13 12 11 10 9
12345678
Pin Configuration Block Diagram
Pin Description
Pin No. Pin Name Function Pin No. Pin Name Function
1 IN1 Input 1 9 COM Clamp diode cathode
2 IN2 Input 2 10 OUT7 Output 7
3 IN3 Input 3 11 OUT6 Output 6
4 IN4 Input 4 12 OUT5 Output 5
5 IN5 Input 5 13 OUT4 Output 4
6 IN6 Input 6 14 OUT3 Output 3
7 IN7 Input 7 15 OUT2 Output 2
8 GND Ground 16 OUT1 Output 1
I/O Equivalence Circuit
Note : The diode indicating the junction with a dotted line is a parasitic element.
Note : The input and output parasitic diodes cannot be used as clamp diodes.
2.7kΩ
7.2kΩ3kΩ
IN
[Pin.1 to 7]
OUT
[Pin.10 to 16]
COM [Pin.9]
GND [Pin.8]
10.5kΩ
7.2kΩ3kΩ
IN
[Pin.1 to 7]
OUT
[Pin.10 to 16]
COM [Pin.9]
GND [Pin.8]
BA12003B / BA12003BF
16 15 14 13 12 11 10 9
12345678
IN1
IN2
IN3
IN4
IN5
IN6
IN7
GND
OUT
1
COM
OUT
2
OUT
3
OUT
4
OUT
5
OUT
6
OUT
7
Not Recommended for
New Designs
3/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
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Absolute Maximum Ratings (TA=25
℃
)
Parameter Symbol Rating Unit
Output Voltage VCE -0.5 to +60 V
Output Current IO 500 mA/circuit
Input Voltage VI -0.5 to +30 V
Diode Reverse Voltage VR 60 V
Diode Forward Current IF 500 mA/ circuit
GND Terminal Current IGND 2.3(Note 1) A
Power Dissipation DIP16 PD 1.25(Note 2)
W
SOP16 0.62(Note 3)
Operating Tempera t ure Topr -40 to +85 °C
Storage Temperature Tstg -55 to +150 °C
(Note 1) Pulse width ≤20ms , Duty Cycle≤10%, 7 circuits flow the same current.
(Note 2) Reduce 10. 0mW per 1°C above 25°C.
(Note 3) Mounted on 70m m x 70mm x 1.6mm glass epoxy board. Reduce 5.0mW per 1°C above 25°C.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open
circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolu te ma xim um r ati ng s.
Electrical Characteristics (Unless otherwise specified, GND=0V TA=25°C)
Parameter Symbol Limit Unit Conditions Test
Circuit
Min Typ Max
Output Leakage Current IL - - 10 µA VCE=60V 1
Output DC Current Gain hFE 1000 2400 - - VCE=2.0V, IO=350mA 2
Output Saturation Voltage1 VCEsat1 - 0.94 1.1 V IO=100mA, II=250μA 2
Output Saturation Voltage2 VCEsat2 - 1.14 1.3 V IO=200mA, II=350μA 2
Output Saturation Voltage3 VCEsat3 - 1.46 1.6 V IO=350mA, II=500μA 2
Input
Voltage1 BA12003 VI1 2.0 - - V VCE=2.0V, IO=100mA 3
BA12004 5.0 - -
Input
Voltage2 BA12003 VI2 2.4 - - V VCE=2.0V, IO=200mA 3
BA12004 6.0 - -
Input
Voltage3 BA12003 VI3 3.4 - - V VCE=2.0V, IO=350mA 3
BA12004 8.0 - -
Input Current BA12003 II - 0.90 1.35 mA VI=3.85V 4
BA12004 0.39 0.5 VI=5.0V
Diode Reverse Current IR - - 50 µA VR=60V 5
Diode Forward Voltage VF - 1.73 2.0 V IF=350mA 6
Input Capacity CI - 30 - pF VI=0V, f=1MHz 7
Not Recommended for
New Designs
4/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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001
V
CE
OPEN
OPEN
I
L
V
CEsat
OPEN
I
O
V
CE
OPEN
I
O
VI
１. Output Leakage Current I
L
２. DC Current Gain h
FE
=I
O
/I
I
I
I
Output Saturation Voltage V
CEsat
３. Input Voltage V
I
V
I
OPEN
GND
OPEN
I
R
V
F
４. Input Current I
I
５. Diode Reverse Current I
R
6. Diode Forward Voltage V
F
OPEN
I
I
OPEN
V
R
I
F
OPEN
OPEN
V
I
OPEN
７. Input Capacity CI
OPEN
H
I
Capacitance
bridge
TEST SIGNAL LEVEL 20mVrms
Test Circuit
Not Recommended for
New Designs
5/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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001
10
100
1000
10000
110 100 1000
hFE(IO÷II)
Iout[mA]
0.4
0.8
1.2
1.6
2.0
100 200 300 400 500
VCE[V]
IOUT[mA]
Typical Performance Curve (Reference Data)
0.0
0.2
0.4
0.6
0.8
1.0
20 40 60 80 100
IL[μA]
Ta[℃]
Figure 1 .
Output Leakage Current vs Ambie nt Temper ature
Figure 2 .
Output DC Current Gain vs Output Current
Figure 3 .
Output Current vs Input Current
Figure 4 .
Output Saturation Voltage1 vs Output Current
VOUT=60V
85
℃
-40
℃
25
℃
85
℃
-40
℃
25
℃
100
200
300
400
500
50 100 150 200
Iout[mA]
Iin[μA]
-40
℃
25
℃
85
℃
Not Recommended for
New Designs
6/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
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0.4
0.8
1.2
1.6
2.0
100 200 300 400 500
VCE[V]
IOUT[mA]
0.4
0.8
1.2
1.6
2.0
100 200 300 400 500
VCE[V]
IOUT[mA]
Typical Performance Curve (Reference Data) - continued
0
1
2
3
4
10 20 30 40
II[mA]
VI[V]
0
2
4
6
8
10
12
10 20 30 40
II[mA]
VI[V]
Figure 5 .
Output Saturation Voltage2 vs Output Current
Figure 6 .
Output Saturation Voltage3 vs Output Current
Figure 7 .
Input Current vs Input Voltage
Figure 8 .
Input Current vs Input Voltage
85
℃
-40
℃
25
℃
-40
℃
25
℃
85
℃
-40
℃
25
℃
85
℃
-40
℃
25
℃
85
℃
Not Recommended for
New Designs
7/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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0
50
100
150
200
250
300
350
400
450
500
0 10 20 30 40 50 60 70 80 90 100
Maximum Output Current [mA]
Duty Cycle [%]
7ch
5ch
6ch
3ch
4ch
1ch
2ch
T
A
=25℃
on PCB
These limit is based on calculation
(IGND÷the number of ON-channel).
328
383
460
0
50
100
150
200
250
300
350
400
450
500
010 20 30 40 50 60 70 80 90 100
Maximum Output Current [mA]
Duty Cycle [%]
7ch
5ch
6ch
3ch
4ch
1ch
2ch
T
A
=85℃
on PCB
These limit is based on calculation
(IGND÷the number of ON-channel).
328
383
460
Typical Performance Curve (Reference Data) - continued
0
20
40
60
80
100
-50 0 50 100
Ton[ns]
Ta[℃]
0
200
400
600
800
-50 0 50 100
Toff[ns]
Ta[℃]
Figure 9 .
Turn-ON Time vs Ambient Temperature
Figure 10 .
Turn-OFF Time vs Ambient Temperature
Figure 11.
Output Current‐Duty Cycl e
(BA12003BF/BA12004BF)
Figure 12.
Output Current‐Duty Cycle
(BA12003BF/BA12004BF)
Not Recommended for
New Designs
8/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
001
0
50
100
150
200
250
300
350
400
450
500
010 20 30 40 50 60 70 80 90 100
Maximum Output Current [mA]
Duty Cycle [%]
7ch
5ch
6ch
3ch
4ch
1ch
2ch
Ta=85℃
Free Air
These limit is based on calculation
(IGND÷the number of ON-channel).
328
383
460
0
50
100
150
200
250
300
350
400
450
500
010 20 30 40 50 60 70 80 90 100
Maximum Output Current [mA]
Duty Cycle [%]
7ch
5ch
6ch
3ch
4ch
1ch
2ch
Ta=25℃
Free Air
These limit is based on calculation
(IGND÷the number of ON-channel).
328
383
460
Typical Performance Curve (Reference Data) - continued
Figure 13 .
Output Current‐Duty Cycle
(BA12003B/BA12004B)
Figure 14.
Output Current‐Duty Cycle
(BA12003B/BA12004B)
Not Recommended for
New Designs
9/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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(b) Derating curv e
0.0
0.1
0.2
0.3
0.4
0.5
0.6
025 50 75 100 125
AMBIENT TEMPERATURE [℃]
POWER DISSIPATION [W]
95
Ambient Temperature [°C]
Power Dissipation [W]
Power Dissipation
Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature). IC is heated
when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that
can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip(maximum junction temperature) and thermal
resistance of package(heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called
thermal resistance, represented by the symbol θJA (°C/W).The temperature of IC inside the package can be estimated by
this thermal resistance. Figure 15(a) shows the model of thermal resistance of the package. Thermal resistance θJA,
ambient temperature TA, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the
equation below:
θJA = (TJMAX -TA) / Pd ［°C/W］
Derating curve in Figure 15(b) indicates power that can be consumed by IC with reference to ambient temperature. Power
that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate
at certain ambient temperature. This gradient is determined by thermal resistance θJA. T hermal resista nc e θJA depends on
chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of
package is used. Thermal reduction curve indicates a reference value measured at a specified condition.
Figure 16 show a derating curve for an example of BA12003B/BA12004B and Figure 17 show a derating curve for an
example of BA12003BF/BA12004BF.
(a) Thermal resistance
Figure 15. Ther ma l resi st an ce and derating curve
θja=(Tjmax-Ta)/Pd (°C/W)
周囲温度 Ta [℃]
チップ表面温度 Tj [℃]
消費電力 P [W]
Chip surface temperature Tj (
℃
)
Ambient temperature T
A
(
℃
)
Not Recommended for
New Designs
10/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
001
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
010 20 30 40 50 60 70 80 90 100 110 120 130 140 150
周囲温度Ta [℃]
許容損失Pd[W]
0.625
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150
周囲温度Ta [℃]
許容損失Pd [W]
1.25
Power Dissipation [W]
Power Dissipation [W]
Ambient Temperature [°C]
Ambient Temperature [°C]
Power Dissipation - continued
Part Number Slope of Derating Curve Unit
BA12003B/BA12004B 10.0 mW/℃
BA12003BF/BA12004BF 5.0 mW/℃
Figure 16. Derating curv e
Figure 17. Derating curve
0.62
BA12003B/BA12004B(DIP16)
BA12003BF/BA12004BF(SOP16)
Not Recommended for
New Designs
11/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
15
・
001
Operation al Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the condi tion s of each p ar am eter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may
flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wi ring, width of ground wiring, and
routing of conne ctio ns.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mountin g Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
Not Recommended for
New Designs
12/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
001
Operation al Notes – continued
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N jun cti on operates as a parasiti c diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
Figure 18. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Output Pins
Connecting zener diode should be enable to prevent degradation of current time.Pease use zener diode satisfy with
VCC+VZ≤VCE(SUS).
16. Output clamp diode
Figure 19 is a construction of the clamp diode part in this IC. When the clamp diode works, PNP transistor works.
Therefore, a consumption power increases. W hen a consecutive surge current (or backward current of motor) flows i n
this clamp diode, we recommend the diode with a low forward voltage etc.( schottky diode) connection between OUT
and COM for bypass pathway of surge current.
Figure 19. Construct ion of ou t put cla mp diode
Not Recommended for
New Designs
13/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
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Orderi n g Information
B A 1 2 0 0 x B F - E2
Part Number
BA12003B
BA12004B
Package
None: DIP16
F: SOP16
Packaging and forming specification
None: Tube (DIP16)
E2: Embossed tape and reel (SOP16)
Marking Diagrams
Lineup
Part Number Marking Package Orderable Part Number
BA12003B DIP16 BA12003B
BA12004B DIP16 BA12004B
BA12003BF SOP16 BA12003BF-E2
BA12004BF SOP16 BA12004BF-E2
DIP16(TOP VIEW)
BA1200xB
Part Number Marking
LOT Number
SOP16(TOP VIEW)
BA1200xBF
Part Number Marking
LOT Number
1PIN MARK
Not Recommended for
New Designs
14/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
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Physical Dim ens io n, Tape and Reel Information
Package Name
DIP16
Not Recommended for
New Designs
15/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
001
Physical Dim ens io n, Tape and Reel Information – continued
Package Name
SOP16
(UNIT : mm)
PKG : SOP16
Drawing No. : EX114-5001
(Max 10.35 (include.BURR))
Not Recommended for
New Designs
16/16
BA12003B BA12003BF BA12004B BA12004BF
TSZ02201-0RCR0GZ00100-1-2
© 2014 ROHM Co., Ltd. A l l rights reserved.
12.May.2015 Rev.002
www.rohm.com
TSZ22111
・
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・
001
Revision History
Date Revision Changes
25.Dec.2014 001 New Release
12.May.2015 002 P.1 Correction : Operating temperature range
P.3 Correction : Mention position of limit (Input Voltage1,2,3 in an Electrical Characteristics)
Not Recommended for
New Designs
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending o n Ambient temper ature (Ta). When us ed in se aled area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall n ot be in any way responsible or liable for failure induced un der deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogen ous (chlori ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Not Recommended for
New Designs
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damag es, e xpenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommende d b y ROHM
[c] the Products are exposed to direct sunshine or conde nsation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an auth orized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the dev elopment of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Not Recommended for
New Designs
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for any damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Not Recommended for
New Designs
Datasheet
Part Number ba12003b
Package DIP16
Unit Quantity 1000
Minimum Package Quantity 25
Packing Type Tube
Constitution Materials List inquiry
RoHS Yes
ba12003b - Web Page