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High Density - Board Mounted Power Division
Powering Communications and Technology
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X10 = LOAD %
EFFICIENCY %
HES033ZE
HES075ZG
HES100ZE
TECHNICAL SPECIFICATIONS
HES single output DC/DC converters provide up to
150 Watts of output power in an industry standard,
half-brick package and footprint. These units feature
ultra-high efficiency, Class A conducted noise specs,
and fixed switching frequency. The HES is designed
with open-frame packaging, along with planar
magnetics to provide maximum useable power with
minimal thermal constraints. The HES is especially
suited to harsh telecom, networking, and industrial
applications, and is fully compatible with production
board washing processes.
High Efficiency
Industry Standard Half-
Brick
Open-Frame Packaging
100°C Baseplate
Operation
Water Washable
“True-Trim” Option
1500V Isolation
Positive or Negative
Logic
DESCRIPTION
FEATURES
HES SERIES
150 WATT
Turn-On Time 10 ms
Remote Shutdown Positive Or Negative Logic
Remote Shutdown Reference Vin Negative
Switching Frequency 2.5 & 3.3, 5V Model 200 kHz, 300 kHz (Respectively)
Isolation
Input - Output 1500 VDC
Input - Case 1050 VDC
Output - Case 500 VDC
Temperature Coefficient 0.02%/°C
Case Temperature
Operating Range -40 To +100°C
Storage Range -40 To +125°C
Thermal Shutdown Range 105 To 115°C
Vibration, 3 Axes, 5 Min Each 5 g, 10 - 55 Hz
MTBF(Bellcore Tr-nwt-000332) 1.8 X 106hrs
Safety UL 1950, Csa 22.2-950, En60950
Weight (Approx.) 1.4 oz
MTBF predictions may vary slightly from model to model.
Specifications typically at 25°C, normal line, and full load,
unless otherwise stated.
Soldering Conditions: I/O pins, 260°C, ten seconds; fully
compatible with commercial wave-soldering equipment.
Safety: Agency approvals may vary from model to model.
Please consult factory for specific model information.
Units are water-washable and fully compatible with commercial
spray or immersion post wave-solder washing equipment.
Setpoint Accuracy ±1%
Line Regulation Vin Min. - Vin Max., Iout Rated 0.2% Vout
Load Regulation Iout Min. - Iout Max., Vin Nom. 0.2% Vout
Remote Sense Headroom 0.5 VDC
Minimum Output Current 10 %
Dynamic Regulation, Loadstep 25% Iout
Pk Deviation 4% Vout
Settling Time 500 ms
Voltage Trim Range ±10%
Short Circuit / Overcurrent Protection Shutdown / Hiccup
Current Limit Threshold Range, % of Iout Rated 110 - 130%
OVP Trip Range 120 - 140% Vout Nom.
OVP Type Self Recovering
Voltage Range
24 VDC Nominal 18 - 36 VDC
48 VDC Nominal 36 - 72 VDC
Reflected Ripple 50 mA
Input Reverse Voltage Protection Shunt Diode
Input Undervoltage Lockout / Hysteresis <34V/1V Nom.
Output
Input
Efficiency vs. Load (48V Input)
Notes
General
2
High Density - Board Mounted Power Division
Powering Communications and Technology
Thermal Impedance
Natural Convection 15.4 °C/W
100 LFM 12.2 °C/W
200 LFM 9.3 °C/W
300 LFM 7.4 °C/W
400 LFM 6.4 °C/W
Tolerances
Note:
Thermal impedance data is
dependent on many environmental
factors. The exact thermal
performance should be validated
for specific application.
HES SERIES
150 WATT
1-V
in
2 Case
3 On/Off
4+V
in
5-V
out
6 -Sense
7 Trim
8 +Sense
9+Vout
Inches: (Millimeters)
.XX ± 0.020 .X ± 0.5
.XXX ± 0.010 .XX ± 0.25
Pin:
± 0.002 ± 0.05
(Dimensions as listed unless otherwise
specified.)
Pin Function
MODELS - (See the last page of Section for options.)
MOUNTING INSERTS
M3X.5 THROUGH 4PL
1.400"(35.6mm)
1.000"(25.4mm)
0.700"(17.8mm)
0.400"(10.2mm)
0
-0.50"(-12.7mm)
2.40"
(61.0mm)
2.28"
(57.9mm)
BOTTOM VIEW
1
2
3
4
5
6
7
8
9
0.18"
DIA 0.080"
DIA 0.040"
0.025" REF.
0.50"
(12.7mm)
(4.6mm)
(1.0mm)
(2.0mm)
(0.6mm)
0
1.900"
(48.3mm) -0.19"
(-4.8mm)
2PL
7PL
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Powering Communications and Technology
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OPTIONS
When ordering equipment options, use the following suffix information. Select the option(s) that you
prefer and add them to the model number. Example ordering options are located below the options
table.
Example Options:
HBS050ZG-ANT3V = HBS050ZG-A with negative logic, Lucent compatible trim, and 0.95” vertical heatsink.
LES015YJ-3N = LES015YJ with optional trim and enable, negative logic.
QBS066ZG-AT8 = QBS066ZG-A with Lucent compatible trim and 0.110” pin length.
NUCLEAR AND MEDICAL APPLICATIONS - Power-One products are not authorized for use as critical components in life support systems, equipment used
in hazardous environments, or nuclear control systems without the express written consent of the President of Power-One, Inc.
TECHNICAL REVISIONS - The appearance of products, including safety agency certifications pictured on labels, may change depending on the date manu-
factured. Specifications are subject to change without notice.
OPTIONS SUFFIX APPLICABLE SERIES REMARKS
Negative Logic NHAS, HBD, HBS, HES, LES, QBS, TTL "Low" Turns Module ON
QES, TES, TQD TTL "High" Turns Module OFF
Lucent Compatible Trim T HAS, HBD, HBS, HES, QBS, QES
Terminal Strip TS XWS, XWD, XWT
Trim 1IAS, LES
Enable 2IAD, IAS, LES, SMS
Trim and Enable 3IAS, LES
Current Share 4SMS
Headerless YEncapsulated EWS, IWS, OWS
PIN LENGTH AND HEATSINK
OPTIONS
Standard Pin Length is 0.180"
(4.6mm)
0.110" (2.8mm) Pin Length 8All Units (Except SMS)
0.150" (3.8mm) Pin Length 9All Units (Except SMS)
0.24" (6.1mm) Horizontal Heatsink 1H All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad
0.24" (6.1mm) Vertical Heatsink 1V All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad
0.45" (11.4mm) Horizontal
Heatsink 2H All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad
0.45" (11.4mm) Vertical Heatsink 2V All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad
0.95" (24.1mm) Horizontal
Heatsink 3H
All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad
0.95" (24.1mm) Vertical Heatsink 3V
All Units (Except DIP, SIP, and SM
Packages) Includes Thermal Pad