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TGA2706-SM
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
July 2013 © Rev F
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Assembly Notes
Recommended Surface Mount Package Assembly
•Proper ESD precautions must be followed while handling packages.
•Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
•TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
•Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
•Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile SnPb Pb Free
Ramp-up Rate 3 C/sec 3 C/sec
Activation Time and Temperature 60 – 120 sec @ 140 – 160 C 60 – 180 sec @ 150 – 200 C
Time above Melting Point 60 – 150 sec 60 – 150 sec
Max Peak Temperature 240 C 260 C
Time within 5 C of Peak Temperature 10 – 20 sec 10 – 20 sec
Ramp-down Rate 4 – 6 C/sec 4 – 6 C/sec
Ordering Information
Part Package Style
TGA2706-SM QFN 5x5 Surface Mount
ESD and MSL Information
ESD: Class 0, Pass 200V.
MSL: Level 3.