1ch Small Package High Side Switch ICs
0.75A Current Lim it Latch O f f
High Side Sw itch ICs
BD2220G BD2221G
General Description
BD2220G and BD2221G are low ON-Resistance
N-Channel MOSFET high-side power switches,
optimized for Universal Serial Bus (USB) applications.
BD2220G and BD2221G are equipped with the function
of over-current detection, thermal shutdown,
under-voltage lockout and soft-start.
Features
■ Low ON-Resistance (Typ 160mΩ) N-Channel
MOSFET Built-in
■ Over-Current Detection
(Output OFF-Latch Operation)
■ Thermal Shutdown
■ Open-Drain Fault Flag Output
■ Flag Output Delay
■ Under-Voltage Lockout
■ Soft-Start Circuit
■ Control Input Logic
Active-High : BD2220G
Active-Low : BD2221G
■ Reverse Current Protection when
Power Switch Off
Applications
USB hub in consumer appliances, PC, PC peripheral
equipment, and so forth
Key Specificati o n s
Input Voltage Range: 2.7V to 5.5V
ON-Resistance: 160mΩ(Typ)
Over-Current Threshold: 0.5A (Min), 1.0A (Max)
Standby Current: 0.01μA (Typ)
Operating Temperature Range: -40°C to +85°C
Package W(Typ) D (Typ) H (Max)
Typical Ap plicati on Circuit
Lineup
Over-Current Threshold
Control Input
Logic
Package Orderable Part Number
Min
Typ
Max
0.5A - 1.0A High SSOP5 Reel of 3000 BD2220G-TR
0.5A - 1.0A Low SSOP5 Reel of 3000 BD2221G-TR
SSOP5
2.90mm x 2.80mm x 1.25mm
10kΩ~
100kΩ
CL
CIN
VIN
GND
EN
VOUT
/OC
5V (Typ.)
+
-
3.3V
5V(Typ)
10kΩ to
100kΩ
IN OUT
○Product structure：Silicon monolithic integrated circuit ○This product has not designed protection against radioactive rays
1/22
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TSZ22111･14･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
Datashee
t
BD2220G BD2221G
Datasheet
Block Diagram
Pin Configu rations
IN
GND
EN
1
2
3
4
5
/OC
OUT
IN
GND
/EN
1
2
3
4
5
/OC
OUT
Pin Description
Pin No. Symbol I/O Function
1 IN - Switch input and the supply voltage for the IC.
2 GND - Ground
3 EN, /EN I
Enable input.
EN: High level input turns on the switch. (BD2220G)
/EN: Low level input turns on the switch. (BD2221G)
4 /OC O
Over-current notification terminal.
Low level output during over-current or over-temperature condition.
Open-drain fault flag output.
5 OUT O Switch output
BD2220G
TOP VIEW
BD2221G
TOP VIEW
Under-Voltage
Lockout
Charge
Pump
EN(/EN)
Delay
Counter
Over-Current
Detection
Thermal
Shutdown
IN
/OC
GND
OUT
S Q
R
2/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Absolute Maximum Ratings ( Ta = 25°C)
Parameter Symbol Rating Unit
IN Supply Voltage VIN -0.3 to +6.0 V
EN(/EN) Input Voltage VEN, V/EN -0.3 to +6.0 V
/OC Voltage V/OC -0.3 to +6.0 V
/OC Sink Current I/OC 5 mA
OUT Voltage VOUT -0.3 to +6.0 V
Storage Temperature Tstg -55 to +150 °C
Power Dissipation Pd 0.67
(Note 1)
W
(Note 1) Mounted on 70mm x 70mm x 1.6mm glass epoxy board. Reduce 5.4mW per 1oC above 25oC.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated
over the absolute maximum ratings.
Recommen d ed Operatin g Conditions
Parameter Symbol Rating Unit
Min Typ Max
IN Operating Voltage VIN 2.7 5.0 5.5 V
Operating Temperature Topr -40 - +85 °C
Electrical Characteristics
BD2220G (VIN = 5V, Ta= 25°C, unless otherwise specified.)
DC Characteristics
Parameter Symbol Limit Unit Conditions
Min Typ Max
Operating Current IDD - 110 160 μA
V
EN
= 5V
VOUT = Open
Standby Current ISTB - 0.01 5 μA
V
EN
= 0V
VOUT = Open
EN Input Voltage VENH 2.0 - - V High Input
VENL - - 0.8 V Low Input
EN Input Leakage IEN -1.0 +0.01 +1.0 μA VEN = 0V or 5V
ON-Resistance RON - 160 210 mΩ IOUT = 50mA
Switch Leak Current ILSW - - 1.0 μA VEN = 0 V, VOUT = 0V
Reverse Leak Current IREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Over-Current Threshold ITH 0.5 - 1.0 A
Short Circuit Output Current ISC 0.35 - - A VOUT = 0V, RMS
/OC Output Low Voltage V/OC - - 0.4 V I/OC = 0.5mA
UVLO Threshold VTUVH 2.1 2.3 2.5 V VIN Increasing
VTUVL 2.0 2.2 2.4 V VIN Decreasing
AC Characteristics
Parameter Symbol Limit Unit Conditions
Min Typ Max
Output Rise Time
tON1
-
1
6
ms
RL = 20Ω
Output Turn ON Time
tON2
-
1.5
10
ms
RL = 20Ω
Output Fall Time
tOFF1
-
1
20
μs
RL = 20Ω
Output Turn OFF Time
tOFF2
-
3
40
μs
RL = 20Ω
/OC Delay Time
t
/OC
10
15
20
ms
3/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Electrical Characteristics – continued
BD2221G (VIN = 5V, Ta= 25°C, unless otherwise specified.)
DC Characteristics
Parameter Symbol Limit Unit Conditions
Min Typ Max
Operating Current IDD - 110 160 μA
V
/EN
= 0V
VOUT = Open
Standby Current ISTB - 0.01 5 μA
V
/EN
= 5V
VOUT = Open
/EN Input Voltage V/ENH 2.0 - - V High Input
V/ENL - - 0.8 V Low Input
/EN Input Leakage I/EN -1.0 +0.01 +1.0 μA V/EN = 0V or 5V
ON-Resistance RON - 160 210 mΩ IOUT = 50mA
Switch Leak Current ILSW - - 1.0 μA V/EN = 0V, VOUT = 0V
Reverse Leak Current IREV - - 1.0 μA VOUT = 5.5V, VIN = 0V
Over-Current Threshold ITH 0.5 - 1.0 A
Short Circuit Output Current ISC 0.35 - - A VOUT = 0V, RMS
/OC Output Low Voltage V/OC - - 0.4 V I/OC = 0.5mA
UVLO Threshold VTUVH 2.1 2.3 2.5 V VIN Increasing
VTUVL 2.0 2.2 2.4 V VIN Decreasing
AC Characteristics
Parameter Symbol Limit Unit Conditions
Min Typ Max
Output Rise Time
tON1
-
1
6
ms
RL = 20Ω
Output Turn ON Time tON2 - 1.5 10 ms RL = 20Ω
Output Fall Time
tOFF1
-
1
20
μs
RL = 20Ω
Output Turn OFF Time tOFF2 - 3 40 μs RL = 20Ω
/OC Delay Time
t/OC
10
15
20
ms
4/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Measurement Circuit
VIN
GND
EN(/EN)
VOUT
/OC
V
IN
V
EN(/EN)
A
1µF
VIN
GND
EN(/EN)
VOUT
/OC
VIN
VEN(/EN)
A
1µF
RL
A. Operating Current B. EN,/EN Input Voltage, Output Rise / Fall Time
VIN
GND
EN(/EN)
VOUT
/OC
V
IN
V
EN(/EN)
A
1µF
I
OUT
10kΩ
VIN
GND
EN(/EN)
VOUT
/OC
V
IN
V
EN(/EN)
A
1µF
I
OC
C. ON-Resistance, Over-Current Detection D. /OC Output Low Voltage
Figure 1. Measurement Circuit
Timing Diagram
TON1
TOFF1
90%
10%
10%
TON2
TOFF2
VENH
VENL
90%
VEN
VOUT
tON1
tOFF1
90%
10%
10%
tON2
tOFF2
V/ENL
V/ENH
90%
V/EN
VOUT
Figure 2. Output Rise / Fall Time
(BD2220G)
Figure 3. Output Rise / Fall Time
(BD2221G)
IN
OUT
IN
OUT
IN
OUT
IN
OUT
tON2
tOFF2
VEN
tON1
tOFF1
5/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves
Operating Current : IDD[μA]
Operating Current : IDD[μA]
Supply Voltage ; V
IN
[V]
Ambient Temperature ; Ta[°C]
Standby Current : ISTB[μA]
Standby Current : ISTB[μA]
Supply Voltage ; V
IN
[V]
Ambient Temperature ; Ta[°C]
0
20
40
60
80
100
120
140
23456
Ta=25°C
Figure 4. Operating Current vs Supply Voltage
(EN, /EN Enable)
0
20
40
60
80
100
120
140
-50 0 50 100
V
IN
=5.0V
Figure 5. Operating Current vs Ambient Temperature
(EN, /EN Enable )
0.0
0.2
0.4
0.6
0.8
1.0
2 3 4 5 6
Ta=25°C
Figure 6. Standby Current vs Supply Voltage
(EN, /EN Disable)
Figure 7. Standby Current vs Ambient Temperature
(EN, /EN Disable)
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
V
IN
=5.0V
6/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves - continued
0
50
100
150
200
250
23456
Ta=25°C
Figure 10. ON-Resistance vs Supply Voltage
ON-Resistance : RON[mΩ]
Supply Voltage ; VIN[V]
0
50
100
150
200
250
-50 0 50 100
V
IN
=5.0V
Figure 11. ON-Resistance vs
Ambient Temperature
ON-Resistance : RON[mΩ]
Ambient Temperature ; Ta[°C]
Supply Voltage ; V
IN
[V]
Figure 8. EN, /EN Input Voltage
vs
Supply Voltage
0.0
0.5
1.0
1.5
2.0
2 3 4 5 6
Ta=25°C
Low to High
High to Low
Enable Input Voltage : VEN, V/EN[V]
Enable Input Voltage : VEN, V/EN[V]
Ambient Temperature ; Ta[°C]
0.0
0.5
1.0
1.5
2.0
-50 050 100
V
IN
=5.0V
Low to High
High to Low
Figure 9. EN, /EN Input Voltage
vs
Ambient Temperature
7/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves - continued
Figure 12. Over-Current Threshold
vs
Supply Voltage
Over-Current Threshold : ITH[A]
Supply Voltage ; VIN[V]
0.5
0.6
0.7
0.8
0.9
1.0
23456
Ta=25°C
Over-Current Threshold : ITH[A]
Ambient Temperature ; Ta[°C]
0.5
0.6
0.7
0.8
0.9
1.0
-50 0 50 100
V
IN
=5.0V
Figure 13. Over-Current Threshold
vs Ambient Temperature
0
20
40
60
80
100
-50 0 50 100
Ta=25°C
Figure 14. /OC Output Low Voltage vs
Supply Voltage
Supply Voltage ; V
IN
[V]
/OC Output Low Voltage : V/OC[mV]
0
20
40
60
80
100
-50 0 50 100
V
IN
=5.0V
Figure 15. /OC Output Low Voltage
vs
Ambient Temperature
Ambient Temperature ; Ta[°C]
/OC Output Low Voltage : V/OC[mV]
8/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves - continued
Output Rise Time : tON[ms]
Ambient Temperature ; Ta[°C]
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
V
IN
=5.0V
Figure 19. Output Rise Time vs
Ambient Temperature
UVLO Hysteresis Voltage : VHYS[V]
Ambient Temperature ; Ta[°C]
0.0
0.2
0.4
0.6
0.8
1.0
-50 0 50 100
Figure 17. UVLO Hysteresis Voltage vs
Ambient Temperature
Output Rise Time : tON[ms]
Supply Voltage ; VIN[V]
Figure 18. Output Rise Time vs
Supply Voltage
0.0
1.0
2.0
3.0
4.0
5.0
2 3 4 5 6
Ta=25°C
Figure 16. UVLO
Threshold Voltage
vs
Ambient Temperature
2.0
2.1
2.2
2.3
2.4
2.5
-50 0 50 100
V
TUVH
V
TUVL
UVLO Threshold : VTUVH, VTUVL [V]
Ambient Temperature ; Ta[°C]
9/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves - continued
Output Turn ON Time : tON2[ms]
Supply Voltage ; VIN[V]
0.0
1.0
2.0
3.0
4.0
5.0
2 3 4 5 6
Ta=25°C
Figure 20. Output Turn ON Time
vs
Supply Voltage
Output Fall Time : tOFF[µs]
Supply Voltage ; VIN[V]
0.0
1.0
2.0
3.0
4.0
5.0
2 3 4 5 6
Ta=25°C
Figure 22. Output Fall Time vs
Supply Voltage
Output Fall Time : tOFF[µs]
Ambient Temperature ; Ta[°C]
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
V
IN
=5.0V
Figure 23. Output Fall Time vs
Ambient Temperature
Output Turn ON Time : tON2[ms]
Ambient Temperature ; Ta[°C]
0.0
1.0
2.0
3.0
4.0
5.0
-50 0 50 100
V
IN
=5.0V
Figure 21. Output Turn ON Time
vs
Ambient Temperature
10/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Performance Curves - continued
0.0
1.0
2.0
3.0
4.0
5.0
6.0
23 456
SUPPLY VOLTAGE : VIN [V]
TURN OFF TIME : TOFF2[μs]
Ta=25°C
Output Turn OFF Time : tOFF2[µs]
Supply Voltage ; V
IN
[V]
0.0
1.0
2.0
3.0
4.0
5.0
6.0
-50 050 100
AMBIENT TEMPERATURE : Ta[℃]
TURN OFF TIME : T
OFF2
[μs]
V
IN
=5.0V
Output Turn OFF Time : tOFF2[µs]
Ambient Temperature ; Ta[°C]
Figure 24. Output Turn OFF Time vs
Supply Voltage
Figure 25. Output Turn OFF Time vs
Ambient Temperature
/OC Delay Time : t/OC[ms]
Supply Voltage ; VIN[V]
10
12
14
16
18
20
2 3 4 5 6
Ta=25°C
Figure 26. /OC Delay Time vs
Supply Voltage
/OC Delay Time : t/OC[ms]
Ambient Temperature ; Ta[°C]
10
12
14
16
18
20
-50 0 50 100
V
IN
=5.0V
Figure 27. /OC Delay Time vs
Ambient Temperature
11/22
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© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Waveforms
Time (1ms/div.)
Figure 28. Output Rise Characteristic
VEN
(5V/div.)
V/OC
(5V/div.)
VOUT
(5V/div.)
IOUT
(0.5A/div.)
V
IN
=5V
RL=20Ω
V
EN
(5V/div.)
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
VIN=5V
R
L
=20Ω
Time (2μs/div.)
Figure 29. Output Fall Characteristic
Time (1ms/div.)
Figure 30. Inrush Current Response
CL =47μF
CL =100μF
CL=220μF
(5V/div.)
V
EN
I
OUT
(0.2A/div.)
V
/OC
(5V/div.)
V
IN
=5V
RL=20Ω
Time (2ms/div.)
Figure 31. Over-Current Response
Ramped Load
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
V
IN
=5V
1A/10ms
12/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Waveforms - continued
Time (10ms/div.)
Figure 32. Over-Current Response
Ramped Load
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
VIN=5V
1A/50ms
Time (5ms/div.)
Figure 33. Over-Current Response
Enable to Short-Circuit
V
EN
(5V/div.)
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(0.5A/div.)
VIN=5V
Time (5ms/div.)
Figure 34. Over-Current Response
1Ω Load Connected at EN
V
/OC
(5V/div.)
V
OUT
(5V/div.)
I
OUT
(1A/div.)
VIN=5V
RL=1Ω
Time (10ms/div.)
Figure 35. UVLO Response
Increasing VIN
V
OUT
(5V/div.)
I
OUT
(0.2A/div.)
V
IN
(5V/div.)
RL=20Ω
13/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Typical Application Circuit
Controller
10kΩ~
100kΩ
C
L
C
IN
VIN
GND
EN(/EN)
VOUT
/OC
5V (Typ.)
Ferrite
Beads
+
-
Application Information
When excessive current flows due to output short circuit or so, ringing occurs because of inductance between power source
line and IC. This may cause bad effects on IC operations. In order to avoid this case, connect a bypass capacitor across IN
terminal and GND terminal of IC. 1μF or higher is recommended.
Pull up /OC output by a resistance value of 10kΩ to 100kΩ.
Set up value which satisfies the application of either CL.
This application circuit does not guarantee its operation.
When using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external
components including AC/DC characteristics as well as dispersion of the IC.
Functional Description
1. Switch Operation
IN terminal and OUT terminal are connected to the drain and the source of switch MOSFET respectively. The IN terminal
is also used as power source input to internal control circuit.
When the switch is turned on from EN, /EN control input, the switch is bidirectional. IN terminal and OUT terminal are
connected by a 160mΩ (Typ) switch. Therefore, when the potential of OUT terminal is higher than that of IN terminal,
current flows from OUT terminal to IN terminal. On the other hand, when the switch is turned OFF, it is possible to prevent
current from flowing reversely from OUT to IN since a parasitic diode between the drain and the source of switch
MOSFET is not present,
2. Thermal Shutdown Circuit (TSD)
If over-current would continue, the temperature of the IC would increase drastically. If the junction temperature were
beyond 170°C (Typ) during the condition of over-current detection, thermal shutdown circuit operates and turns power
switch off and outputs a fault flag (/OC). Then, when the junction temperature decreases lower than 150°C (Typ), power
switch is turned on and fault flag (/OC) is cancelled. Unless the increase of the chip’s temperature is removed or the
output of power switch is turned off, this operation repeats.
Note: The thermal shutdown circuit operates when the switch is on (EN, /EN signal is active).
3. Over-Current Detection (OCD)
The over-current detection circuit limits current (ISC) and outputs a fault flag (/OC) when current flowing in each MOSFET
exceeds a specified value. There are three types of response against over-current. The over-current detection circuit
works when the switch is on (EN, /EN signal is active).
(1) When the switch is turned on while the output is in short circuit status
When the switch is turned on while the output is in short circuit status, the switch goes into current limit status
immediately.
(2) When the output short circuits while the switch is on
When the output short circuits or high-current load is connected while the switch is on, very large current flows until
the over-current limit circuit reacts. When the current detection and limit circuit works, current limitation is carried out.
(3) When the output current increases gradually
When the output current increases gradually, current limitation does not work until the output current exceeds the
over-current detection value. When it exceeds the detection value, current limitation is carried out.
4. Under Voltage Lockout (UVLO)
UVLO circuit prevents the switch from turning on until the VIN exceeds 2.3V(Typ). If VIN drops below 2.2V(Typ) while the
switch is still ON, then UVLO will shut off the power switch. UVLO has a hysteresis of 100mV(Typ).
Note: Under voltage lockout circuit works when the switch is on (EN, /EN signal is active).
10kΩ
to
100kΩ
5V(Typ)
IN
OUT
15/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Switch Status
VIN
t/OC
t/OC
ON
OFF
ON
Output Current
V
TUVH
V
TUVL
FLAG Output
V
EN
5. Fault Flag (/OC) Output
Fault flag output is an NMOS open drain output. At detection of over-current and/or thermal shutdown, the output level is
low. Over-current detection has delay filter. This delay filter prevents current detection flags from being sent during
instantaneous events such as inrush current at switch on or during hot plug.. If fault flag output is unused, /OC pin should
be connected to open or ground line.
t
/OC
t
/OC
ON
OFF
ON
Output Current
Switch Status
V
EN
FLAG Output
Figure 37. Over-Current Shutdown Operation (Reset at Toggle of EN (BD2220G)
Figure 38. Over-Current Shutdown Operation (Reset at UVLO operation) (BD2220G)
16/22
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TSZ22111･15･001
TSZ02201-0E3E0H300190-1-2
21.Aug.2014 Rev.003
BD2220G BD2221G
Datasheet
Power Dissipation
(SSOP5 package)
Figure 39. Power Dissipation Curve (Pd-Ta Curve)
I/O Equivalence Circuit
Symbol Pin No. Equivalence circuit
EN
(/EN) 3
EN
(/EN)
OUT 5
VOUT
/OC 4
/OC
0
100
200
300
400
500
600
700
025 50 75 100 125 150
A MBIENT TEMPERA TURE : Ta [ ℃]
POWER DISSIPATION : Pd [mW]
85
Power Dissipation : Pd[mW]
Ambient Temperature ; Ta[°C]
70mm x 70mm x 1.6mm Glass Epoxy Board
OUT
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BD2220G BD2221G
Datasheet
Operation al Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating, increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained. The electrical characteristics are guaranteed under the conditions of each parameter.
7. In rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush
current may flow instantaneously due to the internal powering sequence and delays, especially if the IC
has more than one power supply. Therefore, give special consideration to power coupling capacitance,
power wiring, width of ground wiring, and routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment)
and unintentional solder bridge deposited in between pins during assembly to name a few.
18/22
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Datasheet
Operation al Notes - continued
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should
be avoided.
Figure 40. Example of monolithic IC structure
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
14. Thermal Shutdown Circuit(TSD)
This IC has a built-in thermal shutdown circuit that prevents heat damage to the IC. Normal operation should always
be within the IC’s power dissipation rating. If however the rating is exceeded for a continued period, the junction
temperature (Tj) will rise which will activate the TSD circuit that will turn OFF all output pins. When the Tj falls below
the TSD threshold, the circuits are automatically restored to normal operation.
Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no
circumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC from
heat damage.
15. Thermal d esig n
Perform thermal design in which there are adequate margins by taking into account the power dissipation (Pd) in
actual states of use.
N N
P+P
N N
P+
P Substrate
GND
NP+
N N
P+
NP
P Substrate
GND GND
Parasitic
Elements
Pin A
Pin A
Pin B Pin B
B C
E
Parasitic
Elements
GND
Parasitic
Elements
CB
E
Transistor (NPN)
Resistor
N Region
close-by
Parasitic
Elements
19/22
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BD2220G BD2221G
Datasheet
Orderi n g Information
Marking Diagram
Part Number Part Number Marking
BD2220G DX
BD2221G DY
B D 2 2 2 0 G - T R
Part Number
Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
B D 2 2 2 1 G - T R
Part Number Package
G: SSOP5
Packaging and forming specification
TR: Embossed tape and reel
Part Number Marking
SSOP5 (TOP VIEW)
LOT Number
20/22
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BD2220G BD2221G
Datasheet
Revision History
Date Revision Changes
11.Mar.2013 001 New Release
25.Jun.2013 002 Modified Y-axis of figure 4. Changed character color from RED to BLOCK of figure 16.
21.Aug.2014 003 Applied the ROHM Standard Style and improved understandability.
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Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the
ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice – GE Rev.002
© 2013 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act,
please consult with ROHM representative in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable
for infringement of any intellectual property rights or other damages arising from use of such information or data.:
2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the information contained in this document.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2014 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
