© 2008 Semiconductor Components Industries, LLC Publication Order Number:
October-2017, Rev. 2 FSA1208/D
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
FSA1208
Low-Power, Eight-Port, High-Speed Isolation Switch
Features
Low On Capacitance: 6 pF Typical
Low On Resistance: 15 Ω Typical
Low Power Consumption: 1 A Maximum
10 μA Maximum ICCT over an Expanded Voltage
Range (VIN=2.3 V, VCC=4.3 V)
Wide -3 dB Bandwidth: > 400 MHz
Packaged in Space-Saving 20-Lead MLP
(2.5 x 4.5 mm)
7.5 kV ESD Rating; >16 kV Power/GND ESD
Rating
Low COFF Capacitance: 2.5 pF Typical
Applications
DIMM DDR Memory
Description
The FSA1208 is a low-power, eight-port, high-speed
switch. This part is configured as a single-pole, single-
throw switch and is optimized for isolating a high-
speed source, such as a DDR memory bus. The
FSA1208 features an extremely low on capacitance
(CON) of 6 pF Superior channel-to-channel crosstalk
minimizes interference.
The FSA1208 contains special circuitry on the A & B
pins that allows the device to withstand an over-voltage
condition. This device is also designed to minimize
current consumption even when the control voltage
applied to the /OE pin is lower than the supply voltage
(VCC). Applications include port isolation and switching
in DDR memory modules, portable cell phones, PDAs,
digital cameras, printers, and notebook computers.
Ordering Information
Part Number
Top Mark
Operating
Temperature Range
Package
FSA1208BQX
F1208
-40 to +85°C
20-Lead, Quad, Molded Leadless Package
(MLP), 2.5 x 4.5 mm
DIMM
DIMM Slot
OEOE VCC
FSA1208
1A
2A
3A
4A
5A
6A
7A
8A
1B
2B
3B
4B
5B
6B
7B
8B
DIMM
Figure 1. Analog Symbol
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2
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
Pin Configurations
Figure 2. Pin Assignments for MLP (Top Through View)
Pin Definitions
Pin #
Name
Description
20
/OE
Switch Enable
2-9
A1-A8
A Side of Bus
12-19
B8-B1
B Side of Bus
11
NC
No Connection
1
VCC
Power
10
GND
Ground
Truth Table
/OE
Function
HIGH
Disconnect
LOW
A1-A8=B1-B8
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3
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VCC
Supply Voltage
-0.50
+5.25
V
VCNTRL
DC Input Voltage (/OE)(1)
-0.50
VCC
V
VSW
DC Switch I/O Voltage(1)
-0.50
5.25
V
IIK
DC Input Diode Current
-50
mA
IOUT
DC Output Current
50
mA
TSTG
Storage Temperature
-65
+150
°C
ESD
Human Body Model, JEDEC: JESD22-A114
All Pins
7.5
kV
I/O to GND
8
Power to GND
16
Charged Device Model, JEDEC: JESD22-C101
2
Note:
1. The input and output negative ratings may be exceeded if the input and output diode current ratings are
observed.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. ON Semiconductor
does not recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
Min.
Max.
Unit
VCC
Supply Voltage
2.3
4.3
V
VCNTRL(2)
Control Input Voltage (S, /OE)
0
VCC
V
VSW
Switch I/O Voltage
-0.5
VCC
V
TA
Operating Temperature
-40
+85
°C
Note:
2. The control input must be held HIGH or LOW; it must not float.
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4
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
DC Electrical Characteristics
All typical values are at 25°C unless otherwise specified.
Symbol
Parameter
Conditions
VCC (V)
TA=- 40ºC to +85ºC
Units
Min.
Typ.
Max.
VIK
Clamp Diode Voltage
IIN=-18 mA
2.5
-1.2
V
VIH
Input Voltage High
2.3 to 3.6
1.3
V
4.3
1.7
V
VIL
Input Voltage Low
2.3 to 3.6
0.5
V
4.3
0.7
V
IIN
Control Input Leakage
VSW=0 to VCC
4.3
-1
1
µA
IOZ
Off State Leakage
0 A, B 3.6 V
4.3
-2
2
µA
RON
Switch On Resistance(3)
VSW=0 V, ION=-10 mA
Figure 3
2.5
7
VSW=1.8 V, ION=-10 mA
Figure 3
2.5
15
ICC
Quiescent Supply Current
VIN=0 or VCC, IOUT=0
4.3
1
µA
ICCT
Increase in ICC Current Per
Control Voltage and VCC
VIN=1.8 V
2.7
10
µA
Note:
3. Measured by the voltage drop between A and B pins at the indicated current through the sw itch.
On resistance is determined by the lower of the voltage on the two (A or B ports).
AC Electrical Characteristics
All typical values are for VCC=2.5 V at 25°C unless otherwise specified.
Symbol
Parameter
Conditions
VCC (V)
TA=- 40ºC to +85ºC
Units
Min.
Typ.
Max.
ton
Turn-On Time, /OE to Output
RL=50 Ω, CL=5 pF
VSW=1.8 V
Figure 4, Figure 5
2.3 to 3.6
15
34
ns
tuff
Turn-Off Time, /OE to Output
RL=50 Ω, CL=5 pF
VSW=1.8 V
Figure 4, Figure 5
2.3 to 3.6
12
25
ns
tad
Propagation Delay(4)
RL=50 Ω, CL=5 pF
Figure 4, Figure 6
3.3
0.35
ns
OIRR
Off Isolation
RL=50 Ω, f=400 MHz
Figure 11
2.3 to 3.6
-40
dB
Xtalk
Non-Adjacent Channel
Crosstalk
RL=50 Ω, f=100 MHz
Figure 12
2.3 to 3.6
-40
dB
BW
-3dB Bandwidth
RL=50 Ω, CL=0 pF
Figure 10
2.3 to 3.6
1000
MHz
RL=50 Ω, CL=5 pF
Figure 10
750
MHz
Note:
4. Guaranteed by characterization.
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5
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
High-Speed-Related AC Electrical Characteristics
Symbol
Parameter
Conditions
VCC (V)
TA=- 40ºC to +85ºC
Units
Min.
Typ.
Max.
tSK(O)
Channel-to-Channel Skew(5)
CL=5 pF
3.3
40
80
ps
tSK(P)
Skew of Opposite Transitions
of the Same Output(5)
CL=5 pF
3.3
15
40
ps
tSK(PKG)
Package-to-Package Skew(5)
CL=5 pF
3.3
60
100
ps
Note:
5. Guaranteed by characterization.
Capacitance
Symbol
Parameter
Conditions
TA=- 40ºC to +85ºC
Units
Min.
Typ.
Max.
CIN
Control Pin Input Capacitance
VCC=0.2 V, f=1 MHz
2.0
pF
CON
D+/D- On Capacitance
VCC=2.5 V, /OE=0 V, f=1 MHz
Figure 9
6.0
COFF
D1n, D2n Off Capacitance
VCC and /OE=2.5 V, f=1 MHz
Figure 8
2.5
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6
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
Test Diagrams
Figure 3. On Resistance
tRISE= 2.5ns
GND
VCC 90%90%
10%10%
tFALL = 2.5ns
VCC /2 VCC /2
Input–V/OE,VSel
Output- VOUT
90%
VOH
VOL tON tOFF
90%
V
–V
V
–
Figure 4. AC Test Circuit Load
Figure 5. Turn-On / Turn-Off Waveforms
tRISE= 500ps
-400mV
90%90%
10%10%
tFALL =500ps
0V
Output
tPHL
+400mV
tPLH
Figure 6. Propagation Delay
(try to – 500ps)
Figure 7. Intra-Pair Skew Test tSK(P)
Figure 8. Channel Off Capacitance
Figure 9. Channel On Capacitance
V
S
e
l
=
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r
V
c
c
B
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C
a
p
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i
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A
n
V
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V
c
c
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a
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i
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e
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V
OU
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/O
E
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V
S
W
G
N
D
S
W
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7
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
Test Diagrams (Continued)
VOUT
GND
GND RT
GND
GND
VS
RS
Network Analyzer
VSel
GND
RSand RTare functions of the application
environment (see AC Tables for specific values).
VIN
Figure 10. Bandwidth
Figure 11. Channel Off Isolation
Figure 12. Non-Adjacent Channel-to-Channel Crosstalk
V
OU
T
G
N
D
G
N
D
R
T
G
N
D
G
N
D
V
S
R
S
N
e
t
w
o
r
k
A
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V
S
e
l
G
N
D
N
C
V
I
N
Crosstalk
=
20
L
og
(
V
OUT
/ V
IN
)
R
S
a
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R
T
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V
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G
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D
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G
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S
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w
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A
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G
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V
S
e
l
G
N
D
V
I
N
R
T
Off isolation = 20 Log (V
OUT
/ V
IN
)
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8
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
Physical Dimensions
Figure 13. 20-Lead, Molded Leadless Package (MLP)
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9
FSA1208 — Low-Power, Eight-Port, High-Speed Isolation Switch
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