Connection Systems Memory Module Sockets DIMM & DDR DIMM Sockets Description: Sockets for DRAM memory modules Typical Applications: Desktop computers Network routers, switches, and hubs DIMM 168 Servers Benefits/Features: Flexible System . . . . Product available for standard 168 position modules and DDR (Double Data Rate) 184 DDR DIMM 184 position modules. Various voltage mating keys are available. Industry Standard . . . . Meets JEDEC MO-161 module mating requirements for DIMM and MO-206 module mating requirements for DDR DIMM. Ruggedness . . . . . . . . Dual retention/ejector latches hold module securely and aid in module removal. Reliability . . . . . . . . . Several gold plating options are available for improved durability. Other Properties: Selectable Features: Product Type DIMM PCB Retention Feature Yes Total No. of Positions 168 and 184 Packaging Type Tray Centerline Spacing 1.27 mm [.050 in.] Housing Material LCP Orientation Vertical Applicable Soldering Process IR, vapor phase, wave Mounting Style Board through hole Ejector Color Ivory Voltage DIMM: 3.3 V, DDR DIMM: 2.5 V Contact Base Material Copper alloy Memory Type Synch DRAM Insulation Resistance 10000 M Withstanding Voltage 1000 VAC RMS Current Rating 1 amp max. per contact Contact Resistance 30 m PCB Thickness 1.57 mm [.062 in.] Insertion Style Direct Contact Style Formed Voltage Rating 150 VAC/DC Contact Area Plating 0.38 m [15 in.] gold Temperature Range -55C to +85C Height Above Board 24.50 mm [.965 in.] Continuous Operating Temperature +85C Tail Length 2.54 mm [.100 in.] Normal Force 0.49 N [50 gf] No. of Ejectors 2 Contact Retention Force 6.67 N [1.5 lbf] Hold Down Material Copper alloy Durability (Mating Cycles) 25 Housing Color Black Plating (Contact Area) Gold (thickness varies per Delphi spec.) over nickel underplating Plating (Soldering End) 2.54 m [100 in.] tin-lead over nickel underplating Underplating 1.27 m [50 in.] nickel Standards JEDEC MO-161, MO-206 Approvals and Certification UL and CSA approved DIMM & DDR DIMM Sockets DIMM 168 Ordering Nomenclature 1543 0315 - 1 1 0 Recommended PCB layout Selective Plating: Gold plated on contact area and 100 in. min. tin-lead plated on soldering end over 50 in. min. nickel underplating 1 = Gold Flash 2 = 0.381 m [15 in.] blue dot 3 = 0.762 m [30 in.] green dot Top view - ejector latches not shown Function Key Option: 1 = Offset Right Key (UDRAM) 2 = Offset Centered Key (DRAM) 3 = Offset Left Key (SDRAM) DDR DIMM 184 1543 0316 - 1 0 0 Selective Plating: Gold plated on contact area and 100 in. min. tin-lead plated on soldering end over 50 in. min. nickel underplating 1 = Gold Flash 2 = 0.381 m [15 in.] blue dot 3 = 0.762 m [30 in.] green dot Recommended PCB layout Top view - ejector latches not shown Function Key Option: 0 = Board Lock 1 = Peg Unless otherwise specified, dimensions are shown in millimeters. www.delphi.com/connect Printed on Recycled Paper. (c) 2002, Delphi. All rights reserved. Printed in the U.S.A. DP-02-E-054 302/5mAci * u502/3w * u802/3m-Gbs * U803/3W Connection Systems 19200 Asheville Highway P.O. Box 519 Landrum, SC 29356 U.S.A. Tel: [1] 864.457.3824 Fax: [1] 864.457.2535