Product Type DIMM
Total No. of Positions 168 and 184
Centerline Spacing 1.27 mm [.050 in.]
Orientation Vertical
Mounting Style Board through hole
Voltage DIMM: 3.3 V, DDR DIMM: 2.5 V
Memory Type Synch DRAM
PCB Thickness 1.57 mm [.062 in.]
Insertion Style Direct
Contact Style Formed
Contact Area Plating 0.38 µm [15 µin.] gold
Height Above Board 24.50 mm [.965 in.]
Tail Length 2.54 mm [.100 in.]
No. of Ejectors 2
Hold Down Material Copper alloy
Housing Color Black
PCB Retention Feature Yes
Packaging Type Tray
Housing Material LCP
Applicable Soldering Process IR, vapor phase, wave
Ejector Color Ivory
Contact Base Material Copper alloy
Insulation Resistance 10000 MΩ
Withstanding Voltage 1000 VAC RMS
Current Rating 1 amp max. per contact
Contact Resistance 30 mΩ
Voltage Rating 150 VAC/DC
Temperature Range -55°C to +85°C
Continuous Operating Temperature +85°C
Normal Force 0.49 N [50 gf]
Contact Retention Force 6.67 N [1.5 lbf]
Durability (Mating Cycles) 25
Plating (Contact Area) Gold (thickness varies per Delphi spec.) over nickel underplating
Plating (Soldering End) 2.54 µm [100 µin.] tin-lead over nickel underplating
Underplating 1.27 µm [50 µin.] nickel
Standards JEDEC MO-161, MO-206
Approvals and Certification UL and CSA approved
DIMM &
DDR DIMM
Sockets
Connection
Systems
Memory Module Sockets
Description:
Sockets for DRAM memory modules
Typical Applications:
Desktop computers Servers
Network routers, switches, and hubs
Benefits/Features:
Flexible System . . . . Product available for standard 168 position
modules and DDR (Double Data Rate) 184
position modules.
Various voltage mating keys are available.
Industry Standard . . . . Meets JEDEC MO-161 module mating requirements for DIMM and MO-206 module mating requirements for DDR DIMM.
Ruggedness . . . . . . . . Dual retention/ejector latches hold module securely and aid in module removal.
Reliability . . . . . . . . . Several gold plating options are available for improved durability.
Selectable Features:
Other Properties:
DIMM 168
DDR DIMM 184
DIMM 168
DDR DIMM 184
Top view - ejector latches not shown
Top view - ejector latches not shown
Recommended PCB layout
Recommended PCB layout
DIMM & DDR DIMM Sockets
Printed on Recycled Paper.
© 2002, Delphi. All rights reserved.
Printed in the U.S.A.
DP-02-E-054 302/5mAci • u502/3w • u802/3m-Gbs • U803/3W
www.delphi.com/connect Connection Systems
19200 Asheville Highway
P. O . B o x 519
Landrum, SC 29356 U.S.A.
Tel: [1] 864.457.3824
Fax: [1] 864.457.2535
Unless otherwise specified, dimensions are shown in millimeters.
Ordering Nomenclature
Function Key Option:
1= Offset Right Key (UDRAM)
2= Offset Centered Key (DRAM)
3= Offset Left Key (SDRAM)
Selective Plating:
Gold plated on contact area and
100 µin. min. tin-lead plated on
soldering end over 50 µin. min.
nickel underplating
1= Gold Flash
2= 0.381 µm [15 µin.] blue dot
3= 0.762 µm [30 µin.] green dot
15430315 –1 1 0
Function Key Option:
0 = Board Lock
1= Peg
Selective Plating:
Gold plated on contact area and
100 µin. min. tin-lead plated on
soldering end over 50 µin. min.
nickel underplating
1= Gold Flash
2= 0.381 µm [15 µin.] blue dot
3= 0.762 µm [30 µin.] green dot
15430316 –1 0 0
