Chip Resistor - Low Ohms - Chip Resistor - Low Ohms INTRODUCTION Chip resistors are general passive component which is useful for derating voltage, current controlling in circuit and surface mounting is available. Frequently very low ohmic values chip resistors are needed so we develop the low ohmic types of chip resistors in order to correspond to these user's needs. Production is increasing with demand for small size & light weight of set product. We provide ultra-small, high-reliability, high-stability resistors. FEATURE AND APPLICATION Feature - Under 1 ohms, precision resistance. - Both flow and reflow soldering are applicable. - Owing to the reduced lead inductance, the high frequency characteristic is excellent. Application - Current detect. - Safe Circuit through protecting over - current flow. - Power supplying part. - Motor controlling, DC power charger, etc. -1- Chip Resistor - Low Ohms STRUCTURE -2- Chip Resistor - Low Ohms APPEARANCE AND DIMENSION l1 H W l2 L [ Unit : ] TYPE inch Power (W) L W H I1 I2 Unit Weight 2012 0805 1/8 2.000.20 1.250.15 0.500.10 0.400.20 0.350.20 4.9 3216 1206 1/4 3.200.20 1.600.15 0.550.10 0.450.20 0.400.20 9.5 3225 1210 1/4 3.200.20 2.550.20 0.550.10 0.450.20 0.400.20 16 5025 2010 1/2 5.000.15 2.500.15 0.550.15 0.600.20 0.600.20 26 6432 2512 1 6.300.15 3.200.15 0.550.15 0.600.20 0.600.20 41 -3- Chip Resistor - Low Ohms PART NUMBERING RC 1 2012 2 F 3 1R0 4 CS 5 1 CODE DESIGNATION RC : This code expresses the Resistor that is produced by Samsung Electro-Mechanics CO.LTD. 2 DIMENSION The dimension is expressed as 4 digits number by SI unit (mm). <Table 1> Left 2 digits are length of resistor, and the other 2 digits are width. <Fig 1> <Fig 1> l1 H l2 W L <Table 1> [ Unit : ] Dimension (inch) 2012 3216 3225 5025 6432 (0805) (1206) (1210) (2010) (2512) L 2.00 0.20 3.20 0.20 3.20 0.20 5.00 0.15 6.30 0.15 W 1.25 0.15 1.60 0.15 2.55 0.20 2.50 0.15 3.20 0.15 H 0.50 0.10 0.55 0.10 0.55 0.10 0.55 0.10 0.55 0.10 l1 0.40 0.20 0.45 0.20 0.45 0.20 0.60 0.20 0.60 0.20 l2 0.35 0.20 0.40 0.20 0.40 0.20 0.60 0.20 0.60 0.20 -4- Chip Resistor - Low Ohms 3 RESISTANCE TOLERANCE The Resistance Tolerance is expressed as 1 digit alphabet by EIAJ standard. <Table 2> <Table 2> Item F G J K Tolerance (%) 1 2 5 10 Producing Series E-24, E-96 E-24, E-48 E-24 E-12 4 NOMINAL RESISTANCE VALUE The Nominal Resistance Value is expressed as 3 or 4 digits by EIAJ standard. <Table 3> <Table 3> Item Resistance Tolerance Only number Number & alphabet "R" Example 3 Digits Mark 4 Digits Mark F, G, J, K F, G Left 2 digits : Resistance value Left 3 digits : Resistance value Right 1 digit : Exponential number of 10. Right 1 digit : Exponential number of 10. Read alphabet "R" as decimal point. Read alphabet "R" as decimal point. 2) R75 : 0.75 2) R909 : 0.909 If resistance value in E-96 is same resistance value in E-24, we mark 3 or 4 digits on the resistor. In case of JUMPER(0 ohm), '000' is marked on that resistor. -5- Chip Resistor - Low Ohms 5 PACKAGING CODE The Packaging Code is expressed as 2 digits alphabet. <Table 4> <Table 4> Packaging Code Description C S 7" REEL PACKAGING E S 10" REEL PACKAGING A S 13" REEL PACKAGING G S BULK CASE PACKAGING Dimension Packaging Q'ty 2012, 3216, 3225 5,000 PCS 5025, 6432 4,000 PCS 2012, 3216 10,000 PCS 2012, 3216, 3225 20,000 PCS 5025, 6432 15,000 PCS 2012 10,000 PCS 3216 5,000 PCS -6- Chip Resistor - Low Ohms PACKAGING PACKAGING METHOD Packaging protects the resistor from damage during the shipping or storage. There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type. REEL TYPE PACKAGING SPECIFICATION The packaging specification is based on the EIAJ RC-1009. <Fig 2> is tape dimension For 2012, 3216, 3225 type. <Table 5> is for pocket sizes, A and B. <Fig 2> 4.00.1 0.1 1.50 1.750.1 1.0 3.50.05 B 2.00.05 1.0 Max 4.00.1 Top Tape 8.00.1 A Chip Resistor 1.0 Max Carrier Tape Bottom Tape <Fig 3> is tape dimension For 5025, 6432 type. <Table 5> is for pocket sizes, A and B. <Fig 3> t MAX = 1.1 -7- Chip Resistor - Low Ohms <Table 5> Dimension 2012 3216 3225 5025 6432 (0805) (1206) (1210) (2010) (2512) A 1.65 0.20 2.00 0.20 2.90 0.20 2.80 0.10 3.50 0.10 B 2.40 0.20 3.60 0.20 3.60 0.20 5.30 0.20 6.75 0.10 Symbol TAPING METHOD There are empty holes at both start part and end part of carrier tape. <Fig 4> <Fig 4> Reel Packed Part Empty Part Lead Part Adhesion Tape Empty Portion 10 Pitches or more ** 5,000 Pitches or 20,000 Pitches Empty Portion Lead Part Start End **** Chips *** 10 Pitches or more 200~250 mm Note The resistor should move in the pocket freely. The resistor should not adhere to the top or bottom tape. There should be no vacant pocket. Peeling strength of the top tape should be within 5g and 80g. <Fig 6> <Fig 5> Peeling Top Tape Chip Resistor Carrier Tape 10 F Bottom Tape -8- Chip Resistor - Low Ohms REEL DIMENSION The Reel dimension is classified by the diameter of Reel. <Fig 6> <Table 6> <Fig 6> <Table 6> [ Unit : mm ] Packaging Code Diameter A B C D C S 7" 178 70 9.5(13.0) 0.1 1.2 0.1 E S 10" 258 80 9.5 0.1 2.0 0.1 F S, A S 13" 330 80 9.5 0.1 2.0 0.1 BULK TYPE PACKAGING Bulk cassette specification is based on the EIAJ ET-7201. <Fig 7> The standard packaging quantity depends on the dimension. <Table 7> <Fig 7> 6.0 0.05 4.4 0.05 3.4 0.05 12 36 11 0 <Table 7> Dimension Inch Standard packaging quantity Weight (g, avg.) 2012 0805 10,000 PCS 65 3216 1206 5,000 PCS 67 -9- Chip Resistor - Low Ohms LABELING Reel type Label The reel type label includes following contents as <Fig 8>. - Following Resistance Value Tolerance, Marking Part Number Quantity LOT Number Bar - Code Serial Number <Fig 8> 0.22 Ohm JR22 P/N : RC2012JR22CS QTY : 5000PCS L/N : RJBC20630 007 V-2 SAMSUNG ELECTRO MECHANICS CO.,LTD. A Bulk type Label The bulk type label includes following contents as <Fig 9>. <Fig 9> Following Part Number Resistance Value LOT Number Quantity Bar - Code Serial Number RC3216JR68G S 0.68oh m RC3216JR68GS RIBG71025 ,5000pcs 0.68ohm 00 V7- 2 SAMSUNG ELECTRO- MECHANICS CO.,LTD BOX PACKAGING METHOD The bulk or reel type packaging is packaged twice by paper box, inner box and outer box. The packaging should protect the resistor from damaging during shipping by vehicle, ship, airplane and etc. The information of contents is marked on both inner and outer box. For other packaging methods, please contact us. - 10 - Chip Resistor - Low Ohms BOX DIMENSION FOR REEL TYPE Max 25,000 pcs ( 5 EA x 7" ) Max 100,000 pcs ( 20 EA x 7" ) 301.0 1851.0 1955.0 1875.0 661.0 2855.0 1851.0 ( Unit : mm ) Max 300,000 pcs ( 60 EA x7" ) ( Unit : mm ) Max 400,000 pcs ( 20 EA x13" ) 2155.0 3485.0 3705.0 3365.0 4105.0 3395.0 ( Unit : mm ) ( Unit : mm ) BOX DIMENSION FOR BULK TYPE Outer box ( Inner box x 20 EA ) Inner box ( Cassette x 5 EA ) 215 41 135 65 116 ( Unit : mm ) 242 ( Unit : mm ) - 11 - Chip Resistor - Low Ohms RELIABILITY TEST DATA ELECTRICAL CHARACTERISTIC The electrical characteristic test should satisfy the test method, procedure, and standard. If there is no special comment, Each test performs in standard state. (temperature 20, humidity 65%RH, pressure 1023mbar) item Permissible deviation Test method Resistor Standard : JIS C 5202 (5.1) Test voltage : <Table 8> Applying time : within 5 seconds. DC resistance value DC resistance should be within the Test board : <Fig 10> <Table 8> specified resistance tolerance. Range () R < 1 Voltage (V) 0.1 Standard : JIS C 5202 (5.2) Temp. : 20 -55 20 125 20 1. Tolerance F Temperature Coefficient Test board : <Fig 11> 200ppm/ 2. Tolerance G, J, K TCR(ppm/) = of Resistance Calculation : <Table 9> R - R0 1 x x106 R0 T - T0 T0 : 20 2 Range() ppm/ 0.1 R < 1 500 R0 : Resistance at T0 () T : Test temperature ( -55, 125) R : Resistance at T () Standard : JIS C 5202. (5.5) 1. No mechanical Short time overload (STOL) damage 2. R should be within (1%+0.1) Test voltage : 2.5 times of rated voltage Max. surge current at the Jumper. Applying time : 5 seconds Test board : <Fig 10> Standard : JIS C 5202. (5.8) Intermittent overload (IOL) 1. No mechanical damage 2. R should be within (3%+0.1) Test voltage : 2.5 times of rated voltage Max. surge current at the Jumper. Test method : 1 sec ON, 25 sec OFF 10,000+400cycles Test board : <Fig 10> - 12 - Chip Resistor - Low Ohms item Withstanding voltage Insulation resistance Permissible deviation No mechanical damage, short circuit, or disconnection. Should have more than 1,000M Noise standard Noise Test method Resistor Standard : JIS C 5202. (5.7) Test voltage : AC 500V Applying time : 60 +10/-0 seconds Test board : <Fig 12> Standard : JIS C 5202. (5.6) Test voltage : DC 500V Applying time : 60 seconds Test pressure : 1.00.2 N Test board : <Fig 12> Standard : JIS C 5202. (5.9) JIS appendix1 "Noise measure in resistor" <Table 10> Range () Measure equipment : QUAN-TECH NOISE dB Max. 0.1 R < 1 METER -10 (MODEL 315C) MECHANICAL CHARACTERISTIC The mechanical characteristic test should satisfy the test method, procedure, and standard. If there is no special comment, Each test performs in standard state. (temperature 20, humidity 65%RH, pressure 1023mbar) item Permissible deviation New solder Solderability Test method Resistor Standard : JIS C 5202. (6.5) coated more than Test temperature : 235 5 95% of termination Test time : 2 0.5 sec (dipping both side) Standard : JIS C 5202. (6.1) Test board : <Fig 11> Test speed : 100mm/min Test procedure : press until 3mm, 1. No mechanical Bending strength damage then keep 5 seconds <Fig 13> <Fig 13> 2. R should be within (0.5%+0.05) 20 R205 3 - 13 - Chip Resistor - Low Ohms item Termination strength Permissible deviation No mechanical damage, or sign of disconnection soldering heat Test time : applying pressure for 10 seconds Test tension : 5 N (500gf) Standard : JIS C 5202 (6.4) Temperature : 260 5 damage 2. R should be within (1%+0.05) 1. No mechanical Vibration Standard : JIS C 5202 (6.1) 1005, 1608 - 3 N (300gf) 1. No mechanical Withstanding Test method Resistor Test time : 10 1second (both side dipping) Test procedure : measures after 24 hours Standard : JIS C 5202 (6.3) Test amplitude : 1.5mm damage 2. R should be Test procedure : frequency 10Hz - 55Hz - within (1%+0.05) 10Hz each 2 hours in x, y, z direction. ENVIRONMENTAL CHARACTERISTIC The Environmental characteristic test should satisfy the test method, procedure, and standard. If there is no special comment, Each test performs in standard state. (temperature 20, humidity 65%RH, pressure 1023mbar) item Permissible deviation Test method Resistor Standard : JIS C 5202 (7.4) Test procedure : <Table 11> 1. No mechanical Temperature cycle damage Measure : after 5 cycles of procedure Test board : <Fig 10> 2. R should be within (1%+0.1) <Table 11> item temp() time(min) 1 -552 30 2 5~35 15 3 1252 30 4 5~35 15 1. No mechanical Standard : JIS C 5202 (7.9) damage 2. R should be Moisture resistance life within <Table 12> Test condition : temp 40 3, humid 90 ~ 95%RH Test voltage : rated voltage Test time : repeat 90min ON, 30min OFF <Table 12> Range() R MAX 0.1 R < 1 5% during 1000+48 hours Test board : <Fig 10> - 14 - Chip Resistor - Low Ohms item Low temperature exposure High temperatur exposure Permissible deviation 1. No mechanical damage 2. R should be within (3%+0.1) 1. No mechanical damage 2. R should be within (3%+0.1) 1. No mechanical damage 2. R should be within <Table 13> Load life Test method Resistor Standard : JIS C 5202 (7.1) Test temperature : -55 2 Test time : 1000+48 hours (without load) Measure : after 1 hour Test board : <Fig 10> Standard : JIS C 5202 (7.2) Test temperature : 2012,3216 : 155 2, others : 125 2 Test time : 1000+48 hours (without load) Measure : after 1 hour Test board : <Fig 10> Standard : JIS C 5202 (7.10) Test temperature : 70 2 Test voltage : rated voltage <Table 13> Test time : repeat 90min ON, 30min OFF during 1000+48 hours Range() R MAX 0.1 R < 1 5% Test board : <Fig 10>. TEST BOARD AND SPECIFICATION Soldering The resistor should be fixed on PCB(printed circuit board) for testing. - Soldering specification : JIS C 5202 (6.2) * Soldering method : Flow type(Dipping type), Reflow type * Solder : H63A (JIS Z 3282) * FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901) - Flow soldering condition * FLUX dipping time * Pre-treatment * Soldering temp. * Soldering time * Temp. profile : : : : : 510 sec None 2355 50.5 sec <Fig 15> - Reflow soldering condition * Peak temp. : 2305 * Duration over 220 : 155 sec * Solder Cream : Sn-Pb (63-37) * Temp. Profile : <Fig 16> - 15 - Chip Resistor - Low Ohms Test board Test board <Table 14> <Fig 10> c item 10 - 1.0 Dimension (mm) Dimension Power 2012 3216 3225 5025 6432 1/8W 1/4W 1/4W 1/2W 1W a 1.2 2.2 2.2 3.6 5.2 b 4.0 5.0 5.0 7.0 8.0 c 1.65 2.0 2.9 3.0 3.5 3 3.5 f 4.3 3.3 3.3 3.0 2.5 f a b 25 5.5 7.5 5.08 3 Connector 58.5 <Table 14>, <Fig 10> are dimensions of test board. : COPPER PATTERN * Board material : epoxy JIS C 6484 : SOLDER - RESISTOR * pattern material : pure copper 99.5% or above JIS C 6484 Bending Test Board <Fig 11> <Table 15> item a Dimension Power 2012 3216 3225 5025 6432 1/8W 1/4W 1/4W 1/2W 1W a 1.2 2.2 2.2 3.6 5.2 b 4.0 5.0 5.0 7.0 8.0 f d=4. 5 Dimension (mm) c 1.65 2.0 2.9 3.0 3.5 f 4.3 3.3 3.3 3.0 2.5 40 c b 100 <Table 15>, <Fig 11> are dimensions of bending test board. * Board material : epoxy JIS C 6484 : COPPER PATTERN : SOLDER - RESISTOR * pattern material : pure copper 99.5% or above JIS C 6484 Sketch of Withstanding voltage and Insulation resistance <Fig 12> Cu Cu Cu P2 P1 P1 Substrate V - 16 - Chip Resistor - Low Ohms CHARACTERISTIC GRAPH RESISTANCE RANGE The Resistance Range that we produce depends on the Dimension and the Resistance Tolerance of the resistor. <Table 16> <Table 16> Dimension 2012 3216 3225 5025 6432 (0805) (1206) (1210) (2010) (2512) 0.11 0.11 0.11 0.11 0.11 Tolerance F, G, J, K RATED POWER The Rated Power is classified by the dimension of the resistor. <Table 17> <Table 17> Dimension 2012 3216 3225 5025 6432 (0805) (1206) (1210) (2010) (2512) Rated Power 1/8 W (0.125 W) 1/4 W (0.25 W) 1/4 W (0.25 W) 1/2 W (0.5W) 1.0 W Working Volt.(Max.) 0.35 V 0.50 V 0.50 V 0.71 V 1.00 V STOL, IOL Volt.(Max.) 0.88 V 1.25 V 1.25 V 1.77 V 2.50 V item The rated power is specified as continuous full loading power at the ambient temperature of 70 2. In case of the temperature exceeding 702, the power should be derated in accordance to <Fig 17>. <Fig 17> [2012, 3216, 3225, 5025, 6432] 100 Rated load percent (%) Ambient temperature () 80 60 40 20 -55 -40 125 70 0 0 40 80 120 Working Temperature - 55 + 125 : 2012, 3216, 3225, 5025, 6432 - 17 - Chip Resistor - Low Ohms APPLICATION MANUAL Applications Chip resistors are designed for general electronic devices such as home appliances, computer, mobile communications, digital circuit, etc. If you require our products with high reliability-performing at more than 125C or below -55C- for medical equipments, aircraft, high speed machines, military usage, and items that can affect human life or if you need to use in specific conditions (corrosive gas atmosphere), please contact us beforehand. Normal Operation temperature ranges() as follows. : -55 ~ + 125 Although resistor body is coated, sharp excessive impact should be avoided to prevent damages and adverse effects on characteristics(resistor value, open circuited, T.C.R.). Storage To maintain proper quality of chip components, the following precautions are required for storage environment, method and period. Storage Environment - Chip components may be deformed, if the temperature of packaged components exceeds 40C. - Do not store where the soldering properties can be deteriorated by harmful gas such as sulphurous gas, chlorine gas, etc. - Bulk packed chip components should be used as soon as the seal is opened, thus preventing the solderability from deteriorating. - The remaining unused chips should be put in the original bag and sealed again or store in a desiccator containing a desiccating agent. Storage Time Period - Stored chip components should be used within 12 months after receiving the components. If 12 months or more have elapsed, please check the solderability before actually using. Mounting Please give more attention not to press the chip owing to the nozzle's improper height when it is mounted on PCB. (Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.) - 18 - Chip Resistor - Low Ohms Soldering Our products have Ag electrodes protected by double layer. 1st Ni Coating - This prevents Ag electrode from leaching and enhance the bonding with Sn-Pb. 2nd Sn-Pb Coating - This is made of Sn 90% and Pb 10% with melting point 213 to prevent it from melting when solder cream melts, and to enhance the bonding. - Commercial solder creams are made of Sn 63% and Pb 37% with melting point 183. Cleaning After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product. If any possibility on product, please take a test before usage. Caution for chip resistor separation from PCB Chip resistor installation on PCB is similar phenomenon on chocolate chip on top of cake. PCB has enough flexibility on outer force but Chip resistor can be defected without any bending. (By chip resistor use of Ceramic, solder, metal) Therefore, when separate from Chip resistor on PCB, be ware of any crack of chip Others Manual work - Whenever separate chip resistor from PCB, do not re-use the chip resistor for circuit safety. Chip resistor can be electrical specification change by soldering Iron after separation. Re-use of separated chip resistor should be prohibited. Do not use more than rated voltage.(check the contents on the file) - 19 - Chip Resistor - Low Ohms NOTICE Usage of the resistor Flow Soldering After sticking the resistor to PCB with paste, dip the PCB into solder bath. <Fig 15> <Fig 15> Temp. 2355 T150 Pre-heating Soldering Cooling within 5 sec Time Reflow Soldering After printing solder creams on PCB, place the resistor on the solder cream. Then heat the PCB. <Fig 16> <Fig 16> Temp. Peak temp. within 10 sec 2305 200 160 130 Pre-heating within 120 sec Soldering Cooling within 20 sec Time Caution Storage condition Please make sure that keep the storage conditions. * Temperature : 535, * Humidity : 45%RH 85%RH Damage control Please handle with care, to prevent damaging the resistor. Specially, the excessive nozzles' height of SMD or the extreme touch with tweezers. Leaching prevention It is important to keep the soldering conditions for prevent Ag leaching in Flow soldering. - 20 -