Surface Mount Metallized PPS Film Capacitor LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Overview Applications Polyphenylene sulphide (PPS) film capacitor for surface mounting. Typical applications include timing, filtering and use as a memory capacitor. The LDB Series is designed for high stability, accuracy and temperature. Benefits * Rated voltage: 16VDC - 50VDC * Capacitance range: 0.0033F - 0.1F * EIA Size 1206 - 1812 * Capacitance tolerance: 2%, 5% * Climatic category: 55/125/56 * RoHS compliance and lead-free terminations * Operating temperature range of -55C to +125C Part Number System LDB A A 2120 G C 5 N 0 Series Rated Voltage (VDC) Size Code Capacitance Code (pF) Capacitance Tolerance Dielectric Version Packaging Internal Use Digits two - four indicate the first three digits of the capacitance value. First digit indicates the number of zeros to be added. G = 2% J = 5% C = PPS 5 = Standard See Ordering Options Table 0 (Standard) Metallized PPS A = 16 C = 50 See Dimension Table One world. One KEMET (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 1 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Ordering Options Table Packaging Code Packaging Type Standard Packaging Options Tape & Reel (Standard Reel) N Dimensions - Millimeters L W B H W Size Code Chip Size (EIA) Nominal Tolerance A B C 1206 1210 1812 1.7 2.5 3.3 0.2 0.3 0.3 H (Maximum) See Part Number Table L B Nominal Tolerance Nominal Tolerance 3.3 3.3 4.7 +0.3/-0.1 +0.3/-0.1 +0.3/-0.2 0.5 0.5 0.5 +0.5/-0.3 +0.5/-0.3 +0.5/-0.3 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 2 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Performance Characteristics Rated Voltage (VDC) Capacitance Range (F) Chip Size (EIA) Capacitance Values Capacitance Tolerance Category Temperature Range Rated Temperature Voltage Derating 16 50 0.012 - 0.1 0.0033 - 0.1 1206 - 1812 E12 series 2%, 5% -55C to +125C +105C VC (category voltage) = VR (rated voltage) up to 105C. Vc is decreased with 1.25%/C from +105 C to +125 C Climatic Category 55/125/56 Capacitance Drift Maximum 1% after a 2 year storage period at a temperature of +10C to +40C and a relative humidity of 40% to 60% Failure rate 1 FIT, T = +40C, V = 0.5 x VR Reliability (Reference MIL-HDBK-217) 1 FIT = 10 -9 failures / (components * hours) Failure criteria: open or short circuit, cap. change > 10%, DF 2 times the catalog limits, IR < 0.005 x initial limit Measured at +25C 5C Minimum Value Between Terminals Insulation Resistance Dissipation Factor Surge Voltage Test 3,000 M Charging time: 1 minute Charging voltage: 10 VDC for VR = 16 VDC 50 VDC for VR = 50 VDC Maximum Values at 25C 5C 1 kHz 0.6% 1.75 x VR (5 seconds; T = 25 5C) (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 3 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC PPS Dielectric Typical Temperature Graphs PPS Dielectric Typical Frequency Graphs Capacitance vs. Frequency Capacitance vs. Temperature (f = 1 kHz) 2.0 1.5 1.0 C/C [%] 1.0 C/C [%] 0.5 0.0 -0.5 0.0 -1.0 -1.5 -0.5 -2.0 0.1 -1.0 -1.5 -60 -40 -20 0 20 40 60 80 1 10 100 f [kHZ] 100 tg x 10-4 80 Dissipation Factor vs. Temperature (f = 1 kHz) 1,000 Dissipation Factor vs. Frequency 100 120 140 Temperature [C] 0.1 F 60 40 20 50 0 0.1 40 30 10 nF 1 10 100 f [kHZ] 1,000 Equivalent Series Resisteance vs. Frequency 20 1E+2 10 1E+1 0 -60 -40 -20 0 20 40 60 80 100 120 140 ESR [] tg x 10-4 0.5 Temperature [C] 10 nF 1E+0 0.1 F 1E-1 1E-2 0.1 Insulation Resistance vs. Temperature 1E+7 1 10 100 f [kHZ] 1,000 PEN and PPS Impedance vs. Frequency 1E+6 1 |Z| [] IR [M] 10 1E+5 0.1 1E+4 -60 -40 -20 0 20 40 60 80 Temperature [C] 100 120 140 0.01 0.1 1.0 F 1 0.1 F f [MHZ] 0.01 F 10 100 Note: Measurements performed at T = 255C (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 4 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Environmental Test Data Damp Heat, Steady State Test Conditions Temperature Relative Humidity (RH) Test Duration Test Conditions Capacitance Change | C/C| 93% 2% DF Change (tg) 56 days Insulation Resistance 3% 50 x 10-4 at 1 kHz limit value No Mechanical Damage 5% DF Change (tg) 30 x 10 at 1 kHz Insulation Resistance 50% of limit value Bending -4 Test Conditions Deflection Endurance Test Conditions Temperature 125C 2C Test Duration 2,000 hours Voltage Applied See Solder Process Performance +40C 2C Performance Capacitance Change | C/C| Reflow 1 to 6 mm Performance Capacitance Change | C/C| 1% No visible damage on the terminations (pealing) neither on the body (cracking) 1.25 x VC Performance Capacitance Change | C/C| 3% DF Change (tg) 30 x 10-4 at 1 kHz Insulation Resistance 50% of limit value Rapid Change of Temperature Test Conditions 1 hour at -55C, 1 hour at Temperature +125C Number of Cycles 1,000 Performance Capacitance Change | C/C| DF Change (tg) Insulation Resistance 3% 50 x 10-4 at 1 kHz limit value No Mechanical Damage Environmental Compliance All KEMET surface mount capacitors are RoHS Compliant. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 5 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Table 1 - Ratings & Part Number Reference Dimensions in mm VDC Capacitance Value (F) Size Code Chip Size New KEMET Part Number Legacy Part Number W H (max) L 16 16 16 16 16 16 16 16 16 16 16 16 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 50 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.0033 0.0039 0.0047 0.0056 0.0068 0.0082 0.010 0.012 0.015 0.018 0.022 0.027 0.033 0.039 0.047 0.056 0.068 0.082 0.10 A A A A A A A A B B B B A A A A A A A A B B B B B B B C C C C 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 2.5 2.5 2.5 2.5 1.7 1.7 1.7 1.7 1.7 1.7 1.7 1.7 2.5 2.5 2.5 2.5 2.5 2.5 2.5 3.3 3.3 3.3 3.3 1.1 1.1 1.1 1.1 1.1 1.1 1.2 1.3 1.7 1.7 1.7 2.0 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.4 1.5 1.5 1.5 1.7 1.9 2.3 1.7 1.7 1.7 2.0 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 4.7 4.7 4.7 4.7 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 DBAA2120(1)C5N0 DBAA2150(1)C5N0 DBAA2180(1)C5N0 DBAA2220(1)C5N0 DBAA2270(1)C5N0 DBAA2330(1)C5N0 DBAA2390(1)C5N0 DBAA2470(1)C5N0 DBAB2560(1)C5N0 DBAB2680(1)C5N0 DBAB2824(1)C5N0 DBAB3100(1)C5N0 DBCA1330(1)C5N0 DBCA1390(1)C5N0 DBCA1470(1)C5N0 DBCA1560(1)C5N0 DBCA1680(1)C5N0 DBCA1820(1)C5N0 DBCA2100(1)C5N0 DBCA2120(1)C5N0 DBCB2150(1)C5N0 DBCB2180(1)C5N0 DBCB2220(1)C5N0 DBCB2270(1)C5N0 DBCB2330(1)C5N0 DBCB2390(1)C5N0 DBCB2470(1)C5N0 DBCC2560(1)C5N0 DBCC2680(1)C5N0 DBCC2824(1)C5N0 DBCC3100(1)C5N0 LDBAA2120(1)C5N0 LDBAA2150(1)C5N0 LDBAA2180(1)C5N0 LDBAA2220(1)C5N0 LDBAA2270(1)C5N0 LDBAA2330(1)C5N0 LDBAA2390(1)C5N0 LDBAA2470(1)C5N0 LDBAB2560(1)C5N0 LDBAB2680(1)C5N0 LDBAB2824(1)C5N0 LDBAB3100(1)C5N0 LDBCA1330(1)C5N0 LDBCA1390(1)C5N0 LDBCA1470(1)C5N0 LDBCA1560(1)C5N0 LDBCA1680(1)C5N0 LDBCA1820(1)C5N0 LDBCA2100(1)C5N0 LDBCA2120(1)C5N0 LDBCB2150(1)C5N0 LDBCB2180(1)C5N0 LDBCB2220(1)C5N0 LDBCB2270(1)C5N0 LDBCB2330(1)C5N0 LDBCB2390(1)C5N0 LDBCB2470(1)C5N0 LDBCC2560(1)C5N0 LDBCC2680(1)C5N0 LDBCC2824(1)C5N0 LDBCC3100(1)C5N0 VDC Capacitance Value (F) Size Code W (mm) H (mm) L (mm) Chip Size New KEMET Part Number Legacy Part Number (1) G = 2%, J = 5%. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 6 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Soldering Process Reflow Recommendations Preheating Maximum Preheating Time 180 seconds Minimum Temperature 150C Maximum Temperature 200C Maximum Time within Tmax and Tmax - 5C (T5) Maximum Time Over 217C (T217) Maximum Temperature Ramp Rate Temperature Reflow Temperature Profile Tmax Tmax-5C T5 217C Preheating T217 30 seconds (Tmax 250C) 10 seconds (250 C < Tmax 260C) Linear profiles are also allowed (if in line with the reflow recommendations) Time 150 seconds 3C/seconds (heating) 6C/seconds (cooling) Second reflow If two reflow processes are needed, be sure that before the second reflow, the temperature on the capacitor's surface is lower than 50C. * Maximum Temperature on the component's body (Tmax): = 260 C. Flux/Cleaning/Storage and Moisture Flux suggestions KEMET suggests to use a no-clean flux with a halogen content lower than 0.1%. Cleaning suggestions To clean the PCB assembly KEMET recommends to use a suitable solvent like Isopropyl alcohol, deionized water or neutral pH detergents. Aggressive solvents shall not be used. For any different cleaning solvent used please contact KEMET Technical Services to analyze the potential impact on KEMET products. Storage and moisture recommendations KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life (temperature 40C/relative humidity 90%). After the MBB has been opened, components may stay in areas with controlled temperature and humidity (temperature 30C/relative humidity 60%) for 168 hours [MSL 3]. For longer periods of time and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected, components require a baking (minimum time: 48 hours at 555C) before the reflow. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 7 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Flux/Cleaning/Storage and Moisture cont'd B Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. 1): C 1. When using tweezers, the components should be gripped across the two terminations (A); 2. Avoid any contact with the two cutting surfaces (C); 3. A vacuum pen is recommended on the top and bottom surfaces (B). A A C B Fig. 1 Manual soldering recommendations LDE and LDB series have been designed for Surface Mount Technology, pick and place machines and reflow soldering systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350C. Therefore please pay careful attention: * Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 2); * If the soldering iron is equipped with a temperature controller device: Set the temperature to 2503C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds); * If the soldering iron is NOT equipped with a temperature controller device: This is the worst situation. The following are a few practical suggestions but, clearly, the operator's experience is extremely important: 1. Proceed as per Fig. 2; 2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible; 3. Wait a few seconds and check that the soldering joint has been properly created; * If the soldering iron is equipped with a hot air flow device: Set the hot air temperature to 2503C and do not send the hot air directly onto the capacitor plastic body. In this situation, the operator's experience is very important; * In any case, avoid mass-mounting SMD Film Capacitors manually. Tin Wire Fig. 2 Landing Area SMD Film Capacitor Soldering Iron PCB (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 8 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Packaging Quantities Chip Size (EIA) 1206 1206 1206 1210 1210 1210 1210 1210 1210 1812 1812 Height (mm) Reel 1.1 1.2 1.3 1.4 1.5 1.7 1.9 2.0 2.3 1.7 2.0 3,000 3,000 3,000 2,250 2,250 2,250 2,250 2,250 2,250 4,000 3,000 Landing A B Size 1206 1210 1812 C D Dimensions in mm A B C D 1.5 2.3 3 1.1 1.1 1.7 2.3 2.3 3.1 4.5 4.5 6.5 These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design. We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 - 0.15 mm). If a NOT Lead Free solder paste is used, a minimum peak temperature of 210C on the component's body is suggested. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 9 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Production process basic suggestions In case of: no solder joint on one end termination no solder joint on both end termination capacitor's body mechanical deformation capacitance drop (up to 20%) capacitance drop (over 20%) Typical cause Typical solution landing area dimensions see landing areas suggestions, page 9 solder paste quality see solder paste suggestions, page 9 not-uniform solder paste thickness on the landing areas wrong position of the capacitor on the landing areas set the dispensing solder paste machine properly set the pick and place machine properly thermal profile temperature see reflow recommendations, page 7 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations" landing area dimensions see landing areas suggestions, page 9 solder paste quality see solder paste suggestions, page 9 no solder paste on the landing areas set the dispensing solder paste machine properly thermal profile temperature see reflow recommendations, page 7 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations oxidated end terminations see moisture recommendations, page 8 too long time over 217C see reflow recommendations, page 7 too long time within Tmax and Tmax-5C see reflow recommendations, page 7 too high temperature ramp rate see reflow recommendations, page 7 capacitor damaged by a soldering iron see manual soldering recommendations, page 8 too long time over 217C see reflow recommendations, page 7 too long time within Tmax and Tmax-5C see reflow recommendations, page 7 too high temperature ramp rate see reflow recommendations, page 7 capacitor damaged by a soldering iron see manual soldering recommendations, page 8 capacitor damaged by a soldering iron see manual soldering recommendations, page 8 Note: small fissures on the capacitor's cutting surface are actually slight detachments of two adjacent metallized film layers and have to be considered only as an aesthetic issue related to the SMD Film Capacitors' manufacturing process and technology. Therefore, small fissures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics. Fissures do not influence in anyway SMD Film Capacitors' reliability. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 10 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC Carrier Taping & Packaging (IEC 60286-2) Horizontal Taping Orientation 2.00.05 1.5 +0.1 0 1.750.1 +0.3 W-0.1 L P0.1 SMD Film Capacitor (Top View) Chip Size (EIA) Horizontal Mounting 1206 1210 1812 1812 W2 T B0 4.00.1 K0 A0 Tape O W1 Reel Dimensions in mm Taping Specification W H L W Nominal Nominal Nominal -0.1/+0.3 +/-0.1 P1 Nominal Nominal Nominal -/+2.0 -0/+2 Maximum 1.7 2.5 3.3 3.3 All All 1.9 2.1 - 2.6 3.3 3.3 4.7 4.7 8 8 12 12 4 4 8 8 2 3 3.8 3.9 3.8 3.8 5.3 5.2 1.3 2.1 2 2.6 180 180 330 330 8 8 12 12 12 12 16 16 A0 B0 K0 D W1 W2 In accordance with IEC 60286-3 Materials: - carrier tape: antistatic material - cover tape: polyester + polythene - reel: recyclable polystyrene All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 11 Surface Mount Metallized PPS Film Capacitors LDB, Unencapsulated Stacked Chip, Size 1206 - 1812, 16 and 50 VDC KEMET Electronics Corporation Sales Offices For a complete list of our global sales offices, please visit www.kemet.com/sales. Disclaimer All product specifications, statements, information and data (collectively, the "Information") in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation's ("KEMET") knowledge of typical operating conditions for such applications, but are not intended to constitute - and KEMET specifically disclaims - any warranty concerning suitability for a specific customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET's products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 * 864-963-6300 * www.kemet.com F3082_LDB * 7/31/2017 12