74LVCU04A
Hex inverter
Product specification 1998 Jul 29
INTEGRATED CIRCUITS
Philips Semiconductors Product specification
74LVCU04AHex inverter
2
1998 Jul 29 853–2099 19800
FEATURES
•Wide supply voltage range of 1.2 V to 3.6 V
•In accordance with JEDEC standard no. 8-1A.
•Inputs accept voltages up to 5.5 V
•CMOS low power consumption
•Direct interface with TTL levels
DESCRIPTION
The 74LVCU04A is a high-performance, low-power, low-voltage,
Si-gate CMOS device and superior to most advanced CMOS
compatible TTL families.
The 74LVCU04A is a general purpose hex inverter . Each of the six
inverters is a single stage with unbuffered outputs.
QUICK REFERENCE DATA
GND = 0 V ; Tamb = 25°C; tr = tf 2.5 ns
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH Propagation delay
nA to nY CL = 50 pF;
VCC = 3.3 V 4.3 ns
CIInput capacitance 7.8 pF
CPD Power dissipation capacitance per gate Note s 1 and 2 16.8 pF
NOTES:
1. CPD is used to determine the dynamic power dissipation(PD in µW)
PD = CPD VCC2 x fi (CL VCC2 fo) where:
fi = input frequency in MHz; CL = output load capacity in pF;
fo = output frequency in MHz; VCC = supply voltage in V ;
(CL VCC2 fo) = sum of the outputs.
2. The condition is VI = GND to VCC.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
14-Pin Plastic SO –40°C to +85°C74LVCU04A D 74LVCU04A D SOT108-1
14-Pin Plastic SSOP Type II –40°C to +85°C74LVCU04A DB 74LVCU04A DB SOT337-1
14-Pin Plastic TSSOP Type I –40°C to +85°C74LVCU04A PW 74LVCU04APW DH SOT402-1
PIN CONFIGURATION
1
2
3
4
5
6
7
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
14
13
12
11
10
9
8
SV00396
PIN DESCRIPTION
PIN NUMBER SYMBOL NAME AND FUNCTION
1, 3, 5, 9, 11, 13 1A – 6A Data inputs
2, 4, 6, 8, 10, 12 1Y – 6Y Data outputs
7 GND Ground (0 V)
14 VCC Positive supply voltage
LOGIC SYMBOL (IEEE/IEC)
12
34
56
98
11 10
13 12
1
1
1
1
1
1
SV00398
Philips Semiconductors Product specification
74LVCU04A
Hex inverter
1998 Jul 29 3
LOGIC SYMBOL
1A 1Y
2A 2Y
3A 3Y
4A 4Y
5A 5Y
6A 6Y
1
3
5
9
11
13
2
4
6
8
10
12
SV00397
LOGIC DIAGRAM (ONE INVERTER)
SV00409
VCC VCC
100
nA nY
FUNCTION TABLE
INPUTS OUTPUTS
nA nY
L H
H L
NOTES:
H = HIGH voltage level
L = LOW voltage level
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARAMETER
CONDITIONS
LIMITS
UNIT
SYMBOL
PARAMETER
CONDITIONS
MIN MAX
UNIT
VCC DC supply voltage (for max. speed performance) 2.7 3.6 V
VCC DC supply voltage (for low-voltage applications) 1.2 3.6 V
VIDC input voltage range 0 5.5 V
VI/O
DC output voltage range; output HIGH or LOW state 0 VCC
V
V
I/O DC input voltage range; output 3-State 0 5.5
V
Tamb Operating free-air temperature range –40 +85 °C
tr, tfInput rise and fall times VCC = 1.2 to 2.7V
VCC = 2.7 to 3.6V 0
020
10 ns/V
Philips Semiconductors Product specification
74LVCU04A
Hex inverter
1998 Jul 29 4
ABSOLUTE MAXIMUM RATINGS1
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +6.5 V
IIK DC input diode current VIt0 –50 mA
VIDC input voltage Note 2 –0.5 to +6.5 V
IOK DC output diode current VO uVCC or VO t 0 "50 mA
VI/O
DC output voltage; output HIGH or LOW Note NO TAG –0.5 to VCC +0.5
V
V
I/O DC input voltage; output 3-State Note NO TAG –0.5 to 6.5
V
IODC output source or sink current VO = 0 to VCC "50 mA
IGND, ICC DC VCC or GND current "100 mA
Tstg Storage temperature range –65 to +150 °C
Power dissipation per package
PTOT – plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500
mW
– plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 500
mW
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V).
LIMITS
SYMBOL PARAMETER TEST CONDITIONS Temp = -40°C to +85°CUNIT
MIN TYP1MAX
VCC = 1.2 V ;V OL(max) = 0.5 V; IO = -100 mAVCC
VCC = 2.0 V ; VOL(max) = 0.5 V; IO = -100 mA1.2
VIH HIGH level Input voltage VCC = 2.7 V ; VOL(max) = 0.5 V; IO = -100 mA1.8 V
VCC = 3.0 V ; VOL(max) = 0.5 V; IO = -100 mA2.0
VCC = 3.6 V ; VOL(max) = 0.5 V; IO = -100 mA2.4
VCC = 1.2 V ; VOH(min) = VCC – 0.5 V; IO = 100 mAGND
VCC = 2.0 V ; VOH(min) = VCC – 0.5 V; IO = 100 mA0.6
VIL LOW level Input voltage VCC = 2.7 V ; VOH(min) = VCC – 0.5 V; IO = 100 mA0.6 V
VCC = 3.0 V ; VOH(min) = VCC – 0.5 V; IO = 100 mA1.0
VCC = 3.6 V ; VOH(min) = VCC – 0.5 V; IO = 100 mA1.2
VCC = 2.7 V ; VCC or GND; IO = -12 mA VCC*0.5
VO
HIGH level out
p
ut voltage
VCC = 3.0 V ; VCC or GND; IO = -100mAVCC*0.2 VCC
V
V
OH
HIGH
le
v
el
o
u
tp
u
t
v
oltage
VCC = 3.0 V ; VCC or GND; IO = -12 mA VCC*0.6
V
VCC = 3.0 V ; VCC or GND; IO = -24 mA VCC*1.0
VCC = 2.7 V ; VCC or GND; IO = 12 mA 0.40
VOL LOW level output voltage VCC = 3.0 V ; VCC or GND; 12mA; IO = 100µA 0.20 V
VCC = 3.0 V ; VCC or GND; IO = 24mA 0.55
I
In
p
ut leakage current
VCC =36V
;
55VorGND
;
Not for I/O
p
ins
"01
"5
µA
I
I
Inp
u
t
leakage
c
u
rrent
V
CC =
3
.
6
V
;
5
.
5
V
or
GND
;
Not
for
I/O
pins
"0
.
1
"5
µ
A
ICC Quiescent supply current VCC = 3.6 V; VCC or GND; IO = 0 0.1 10 µA
NOTE:
1. All typical values are at VCC = 3.3V and Tamb = 25°C.
Philips Semiconductors Product specification
74LVCU04A
Hex inverter
1998 Jul 29 5
AC CHARACTERISTICS
GND = 0 V ; tr = tf 2.5 ns; CL = 50 pF; RL = 500W; Tamb = –40C to +85C
LIMITS
SYMBOL PARAMETER WAVEFORM VCC = 3.3V ±0.3V VCC = 2.7V VCC = 1.2V UNIT
MIN TYP1MAX MIN MAX TYP
tPHL/
tPLH Propagation delay
nA to nY Figure 1 – 2.7 4.3 – 5.3 – ns
NOTE:
1. These typical values are at VCC = 3.3V and Tamb = 25°C.
AC WAVEFORM
VM = 1.5 V at VCC 2.7 V
VM = 0.5 VCC at VCC < 2.7 V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VM
nA INPUT
nY OUTPUT VM
tPLH
tPHL
GND
VI
VOL
VOH
SV00395
Figure 1. Input (nA) to output (nY) propagation delays.
io ~
A
VCC
Rbias = 560 kW
input output 100 mF0.47 mF
Vi ~
(f = 1 kHz) GND
SV00323
Figure 2. T est set-up for measuring forward transconductance
gfs = dio/dvi at vo is constant (see also graph Figure 3).
SV00410
VCC
(V)
01234
0
20
10
40
60
80
gfs
(mA/V)
Figure 3. Typical forward transconductance gfs as a function of
the supply voltage VCC at Tamb = 25C.
Philips Semiconductors Product specification
74LVCU04A
Hex inverter
1998 Jul 29 6
APPLICATION INFORMATION
Some applications for the 74LVU04 are:
•Linear amplifier (see Figure 4)
•In crystal oscillator designs (see Figure 5)
•Astable multivibrator (see Figure 6)
SV00404
VCC
R2
R1
1 mF
ZL
GND
U04
Note:
ZL > 10kΩ; AOL = 20 (typical)
Au+–AOL
1)R1
R2(1 )AOL )
;VOMax(P*P)
VCC – 1.5 V centered
at 1/2 VCC
≈
3 kΩ < R1, R2 < 1 MΩ
Typical unity gain bandwidth product is 5 MHz.
Cl, see Figure10
AOL = open loop amplification
Au = voltage amplification
Figure 4. LVU04 used as a linear amplifier .
Note to Figure 4
ZL > 10 kW; AOL = 20 (typical)
Au+–AOL
1)R1
R2(1 )AOL); VO Max (P – P)
≈ VCC – 1.5 V centered
at 1/2 VCC
3 kW < R1, R2 < 1 MW
Typical unity gain bandwidth product is 50 MHz.
AOL = open loop amplification
Au = voltage amplification
SV00408
U04
R2
C2
C1
R1
out
Note:
C1 = 47 pF (typ.)
C2 = 22 pF (typ.)
R1 = 1 to 10 MW (typ.)
R2 optimum value depends on the frequency and required stability against
changes in VCC or average minimum ICC (ICC is typically
2 mA at VCC = 3 V and f = 1 MHz).
Figure 5. Crystal oscillator configuration.
Note to Figure 5
C1 = 47 pF (typ.)
C2 = 22 pF (typ.)
R1 = 1 to 10 MW (typ.)
R2 optimum value depends on the frequency and required stability
against changes in VCC or average minimum ICC.
SV00406
U04
RC
RS
U04
Note:
f+1
T[1
2.2 RC
RS[2xR
The average ICC (mA) is approximately
3.5 + 0.05 x f (MHz) x C (pF) at VCC = 3.0 V.
Figure 6. LVCU04 used as an astable multivibrator.
Note to Figure 6
f+1
T[1
2.2 RC
RS ≈ 2 x R
Philips Semiconductors Product specification
74LVCU04AHex inverter
1998 Jul 29 7
SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1
Philips Semiconductors Product specification
74LVCU04AHex inverter
1998 Jul 29 8
SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1
Philips Semiconductors Product specification
74LVCU04AHex inverter
1998 Jul 29 9
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1
Philips Semiconductors Product specification
74LVCU04AHex inverter
yyyy mmm dd 10
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may af fect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 07-98
Document order number: 9397-750-04235
Data sheet
status
Objective
specification
Preliminary
specification
Product
specification
Product
status
Development
Qualification
Production
Definition [1]
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
Data sheet status
[1] Please consult the most recently issued datasheet before initiating or completing a design.
