SA56004ATK,118"" - NXP SEMICONDUCTORS

1. General description

The NXP Semiconductors SA56004X is an SMBus compatible, 11-bit remote/local digital

temperature sensor with overtemperature alarms. The remote channel of the SA56004X

monitors a diode junction, such as a substrate PNP of a microprocessor or a diode

connected transistor such as the 2N3904 (NPN) or 2N3906 (PNP). With factory trimming,

remote sensor accuracy of 1C is achieved.

Undertemperatu re and overtemperature alert thr esholds can be programmed to cau se the

ALERT output to indicate when the on-chip or remote temperature is out of range. This

output may be used as a system interrupt or SMBus alert. The T_CRIT output is activated

when the on-chip or remote temperature measurement rises above the programmed

T_CRIT threshold register value. This output may be used to activate a cooling fan, send

a warning or trigger a system shutdown. To enhance system reliability further, the

SA56004X employs an SMBus time-out protocol. The SA56004X has a unique device

architecture.

The SA56004X is available in the SO8, TSSOP8 an d HVSON8 packages. SA56004X has

8 factory-programmed device address options. The SA56004X is pin-compatible with the

LM86, MAX6657/8, and ADM1032.

2. Features and benefits

Accurately senses temperature of remote microprocessor thermal diodes or diode

connected tr an sistors within 1C

On-chip local temperature sensing within 2C

Temperature range of 40 C to +125 C

11-bit, 0.125 C resolution

8 different device addresses are available for server applications. The SA56004ED

with marking code 56004E, and SA56004EDP with marking code 6004E are address

compatible with the National LM86, the MAX6657/8 and the ADM1032.

Offset registers available for adjusting the remote temperature accuracy

Programmable under/overtemperature alarms: ALERT and T_CRIT

SMBus 2.0 compatible interface, supports TIMEOUT

Operating voltage range: 3.0 V to 3.6 V

I2C-bus Standard-mode and Fast-mode compatible

SO8, TSSOP8 and HVSON8 packages

Programmable conversion rate (0.0625 Hz to 26 Hz)

Undervoltage lockout prevents erroneous temperature readings

Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

SA56004X

SMBus-compatible, 8-pin, remote/local digital temperature

sensor with overtemperature alarms

Rev. 7 — 25 February 2013 Product data sheet

Product data sheet Rev. 7 — 25 February 2013 2 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

3. Applications

System thermal management in laptops, desktops, ser vers and workstations

Computers and office electronic equipment

Electronic test equipment and instrumentation

HVAC

Industrial controllers and embedded systems

4. Ordering information

[1] There are 8 device slave address options, as described in Table 4.

Table 1. Ordering information

Type number[1] Topside

marking Package

Name Description Version

SA56004AD 56004AD SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

SA56004BD 56004BD

SA56004CD 56004CD

SA56004DD 56004DD

SA56004ED 56004ED

SA56004FD 56004FD

SA56004GD 56004GD

SA56004HD 56004HD

SA56004ADP 6004A TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

SA56004BDP 6004B

SA56004CDP 6004C

SA56004DDP 6004D

SA56004EDP 6004E

SA56004FDP 6004F

SA56004GDP 6004G

SA56004HDP 6004H

SA56004A TK 6004A HVSON8 plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 30.85 mm SOT782-1

SA56004ETK 6004E

Product data sheet Rev. 7 — 25 February 2013 3 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

4.1 Ordering options

Table 2. Ordering options

Type number Orderable

part number Package Packing meth od Minimum

order quantity Temperature

SA56004AD SA56004AD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004AD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004BD SA56004BD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004BD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004CD SA56004CD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004CD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004DD SA56004DD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004DD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004ED SA56004ED,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004ED,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004FD SA56004FD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004FD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004GD SA56004GD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004HD SA56004HD,112 SO8 Tube, bulk pack 2000 Tamb = 40 C to +125 C

SA56004HD,118 SO8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004ADP SA56004ADP,118 TSSOP8 Reel pack, SMD, 13-inch 2 500 Tamb = 40 C to +125 C

SA56004BDP SA56004BDP,118 TSSOP8 Reel pack, SMD, 13-inch 2 500 Tamb = 40 C to +125 C

SA56004CDP SA56004CDP,118 TSSOP8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004DDP SA56004DDP,118 TSSOP8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004EDP SA56004EDP,118 TSSOP8 Reel pack, SMD, 13-inch 2 500 Tamb = 40 C to +125 C

SA56004FDP SA56004FDP,118 TSSOP8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004GDP SA56004GDP,118 TSSOP8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004HDP SA56004HDP,118 TSSOP8 Reel pack, SMD, 13-inch 2500 Tamb = 40 C to +125 C

SA56004ATK SA56004ATK,118 HVSON8 Reel pack, SMD, 13-inch 6000 Tamb = 40 C to +125 C

SA56004ETK SA56004ETK,118 HVSON8 Reel pack, SMD, 13-inch 6000 Tamb = 40 C to +125 C

Product data sheet Rev. 7 — 25 February 2013 4 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

5. Block diagram

Fig 1. Block diagram

002aad202

LOCAL

TEMP

SENSOR

LOCAL

REMOTE

MUX

ALERT

INTERRUPT

T_CRIT

INTERRUPT

ONE-SHOT

REMOTE OFFSET

CONVERSION

LOCAL TEMP

DATA REGISTER

REMO TE TEMP

DATA REGISTER

T_CRIT

HYSTERESIS

CONTROL

LOGIC

11-BIT

Σ-Δ

A-to-D

CONVERTER

CONFIGURATION

LOCAL HIGH TEMP

THRESHOLD

LOCAL LOW TEMP

THRESHOLD

REMOTE HIGH

TEMP THRESHOLD

REMOTE LOW

TEMP THRESHOLD

COMMAND

LOCAL TEMP HIGH

LIMIT REGISTER

LOCAL TEMP LOW

THRESHOLD

REMO TE TEMP

HIGH LIMIT REG.

REMO TE TEMP

LOW LIMIT REG.

SA56004X

VDD

D+

D−

ALERT

GND

T_CRIT

STATUS REGISTER

SMBus INTERFACE

OTP DEVICE

ADDRESS REGISTER

SDATA SCLK

Product data sheet Rev. 7 — 25 February 2013 5 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pin configuration for SO8 Fig 3. Pin configuration for TSSOP8

Fig 4. Pin configuratio n for HVSON8

SA56004XD

SCLK

D+ SDATA

D−ALERT

T_CRIT GND

002aad198

VDD SCLK

D+ SDATA

D−ALERT

T_CRIT GND

SA56004XDP

002aad199

002aad200

SA56004XTK

Transparent top view

3 6

2 7

1 8

terminal 1

index area

VDD SCLK

D+ SDATA

D−ALERT

T_CRIT GND

Table 3. Pin description

Symbol Pin Description

VDD 1 Positive supply voltage. DC voltage from 3.0 V to 5.5 V.

D+ 2 Diode current source (anode).

D3 Diode sink current (cathode).

T_CRIT 4 T_CRIT alarm is open-drain, active LOW output which requires an external

pull-up resistor. It functions as a system interrupt or power shutdown.

GND 5 Power supply ground.

ALERT 6ALERT alarm is an open-drain, active LOW output which requires an

external pull-up resistor. It functions as an interrupt indicating that the

temperature of the on-chip or remote diode is above or below programmed

overtemperature or undertemperature thresholds.

SDATA 7 SMBus/I2C-bus bidirectional data line. This is an open-drain output which

requires an external pull-up resistor.

SCLK 8 SMBus/I2C-bus clock input which requires an external pull-up resistor.

Product data sheet Rev. 7 — 25 February 2013 6 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7. Functional description

Refer to Figure 1 “Block diagram”.

7.1 Serial bus interface

The SA56004X should be connected to a compatible two-wire serial interface System

Management Bus (SMBus) as a slave device using the two device terminals SCLK and

SDATA. The ALER T pin can optionally be used with the SMBus protocol to implement the

ARA response. The controller provides a clock signal to the device SCLK pin and

write/read data to/from the device through the device SDATA pin. External pull-up

resistors, about 10 k each, are needed for these device pins due to open-drain circuitry.

Data of 8-bit digital byte or word are used for communication between the controller and

the device using SMBus 2.0 protocols which are described more in Section 7.10 “SMBus

interface”. The operation of the device to the bus is described with details in the following

sections.

7.2 Slave address

The SA56004X has a 7-bit slave address regi ster which is factory programmed in OTP

memory. Eight unique devices are available with different slave addresses as defined in

Table 4. Up to eight devices can reside on the same SMBus without conflict, if their

addresses are un iqu e .

[1] The device slave address is factory programmed in OTP device address register.

[2] The SA56004ED/EDP/ETK has the bus address of the National LM86, MAX6657/8 and the ADM1032.

Table 4. Slave addresses

Type number Device slave address[1]

SA56004AD 1001 000

SA56004ADP

SA56004ATK

SA56004BD 1001 001

SA56004BDP

SA56004CD 1001 010

SA56004CDP

SA56004DD 1001 011

SA56004DDP

SA56004ED[2] 1001 100

SA56004EDP[2]

SA56004ETK[2]

SA56004FD 1001 101

SA56004FDP

SA56004GD 1001 110

SA56004GDP

SA56004HD 1001 111

SA56004HDP

Product data sheet Rev. 7 — 25 February 2013 7 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.3 Register overview

The SA56004X contains three types of SMBus addressable registers: read-only (R),

write-only (W), an d re ad - writ e (R/ W ). Attem p ting to wr it e to any R- on ly regi st er or read

data from any W-only register produces an invalid result. Some of the R/W registers ha ve

separate addresses for reading and writing operations.

The registers of the SA56004X serve four purposes:

•Control and configuration of the SA56004X

•Status reporting

•Temperature measurement storage

•ID and manufacturer test registers

Table 5 describes the names, addresses, Power-On Reset (POR), and functions of each

which the MSB is the sign bit. The 8-bit data of other registers is in 8-bit straight format.

Product data sheet Rev. 7 — 25 February 2013 8 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.4 Power-on reset

When power is applied to the SA56004X, the device enters its Power-On Reset (POR)

state and its registers are reset to their default values. The configuration, status, and

temperature-reading registers remain in these states until after the first conversion. As

shown in Table 5 this results in:

1. Command register set to 00h.

2. Local Temperature register (LTHB and LTLB) set to 0 C.

3. Remote Diode Te mperature re gister (R THB and RTLB) set to 0 C until the end of the

first conversion.

4. Status register (SR) set to 00h.

5. Configuration registe r (CON) set to 00h; interrupt latch es are cleared, the ALER T and

T_CRIT output drivers are off and the ALERT and T_CRIT pins are pulled HIGH by

the external pu ll-u p re sist or s.

6. Local T_CRIT temperature setpoints (LCS) and Remote T_CRIT temperature

setpoints (RCS) at 85 C.

7. Local HIGH setpoint (LHS) and remote HIGH temperature setpoint (RHSHB) at 70 C.

Table 5. Register assignments

name Command byte POR state Function Bits Access

Read

address Write

address

LTHB 00h n/a 0000 0000 local temperature high byte 8 R

RTHB 01h n/a 0000 0000 remote temperature high byte 8 R

SR 02h n/a 0000 0000 st atus register 8 R

CON 03h 09h 0000 0000 configuration register 8 R/W

CR 04h 0Ah 1000 conversion rate 4 R/W

LHS 05h 0Bh 0100 0110 local high setpoint 8 R/W

LLS 06h 0Ch 0000 0000 local low setpoint 8 R/W

RHSHB 07h 0Dh 0100 0110 remote high setpoint high byte 8 R/W

RLSHB 08h 0Eh 0000 0000 remote low setpoint high byte 8 R/W

One Shot n/a 0Fh - writing register initiates a one-shot conversion 0 W

RTLB 10h n/a 0000 00 remote temperature low byte 6 (MSBs) R

RTOHB 11h 11h 0000 0000 remote temperature offset high byte 8 R/W

RTOLB 12h 12h 000 remote temperature offset low byte 3 (MSBs) R/W

RHSLB 13h 13h 000 remote high setpoint low byte 3 (MSBs) R/W

RLSLB 14h 14h 000 remote low setpoint low byte 3 (MSBs) R/W

RCS 19h 19h 0101 0101 remote T_CRIT setpoint 8 R/W

LCS 20h 20h 0101 0101 local T_CRIT setpoint 8 R/W

TH 21h 21h 0 1010 T_CRIT hysteresis 5 R/W

ATLB 22h n/a 0000 0000 local temperature low byte 3 (MSBs) R

AM BFh BFh 0 Alert mode 1 R/W

RMID FEh n/a 1010 000 1 read manufacturer’s ID 8 R

RDR FFh n/a 0000 0000 read stepping or die revision 8 R

Product data sheet Rev. 7 — 25 February 2013 9 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

8. Local LOW setpoint (LLS) and Remote LOW temperature setpoints (RLSHB) at 0 C.

9. Conversion Rate register (CR) is set to 8h; the default value of about 16

conversions/s.

7.5 Starting conversion

Upon POR, the RUN/STOP bit 6 of the configuration register is zero (default condition),

then, the device enters into its free-running operation mode in which the device A/D

converter is enabled and the measurement function is activated. In this mode, the de vice

cycles the measurements of the local and remote temperature automatically and

periodically. The conversion rate is defined by the progra mmable conversion rate stored in

the conversio n rate re gister. It also perfo rm s com parison between readings and limits of

the temperature in order to set the flags and interruption accordingly at the end of every

conversion. Measured values are stored in the temp registers, results of the limit

comparisons are reflected by the status of the flag bits in the status register and the

interruption is reflected by the logical level of the ALERT and T_CRIT output. If the

power-on temperature limit is not suitable, the temp limit values could be written into the

limit registers during the busy-conversion duration of about 38 ms of the fir st con ve rs ion

after power-up. Otherwise, the status register must be read and the configuration bit 7

must be reset in order to recover the device from interruption caused by the undesired

temp limits.

7.6 Low power software standby mode

The device can be placed in a software standby mode by setting the RUN/STOP bit 6 in

the configuration register HIGH (logic 1). In standby, the free-running oscillator is stopped,

the supply current is less than 10 A if there is no SMBus activity, all data in the registers

is retained. However, the SMBus is still active and reading and writing registers can still be

performed. A one-shot command initiates a single conversion which has the same effect

as any conversion that occurs when the device is in its free-running mode. To restore the

device to free running mode, set the RUN/STOP bit 6 LOW (logic 0).

7.7 Temperature data format

The temperature data can only be read from the Local and Remote Temperatur e

registers; the setpoint registers (for example, T_CRIT, LOW, HIGH) are read/write.

Both local and remote temperature reading data is represented by an 11-bit,

two’s complement word with the Least Significant Bit (LSB) = 0.125 C. The temperature

setpoint data for the remote channel is also represente d by an 11-bit, two’s complement

word with the LSB = 0.125 C. The temperature setpoint data for both the local channel

and the T_CRIT setpoints are represented by 8-bit, two’s complement words with the

LSB =1.0 C. For 11-bit temp dat a, the data format is a left justified, 16-bit word available

in two 8-bit registers (high byte and low byte). For 8-bit temp data, the data is available in

a single 8-bit register (high byte only).

Product data sheet Rev. 7 — 25 February 2013 10 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.8 SA56004X SMBus registers

7.8.1 Command register

The command register selects which register will be read or written to. Data for this

communication.

7.8.2 Local and remote temperature registers (LTHB, LTLB, RTHB, RTLB)

7.8.3 Configuration register (CON)

The configuration register is an 8-bit register with read address 03h and write address

09h. Table 8 shows how the bits in this register are used.

Table 6. Tempe rature data format

Temperature Digital output

Binary Hexadecimal

+125 C 0111 1101 0000 0000 7D00h

+25 C 0001 1001 0000 0000 1900h

+1 C 0000 0001 0000 0000 0100h

+0.125 C 0000 0000 0010 0000 0020h

0C 0000 0000 0000 0000 0000h

0.125 C 1111 1111 1110 0000 FFE0h

1C 1111 1111 0000 0000 FF00h

25 C 1110 0111 0000 0000 E700h

55 C 1100 1001 0000 0000 C900h

Table 7. LTHB, LTLB, RTHB, RT LB - Local and remo te temperature registers

Byte High byte (read only; address 00h, 01h) Low byte (read only; address 10h)

Bit D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Valuesign64321684210.50.250.12500000

Table 8. CON - Configuration register (read address 03h; write address 09h)

bit assignments

Bit Description POR state

7ALERT

mask.

The ALERT interrupt is enabled when this bit is LOW. The ALERT interrupt

is disabled (masked) when this bit is HIGH.

6 RUN/STOP.

Standby or run mode control. Running mode is enabled when this bit is

LOW. The SA56004X is in standby mode when this bit is HIGH.

5 Not defined; defaults to logic 0. 0

4 Remote T_CRIT mask.

The T_CRIT output will be activated by a remote te mperat ure that exceeds

the remote T_CRIT setpoint when this bit is LOW. The T_CRIT output

will not be activated unde r this condition when this bit is HIGH.

3 Not defined; defaults to logic 0. 0

Product data sheet Rev. 7 — 25 February 2013 11 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.8.4 Status register (SR)

The contents of the status register reflect condition status resulting from all activities:

comparison between temperature measurements and temperature limits, the status of

A/D conversion, and the hardware condition of external diode to th e de vice . Bit

assignments are listed in Table 9. This register is read-only and its address is 02h. Upon

POR, all bits are set to zero.

Remark: Any one of the fault conditions, with the exceptions of Diode OPEN and

A/D BUSY, introduces an Alert in terrupt (see Section 7.9.1.2). Also, whenever a one-shot

command is executed, the status byte should be read after the conversion is completed,

which is about 38 ms (1 conversion tim e pe rio d ) after the one- sh ot com man d is sen t.

2 Local T_CRIT mask.

The T_CRIT output will be activated by a local temperature that exceeds

the local T_CRIT setpoint when this bit is LOW. The T_CRIT output will not

be activated under this condition when this bit is HIGH.

1 Not defined; defaults to logic 0. 0

0 Fault queue.

A single remot e te mp e r at ure measurement outside the HIGH, LOW or

T_CRIT setpoints will trigger an outside limit condition resulting in setting

the status bits and associated output pins when this bit is LOW . Three

consecutive measurements outside of one of these setpoints are required

to trigger an outside of limit condition when this bit is HIGH.

Table 8. CON - Configuration register (read address 03h; write address 09h)

bit assignments …continued

Bit Description POR state

Table 9. SR - Status register (read-only address 02h) bit assign ments

Bit Name Description

7 BUSY Whe n logic 1, A/D is busy converting. POR state = n/a.

6 LHIGH When logic 1, indicates local HIGH temperature alarm. POR state = 0.

5 LLOW When logi c 1, indicates a local LOW temperature alarm. POR state = 0.

4 RHIGH When logic 1, indicates a remote diode HIGH temperature alarm. POR state = 0.

3 RLOW When logic 1, indicates a remote diode LOW temperature alarm. POR state = 0.

2 OPEN When logic 1, indicates a remote diode disconnect. POR state = 0.

1 RCRIT When logic 1, indicates a remote diode critical temper at ure alarm. POR st a te = 0.

0 LCRIT When logic 1, indicates a local critical temperature alarm. POR state = 0.

Product data sheet Rev. 7 — 25 February 2013 12 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.8.5 Conversion rate register (CR)

The conversion rate register is used to store programmable conversion data, which

defines the time interval between conversions in the standard free-running auto convert

mode. Table 10 shows all applicable data values and rates for the SA56004X. Only the

4 LSBs of the register are used and the other b it s are rese rved for future use. Th e register

is R/W using the read address 04h and write address 0Ah. The POR default conversion

data is 08h.

7.8.6 Temperature limit registers

[1] POR default LHS = RHSHV = 46h (70 C).

[2] POR default RHSLB = 00h.

[1] POR default LLS = RLSHV = 00h.

[2] POR default RLSLB = 00h (0 C).

[1] POR default LCS = RCS = 55h (85 C).

Table 10. Co nversion rate control byte (CR)

Data value Conversion rate (Hz)

00h 0.06

01h 0.12

02h 0.25

03h 0.50

04h 1.0

05h 2

06h 4

07h 8

08h 16

09h 32

0Ah to FFh n/a

Table 11. LHS, RHSHB, RHSLB - Local and remote HIGH setpoint registers

Byte High byte (read only address 05h, 07h;

write address 0Bh, 0Dh)[1] Low byte (read /write address 13h)[2]

Bit D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Valuesign64321684210.50.250.12500000

Table 12. LLS, RLSHB, RLSLB - Local and remote LOW se tpoint registers

Byte High byte (read address 06h, 08h;

write address 0Ch, 0Eh)[1] Low byte (read/write address 14h)[2]

Bit D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Valuesign64321684210.50.250.12500000

Table 13. LCS, RCS - Local and remote T_CRIT registers

Byte Single high byte (rea d/write address 20h, 19h) [1]

Bit D7 D6 D5 D4 D3 D2 D1 D0

Value sign6432168421

Product data sheet Rev. 7 — 25 February 2013 13 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

[1] POR default TH = 0Ah (10 C).

7.8.7 Programmable offset register (remote only)

[1] POR default RTOHB = RTOLB = 00h.

[2] POR default RTOLB = 00h.

7.8.8 ALERT mode register (AM)

D[7:1] is not defined and defaults to logic 0.

D0: The ALERT output is in interrupt mode when this bit is LOW. The ALERT output is in

comparator mode when this bit is HIGH.

7.8.9 Other registers

The Manufacturers ID register has a default value A1h (1010 0001) and a read address

FEh.

The Die Revision Code register has a default value 00h (0000 0000) and read address

FFh. This register increments by 1 every time there is a revision to the die.

7.8.10 One-shot register

The one-shot register is used to initiate a single conversion and comparison cycle when

the device is in the standby mode; upon completion of the single conversion cycle, the

device returns to the standby mode. It is not a data register; it is the write operation that

causes the one-shot conversion. The data written to this register is not stored; an FFh

value will always be read from this register. To initiate a one-shot operation, send a

standard write command with the command byte of 0Fh (One-Shot Write Address).

Table 14. TH - T_CRIT hysteresis register

Byte Single high byte (rea d/write address 21h) [1]

Bit D7 D6 D5 D4 D3 D2 D1 D0

Value ---168421

Table 15. RTOHB, RTOLB - Remote temperature offset registers

Byte High byte (rea d/write addr e ss 11h)[1] Low byte (read/write address 12h )[2]

Bit D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Valuesign64321684210.50.250.12500000

Table 16. AM - ALERT mode register

Read and write address BFh.

Bit D7 D6 D5 D4 D3 D2 D1 D0

Value0000000ALERT mode

Product data sheet Rev. 7 — 25 February 2013 14 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.9 Interruption logic and functional description

7.9.1 ALERT output

The ALERT output is used to signal Ale rt interruptions from the device to the SMBus or

other system interrupt handle r and it is active LOW. Because this is an open-drain output,

a pull-up resistor (typically 10 k) to VDD is required. Several slave devices can share a

common interrupt line on the same SMBus.

The ALERT function is very versatile and accommodate s three separate operating

modes:

•Temperature comparator

•System interrupt based on temperature

•SMBus Alert Response Address (ARA) response.

The ARA and interrupt modes are different only in how the user interacts with the

SA56004X.

At the end of every temper ature reading, di gita l comparato rs determine if the readings are

above the HIGH or T_CRIT setpoint or below the LOW setpoint register values. If so, the

corresponding bit in the S tatus register is set. If the ALERT mask bit 7 of the Configuration

OPEN (D2) causes the AL ERT output pin to be active LOW . An alert will be triggered after

any conversion cycle that finds the temperature is out of the limits defined by the setpoint

registers. In order to trigger an ALERT in all alert modes, the ALERT mask bit 7 of the

Configuration register must be cleared (not HIGH).

7.9.1.1 ALERT output in comparator mode

When operating the SA56004X in a system that utilizes an SMBus controller not having

an interrupt, the ALERT output may be operated as a temperature comparator. In this

mode, when the condition that triggered the ALERT to be asserted is no longer present,

the ALERT output is released as it goes HIGH. In order to use the ALERT output as a

temperature comparator, bit D0 (the ALERT configure bit) in the ALERT Mode (AM)

7.9.1.2 ALERT output in interrupt mode

In the interrup t mode, the ALER T output is used to provide an interrupt signal that remains

asserted until the interrupt service routine has elapsed. In the interr up t oper ating mode, a

read of the Status register will set the ALERT mask bit 7 of the Configuration register if

any of the temperature alarm bits of the S tatus register is set, with exception of BUSY (D7)

and OPEN (D2). This protocol prevents further ALERT output triggering until the master

device has reset the ALERT mask bit at the end of the interrupt service routine. The

Status register bits are cleared only upon a read of the Status register by the serial bus

master (see Figure 5). In order for the ALERT output to be used as an interrupt, the

ALERT Configure bit D0 of the ALERT Mode (AM) register must be set LOW (POR

default).

Product data sheet Rev. 7 — 25 February 2013 15 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

The following events summarize the ALERT output interrupt mode of operation:

Event A: Master senses ALERT output being active-LOW.

Event B: Master reads the SA5600 4X Status register to determ in e wh at caus e the

ALERT interrupt.

Event C: SA56004X clears the S t atus register , rese ts the ALERT output HIGH, and sets

the ALERT mask bit 7 in the Configuration register.

Event D: A new conversion result indicates that the temperature is still above the high

limit, however the ALERT pin is not activated due to the ALERT mask.

Event E: Master should correct the conditions that caused the ALERT output to be

triggered. For instance, the fan is started, setpoint levels are adjusted.

Event F: Master resets the ALERT mask bit 7 in the Configuration register.

7.9.1.3 ALERT output in SMBus ALERT mode

When several slave devices share a common interrupt line, an SMBus alert line is

implemented. The SA56004X is designed to accommodate the Alert interrupt detection

capability of the SMBus 2.0 Alert Response Address (ARA) protocol, defined in SMBus

specification 2.0. This procedure is designed to assist the ma ster in re solving which slave

device generated the interrupt and in servicing the interrupt while minimizing the time to

restore the system to its proper operation. Basically, the SMBus provides Alert response

interrupt pointers in order to identify slave devices which have caused the Alert interrupt.

When the ARA command is received by all devices on the SMBus, the devices pulling the

SMBus alert line LOW send their device addresses to the master; await an

acknowledgement and then release the alert line. This requirement to disengage the

SMBus alert line prevents locking up the alert line. The SA56004X complies with this ARA

disengagement protocol by setting the ALERT mask bit 7 in the Configuration register at

address 09h after successfully sending out its address in response to an ARA command

and releasing the ALERT output. Once the mask bit is activated, the ALERT output is

disabled until enabled by software. In order to enable the ALERT the master must read

Fig 5. ALERT output in interrupt mode

remote temperature high limit

remote diode temperature

ALERT pin

status register bit 4

(RHIGH)

A B, C D E, F

002aad216

Product data sheet Rev. 7 — 25 February 2013 16 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

the Status register, at address 02h, during the interrupt service routine and then reset the

ALERT mask bit 7 in the Configuration r egister to logic 0 at the end of the interrupt service

routine (see Figure 6).

In order for the SA56004X to respond to the ARA command, the bit D0 in the ALERT

mode register must be set LOW.

ALERT mask bit 7 and the ALERT mode bit D0 are both LOW for the POR default.

The following events summarize the ALERT output interrupt operation in the SMBus Alert

mode:

Event A: Master senses the ALERT line being LOW.

Event A to B: Master sends a read command using the common 7-bit Alert Response

Address (ARA) of 0001100.

Event A to B: Alerting device(s) return ACK signal and their addresses using the

I2C-bus Arbitration (the device with the lowest a ddress value sends its a ddress first. The

master can repeat the alert reading process and work up through all the interrupts).

Event B: Upon the successful completion of retur ning address, the SA56004X reset s its

ALERT output (to OFF) and sets the ALERT mask bit 7 in its configuration register.

Event C: Master should read th e de vice status regis te r to ide n tify an d correct the

conditions that caused the Alert interruption. The status register is reset.

Event D: Master resets the ALERT mask bit 7 in the configuration register to enable the

device ALERT output interruption.

Remark: The bit assignment of the returned data from the ARA reading is listed in

Table 17. If none of the devices on the bus is alerted, then the returned data from ARA

reading is FFh (1111 111 1).

Fig 6. ALERT pin in SMBus Alert mode

temperature

002aad215

remote temperature high limit

remote diode temperature

ALERT pin

status register bit 4

(RHIGH)

ABCD

Product data sheet Rev. 7 — 25 February 2013 17 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.9.2 T_CRIT output

The T_CRIT output is LOW wh en any temp er ature r eading is greater than the preset limit

in the corresponding critical temperature setpoint register. When one of the T_CRIT

setpoint temperatures is exceeded, the appropriate status register bit, 1 (RCRIT) or 0

(LCRIT), is set.

After every local and remote temperature conversion the status register flags and the

T_CRIT output are updated. Figure 7 is a timing diagram showing the relationship of

T_CRIT output, Status bit 1 (RCRIT) and the remote critical temperature setpoint (RCS),

and critical temperature hysteresis (TH) with remote temperature changes. Note that the

T_CRIT output is de-activated only after the remote temperature is below the remote

temperature setpoint, RCS minus the hysteresis, TH. In the interrupt mode only, the

Status register flags are reset after the Status register is read.

Event A: T_CRIT goes LOW and St atus bit 1 (RCRIT) is set HIGH when Remote

Temperature exceeds RCS, Remote T_CRIT Setpoint.

Event B: Remote Temperature goes below RCS TH. T_CRIT is de-activated, but

Status register remains unchang ed.

Table 17. ALERT response bit assignment

ALERT response bit Device address bit Function

7 (MSB) ADD6 address bit 6 (MSB) of alerted device

6 ADD5 address bit 5 of alerted device

5 ADD4 address bit 4 of alerted device

4 ADD3 address bit 3 of alerted device

3 ADD2 address bit 2 of alerted device

2 ADD1 address bit 1 of alerted device

1 ADD0 address bit 0 of alerted device

0 1 always logic 1

Fig 7. T_CRIT temp erature response timing

002aad217

RCS

RCS − TH

Status register bit 1

(RCRIT)

ABC

remote temperature

T_CRIT output

Product data sheet Rev. 7 — 25 February 2013 18 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Event C: The Status register bit 1 (RCRIT) is reset by a read of the Status register (in

the interrupt mode).

7.9.3 Fault Queue

To suppress erroneous ALERT or T_CRIT triggering, the SA56004X implements a Fau lt

Queue for both local and remote channel. The Fault Queue insures a temperature

measurement is genuinely beyond a HIGH, LOW or T_CRIT setpoint by not triggering

until three consecutive out-of-limit measurements have been made. The fault queue

defaults OFF upon POR and may be activated by setting bit 0 in the Configuration register

(address 09h) to logic 1.

Event A: The remote temperature has exceeded the Remote HIGH setpoint.

Event B: Three consecutive over limit measurements have been made exceeding the

Remote HIGH setpoint; the ALERT output is activated (goes LOW). By now, the remote

temp has exceeded the Remote T_CRIT setpoint (RCS).

Event C: Three consecutive over limit measurements have be en made exceeding RCS;

the T_CRIT output is activated (goes LOW).

Event D: The remote temperature falls below the RCS TH setpoint.

Event E: The ALERT output is de-activated (goes HIGH) after a below_high_limit

temperature measurement is completed.

Remark: All events indicate the completion of a conversion.

Fig 8. Fault queue remote HIGH and LOW and T_CRI T, T_CRIT hysteresis set poi nt

response (comparator mode)

002aad218

remote temperature

RCS

RCS − TH

remote HIGH setpoint

remote LOW setpoint

ALERT output

T_CRIT output

events A B C D E F G H I

Product data sheet Rev. 7 — 25 February 2013 19 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Event F: Three consecutive measurements have been made with the remote

temperature below the RCS TH threshold; the T_CRIT output is de-activat ed (goe s

HIGH).

Event G: The remote temp falls below the Remote LOW setpoint.

Event H: Three consecutive measurements are made with the temp below the Remote

LOW setpoint; ALERT output is activated (goes LOW).

Event I: The ALERT output is de-activated (goes HIGH) after a above_low_limit

temperature measurement is completed.

7.9.4 Temperature measurement

To measure the remote temperature or the temperature of an externally attached diode,

the device automatically forces two successive currents of about 160 A and 10 A at D+

pin. It measures the volt age (VBE) betwee n D+ and D, detects the difference between the

two VBE voltages or the VBE and then converts the VBE into a temperature data using

the basic PTAT voltage formula as shown in Equation 1. The device typically takes about

38 ms to perform a measurement during each conversion period or cycle, which is

selectable by programming the conversion rate register.

(1)

Where:

n = diode ideality factor

k = Boltzmann’s constant

T = absolute temper a tur e (K) = 273 C+T (C)

q = electron charge

ln = natural logarithm

l2, l1 = two source currents

Because the device does not directly convert the sensed VBE as in the old method of

temperature measurement systems, the VBE calibration is not required. Furthermore, the

device remote temperature error is adjusted at the manufacturer to meet the

specifications with the use of the reference diode-connected transistors such as the

2N3904/2N3906. The diode type to be used in customer applications must have the

characteristics as close to the 2N3904/2N3906 as possible in order to obtain optimal

results. Finally, to prevent the effects of system noise on the measured VBE signals, an

external cap acitor of about 2200 pF connected between the D+ and D pins as well as the

grounded-shield cable for the diode connection wires are recommended.

7.9.5 Diode fault detection

The SA56004X is designed with circuitry to detect the fault conditions of the r emote diode.

When the D+ pin is shorted to V DD or floating, the Remote Temperature High Byte (R THB)

loaded with 0 C, and the OPEN bit (bit 2 of the Status register) is set. Under the above

conditions of D+ shorted to VDD or floating, if the Remote T_CRIT setpoint is set less than

+127 C, and T_CRIT Mask are disabled, then, the T_CRIT output pins will be pulled

VBE nkT

------

l2

-----





ln=

Product data sheet Rev. 7 — 25 February 2013 20 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

LOW. Furthermore, if the Remote HIGH Setpoint High Byte (RHSHB) register is set to a

value less than +127 C and the Alert Mask is disabled, then the ALERT output will be

pulled LOW. Note that the OPEN bit itself will not trigger an ALERT.

When the D+ pin is shorted to ground or to D, the Remote Temperature High Byte

(RTHB) register is loaded with 128 C (1000 0000) and the OPEN (bit 2 in the Status

temperature reading represents this shorted fault condition. If the value in the Remote

Low Setpoint High Byte (RLSHB) register is more than 128 C and the Alert Mask is

disabled, the ALERT output will be pulled LOW.

7.10 SMBus interface

The device can communicate over a standard two-wire serial interface System

Management Bus (SMBus) or compatible I2C-bus using SCLK and SDATA. The device

employs four standard SMBus protocols: Write B yte, Read Byte, Receive Byte, and

Send Byte. Data formats of four protocols ar e shown in Figure 9. The following key points

of protocol are important:

•The SMBus master initiat es data transfer by establishing a START condition (S) and

terminates data transfer by generating a STOP condition (P).

•Data is sent over the serial bus in sequence s of 9 clock pulses according to each 8-bit

data byte followed by 1-bit status of device acknowledgement (A).

•The 7-bit slave address is equivalent to factory-programmed address of the device.

•The command byte is equivalent to the address of the selected device register.

•The Receive Byte format is used for quicker transfer data from a device reading

Product data sheet Rev. 7 — 25 February 2013 21 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

a. Write Byte format (to write a data byte to the device register)

b. Read Byte format (to read a data byte from the device register)

c. Receive Byte format (to read a data byte from already pointed register)

d. Send Byte format

Fig 9. SMBus interface protocols

123456789123456789

SCLK

a6 a5 a4 a3 a2 a1 a0

SDATA D7 D6 D5 D4 D3 D2 D1 D0

device address device register command

WAS

START A

(cont.)

002aad219

123456789

SCLK

D7 D6 D5 D4 D3 D2 D1

SDATA

data to be written to register AP

STOP

123456789123456789

SCLK

a6 a5 a4 a3 a2 a1 a0

SDATA D7 D6 D5 D4 D3 D2 D1 D0

device address device register command

WAS

START A

(cont.)

002aad220

STOP

123456789123456789

SCLK

a6 a5 a4 a3 a2 a1 a0

SDATA D7 D6 D5 D4 D3 D2 D1 D0

device address data from device register

RAS

RESTART NA P

STOP

002aad221

123456789123456789

SCLK

a6 a5 a4 a3 a2 a1 a0

SDATA D7 D6 D5 D4 D3 D2 D1 D0

device address data from device register

RAS

RESTART NA P

STOP

(cont.)

123456789123456789

SCLK

a6 a5 a4 a3 a2 a1 a0

SDATA D7 D6 D5 D4 D3 D2 D1 D0

device address device register command

WAS

START A

002aad222

STOP

Product data sheet Rev. 7 — 25 February 2013 22 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

7.10.1 Serial interface reset

If the SMBus master attempts to reset the SA5600 4X while the SA56004X is controlling

the data line and transmitting on the da ta line, the SA56004X m ust be returned to a known

state in the communication protocol. This may be accomplished in two ways:

1. When the SDATA is LOW, the SA56004X SMBus state machine resets to the SMBus

idle state if SCLK is held LOW for more than 35 ms (maximum TIMEOUT period).

According to SMBus specification 2.0, all devices are required to time out when the

SCLK line is held LOW for 25 ms to 35 ms. Therefore, to insure a time-out of all

devices on the bus, the SCLK line must be held LOW for at least 35 ms.

2. When the SDATA is HIGH, the master initiates an SMBus START. The SA56004X

responds properly to a SMBus START condition only during the d ata retrieving cycle.

After the START, the SA56004X expects an SMBus Address byte.

8. Application design-in information

8.1 Factors affecting accuracy

8.1.1 Remote sensing diode

The SA56004X is designed to work with substrate transistors built into processors’ CPUs

or with discrete transistors. Substrate transistors are generally PNP types with the

collector connected to the substrate. Discrete types can be either a PNP or an NPN

transistor connected as a diode (base shorted to collector). If an NPN transist or is used ,

the collector and base are connected to D+ and the emitter to D. If a PNP transistor is

used, the collect or and base ar e co nn ec te d to D and the emitter to D+. Substrate

transistors are found in a number of CPUs. To reduce the error due to variations in these

substrate and discrete transistors, a number of factors should be considered:

•The ideality factor , nf, of the tran sistor . The ideality factor is a measure of the deviation

of the thermal diode fro m the ideal behavior . The SA56004X is trimmed for an nf value

of 1.008. Equation 2 can be used to calculate the error introduced at a temperature

TC when using a transistor whose nf does not equal 1.008. Consult the processor

data sheet for nf values.

This value can be written to the offset register and is automatically added to or

subtracted from the temperature measurement.

(2)

•Some CPU manufacturers specify the high and low cu rrent levels of the substrate

transistors. The Isource high current level of the SA56004X is 100 A and the low-level

current is 10 A.

If a discrete transistor is being used with the SA56004X, the best accuracy is obtained by

choosing devices according to the following criteria:

•Base-emitter voltage greater than 0.25 V at 6 mA, at the highest operating

temperature.

•Base-emitter volt age less than 0.95 V at 100 mA, at the lowest operating temperature.

Tnnatural 1.008–

1.008

------------------------------------------ 273.15 Kelvin T+=

Product data sheet Rev. 7 — 25 February 2013 23 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

•Base resistance less than 100 .

•Small variation in hFE (say 50 to 150) that indicates tight control of VBE characteristics.

Transistors such as 2N3904, 2N3906, or equivalents in SOT23 p ackages are suitable

devices to use. See Table 18 for representative devices.

8.1.2 Thermal inertia and self-heating

Accuracy depends on the temperature of the remote-sensing diode and/or the internal

temperature sensor being at the same temperature as that being measured, and a

number of factors can affect this. Ideally, the sensor should be in good thermal contact

with the part of the system being measured, for example, the processor. If it is not, the

thermal inertia caused by the mass of the sensor causes a lag in the response of the

sensor to a temperature change. In the case of the remote sensor, this should not be a

problem, since it is either a substrate transistor in the processor or a small package

device, such as the SOT23, placed close to it.

The on-chip sensor, however, is often remote from the processor and is only mon itoring

the general amb i en t tem p er at ur e around the package. The th er m al ti m e cons tant of the

SSOP16 package in still air is about 140 seconds, and if the ambient air temperature

quickly change d by 10 0 C, it would take about 12 minutes (five time constants) for the

junction temp er at ur e of th e SA56 0 04X to se ttle within 1 C of this. In practice, the

SA56004X package is in electrical and therefore thermal contact with a printed-circuit

board and can also be in a forced airflow. How accurately the temperature of the board

and/or the forced ai rflow reflect the temper ature to be mea sured also af fect s the accuracy.

Self-heating due to the power dissipated in the SA56004X or the remote sensor causes

the chip temperature of the device or remote sensor to rise above ambient. However, the

current forced through the remote sensor is so small that self-heating is negligible. In the

case of the SA56004X, the worst-case condition occurs when the device is converting at

16 conversions per second while sinking the maximum current of 1 mA at the ALERT

output. In this case, the total power dissipation in the device is about 11 mW . The thermal

resistance, R th(j-a), of the SSOP16 package is about 121 C/W.

In practice, the package has electrical and therefore thermal connection to the printed

circuit board, so the temperature rise due to self-heating is negligible.

Table 18. Representative diodes for temperature sensing

Manufacturer Model numb er

ROHM UMT3904

Diodes Inc. MMBT3904-7

Philips MMBT3904

ST Micro MMBT3904

ON Semiconductor MMBT3904LT1

Chenmko MMBT3904

Infineon Technolog ies SMBT3904E6327

Fairchild Semiconductor MMBT3904FSCT

National Semiconductor MMBT3904N623

Product data sheet Rev. 7 — 25 February 2013 24 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

8.1.3 Layout considerations

Digital boards can be electrically noisy environments, and the SA56004X is measuring

very small voltages from the remote sensor, so care must be taken to minimize noise

induced at the sensor inputs. The following precautions should be taken.

1. Place the SA56004X as close as possible to the re mote sensing diod e. Pr ovided th at

the worst noise sources, that is, clock generators, dat a/address b uses, and CR Ts, are

avoided, this distance can be 4 inches to 8 inches.

2. Route the D+ and D tracks close together, in p arallel, with grounde d gua rd tracks on

each side. Provide a ground plane under the tracks if possible.

3. Use wide tracks to minimize inductance and reduce noise pickup. 10 mil track

minimum width and spacing is recommended (see Figure 10).

4. Try to minimize the number of copper /solder joints, which can cause thermocouple

effects. Where copper/solder joints are used, make sure that they are in both the D+

and D path and at the same temperature.

Thermocouple effects should not be a major problem since 1 C corresponds to about

200 V and thermocouple voltages are about 3 V/C of temperature difference.

Unless there are two thermocouples with a large temperature differential between

them, thermocouple voltages should be much less than 200 V.

5. Place a 0.1 F bypass capacitor close to the VDD pin. In very noisy environments,

place a 1000 pF input filter capacitor across D+ and D close to the SA56004X.

6. If the distance to the remote sensor is more than 8 inches, the use of twisted-pair

cable is recommended. This works up to about 6 feet to 12 feet.

7. For really long distances (up to 100 feet), use shielded twisted pair, such as

Belden #8451 microphone cable. Connect the twisted pair to D+ and D and the

shield to GND close to the SA56004X. Leave the remote end of the shield

unconnected to avoid ground loops.

Because the measurement technique uses switched current sources, excessive cable

and/or filter capacitance can affect the measurement. When using long cables, the filter

capacitor can be reduced or removed.

Cable resistance can also introduce errors. 1  resistance introduces about 1 C error.

Fig 10. Typical arrangement of signal tracks

002aag953

GND

D+

D−

10 mil

Product data sheet Rev. 7 — 25 February 2013 25 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

8.2 Power sequencing considerations

8.2.1 Power supply slew rate

When powering-up the SA56004X, ensure that the slew rate of VDD is less than 18 mV/s.

A slew rate larger than this may cause power-on reset issues an d yie ld un pr ed ictable

results.

8.2.2 Application circuit

Figure 11 shows a typical application circuit for the SA56004X, using a discrete sensor

transistor connected via a shielded, twisted- pa ir cable. The pull-ups on SCLK, SDATA,

and ALERT are required only if they are not already provided elsewhere in the system.

The SCLK and SDATA pins of the SA56004 X can be inter fa ce d dir ec tly to th e SMBus of

an I/O controller, such as the Intel 820 chip set.

8.3 Timing and firmware consideration

It is important not to violate the conversion timing on this part.

Regardless of timi ng , th e de vice ‘cou ld’ re po rt an erro ne o us rea din g, but NXP, nor

reporting customers have not encountered two subsequent erroneous readings in its

product reviews or e valuations. Masking of single or two sequen tial err oneous readings is

recommended by comparing several reads should there be a large prompt change in the

temperature reading before taking protective action.

(1) Typical value, placed close to temperature sensor.

Fig 11. Typical application circuit

VDD SCLK

D+ SDATA

D−ALERT

T_CRIT GND

SA56004X

002aad201

shielded twisted pair

100 nF

2.2 nF(1)

VDD

FAN CONTROL

CIRCUIT

+5 V

remote sensor

2N3904 (NPN), 2N3906 (PNP),

or similar standalone, ASIC or

microprocessor thermal diode R

10 kΩ

VDD

CLOCK

DATA

INT

SMBus

CONTROLLER

Product data sheet Rev. 7 — 25 February 2013 26 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

9. Limiting values

[1] The D+ and D pins are 1000 V HBM due to the higher sensitivity of the analog pins that introduces a limitation to the circuit protection

structure.

Table 19. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

All voltages are referenced to GND.

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0.3 +6 V

voltage at SDATA, SCLK, ALERT, T_CRIT 0.3 +6 V

VD+ voltage at positive diode input 0.3 VDD +0.3 V

VDvoltage at negative diode input 0.3 +0.8 V

Isink sink current SDATA, SCLK, ALERT, T_CRIT 1+50 mA

ID+ D+ input current 1+1 mA

VESD electrostatic discharge voltage Human Body Model [1] - 2000 V

Tj(max) maximum junction temperature - +150 C

Tstg storage temperature 65 +165 C

Product data sheet Rev. 7 — 25 February 2013 27 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

10. Characteristics

[1] The SA56004X is optimized for 3.3 V VDD operation.

[2] Definition of UnderV oltage LockOut (UVLO) threshold voltage: The value of VDD below which the internal A/D converter is disabled. This

is designed to be a minimum of 200 mV above the power-on reset. While it is disabled, the temperature that is in the ‘read temperature

registers’ remains at the value that it was before the A/D was disabled. This is done to eliminate the possibility of reading unexpected

false temperatures due to the A/D converter not working correctly due to low voltage. In case of power-up (rising VDD), the reading that

is stored in the ‘read temperature registers’ will be the default value of 0 C. VDD will rise to the value of the Vth(UVLO), at which point the

A/D functions correctly and the normal temperature is read.

[3] VDD (rising edge) voltage below which the A/D converter is disabled.

[4] VDD (falling edge) voltage below which the logic is reset.

Table 20. Electrical characteristics

VDD = 3.0 V to 3.6 V; Tamb =





C to +125



C; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

TERRL local temperature error Tamb = +60 C to +100 C21+2C

Tamb = 40 C to +125 C3- +3C

TERRR remote temper at ure error Tamb =+25C to +85 C;

TRD =+60C to +100 C1- +1C

Tamb =40 C to +85 C;

TRD =40 C to +125 C3- +3C

TRESR remote temperature

resolution -11-bit

-0.125-C

TRESL local temperature resolution - 11 - bit

-0.125-C

Tconv conversion period - 38 - ms

VDD supply voltage [1] 3.0 - 5.5 V

IDD quiescent current during conversion,

16 Hz conversion rate -500-A

shut-down current SMBus inactive - 10 - A

IRD remote diode source current high setting: D+ D= +0.65 V - 160 - A

low setting - 10 - A

Vth(UVLO) undervoltage lockout

threshold vo ltage[2] VDD input disables A/D conversion [3] 2.6 - 2.95 V

Vth(POR) power-on reset threshold

voltage VDD input falling edge [4] 1.8 - 2.4 V

Tth(high) high threshold temperature local and remote ALERT high

default te mp erature set ti n gs;

default values set at power-up

-+70-C

Tth(low) low threshold temperature local and remote ALERT low default

temperature settings;

default values set at power-up

-0-C

Tth(crit) critical threshold temperatur e loca l and remote T_CRIT default

temperature settings;

default values set at power-up

-+85-C

Thys hysteresis temperature T_CRIT; default value set at

power-up -+10-C

Vsat saturation voltage ALERT and T_CRIT output;

IO=6.0mA --0.4V

Product data sheet Rev. 7 — 25 February 2013 28 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

[1] The switching characteristics of the SA56004X fully meet or exceed all parameters specified in SMBus version 2.0. The following

parameters specify the timing between the SCLK and SDATA signals in the SA56004X. They adhere to, but are not necessarily

specified as the SMBus specifications.

[2] Delay from SDATA STOP to SDATA START.

[3] Delay from SDATA START to first SCLK HIGH-to-LOW transition.

[4] Delay from SCLK HIGH-to-LOW transition to SDATA edges.

[5] Delay from SDATA edges to SCLK LOW-to-HIGH transition.

[6] Delay from SCLK LOW-to-HIGH transition to restart SDATA.

[7] Delay from SCLK HIGH-to-LOW transition to SDATA STOP condition.

[8] LOW period for reset of SMBus.

Table 21. SMBus interface characteristics

VDD = 3.0 V to 3.6 V; Tamb =





C to +125



C; unless otherwise specified.

These specifications are guaranteed by design and not tested in production.

Symbol Parameter Conditions Min Typ Max Unit

VIH HIGH-level input voltage SCLK, SDATA; VDD = 2.7 V to 5.5 V 2.2 - - V

VIL LOW-level input voltage SCLK, SDATA; VDD = 2.7 V to 5.5 V - - 0.8 V

IOL LOW-level output current ALERT, T_CRIT; VOL =0.4V 1.0--mA

SDATA; VOL = 0.6 V 6.0 - - mA

IOH HIGH-level output current - - 1.0 A

IIL LOW-level input current 1.0 - - A

IIH HIGH-level input current - - 1.0 A

Ciinput capacitance SCLK, SDATA - 5 - pF

SMBus digital switching characteristics[1]

fSCLK SCLK operating frequency - - 400 kHz

tLOW SCLK LOW time 10 % to 10 % 600 5000 - ns

tHIGH SCLK HIGH time 90 % to 90 % 600 5000 - ns

tBUF SMBus free time[2] 600--ns

tHD;STA hold time of START condition[3] 10 % of SDATA to 90 % of SCLK 600 - - ns

tHD;DAT hold time of data[4] 0300- ns

tSU;DAT set-up time of data in[5] 250--ns

tSU;STA set-up time of repeat START

condition[6] 90 % to 90 % 250 - - ns

tSU;STO set-up time of STOP condition[7] 90 % of SCLK to 90 % of SDATA 250 - - ns

trrise time SCLK and SDATA - - 1 s

tffall time SCLK and SDATA - - 300 ns

tof output fall time CL = 400 pF; IO = 3 mA - - 250 ns

tto(SMBus) SMBus time-out time[8] 25 - 35 ms

Product data sheet Rev. 7 — 25 February 2013 29 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 12. Timing measurements

tBUF

tHD;STA

PP S

tLOW

tHD;DAT

tHIGH

tSU;DAT

tSU;STO

SDATA

SCLK

tSU;STA

tHD;STA

002aad237

Product data sheet Rev. 7 — 25 February 2013 30 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

11. Performance curves

Fig 13. Typ ic al IDD shutdown versus temperature and

VDD

Fig 14. Typical IDD quiescent current versus

temperature and VDD (conversion rate = 16 Hz)

Conversion rate:

(1) 16 Hz

(2) 8.0 Hz

(3) 4.0 Hz

(4) 2.0 Hz

(5) 1.0 Hz

(6) 0.5 Hz

(7) 0.25 Hz

(8) 0.12 Hz

(9) 0.06 Hz

Fig 15. Typ ic al IDD quiescent curren t versus

temperature and VDD

(conversion rate = 0.06 Hz)

Fig 16. Typical IDD quiescent current versus

temperature and conversion rate (VDD =3.3V)

IDD

shutdown

(μA)

Tamb (°C)

−50 125

002aad228

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

400

600

800

IDD

quiescent

(μA)

200

Tamb (°C)

−50 125

002aad229

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

200

300

400

IDD

quiescent

(μA)

100

Tamb (°C)

−50 125

002aad230

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

500

100

Tamb (°C)

−50 125

002aad231

1007550250−25

200

300

400

IDD quiescent

(μA)

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

Product data sheet Rev. 7 — 25 February 2013 31 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 17. Typic al T_CRIT IOL ve rsus temperature a nd

VDD (VOL =0.4V) Fig 18. Typical ALERT IOL versus temperature and VDD

(VOL =0.4V)

Fig 19. Typical undervoltage lockout threshold

voltage versus temperature and VDD

Fig 20. Typical power-on reset threshold voltage

versus temperature

IOL

(mA)

Tamb (°C)

−50 125

002aad232

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

IOL

(mA)

Tamb (°C)

−50 125

002aad234

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

Tamb (°C)

−50 125

002aad233

1007550250−25

VDD = 5.5 V

3.6 V

3.3 V

3.0 V

2.78

2.74

2.72

2.76

2.80

2.70

Vth(UVLO) (V)

2.6

1.0

Tamb (°C)

−50 125

002aad235

1007550250−25

1.4

1.8

2.2

Vth(POR)

(V)

Product data sheet Rev. 7 — 25 February 2013 32 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

12. Package outline

Fig 21. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10 1.45

1.25 0.25 0.49

0.36 0.25

0.19 5.0

4.8 4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6 0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004 0.057

0.049 0.01 0.019

0.014 0.0100

0.0075 0.20

0.19 0.16

0.15 0.05 0.244

0.228 0.028

0.024 0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1

99-12-27

03-02-18

Product data sheet Rev. 7 — 25 February 2013 33 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 22. Package outline SOT505-1 (TSSOP8)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(2) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05 0.95

0.80 0.45

0.25 0.28

0.15 3.1

2.9 3.1

2.9 0.65 5.1

4.7 0.70

0.35 6°

0°

0.1 0.10.10.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT505-1 99-04-09

03-02-18

0.25

A2A1

(A3)

detail X

vMA

2.5 5 mm0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1

1.1

pin 1 index

Product data sheet Rev. 7 — 25 February 2013 34 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 23. Package outline SOT782-1 (HVSON8)

References

Outline

version European

projection Issue date

IEC JEDEC JEITA

SOT782-1 - - -- - -

sot782-1_po

09-08-25

09-08-28

Unit(1)

mm max

nom

min

1.00

0.85

0.80

0.05

0.03

0.00 0.2 3.10

3.00

2.90

2.45

2.40

2.35

3.10

3.00

2.90 0.65 1.95 0.45

0.40

0.35 0.1

Dimensions

Note

1. Plastic or metal protrusions of 0.075 maximum per side are not included.

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 3 x 3 x 0.85 mm SOT782-1

A1b

0.35

0.30

0.25

cDD

hEE

1.65

1.60

1.55

0.35

0.30

0.25

0.1

0.05

0 1 2 mm

scale

MO-229

detail X

B A

terminal 1

index area

eAC B

vCw

1 4

8 5

terminal 1

index area

Product data sheet Rev. 7 — 25 February 2013 35 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

13. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

13.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

13.2 Wave and reflow soldering

W ave soldering is a joinin g technology in which the joint s are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circu it board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldere d. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solderable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering versus SnPb soldering

13.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 7 — 25 February 2013 36 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

13.4 Reflow soldering

Key characteristics in reflow soldering are:

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 24) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classified in accordance with

Table 22 and 23

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 24.

Table 22. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reflow temperatu re (C)

Volume (mm3)

< 350  350

< 2.5 235 220

 2.5 220 220

Table 23. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reflow temperatu re (C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 7 — 25 February 2013 37 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

For further information on temperature profiles, refer to Application Note AN10365

“Surface mount reflow soldering description”.

14. Soldering: PCB footprints

MSL: Moisture Sensitivity Level

Fig 24. Temperature profiles for large and small components

001aac844

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Fig 25. PCB footprint for SOT96-1 (SO8); reflow soldering

sot096-1_fr

occupied area

solder lands Dimensions in mm

placement accuracy ± 0.25

1.30

0.60 (8×)

1.27 (6×)

4.00 6.60

5.50

7.00

Product data sheet Rev. 7 — 25 February 2013 38 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 26. PCB footprint for SOT96-1 (SO8); wa ve soldering

Fig 27. PCB footprint for SOT505-1 (TSSOP8); reflow soldering

sot096-1_fw

solder resist

occupied area

solder lands Dimensions in mm

board direction

placement accurracy ± 0.25

4.00

5.50

1.30

0.3 (2×)

0.60 (6×)

1.20 (2×)

1.27 (6×)

7.00

6.60

enlarged solder land

sot505-1_fr

occupied areasolder lands Dimensions in mm

3.200

3.600

5.750

0.725

0.650

0.125

0.4500.600

3.600

2.950

0.125

1.150

5.500

Product data sheet Rev. 7 — 25 February 2013 39 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Fig 28. PCB footprint for SOT782-1 (HVSON8); reflow soldering

SOT782-1

DIMENSIONS in mm

Footprint information for reflow soldering of HVSON8 package

Ay By D SLx SLy SPx SPy Gx Gy

3.25 2.2

0.65 0.3

0.525 2.45 1.65 1.1 0.65 3.25 3.25

3.5

nSPx nSPy

occupied area

solder land plus solder paste

solder land

solder paste deposit

sot782-1_fr

Issue date 12-02-09

12-02-28

SLx

BySLy

nSPx

nSPy

SPy

SPx

Product data sheet Rev. 7 — 25 February 2013 40 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

15. Abbreviations

16. Revision history

Table 24. Abbreviations

Acronym Description

A/D Analog-to-Digital

ARA Alert Response Address

ASIC Application Specific Integrated Circuit

CRT Cathode Ra y Tube

ESD ElectroStatic Discharge

HBM Human Body Model

HVAC Heating, Ventilating and Air Conditioning

I2C-bus Inter-Integrated Circuit bus

LSB Least Significant Bit

MSB Most Significant Bit

OTP One-Time Programmable

POR Power-On Reset

PTAT Proportional To Absolute Temperature

SMBus System Management Bus

UVLO Under Voltage LockOut

Table 25. Revision history

Document ID Release date Data sheet status Change notice Supersedes

SA56004X v.7 20130225 Product data sheet - SA56004X v.6

Modifications: •Table 1 “Ordering information”: added “Topside marking” column and corrected Topside marking for

SO8 package (appended “D”)

•Table 2 “Ordering options” modified:

–deleted column “Topside marking” (moved to Table 1)

–added columns “Orderable part number”, “Package”, “Packing method”, “Mini mum order

quantity”

•Section 7.2 “Slave address”: added (new) Table 4 “Slave addresses”

•Added (new) Section 8.3 “Timing and firmware consideration ”

•Deleted (old) Section 13 “Packing information”

•Added (new) Section 14 “Soldering: PCB footprints”

SA56004X v.6 20120423 Product data sheet - SA56004X v.5

SA56004X v.5 20080522 Product data sheet - SA56004X v.4

SA56004X v.4 20060808 Product data sheet - SA56004X v.3

SA56004X v.3

(9397 750 13841) 20041006 Product data sheet - SA56004X v.2

SA56004X v.2

(9397 750 12015) 20030903 Objective data - SA56004-X v.1

SA56004-X v.1

(9397 750 10993) 20030819 Objective data - -

Product data sheet Rev. 7 — 25 February 2013 41 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

17. Legal information

17.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

17.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre vail.

Product specificatio n — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

17.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information. NXP Se miconductors takes no

responsibility for the content in this document if provided by an inf ormation

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental ,

punitive, special or consequ ential damages (including - wit hout limitatio n - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggreg ate and cumulative liabil ity towards

customer for the products described herein shall be limited in accordance

with the Terms and condition s of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

Suitability for use — NXP Semiconductors product s are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors pro duct can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconducto rs products in such equipment or

applications and ther efore such inclu sion and/or use is at the cu stomer’s own

risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty tha t such application s will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

NXP Semiconductors does not accept any liabili ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessa ry

testing for th e customer’s applications and pro ducts using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by cust omer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanent ly and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter ms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or t he grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] dat a sheet Production This document contains the product specification.

Product data sheet Rev. 7 — 25 February 2013 42 of 43

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for aut omo tive use. It i s neit her qua lif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standard s, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product cl aims resulting fr om customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specif ications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

17.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respect i ve ow ners.

I2C-bus — logo is a trademark of NXP B.V.

18. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors SA56004X

Digital temperature sensor with overtemperature alarms

For more information, please visit: http://www.nxp.co m

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 February 2013

Document identifier: SA56004X

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

19. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7 Functional description . . . . . . . . . . . . . . . . . . . 6

7.1 Serial bus interface. . . . . . . . . . . . . . . . . . . . . . 6

7.2 Slave address. . . . . . . . . . . . . . . . . . . . . . . . . . 6

7.3 Register overview. . . . . . . . . . . . . . . . . . . . . . . 7

7.4 Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . . 8

7.5 Starting conversion. . . . . . . . . . . . . . . . . . . . . . 9

7.6 Low power software standby mode . . . . . . . . . 9

7.7 Temperature data format . . . . . . . . . . . . . . . . . 9

7.8 SA56004X SMBus registers. . . . . . . . . . . . . . 10

7.8.1 Command register . . . . . . . . . . . . . . . . . . . . . 10

7.8.2 Local and remote temperature registers

(LTHB, LTLB, RTHB, RTLB). . . . . . . . . . . . . . 10

7.8.3 Configuration register (CON) . . . . . . . . . . . . . 10

7.8.4 Status register (SR) . . . . . . . . . . . . . . . . . . . . 11

7.8.5 Conversion rate register (CR). . . . . . . . . . . . . 12

7.8.6 Temperature limit registers. . . . . . . . . . . . . . . 12

7.8.7 Programmable offset register (remote only). . 13

7.8.8 ALERT mode register (AM) . . . . . . . . . . . . . . 13

7.8.9 Other registers . . . . . . . . . . . . . . . . . . . . . . . . 13

7.8.10 One-shot register . . . . . . . . . . . . . . . . . . . . . . 13

7.9 Interruption logic and functional description . . 14

7.9.1 ALERT output. . . . . . . . . . . . . . . . . . . . . . . . . 14

7.9.1.1 ALERT output in comparator mode . . . . . . . . 14

7.9.1.2 ALERT output in interrupt mode. . . . . . . . . . . 14

7.9.1.3 ALERT output in SMBus ALERT mode . . . . . 15

7.9.2 T_CRIT output . . . . . . . . . . . . . . . . . . . . . . . . 17

7.9.3 Fault Queue . . . . . . . . . . . . . . . . . . . . . . . . . . 18

7.9.4 Temperature measurement . . . . . . . . . . . . . . 19

7.9.5 Diode fault detection. . . . . . . . . . . . . . . . . . . . 19

7.10 SMBus interface . . . . . . . . . . . . . . . . . . . . . . . 20

7.10.1 Serial interface reset. . . . . . . . . . . . . . . . . . . . 22

8 Application design-in information . . . . . . . . . 22

8.1 Factors affecting accuracy . . . . . . . . . . . . . . . 22

8.1.1 Remote sensing diode . . . . . . . . . . . . . . . . . . 22

8.1.2 Thermal inertia and self-heating. . . . . . . . . . . 23

8.1.3 Layout considerations . . . . . . . . . . . . . . . . . . . 24

8.2 Power sequencing considerations . . . . . . . . . 25

8.2.1 Power supply slew rate . . . . . . . . . . . . . . . . . 25

8.2.2 Application circuit. . . . . . . . . . . . . . . . . . . . . . 25

8.3 Timing and firmware consideration . . . . . . . . 25

9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26

10 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

11 Performance curves . . . . . . . . . . . . . . . . . . . . 30

12 Package outline. . . . . . . . . . . . . . . . . . . . . . . . 32

13 Soldering of SMD packages. . . . . . . . . . . . . . 35

13.1 Introduction to soldering . . . . . . . . . . . . . . . . . 35

13.2 Wave and reflow soldering. . . . . . . . . . . . . . . 35

13.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . 35

13.4 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . 36

14 Soldering: PCB footprints . . . . . . . . . . . . . . . 37

15 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40

16 Revision history . . . . . . . . . . . . . . . . . . . . . . . 40

17 Legal information . . . . . . . . . . . . . . . . . . . . . . 41

17.1 Data sheet status. . . . . . . . . . . . . . . . . . . . . . 41

17.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

17.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 41

17.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42

18 Contact information . . . . . . . . . . . . . . . . . . . . 42

19 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43