Chip Resistor
-LowOhms-
Chip Resistor - Low Ohms
- 1 -
■INTRODUCTION
Chip resistors are general passive component which is useful for derating voltage, current
controlling in circuit and surface mounting is available. Frequently very low ohmic values chip
resistors are needed so we develop the low ohmic types of chip resistors in order to correspond
to these user's needs. Production is increasing with demand for small size & light weight of set
product. We provide ultra-small, high-reliability, high-stability resistors.
■FEATURE AND APPLICATION
●Feature
- Under 1 ohms, precision resistance.
- Both flow and reflow soldering are applicable.
- Owing to the reduced lead inductance, the high frequency characteristic is excellent.
●Application
- Current detect.
- Safe Circuit through protecting over - current flow.
- Power supplying part.
- Motor controlling, DC power charger, etc.
Chip Resistor - Low Ohms
- 2 -
■STRUCTURE
Chip Resistor - Low Ohms
- 3 -
■APPEARANCE AND DIMENSION
L
l2
l1
W
H
TYPE inch Power (W) L W H I1I2Unit
Weight
2012 0805 1/8 2.00±0.20 1.25±0.15 0.50±0.10 0.40±0.20 0.35±0.20 4.9㎎
3216 1206 1/4 3.20±0.20 1.60±0.15 0.55±0.10 0.45±0.20 0.40±0.20 9.5㎎
3225 1210 1/4 3.20±0.20 2.55±0.20 0.55±0.10 0.45±0.20 0.40±0.20 16㎎
5025 2010 1/2 5.00±0.15 2.50±0.15 0.55±0.15 0.60±0.20 0.60±0.20 26㎎
6432 2512 16.30±0.15 3.20±0.15 0.55±0.15 0.60±0.20 0.60±0.20 41㎎
[Unit:㎜]
Chip Resistor - Low Ohms
- 4 -
■PART NUMBERING
RC : This code expresses the Resistor that is produced by Samsung Electro-Mechanics
CO.LTD.
The dimension is expressed as 4 digits number by SI unit (mm). <Table 1>
Left 2 digits are length of resistor, and the other 2 digits are width. <Fig 1>
<Fig 1>
<Table 1>
Dimension 2012 3216 3225 5025 6432
(inch) (0805) (1206) (1210) (2010) (2512)
L2.00 ±0.20 3.20 ±0.20 3.20 ±0.20 5.00 ±0.15 6.30 ±0.15
W1.25 ±0.15 1.60 ±0.15 2.55 ±0.20 2.50 ±0.15 3.20 ±0.15
H0.50 ±0.10 0.55 ±0.10 0.55 ±0.10 0.55 ±0.10 0.55 ±0.10
l10.40 ±0.20 0.45 ±0.20 0.45 ±0.20 0.60 ±0.20 0.60 ±0.20
l20.35 ±0.20 0.40 ±0.20 0.40 ±0.20 0.60 ±0.20 0.60 ±0.20
RC 2012 F 1R0 CS
●
2
●
2●
3●
4●
5
●
1
●
1
CODE DESIGNATION
DIMENSION
L
l2
l1
W
H
[Unit:㎜]
Chip Resistor - Low Ohms
- 5 -
The Resistance Tolerance is expressed as 1 digit alphabet by EIAJ standard. <Table 2>
<Table 2>
The Nominal Resistance Value is expressed as 3 or 4 digits by EIAJ standard. <Table 3>
<Table 3>
Item 3DigitsMark 4DigitsMark
Resistance
Tolerance F, G, J, K F, G
Only number Left 2 digits : Resistance value
Right 1 digit : Exponential number of 10.
Left 3 digits : Resistance value
Right 1 digit : Exponential number of 10.
Number &
alphabet "R" Read alphabet "R" as decimal point. Read alphabet "R" as decimal point.
Example 2) R75 : 0.75Ω2) R909 : 0.909Ω
If resistance value in E-96 is same resistance value in E-24, we mark 3 or 4 digits on the
resistor.
In case of JUMPER(0 ohm), '000' is marked on that resistor.
Item F G J K
Tolerance (%) ±1±2±5±10
Producing Series E-24, E-96 E-24, E-48 E-24 E-12
RESISTANCE TOLERANCE
●
3
●
4NOMINAL RESISTANCE VALUE
Chip Resistor - Low Ohms
- 6 -
The Packaging Code is expressed as 2 digits alphabet. <Table 4>
<Table 4>
Packaging
Code Description Dimension Packaging Q'ty
CS 7" REEL PACKAGING
2012, 3216, 3225 5,000 PCS
5025, 6432 4,000 PCS
ES 10" REEL PACKAGING 2012, 3216 10,000 PCS
AS 13" REEL PACKAGING
2012, 3216, 3225 20,000 PCS
5025, 6432 15,000 PCS
GS BULK CASE PACKAGING
2012 10,000 PCS
3216 5,000 PCS
PACKAGING CODE
●
5
Chip Resistor - Low Ohms
- 7 -
■PACKAGING
Packaging protects the resistor from damage during the shipping or storage.
There are two types of packaging method ; one is "Reel" type, and the other is "Bulk" type.
The packaging specification is based on the EIAJ RC-1009.
<Fig 2> is tape dimension For 2012, 3216, 3225 type. <Table 5> is for pocket sizes,
AandB.
<Fig 3> is tape dimension For 5025, 6432 type. <Table 5> is for pocket sizes, A and B.
●PACKAGING METHOD
●REEL TYPE PACKAGING SPECIFICATION
1.0 Max
1.0
2.0±0.05
4.0±0.1
4.0±0.1 A
B
1.5±
0.1
01.75±0.1
3.5±0.05
8.0±0.1
1.0 Max
Chip Resistor
Bottom Tape
Top Tape
Carrier Tape
<Fig 2>
<Fig 3>
tMAX=1.1
Chip Resistor - Low Ohms
- 8 -
There are empty holes at both start part and end part of carrier tape. <Fig 4>
Note
①The resistor should move in the pocket freely.
②The resistor should not adhere to the top or bottom tape.
③There should be no vacant pocket.
④Peeling strength of the top tape should be within 5g and 80g. <Fig 6>
<Fig 4>
10°
Top Tape
Chip Resistor
Carrier Tape
Bottom Tape
F
Peeling
<Fig 5>
Reel Packed Part Empty Part Lead Part
Adhesion Tape
*********
Start
Empty Portion Chips Empty Portion Lead Part
10 Pitches
or more
End
5,000 Pitches
or
20,000 Pitches
10 Pitches
or more 200~250 mm
●TAPING METHOD
Dimension
Symbol
2012 3216 3225 5025 6432
(0805) (1206) (1210) (2010) (2512)
A1.65 ±0.20 2.00 ±0.20 2.90 ±0.20 2.80 ±0.10 3.50 ±0.10
B2.40 ±0.20 3.60 ±0.20 3.60 ±0.20 5.30 ±0.20 6.75 ±0.10
<Table 5>
Chip Resistor - Low Ohms
- 9 -
The Reel dimension is classified by the diameter of Reel. <Fig 6> <Table 6>
Bulk cassette specification is based on the EIAJ ET-7201. <Fig 7>
The standard packaging quantity depends on the dimension. <Table 7>
Packaging Code Diameter A B C D
CS 7" 178 Φ70 9.5(13.0) ±0.1 1.2 ±0.1
E S 10" 258 Φ80 9.5 ±0.1 2.0 ±0.1
F S, A S 13" 330 Φ80 9.5 ±0.1 2.0 ±0.1
[Unit:mm]
12
36
11
0
<Fig 7> 6.0 ±0.05
4.4 ±0.05
3.4 ±0.05
<Table 7>
Dimension Inch Standard packaging quantity Weight (g, avg.)
2012 0805 10,000 PCS 65
3216 1206 5,000 PCS 67
●REEL DIMENSION
●BULK TYPE PACKAGING
<Fig 6>
<Table 6>
Chip Resistor - Low Ohms
- 10 -
▶Reel type Label
The reel type label includes following contents as <Fig 8>.
- Following -
①Resistance Value
②Tolerance, Marking
③Part Number
④Quantity
⑤LOT Number
⑥Bar-Code
⑦Serial Number
▶Bulk type Label
The bulk type label includes following contents as <Fig 9>.
- Following -
①Part Number
②Resistance Value
③LOT Number
④Quantity
⑤Bar-Code
⑥Serial Number
①The bulk or reel type packaging is packaged twice by paper box, inner box and outer box.
②The packaging should protect the resistor from damaging during shipping by vehicle, ship,
airplane and etc.
③The information of contents is marked on both inner and outer box.
※For other packaging methods, please contact us.
<Fig 8>
<Fig 9>
●LABELING
●BOX PACKAGING METHOD
0.22 JR22
Ohm
P/N : RC2012JR22CS
QTY : 5000PCS
L/N : RJBC20630
007
SAMSUNG ELECTRO MECHANICS CO.,LTD. A
V-2
④
③
②
⑤
①
⑥⑦
RC3216JR68GS
RIBG71025 ,5000pcs 0.68ohm
00
7
SAMSUNG ELECTRO- MECHANICS CO.,LTD
RC3216JR68G
S
0.68oh
m
V-2
①
②
③
④
⑤⑥
Chip Resistor - Low Ohms
- 11 -
①Max 25,000 pcs ( 5 EA ×7" ) ②Max 100,000 pcs ( 20 EA ×7" )
(Unit:mm) (Unit:mm)
③Max 300,000 pcs ( 60 EA ×7" ) ④Max 400,000 pcs ( 20 EA ×13" )
(Unit:mm) (Unit:mm)
①Inner box ( Cassette ×5EA) ②Outer box ( Inner box ×20 EA )
41
116
65
(Unit:mm) 242
135
215
(Unit:mm)
30±1.0
185±1.0
185±1.0
66±1.0
195±5.0
285±5.0
187±5.0
215±5.0
410±5.0
370±5.0
348±5.0
339±5.0
336±5.0
●BOX DIMENSION FOR BULK TYPE
●BOX DIMENSION FOR REEL TYPE
Chip Resistor - Low Ohms
- 12 -
■RELIABILITY TEST DATA
The electrical characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Test method
Resistor
DC resistance
DC resistance value
should be within the
specified resistance
tolerance.
묤Standard : JIS C 5202 (5.1)
묤Test voltage : <Table 8>
묤Applying time : within 5 seconds.
묤Test board : <Fig 10>
Temperature
Coefficient
of
Resistance
1. Tolerance F
±200ppm/℃
2. Tolerance G, J, K
묤Standard : JIS C 5202 (5.2)
묤Temp. : 20℃→-55℃→20℃→125℃→
20℃
묤Test board : <Fig 11>
묤Calculation :
TCR(ppm/℃)=
T0:20±2℃
R0:ResistanceatT
0(Ω)
T : Test temperature ( -55, 125℃)
R : Resistance at T (Ω)
Short time
overload
(STOL)
1. No mechanical
damage
2.
Δ
R should be
within ±(1%+0.1Ω)
묤Standard : JIS C 5202. (5.5)
묤Test voltage : 2.5 times of rated voltage
Max. surge current at the
Jumper.
묤Applying time : 5 seconds
묤Test board : <Fig 10>
Intermittent
overload
(IOL)
1. No mechanical
damage
2.
Δ
R should be
within ±(3%+0.1Ω)
묤Standard : JIS C 5202. (5.8)
묤Test voltage : 2.5 times of rated voltage
Max. surge current at the
Jumper.
묤Test method : 1 sec ON, 25 sec OFF
10,000+400cycles
묤Test board : <Fig 10>
<Table 8>
Range (Ω) Voltage (V)
R<1 0.1
<Table 9>
Range(Ω) ppm/℃
0.1 ≤R<1 500
RR
RTT
−
×
−
×
0
00
6
1
10
●ELECTRICAL CHARACTERISTIC
Chip Resistor - Low Ohms
- 13 -
The mechanical characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Test method
Resistor
Withstanding
voltage
묤No mechanical
damage, short circuit, or
disconnection.
묤Standard : JIS C 5202. (5.7)
묤Test voltage : AC 500V
묤Applying time : 60 +10/-0 seconds
묤Test board : <Fig 12>
Insulation
resistance
묤Shouldhavemore
than 1,000MΩ
묤Standard : JIS C 5202. (5.6)
묤Test voltage : DC 500V
묤Applying time : 60 seconds
묤Test pressure : 1.0±0.2 N
묤Test board : <Fig 12>
Noise
묤Noise standard
<Table 10>
묤Standard : JIS C 5202. (5.9)
JIS appendix1 "Noise measure in
resistor"
묤Measure equipment : QUAN-TECH NOISE
METER
(MODEL 315C)
Range (Ω)dBMax.
0.1 ≤ R < 1 -10
item
Permissible deviation
Test method
Resistor
Solderability
묤New solder
coated more than
95% of termination
묤Standard : JIS C 5202. (6.5)
묤Test temperature : 235 ±5℃
묤Test time : 2 ±0.5 sec (dipping both side)
Bending
strength
1. No mechanical
damage
2.
Δ
R should be
within ±(0.5%+0.05Ω)
묤Standard : JIS C 5202. (6.1)
묤Test board : <Fig 11>
묤Test speed : 100mm/min
묤Test procedure : press until 3mm,
then keep 5 seconds <Fig 13>
20
R205
3
<Fig 13>
●MECHANICAL CHARACTERISTIC
Chip Resistor - Low Ohms
- 14 -
The Environmental characteristic test should satisfy the test method, procedure, and standard.
If there is no special comment, Each test performs in standard state.
(temperature 20℃, humidity 65%RH, pressure 1023mbar)
item
Permissible deviation
Test method
Resistor
Termination
strength
묤No mechanical
damage, or sign of
disconnection
묤Standard : JIS C 5202 (6.1)
묤Test time : applying pressure for 10 seconds
묤Test tension : 5 N (500g묤f)
1005, 1608 - 3 N (300g묤f)
Withstanding
soldering heat
1. No mechanical
damage
2.
Δ
R should be
within ±(1%+0.05Ω)
묤Standard : JIS C 5202 (6.4)
묤Temperature : 260 ±5℃
묤Test time : 10 ±1second (both side dipping)
묤Test procedure : measures after 24 hours
Vibration
1. No mechanical
damage
2.
Δ
R should be
within ±(1%+0.05Ω)
묤Standard : JIS C 5202 (6.3)
묤Test amplitude : 1.5mm
묤Test procedure : frequency 10Hz - 55Hz -
10Hz each 2 hours in x, y, z direction.
item
Permissible deviation
Test method
Resistor
Temperature
cycle
1. No mechanical
damage
2.
Δ
R should be
within ±(1%+0.1Ω)
묤Standard : JIS C 5202 (7.4)
묤Test procedure : <Table 11>
묤Measure : after 5 cycles of procedure
묤Test board : <Fig 10>
Moisture
resistance life
1. No mechanical
damage
2.
Δ
R should be
within <Table 12>
묤Standard : JIS C 5202 (7.9)
묤Test condition : temp 40 ±3℃, humid 90 ~
95%RH
묤Test voltage : rated voltage
묤Test time : repeat 90min ON, 30min OFF
during 1000+48 hours
묤Test board : <Fig 10>
item 1 2 3 4
temp(℃)-55±25~35 125±25~35
time(min) 30 15 30 15
<Table 11>
<Table 12>
Range(Ω)
Δ
RMAX
0.1 ≤ R < 1 ±5%
●ENVIRONMENTAL CHARACTERISTIC
Chip Resistor - Low Ohms
- 15 -
▶Soldering
▷The resistor should be fixed on PCB(printed circuit board) for testing.
- Soldering specification : JIS C 5202 (6.2)
* Soldering method : Flow type(Dipping type), Reflow type
* Solder : H63A (JIS Z 3282)
* FLUX : ROSIN 25WT% (JIS K 5902), IPA 75WT% (JIS K 5901)
- Flow soldering condition
* FLUX dipping time : 5∼10 sec
* Pre-treatment : None
* Soldering temp. : 235℃±5℃
* Soldering time : 5±0.5 sec
* Temp. profile : <Fig 15>
- Reflow soldering condition
* Peak temp. : 230℃±5℃
* Duration over 220℃:15
±5sec
* Solder Cream : Sn-Pb (63-37)
* Temp. Profile : <Fig 16>
item
Permissible deviation
Test method
Resistor
Low
temperature
exposure
1. No mechanical
damage
2.
Δ
R should be
within ±(3%+0.1Ω)
묤Standard : JIS C 5202 (7.1)
묤Test temperature : -55 ±2℃
묤Test time : 1000+48 hours (without load)
묤Measure : after 1 hour
묤Test board : <Fig 10>
High
temperatur
exposure
1. No mechanical
damage
2.
Δ
R should be
within ±(3%+0.1Ω)
묤Standard : JIS C 5202 (7.2)
묤Test temperature : 2012,3216 : 155 ±
2℃, others : 125 ±2℃
묤Test time : 1000+48 hours (without load)
묤Measure : after 1 hour
묤Test board : <Fig 10>
Load life
1. No mechanical
damage
2.
Δ
R should be
within <Table 13>
묤Standard : JIS C 5202 (7.10)
묤Test temperature : 70 ±2℃
묤Test voltage : rated voltage
묤Test time : repeat 90min ON, 30min OFF
during 1000+48 hours
묤Test board : <Fig 10>.
<Table 13>
Range(Ω)
Δ
RMAX
0.1 ≤ R < 1 ±5%
●TEST BOARD AND SPECIFICATION
Chip Resistor - Low Ohms
- 16 -
▶Test board
▷Test board
<Table 14>, <Fig 10> are dimensions of test board.
* Board material : epoxy JIS C 6484
* pattern material : pure copper 99.5% or above JIS C 6484
▷Bending Test Board
<Table 15>, <Fig 11> are dimensions of bending test board.
* Board material : epoxy JIS C 6484
* pattern material : pure copper 99.5% or above JIS C 6484
▶Sketch of Withstanding voltage and Insulation resistance
<Fig 11>
b
af d=4.
5
40
c
100
<Table 15>
P2
P1P1
V
Substrate
Cu
Cu
Cu
<Fig 12>
<Fig 10>
58.5
Connector
35.08
b
c10 - φ1.0
7.5
5.5
a
f
3.5
3
25
item Dimension (mm)
Dimension Power a b c f
2012 1/8W 1.2 4.0 1.65 4.3
3216 1/4W 2.2 5.0 2.0 3.3
3225 1/4W 2.2 5.0 2.9 3.3
5025 1/2W 3.6 7.0 3.0 3.0
6432 1W 5.2 8.0 3.5 2.5
<Table 14>
item Dimension (mm)
Dimension Power a b c f
2012 1/8W 1.2 4.0 1.65 4.3
3216 1/4W 2.2 5.0 2.0 3.3
3225 1/4W 2.2 5.0 2.9 3.3
5025 1/2W 3.6 7.0 3.0 3.0
6432 1W 5.2 8.0 3.5 2.5
: COPPER PATTERN
: SOLDER - RESISTOR
: COPPER PATTERN
:SOLDER-RESISTOR
Chip Resistor - Low Ohms
- 17 -
■CHARACTERISTIC GRAPH
The Resistance Range that we produce depends on the Dimension and the Resistance
Tolerance of the resistor. <Table 16>
The Rated Power is classified by the dimension of the resistor. <Table 17>
※The rated power is specified as continuous full loading power at the ambient temperature of 70
±2℃.Incaseofthetemperatureexceeding70
±2℃, the power should be derated in
accordance to <Fig 17>.
-55
℃∼+125℃: 2012, 3216, 3225, 5025, 6432
<Fig 17>
100
80
40
60
20
0
-55
04080120
125
Ambient temperature (℃)
-40
70
Ratedloadpercent(%)
[2012, 3216, 3225, 5025, 6432]
●RESISTANCE RANGE
<Table 16>
Dimension
Tolerance
2012 3216 3225 5025 6432
(0805) (1206) (1210) (2010) (2512)
F, G, J, K 0.1Ω∼1Ω0.1Ω∼1Ω0.1Ω∼1Ω0.1Ω∼1Ω0.1Ω∼1Ω
●RATED POWER
<Table 17>
Dimension
item
2012 3216 3225 5025 6432
(0805) (1206) (1210) (2010) (2512)
Rated Power 1/8 W
(0.125 W)
1/4 W
(0.25 W)
1/4 W
(0.25 W)
1/2 W
(0.5W) 1.0 W
Working Volt.(Max.) 0.35 V 0.50 V 0.50 V 0.71 V 1.00 V
STOL, IOL Volt.(Max.) 0.88 V 1.25 V 1.25 V 1.77 V 2.50 V
▶Working Temperature
Chip Resistor - Low Ohms
- 18 -
■APPLICATION MANUAL
●Applications
Chip resistors are designed for general electronic devices such as home appliances, computer,
mobile communications, digital circuit, etc.
If you require our products with high reliability-performing at more than 125C or below -55C- for
medical equipments, aircraft, high speed machines, military usage, and items that can affect
human life or if you need to use in specific conditions (corrosive gas atmosphere), please contact
us beforehand.
▶Normal Operation temperature ranges(℃)asfollows.
:-55℃~+125℃
▶Although resistor body is coated, sharp excessive impact should be avoided to prevent
damages and adverse effects on characteristics(resistor value, open circuited, T.C.R.).
●Storage
To maintain proper quality of chip components, the following precautions are required for storage
environment, method and period.
▶Storage Environment
- Chip components may be deformed, if the temperature of packaged components exceeds
40C.
- Do not store where the soldering properties can be deteriorated by harmful gas such as
sulphurous gas, chlorine gas, etc.
- Bulk packed chip components should be used as soon as the seal is opened, thus
preventing the solderability from deteriorating.
- The remaining unused chips should be put in the original bag and sealed again or store in
a desiccator containing a desiccating agent.
▶Storage Time Period
- Stored chip components should be used within 12 months after receiving the components.
If 12 months or more have elapsed, please check the solderability before actually using.
●Mounting
Please give more attention not to press the chip owing to the nozzle's improper height when it
is mounted on PCB.
(Excessive pressure may cause exterior damage, change in resistance, circuit open, etc.)
Chip Resistor - Low Ohms
- 19 -
●Soldering
Our products have Ag electrodes protected by double layer.
▶1st Ni Coating
- This prevents Ag electrode from leaching and enhance the bonding with Sn-Pb.
▶2nd Sn-Pb Coating
- This is made of Sn 90% and Pb 10% with melting point 213℃to prevent it from melting
when solder cream melts, and to enhance the bonding.
- Commercial solder creams are made of Sn 63% and Pb 37% with melting point 183℃.
●Cleaning
After Soldering Cleaning, soldering flux & Ionic cleaning liquid should be avoided on product.
If any possibility on product, please take a test before usage.
●Caution for chip resistor separation from PCB
Chip resistor installation on PCB is similar phenomenon on chocolate chip on top of cake.
PCB has enough flexibility on outer force but Chip resistor can be defected without any bending.
(By chip resistor use of Ceramic, solder, metal)
Therefore, when separate from Chip resistor on PCB, be ware of any crack of chip
●Others
▶Manual work
- Whenever separate chip resistor from PCB, do not re-use the chip resistor for circuit safety.
Chip resistor can be electrical specification change by soldering Iron after separation.
Re-use of separated chip resistor should be prohibited.
▶Do not use more than rated voltage.(check the contents on the file)
Chip Resistor - Low Ohms
- 20 -
■NOTICE
●Usage of the resistor
▶Flow Soldering
After sticking the resistor to PCB with paste, dip the PCB into solder bath. <Fig 15>
▶Reflow Soldering
After printing solder creams on PCB, place the resistor on the solder cream.
Then heat the PCB. <Fig 16>
●Caution
▶Storage condition
Please make sure that keep the storage conditions.
* Temperature : 5℃∼35℃,*Humidity:45%RH∼85%RH
▶Damage control
Please handle with care, to prevent damaging the resistor.
Specially, the excessive nozzles' height of SMD or the extreme touch with tweezers.
▶Leaching prevention
It is important to keep the soldering conditions for prevent Ag leaching in Flow soldering.
<Fig 15> Temp.
Soldering Cooling
235±5℃
within 5 sec
<Fig 16> Temp.
Pre-heating Soldering Cooling
within 120 sec
230±5℃
160℃
within 20 sec
200℃
130℃
Pre-heating
Δ
T≤150℃
Peak temp.
within 10 sec
Time
Time
