LP3873,LP3876
LP3873/LP3876 3A Fast Ultra Low Dropout Linear Regulators
Literature Number: SNVS220D
LP3873/LP3876
3A Fast Ultra Low Dropout Linear Regulators
General Description
The LP3873/LP3876 series of fast ultra low-dropout linear
regulators operate from a +2.5V to +7.0V input supply. Wide
range of preset output voltage options are available. These
ultra low dropout linear regulators respond very quickly to
step changes in load, which makes them suitable for low
voltage microprocessor applications. The LP3873/LP3876
are developed on a CMOS process which allows low quies-
cent current operation independent of output load current.
This CMOS process also allows the LP3873/LP3876 to op-
erate under extremely low dropout conditions.
Dropout Voltage: Ultra low dropout voltage; typically 80mV
at 300mA load current and 800mV at 3A load current.
Ground Pin Current: Typically 6mA at 3A load current.
Shutdown Mode: Typically 1µA quiescent current when the
shutdown pin is pulled low.
Error Flag: Error flag goes low when the output voltage
drops 10% below nominal value.
SENSE: Sense pin improves regulation at remote loads.
Precision Output Voltage: Multiple output voltage options
are available ranging from 1.8V to 5.0V with a guaranteed
accuracy of ±1.5% at room temperature, and ±3.0% over all
conditions (varying line, load, and temperature).
Features
nUltra low dropout voltage
nLow ground pin current
nLoad regulation of 0.08%
n1µA quiescent current in shutdown mode
nGuaranteed output current of 3A DC
nAvailable in TO-263 and TO-220 packages
nOutput voltage accuracy ±1.5%
nError flag indicates output status
nSense option improves load regulation
nMinimum output capacitor requirements
nOvertemperature/overcurrent protection
n−40˚C to +125˚C junction temperature range
Applications
nMicroprocessor power supplies
nGTL, GTL+, BTL, and SSTL bus terminators
nPower supplies for DSPs
nSCSI terminator
nPost regulators
nHigh efficiency linear regulators
nBattery chargers
nOther battery powered applications
Typical Application Circuits
20060501
*SD and ERROR pins must be pulled high through a 10kpull-up resistor. Connect the ERROR pin to ground if this function is not used. See application hints
for more information.
September 2006
LP3873/LP3876 3A Fast Ultra Low Dropout Linear Regulators
© 2006 National Semiconductor Corporation DS200605 www.national.com
Typical Application Circuits (Continued)
20060545
*SD pins must be pulled high through a 10kpull-up resistor. See application hints for more information.
Connection Diagrams
20060505
Top View
TO220-5 Package
Bent, Staggered Leads
20060506
Top View
TO263-5 Package
Pin Descriptions for TO220-5 and TO263-5 Packages
Pin # LP3873 LP3876
Name Function Name Function
1SD
Shutdown SD Shutdown
2V
IN
Input Supply V
IN
Input Supply
3 GND Ground GND Ground
4V
OUT
Output Voltage V
OUT
Output Voltage
5 ERROR ERROR Flag SENSE Remote Sense Pin
LP3873/LP3876
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Ordering Information
20060531
Package Type Designator is "T" for TO220 package, and "S" for TO263 package.
TABLE 1. Package Marking and Ordering Information
Output
Voltage Order Number
Description
(Current, Option)
Package
Type Package Marking Supplied As:
5.0 LP3873ES-5.0 3A, Error Flag TO263-5 LP3873ES-5.0 Rail
5.0 LP3873ESX-5.0 3A, Error Flag TO263-5 LP3873ES-5.0 Tape and Reel
3.3 LP3873ES-3.3 3A, Error Flag TO263-5 LP3873ES-3.3 Rail
3.3 LP3873ESX-3.3 3A, Error Flag TO263-5 LP3873ES-3.3 Tape and Reel
2.5 LP3873ES-2.5 3A, Error Flag TO263-5 LP3873ES-2.5 Rail
2.5 LP3873ESX-2.5 3A, Error Flag TO263-5 LP3873ES-2.5 Tape and Reel
1.8 LP3873ES-1.8 3A, Error Flag TO263-5 LP3873ES-1.8 Rail
1.8 LP3873ESX-1.8 3A, Error Flag TO263-5 LP3873ES-1.8 Tape and Reel
5.0 LP3876ES-5.0 3A, SENSE TO263-5 LP3876ES-5.0 Rail
5.0 LP3876ESX-5.0 3A, SENSE TO263-5 LP3876ES-5.0 Tape and Reel
3.3 LP3876ES-3.3 3A, SENSE TO263-5 LP3876ES-3.3 Rail
3.3 LP3876ESX-3.3 3A, SENSE TO263-5 LP3876ES-3.3 Tape and Reel
2.5 LP3876ES-2.5 3A, SENSE TO263-5 LP3876ES-2.5 Rail
2.5 LP3876ESX-2.5 3A, SENSE TO263-5 LP3876ES-2.5 Tape and Reel
1.8 LP3876ES-1.8 3A, SENSE TO263-5 LP3876ES-1.8 Rail
1.8 LP3876ESX-1.8 3A, SENSE TO263-5 LP3876ES-1.8 Tape and Reel
5.0 LP3873ET-5.0 3A, Error Flag TO220-5 LP3873ET-5.0 Rail
3.3 LP3873ET-3.3 3A, Error Flag TO220-5 LP3873ET-3.3 Rail
2.5 LP3873ET-2.5 3A, Error Flag TO220-5 LP3873ET-2.5 Rail
1.8 LP3873ET-1.8 3A, Error Flag TO220-5 LP3873ET-1.8 Rail
5.0 LP3876ET-5.0 3A, SENSE TO220-5 LP3876ET-5.0 Rail
3.3 LP3876ET-3.3 3A, SENSE TO220-5 LP3876ET-3.3 Rail
2.5 LP3876ET-2.5 3A, SENSE TO220-5 LP3876ET-2.5 Rail
1.8 LP3876ET-1.8 3A, SENSE TO220-5 LP3876ET-1.8 Rail
LP3873/LP3876
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Block Diagram LP3873
20060503
Block Diagram LP3876
20060529
LP3873/LP3876
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range −65˚C to +150˚C
Lead Temperature
(Soldering, 5 sec.) 260˚C
ESD Rating (Note 3) 2 kV
Power Dissipation (Note 2) Internally Limited
Input Supply Voltage (Survival) −0.3V to +7.5V
Shutdown Input Voltage
(Survival) −0.3V to 7.5V
Output Voltage (Survival), (Note
6), (Note 7) −0.3V to +6.0V
I
OUT
(Survival) Short Circuit Protected
Maximum Voltage for ERROR
Pin V
IN
Maximum Voltage for SENSE Pin V
OUT
Operating Ratings
Input Supply Voltage (Note 11) 2.5V to 7.0V
Shutdown Input Voltage −0.3V to 7.0V
Maximum Operating Current (DC) 3A
Junction Temperature −40˚C to +125˚C
Electrical Characteristics
LP3873/LP3876
Limits in standard typeface are for T
J
= 25˚C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V
IN
=V
O(NOM)
+ 1.5V, I
L
= 10 mA, C
OUT
= 10µF, V
SD
= 2V.
Symbol Parameter Conditions Typ
(Note 4)
LP3873/6 (Note 5) Units
Min Max
V
O
Output Voltage
Tolerance
(Note 8)
V
OUT
+1.5V V
IN
7.0V
10 mA I
L
3A 0 -1.5
-3.0
+1.5
+3.0 %
V
OL
Output Voltage Line
Regulation (Note 8)
V
OUT
+ 1.5V V
IN
7.0V 0.02
0.06
%
V
O
/I
OUT
Output Voltage Load
Regulation
(Note 8)
10 mA I
L
3A 0.08
0.14
%
V
IN
-V
OUT
Dropout Voltage
(Note 10)
I
L
= 300 mA 80 100
120 mV
I
L
= 3A 800 1000
1200
I
GND
Ground Pin Current In
Normal Operation
Mode
I
L
= 300 mA 5 9
10 mA
I
L
=3A 6 14
15
I
GND
Ground Pin Current In
Shutdown Mode
V
SD
0.3V 1 10 µA
-40˚C T
J
85˚C 50
I
O(PK)
Peak Output Current V
O
V
O(NOM)
- 4% 4.5 A
SHORT CIRCUIT PROTECTION
I
SC
Short Circuit Current 6 A
LP3873/LP3876
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Electrical Characteristics
LP3873/LP3876 (Continued)
Limits in standard typeface are for T
J
= 25˚C, and limits in boldface type apply over the full operating temperature range.
Unless otherwise specified: V
IN
=V
O(NOM)
+ 1.5V, I
L
= 10 mA, C
OUT
= 10µF, V
SD
= 2V.
Symbol Parameter Conditions Typ
(Note 4)
LP3873/6 (Note 5) Units
Min Max
SHUTDOWN INPUT
V
SDT
Shutdown Threshold Output = High V
IN
2V
Output = Low 0 0.3
T
dOFF
Turn-off delay I
L
=3A 20 µs
T
dON
Turn-on delay I
L
=3A 25 µs
I
SD
SD Input Current V
SD
=V
IN
1nA
ERROR FLAG
V
T
Threshold (Note 9) 10 516%
V
TH
Threshold Hysteresis (Note 9) 5 28%
V
EF(Sat)
Error Flag Saturation I
sink
= 100µA 0.02 0.1 V
Td Flag Reset Delay 1 µs
I
lk
Error Flag Pin Leakage
Current
1nA
I
max
Error Flag Pin Sink
Current
V
Error
=0.5V 1mA
AC PARAMETERS
PSRR Ripple Rejection
V
IN
=V
OUT
+ 1.0V
C
OUT
= 10uF
V
OUT
= 3.3V
73
dB
V
IN
=V
OUT
+ 0.5V
C
OUT
= 10uF
V
OUT
= 3.3V
57
ρ
n(l/f
Output Noise Density f = 120Hz 0.8 µV
e
n
Output Noise Voltage
BW = 10Hz 100kHz
V
OUT
= 2.5V
150
µV (rms)
BW = 300Hz 300kHz
V
OUT
= 2.5V
100
Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics. The
guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed
test conditions.
Note 2: At elevated temperatures, devices must be derated based on package thermal resistance. The devices in TO220 package must be derated at θjA = 50˚C/W
(with 0.5in2, 1oz. copper area), junction-to-ambient (with no heat sink). The devices in the TO263 surface-mount package must be derated at θjA = 60˚C/W (with
0.5in2, 1oz. copper area), junction-to-ambient. See Application Hints.
Note 3: The human body model is a 100pF capacitor discharged through a 1.5kresistor into each pin.
Note 4: Typical numbers are at 25˚C and represent the most likely parametric norm.
Note 5: Limits are guaranteed by testing, design, or statistical correlation.
Note 6: If used in a dual-supply system where the regulator load is returned to a negative supply, the output must be diode-clamped to ground.
Note 7: The output PMOS structure contains a diode between the VIN and VOUT terminals. This diode is normally reverse biased. This diode will get forward biased
if the voltage at the output terminal is forced to be higher than the voltage at the input terminal. This diode can typically withstand 200mA of DC current and 1Amp
of peak current.
Note 8: Output voltage line regulation is defined as the change in output voltage from the nominal value due to change in the input line voltage. Output voltage load
regulation is defined as the change in output voltage from the nominal value due to change in load current. The line and load regulation specification contains only
the typical number. However, the limits for line and load regulation are included in the output voltage tolerance specification.
Note 9: Error Flag threshold and hysteresis are specified as percentage of regulated output voltage. See Application Hints.
Note 10: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. Dropout voltage
specification applies only to output voltages of 2.5V and above. For output voltages below 2.5V, the drop-out voltage is nothing but the input to output differential,
since the minimum input voltage is 2.5V.
Note 11: The minimum operating value for VIN is equal to either [VOUT(NOM) +V
DROPOUT] or 2.5V, whichever is greater.
LP3873/LP3876
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Typical Performance Characteristics Unless otherwise specified: T
J
= 25˚C, C
OUT
= 10µF,
C
IN
= 10µF, S/D pin is tied to V
IN
,V
OUT
= 2.5V, V
IN
=V
O(NOM)
+ 1V, I
L
= 10mA
Dropout Voltage Vs Output Load Current
Ground Current vs Output Load Current
V
OUT
=5V
20060562 20060553
Ground Current vs Output Voltage
I
L
= 3A Shutdown I
Q
vs Junction Temperature
20060554
20060555
Error Flag Threshold vs Junction Temperature DC Load Reg. vs Junction Temperature
20060557
20060558
LP3873/LP3876
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Typical Performance Characteristics Unless otherwise specified: T
J
= 25˚C, C
OUT
= 10µF,
CIN = 10µF, S/D pin is tied to V
IN
,V
OUT
= 2.5V, V
IN
=V
O(NOM)
+ 1V, I
L
= 10mA (Continued)
DC Line Regulation vs Temperature V
IN
vs V
OUT
Over Temperature
20060559
20060560
Noise vs Frequency
Load Transient Response
C
IN
=C
OUT
= 10µF, OSCON
20060561
20060581
Load Transient Response
C
IN
=C
OUT
= 100µF, OSCON
Load Transient Response
C
IN
=C
OUT
= 100µF, POSCAP
20060582 20060583
LP3873/LP3876
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Typical Performance Characteristics Unless otherwise specified: T
J
= 25˚C, C
OUT
= 10µF,
CIN = 10µF, S/D pin is tied to V
IN
,V
OUT
= 2.5V, V
IN
=V
O(NOM)
+ 1V, I
L
= 10mA (Continued)
Load Transient Response
C
IN
=C
OUT
= 10µF, TANTALUM
Load Transient Response
C
IN
=C
OUT
= 100µF, TANTALUM
20060584 20060585
Load Transient Response
C
IN
=C
OUT
= 10µF, OSCON
Load Transient Response
C
IN
=C
OUT
= 100µF, OSCON
20060586 20060587
Load Transient Response
C
IN
=C
OUT
= 100µF, POSCAP
Load Transient Response
C
IN
=C
OUT
= 10µF, TANTALUM
20060588 20060589
LP3873/LP3876
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Typical Performance Characteristics Unless otherwise specified: T
J
= 25˚C, C
OUT
= 10µF,
CIN = 10µF, S/D pin is tied to V
IN
,V
OUT
= 2.5V, V
IN
=V
O(NOM)
+ 1V, I
L
= 10mA (Continued)
Load Transient Response
C
IN
=C
OUT
= 100µF, TANTALUM
20060590
LP3873/LP3876
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Application Hints
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are re-
quired to assure stability. these capacitors must be correctly
selected for proper performance.
INPUT CAPACITOR: An input capacitor of at least 1µF is
required. Ceramic or Tantalum may be used, and capaci-
tance may be increased without limit
OUTPUT CAPACITOR: An output capacitor is required for
loop stability. It must be located less than 1 cm from the
device and connected directly to the output and ground pins
using traces which have no other currents flowing through
them (see PCB Layout section).
The minimum value of the output capacitance that can be
used for stable full-load operation is 10 µF, but it may be
increased without limit. The output capacitor must have an
ESR value as shown in the stable region of the curve (be-
low).
ESR Curve
20060570
SELECTING A CAPACITOR
It is important to note that capacitance tolerance and varia-
tion with temperature must be taken into consideration when
selecting a capacitor so that the minimum required amount
of capacitance is provided over the full operating tempera-
ture range. In general, a good Tantalum capacitor will show
very little capacitance variation with temperature, but a ce-
ramic may not be as good (depending on dielectric type).
Aluminum electrolytics also typically have large temperature
variation of capacitance value.
Equally important to consider is a capacitor’s ESR change
with temperature: this is not an issue with ceramics, as their
ESR is extremely low. However, it is very important in Tan-
talum and aluminum electrolytic capacitors. Both show in-
creasing ESR at colder temperatures, but the increase in
aluminum electrolytic capacitors is so severe they may not
be feasible for some applications (see Capacitor Character-
istics Section).
CAPACITOR CHARACTERISTICS
CERAMIC: For values of capacitance in the 10 to 100 µF
range, ceramics are usually larger and more costly than
tantalums but give superior AC performance for bypassing
high frequency noise because of very low ESR (typically less
than 10 m). However, some dielectric types do not have
good capacitance characteristics as a function of voltage
and temperature.
Z5U and Y5V dielectric ceramics have capacitance that
drops severely with applied voltage. A typical Z5U or Y5V
capacitor can lose 60% of its rated capacitance with half of
the rated voltage applied to it. The Z5U and Y5V also exhibit
a severe temperature effect, losing more than 50% of nomi-
nal capacitance at high and low limits of the temperature
range.
X7R and X5R dielectric ceramic capacitors are strongly rec-
ommended if ceramics are used, as they typically maintain a
capacitance range within ±20% of nominal over full operat-
ing ratings of temperature and voltage. Of course, they are
typically larger and more costly than Z5U/Y5U types for a
given voltage and capacitance.
TANTALUM: Solid Tantalum capacitors are recommended
for use on the output because their typical ESR is very close
to the ideal value required for loop compensation. They also
work well as input capacitors if selected to meet the ESR
requirements previously listed.
Tantalums also have good temperature stability: a good
quality Tantalum will typically show a capacitance value that
varies less than 10-15% across the full temperature range of
125˚C to −40˚C. ESR will vary only about 2X going from the
high to low temperature limits.
The increasing ESR at lower temperatures can cause oscil-
lations when marginal quality capacitors are used (if the ESR
of the capacitor is near the upper limit of the stability range at
room temperature).
ALUMINUM: This capacitor type offers the most capaci-
tance for the money. The disadvantages are that they are
larger in physical size, not widely available in surface mount,
and have poor AC performance (especially at higher fre-
quencies) due to higher ESR and ESL.
Compared by size, the ESR of an aluminum electrolytic is
higher than either Tantalum or ceramic, and it also varies
greatly with temperature. A typical aluminum electrolytic can
exhibit an ESR increase of as much as 50X when going from
25˚C down to −40˚C.
It should also be noted that many aluminum electrolytics only
specify impedance at a frequency of 120 Hz, which indicates
they have poor high frequency performance. Only aluminum
electrolytics that have an impedance specified at a higher
frequency (between 20 kHz and 100 kHz) should be used for
the LP387X. Derating must be applied to the manufacturer’s
ESR specification, since it is typically only valid at room
temperature.
Any applications using aluminum electrolytics should be
thoroughly tested at the lowest ambient operating tempera-
ture where ESR is maximum.
TURN-ON CHARACTERISTICS FOR OUTPUT
VOLTAGES PROGRAMMED TO 2.0V OR BELOW
As Vin increases during start-up, the regulator output will
track the input until Vin reaches the minimum operating
voltage (typically about 2.2V). For output voltages pro-
grammed to 2.0V or below, the regulator output may mo-
mentarily exceed its programmed output voltage during start
up. Outputs programmed to voltages above 2.0V are not
affected by this behavior.
LP3873/LP3876
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Application Hints (Continued)
PCB LAYOUT
Good PC layout practices must be used or instability can be
induced because of ground loops and voltage drops. The
input and output capacitors must be directly connected to the
input, output, and ground pins of the regulator using traces
which do not have other currents flowing in them (Kelvin
connect).
The best way to do this is to lay out C
IN
and C
OUT
near the
device with short traces to the V
IN
,V
OUT
, and ground pins.
The regulator ground pin should be connected to the exter-
nal circuit ground so that the regulator and its capacitors
have a "single point ground".
It should be noted that stability problems have been seen in
applications where "vias" to an internal ground plane were
used at the ground points of the IC and the input and output
capacitors. This was caused by varying ground potentials at
these nodes resulting from current flowing through the
ground plane. Using a single point ground technique for the
regulator and it’s capacitors fixed the problem.
Since high current flows through the traces going into V
IN
and coming from V
OUT
, Kelvin connect the capacitor leads to
these pins so there is no voltage drop in series with the input
and output capacitors.
RFI/EMI SUSCEPTIBILITY
RFI (radio frequency interference) and EMI (electromagnetic
interference) can degrade any integrated circuit’s perfor-
mance because of the small dimensions of the geometries
inside the device. In applications where circuit sources are
present which generate signals with significant high fre-
quency energy content (>1 MHz), care must be taken to
ensure that this does not affect the IC regulator.
If RFI/EMI noise is present on the input side of the regulator
(such as applications where the input source comes from the
output of a switching regulator), good ceramic bypass ca-
pacitors must be used at the input pin of the IC.
If a load is connected to the IC output which switches at high
speed (such as a clock), the high-frequency current pulses
required by the load must be supplied by the capacitors on
the IC output. Since the bandwidth of the regulator loop is
less than 100 kHz, the control circuitry cannot respond to
load changes above that frequency. The means the effective
output impedance of the IC at frequencies above 100 kHz is
determined only by the output capacitor(s).
In applications where the load is switching at high speed, the
output of the IC may need RF isolation from the load. It is
recommended that some inductance be placed between the
output capacitor and the load, and good RF bypass capaci-
tors be placed directly across the load.
PCB layout is also critical in high noise environments, since
RFI/EMI is easily radiated directly into PC traces. Noisy
circuitry should be isolated from "clean" circuits where pos-
sible, and grounded through a separate path. At MHz fre-
quencies, ground planes begin to look inductive and RFI/
EMI can cause ground bounce across the ground plane.
In multi-layer PCB applications, care should be taken in
layout so that noisy power and ground planes do not radiate
directly into adjacent layers which carry analog power and
ground.
OUTPUT NOISE
Noise is specified in two ways-
Spot Noise or Output noise density is the RMS sum of all
noise sources, measured at the regulator output, at a spe-
cific frequency (measured with a 1Hz bandwidth). This type
of noise is usually plotted on a curve as a function of fre-
quency.
Total output Noise or Broad-band noise is the RMS sum
of spot noise over a specified bandwidth, usually several
decades of frequencies.
Attention should be paid to the units of measurement. Spot
noise is measured in units µV/Hz or nV/Hz and total output
noise is measured in µV(rms).
The primary source of noise in low-dropout regulators is the
internal reference. In CMOS regulators, noise has a low
frequency component and a high frequency component,
which depend strongly on the silicon area and quiescent
current. Noise can be reduced in two ways: by increasing the
transistor area or by increasing the current drawn by the
internal reference. Increasing the area will decrease the
chance of fitting the die into a smaller package. Increasing
the current drawn by the internal reference increases the
total supply current (ground pin current). Using an optimized
trade-off of ground pin current and die size, LP3873/LP3876
achieves low noise performance and low quiescent current
operation.
The total output noise specification for LP3873/LP3876 is
presented in the Electrical Characteristics table. The Output
noise density at different frequencies is represented by a
curve under typical performance characteristics.
SHORT-CIRCUIT PROTECTION
The LP3873 and LP3876 are short circuit protected and in
the event of a peak over-current condition, the short-circuit
control loop will rapidly drive the output PMOS pass element
off. Once the power pass element shuts down, the control
loop will rapidly cycle the output on and off until the average
power dissipation causes the thermal shutdown circuit to
respond to servo the on/off cycling to a lower frequency.
Please refer to the section on thermal information for power
dissipation calculations.
ERROR FLAG OPERATION
The LP3873/LP3876 produces a logic low signal at the Error
Flag pin when the output drops out of regulation due to low
input voltage, current limiting, or thermal limiting. This flag
has a built in hysteresis. The timing diagram in Figure 1
shows the relationship between the ERROR flag and the
output voltage. In this example, the input voltage is changed
to demonstrate the functionality of the Error Flag.
The internal Error flag comparator has an open drain output
stage. Hence, the ERROR pin should be pulled high through
a pull up resistor. Although the ERROR flag pin can sink
current of 1mA, this current is energy drain from the input
supply. Hence, the value of the pull up resistor should be in
the range of 10kto 1M.The ERROR pin must be
connected to ground if this function is not used. It should
also be noted that when the shutdown pin is pulled low, the
ERROR pin is forced to be invalid for reasons of saving
power in shutdown mode.
LP3873/LP3876
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Application Hints (Continued)
SENSE PIN
In applications where the regulator output is not very close to
the load, LP3876 can provide better remote load regulation
using the SENSE pin. Figure 2 depicts the advantage of the
SENSE option. LP3873 regulates the voltage at the output
pin. Hence, the voltage at the remote load will be the regu-
lator output voltage minus the drop across the trace resis-
tance. For example, in the case of a 3.3V output, if the trace
resistance is 100m, the voltage at the remote load will be
3V with 3A of load current, I
LOAD
. The LP3876 regulates the
voltage at the sense pin. Connecting the sense pin to the
remote load will provide regulation at the remote load, as
shown in Figure 2. If the sense option pin is not required, the
sense pin must be connected to the V
OUT
pin.
20060507
FIGURE 1. Error Flag Operation
20060508
FIGURE 2. Improving remote load regulation using LP3876
LP3873/LP3876
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Application Hints (Continued)
SHUTDOWN OPERATION
A CMOS Logic level signal at the shutdown ( SD) pin will
turn-off the regulator. Pin SD must be actively terminated
through a 10kpull-up resistor for a proper operation. If this
pin is driven from a source that actively pulls high and low
(such as a CMOS rail to rail comparator), the pull-up resistor
is not required. This pin must be tied to Vin if not used.
DROPOUT VOLTAGE
The dropout voltage of a regulator is defined as the minimum
input-to-output differential required to stay within 2% of the
nominal output voltage. For CMOS LDOs, the dropout volt-
age is the product of the load current and the Rds(on) of the
internal MOSFET.
REVERSE CURRENT PATH
The internal MOSFET in LP3873 and LP3876 has an inher-
ent parasitic diode. During normal operation, the input volt-
age is higher than the output voltage and the parasitic diode
is reverse biased. However, if the output is pulled above the
input in an application, then current flows from the output to
the input as the parasitic diode gets forward biased. The
output can be pulled above the input as long as the current
in the parasitic diode is limited to 200mA continuous and 1A
peak.
POWER DISSIPATION/HEATSINKING
LP3873 and LP3876 can deliver a continuous current of 3A
over the full operating temperature range. A heatsink may be
required depending on the maximum power dissipation and
maximum ambient temperature of the application. Under all
possible conditions, the junction temperature must be within
the range specified under operating conditions. The total
power dissipation of the device is given by:
P
D
=(V
IN
−V
OUT
)I
OUT
+(V
IN
)I
GND
where I
GND
is the operating ground current of the device
(specified under Electrical Characteristics).
The maximum allowable temperature rise (T
Rmax
) depends
on the maximum ambient temperature (T
Amax
) of the appli-
cation, and the maximum allowable junction temperature
(T
Jmax
):
T
Rmax
=T
Jmax
−T
Amax
The maximum allowable value for junction to ambient Ther-
mal Resistance, θ
JA
, can be calculated using the formula:
θ
JA
=T
Rmax
/P
D
LP3873 and LP3876 are available in TO-220 and TO-263
packages. The thermal resistance depends on amount of
copper area or heat sink, and on air flow. If the maximum
allowable value of θ
JA
calculated above is 60 ˚C/W for
TO-220 package and 60 ˚C/W for TO-263 package no
heatsink is needed since the package can dissipate enough
heat to satisfy these requirements. If the value for allowable
θ
JA
falls below these limits, a heat sink is required.
HEATSINKING TO-220 PACKAGE
The thermal resistance of a TO220 package can be reduced
by attaching it to a heat sink or a copper plane on a PC
board. If a copper plane is to be used, the values of θ
JA
will
be same as shown in next section for TO263 package.
The heatsink to be used in the application should have a
heatsink to ambient thermal resistance,
θ
HA
≤θ
JA
θ
CH
θ
JC
.
In this equation, θ
CH
is the thermal resistance from the case
to the surface of the heat sink and θ
JC
is the thermal resis-
tance from the junction to the surface of the case. θ
JC
is
about 3˚C/W for a TO220 package. The value for θ
CH
de-
pends on method of attachment, insulator, etc. θ
CH
varies
between 1.5˚C/W to 2.5˚C/W. If the exact value is unknown,
2˚C/W can be assumed.
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking. Figure 3 shows a curve for the
θ
JA
of TO-263 package for different copper area sizes, using
a typical PCB with 1 ounce copper and no solder mask over
the copper area for heat sinking.
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θ
JA
for the TO-263 package mounted to a PCB is
32˚C/W.
Figure 4 shows the maximum allowable power dissipation
for TO-263 packages for different ambient temperatures,
assuming θ
JA
is 35˚C/W and the maximum junction tempera-
ture is 125˚C.
20060532
FIGURE 3. θ
JA
vs Copper (1 Ounce) Area for TO-263
package
20060533
FIGURE 4. Maximum power dissipation vs ambient
temperature for TO-263 package
LP3873/LP3876
www.national.com 14
Physical Dimensions inches (millimeters) unless otherwise noted
TO220 5-lead, Molded, Stagger Bend Package (TO220-5)
NS Package Number T05D
For Order Numbers, refer to the “Ordering Information” section of this document.
TO263 5-Lead, Molded, Surface Mount Package (TO263-5)
NS Package Number TS5B
For Order Numbers, refer to the “Ordering Information” section of this document.
LP3873/LP3876
www.national.com15
Notes
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves
the right at any time without notice to change said circuitry and specifications.
For the most current product information visit us at www.national.com.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and whose failure to perform when
properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in a significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
BANNED SUBSTANCE COMPLIANCE
National Semiconductor follows the provisions of the Product Stewardship Guide for Customers (CSP-9-111C2) and Banned Substances
and Materials of Interest Specification (CSP-9-111S2) for regulatory environmental compliance. Details may be found at:
www.national.com/quality/green.
Lead free products are RoHS compliant.
National Semiconductor
Americas Customer
Support Center
Email: new.feedback@nsc.com
Tel: 1-800-272-9959
National Semiconductor
Europe Customer Support Center
Fax: +49 (0) 180-530 85 86
Email: europe.support@nsc.com
Deutsch Tel: +49 (0) 69 9508 6208
English Tel: +44 (0) 870 24 0 2171
Français Tel: +33 (0) 1 41 91 8790
National Semiconductor
Asia Pacific Customer
Support Center
Email: ap.support@nsc.com
National Semiconductor
Japan Customer Support Center
Fax: 81-3-5639-7507
Email: jpn.feedback@nsc.com
Tel: 81-3-5639-7560
www.national.com
LP3873/LP3876 3A Fast Ultra Low Dropout Linear Regulators
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