KIA7019AP/AF/AT~ KIA7045AP/AF/AT SEMICONDUCTOR TECHNICAL DATA BIPOLAR LINEAR INTEGRATED CIRCUIT VOLTAGE DETECTOR B C A Function of this IC is accurately resetting the system after detecting voltage at the time of switching power on and instantaneous power off in various CPU systems and other logic systems. N G J D FEATURES DIM A B C D E F G H J K L M N E K *Current Consumption is Low. ICCL=300A Typ. ICCH=30A Typ. *Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ. H *Hysteresis Voltage is Provided. 50mV Typ. F F *Reset Signal Generation Starting Voltages : L 3 2 C 1 KIA7033 3.3V Typ. KIA7021 2.1V Typ. KIA7034 3.4V Typ. 1. VCC KIA7023 2.3V Typ. KIA7035 3.5V Typ. 2. GND 3. OUT KIA7025 2.5V Typ. KIA7036 3.6V Typ. KIA7027 2.7V Typ. KIA7039 3.9V Typ. KIA7029 2.9V Typ. KIA7042 4.2V Typ. KIA7031 3.1V Typ. KIA7045 4.5V Typ. M KIA7019 1.9V Typ. MILLIMETERS 4.70 MAX 4.80 MAX 3.70 MAX 0.45 1.00 1.27 0.85 0.45 _ 0.50 14.00 + 0.55 MAX 2.30 0.45 MAX 1.00 TO-92 KIA7032 3.2V Typ. A C H *Taping Type is also Available. J B E G APPLICATIONS (1) As Control Circuit of Battery-Backed Memory. DIM A B C D E F G H J K D D K (2) As Measure Against Erroneous Operations at Power ON-OFF. (3) As Measure Against System Runaway at Instantaneous Break F F of Power Supply etc. (4) As Resetting Function for the CPU-Mounted Equipment, 1 2 3 MILLIMETERS 4.70 MAX _ 0.20 2.50 + 1.70 MAX 0.45+0.15/-0.10 4.25 MAX _ 0.10 1.50 + 0.40 TYP 1.75 MAX 0.75 MIN 0.5+0.10/-0.05 such as Personal Computers, Printers, VTRs and so forth. 1. VCC 2. GND 3. OUT EQUIVALENT CIRCUIT Heat Sink is common to 2 (GND) VCC SOT-89 OUT + - E K B K DIM A B GND D G G Marking Type No. Marking KIA7019AF/AT 6A KIA7029AF/AT 6F KIA7035AF/AT 6L KIA7021AF/AT 6B KIA7031AF/AT 6G KIA7036AF/AT 6M KIA7023AF/AT 6C KIA7032AF/AT 6H KIA7039AF/AT 6N KIA7025AF/AT 6D KIA7033AF/AT 6J KIA7042AF/AT 6P 1 I J KIA7034AF/AT 6K KIA7045AF/AT 0.00-0.10 0.25+0.25/-0.15 0.60 0.55 H 2 3 2. OUT 1 3. GND 6E 2.8+0.2/-0.3 _ 0.2 1.9 + 0.95 _ 0.05 0.16 + J 1. VCC KIA7027AF/AT D E F G H I J K L L Type No. 3 F A Marking C Marking Type No. C 2 MILLIMETERS _ 0.2 2.9 + 1.6+0.2/-0.1 _ 0.05 0.70 + _ 0.1 0.4 + 6R TSM 2005. 2. 3 Revision No : 4 1/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT MAXIMUM RATINGS (Ta=25) CHARACTERISTIC Supply Voltage SYMBOL RATING UNIT VCC -0.3+15.0 V 400 KIA7019AP45AP Power Dissipation (Package Limitation) PD KIA7019AF45AF mW 500 350 KIA7019AT45AT Operating Temperature Topr -30+85 Storage Temperature Tstg -55+150 ELECTRICAL CHARACTERISTICS (VCC=5V, VEE=GND, Ta=25) CHARACTERISTIC Detecting Voltage SYMBOL VS TEST CIRCUIT 1 TEST CONDITION RL=200 VOL0.4V MIN. TYP. MAX. KIA7019 1.75 1.9 2.05 KIA7021 1.95 2.1 2.25 KIA7023 2.15 2.3 2.45 KIA7025 2.35 2.5 2.65 KIA7027 2.55 2.7 2.85 KIA7029 2.75 2.9 3.05 KIA7031 2.95 3.1 3.25 KIA7032 3.05 3.2 3.35 KIA7033 3.15 3.3 3.45 KIA7034 3.25 3.4 3.55 KIA7035 3.35 3.5 3.65 KIA7036 3.45 3.6 3.75 KIA7039 3.75 3.9 4.05 KIA7042 4.05 4.2 4.35 KIA7045 4.35 4.5 4.65 UNIT V Low-Level Output Voltage VOL 1 RL=200 - - 0.4 V Output Leakage Current IOH 1 VCC=15V - - 0.1 A Vs 1 RL=200 30 50 100 mV Vs/T 1 RL=200 - 0.01 - %/ Circuit Current at on Time IccL 1 VCC=Vsmin.-0.05V - 300 500 A Circuit Current at off Time IccH 1 VCC=5.25V - 30 50 A Threshold Operating Voltage Vopr 1 RL=200, VOL0.4V - 0.8 - V "L" Transmission Delay Time tpHL 2 RL=1.0k, CL=100pF - 10 - s "H" Transmission Delay Time tpLH 2 RL=1.0k, CL=100pF - 15 - s Output Current at on Time I IoL I 1 VCC=Vsmin.-0.05V, Tc=25 20 - - mA Output Current at on Time II IoL II 1 VCC=Vsmin.-0.05V, Tc=-30+75 16 - - mA Hysteresis Voltage Detecting Voltage Temperature Coefficient 2005. 2. 3 Revision No : 4 2/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT TEST CIRCUIT 1. A2 A1 1 RL V1 3 KIA70XX 2 10uF/10V M TEST CIRCUIT 2. 1 RL KIA70XX 0.2uF /10V Input Pulse 3 10uF/10V CL 2 5.0V M APPLICATION CIRCUIT (1) BATTERY LOW INDICATOR (2) CPU RESETTING VCC 1 KIA70XX VCC 5V 1 R2 KIA70XX 3 R1 VCC 3 Reset LED CPU GND C1 2 2 VCC 5V VS Delay Time for Power ON Reset (Note) (1) Connecting of LED and R2 obtains a voltage drop indicator. (2) Connecting of C1 and selection of time constant with C1 and R1 set the power on delay time. 2005. 2. 3 Revision No : 4 3/4 KIA7019AP/AF/AT~KIA7045AP/AF/AT PRECAUTION FOR USE Lead-Free Soldering Condition. Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent excellent reliability. _ 1sec 10 + _3 C Peak : 260 + Temperature ( C) 250 C 230 C 180 C 150 C _ 30sec 90 + _ 5sec 35 + Preheating Zone Reflow Zone Time (sec) [Lead-Free Soldering Temperature Profile] 1. When employing solder reflow method 1) Soldering Condition Standard Condition : 250 (Temperature), 101sec. (Time) Peak Condition : 2603 2) Recommend temperature profile 3) Precautions on heating method When resin in kept exposed to high temperature for a long time, device reliability may be marred. Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising. 2. When employing halogen lamps or infrared-ray heaters When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices cause extensive localized temperature rise. Please keep a reflow solder operating when Surface Mount Package s Soldering. 2005. 2. 3 Revision No : 4 4/4