AD1672-703D - Analog Devices, Inc.

Monday, Apr 28, 2008 9:22 AM /

12-Bit, 3 MSPS,

A to D Converter

AD1672

ASD0010965 Rev. G

Information furnished by Analog Devices is believed to be accurate and

reliable. However, no responsibilit y is assumed by Analog Devices for its use,

nor for any infringements of patents or other rights of third parties that may

result from its use. Specifications subj ect to chang e without notice. No license

is granted by implication or otherwise under any patent or patent rights of

Analog Devices. Trademarks and registered trademarks are the property of

their respective companies.

One Technology Wa y, P.O. Box 9106, Norwood, MA 02062-9106,

U.S.A.

Tel: 781.329.4700 www.analog.com

1.0 SCOPE

This specification documents the detail requirements for space qualified product manufactured on

Analog Devices, Inc.’s QML certified line per MIL-PRF-38535 Level V except as modified herein.

The manufacturing flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM

brochure is to be considered a part of this specification. This brochure may be found at:

http://www.analog.com/aerospace

This data sheet specifically details the space grade version of this product. A more detailed operational

description and a complete data sheet for commercial product grades can be found at

www.analog.com/AD1672

2.0 Part Number. The complete part number(s) of this specification follow:

Part Number Description

AD1672-703D 12-Bit , 3 MSPS, A to D Converter

AD1672-703F 12-Bit , 3 MSPS, A to D Converter

AD1672-713D 12-Bit , 3 MSPS, A to D Converter with radiation test

AD1672-713F 12-Bit , 3 MSPS, A to D Converter with radiation test

2.1 Case Outline.

Letter Descriptive designator Case Outline (Lead Finish per MIL-PRF-38535)

D GDIP2-T28 28-Lead Sidebrazed DIP package

F CDFP3-F28 28-Lead bottom-brazed flatpack

Figure 1 - Terminal connections.

AD1672

ASD0010965 Rev. G | Page 2 of 5

3.0 Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted)

CC with respect to ACOM..............................................................................-0.5 to +6.5V

DD with respect to DCOM..............................................................................-0.5 to +6.5V

DRVDD with respect to DRCOM .....................................................................-0.5 to +6.5V

ACOM with respect to DCOM, DRCOM........................................................-0.5 to +0.5V

Clock with respect to DCOM..................................................................-0.5 to VDD + 0.5V

Digital Outputs with respect to DCOM.......................................... -0.5V to DRVDD + 0.5V

AIN with respect to ACOM ..........................................................................-6.5V to +6.5V

REFIN with respect to ACOM............................................................. -0.5V to VCC + 0.5V

Junction Temperature (TJ).........................................................................................+150°C

Operating Temperature Range...................................................................-55°C to + 125°C

Storage Temperature...................................................................................-65°C to +150°C

Lead Temperature (10 sec)........................................................................................+300°C

Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating

only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the

specification is not implied. Expo sure to absolute maximum ratings for extended periods may effect device reliability.

3.1 Thermal Characteristics:

Thermal Resistance, Sidebrazed (D) Package

Junction-to-Case (ΘJC) = 28°C/W Max

Junction-to-Ambient (ΘJA) = 70°C/W Max

Thermal Resistance, Bottom brazed (F) Package

Junction-to-Case (ΘJC) = 22°C/W Max

Junction-to-Ambient (ΘJA) = 60°C/W Max

4.0 Electrical Table:

Parameter

See notes at end of table Symbol Conditions 1/

Unless Otherwise Specified Sub

Group Limit

Min. Limit

Max Units

RESOLUTION No Missing Codes 1,2,3 12 Bits

Supply Current IVCC 1,2,3 65 mA

IVDD

IDRVDD

Power dissipation PD 1,2,3 363 mW

Power supply rejection PSR VCC=5.0V ± 0.25V 1,2,3 -0.3 0.3 %FSR

3/ VDD=5.0V ± 0.25V -0.3 0.3

VDRDD=3.0V to 5.25V -0.1 0.1

ACCURACY 1,2,3

Integral Nonlinearity INL

-2.5 2.5 LSB

Differential Nonlinearity DNL

-1 1.5 LSB

Offset Error VOSE

-0.75 0.75 %FSR

Zero Error 5/ -0.75 0.75 %FSR

Gain Error 2/ -1.5 1.5 %FSR

Internal Voltage

Reference VO Iout = 0.5 mA 4/ 1,2,3 2.475 2.525 V

Analog Input 2.5V Range Unipolar 1,2,3 0 2.5 V

5.0V Range Unipolar 0 5

AD1672

ASD0010965 Rev. G | Page 3 of 5

4.0 Electrical Table: (Cont’d)

NOTES:

1/ VCC = VDD = VDRVDD = +5.0V.

2/ Includes internal reference error.

/ Change in full scale as a function of the dc supply voltage.

/ Current available for external loads. External load should not change during conversion.

/ Bipolar Mode

Parameter

See notes at end of table Symbol Conditions 1/

Unless Otherwise Specified Sub

Group Limit

Min. Limit

Max Units

5.0V Bipolar -2.5 2.5

Input Resistance 2.5V Input Range

5.0V Input Range 1,2,3 1.5

3 2.5

5 Kohm

Output Voltage, High VOH I

OH= 0.5 mA 1,2,3 2.4 V

Output Voltage, Low VOL I

OL= 1.6 mA 1,2,3 0.4 V

Logic Inputs

Logic “0” Input Current

Logic “1” Input Current

IIH

IIL

VIH=VDD

VIL=0V

1,2,3

-10

AC Parameters:

Parameter

See notes at end of table Symbol Conditions 1/

Unless Otherwise Specified Sub

Group Limit

Min. Limit

Max Units

Signal to Noise Distortion

(S/(N+D))

finput=500KHz

10,11

Signal to Noise Ratio SNR finput=500KHz 9

10,11 66

62 dB

Total Harmonic Distortion THD finput=500KHz 9,10,11 -64 dB

Spurious Free Dynamic Range SFDR finput=500KHz 9,10,11 -65 dB

AD1672

ASD0010965 Rev. G | Page 4 of 5

4.1 Electrical Test Requirements:

1/ PDA applies to Subgroup 1 only. No other subgroups are included in PDA.

/ See table III for delta parameters.

4.2 Table III. Life Test/Burn-In test delta limits.

5.0 Life Test/Burn-In Circuit:

5.1 HTRB is not applicable for this drawing.

5.2 Burn-in is per MIL-STD-883 Method 1015 test condition D.

5.3 Steady state life test is per MIL-STD-883 Method 1005.

Table II

Test Requirements Subgroups (in accordance

with MIL-PRF-38535,

Table III)

Interim Electrical Parameters 1

Final Electrical Parameters 1, 2, 3, 9, 10, 11 1/ 2/

Group A Test Requirements 1, 2, 3, 9, 10, 11

Group C end-point electrical parameters 1 2/

Group D end-point electrical parameters 1

Group E end-point electrical parameters 1

Table III

TEST

TITLE ENDPOINT

LIMIT DELTA

LIMIT UNITS

ICC

VOH

VOL

2.4

0.4

±10%

±0.24

±0.1

AD1672

ASD0010965 Rev. G | Page 5 of 5

Rev Description of Change Date

A Initiate Apr. 20, 2000

B Add Flatpack, Add radiation part number, Add timing information on

page 3. Mar. 22, 2001

C Update web address. Feb. 7, 2002

D Change subgroups 4, 5, 6 to 9, 10, 11. Update web address Jan. 9, 2003

E Delete Burn-In circuit. Aug. 5, 2003

F Update header/footer and add to 1.0 Scope description Feb. 19,2008

G Add Operating Temperature Range to Section 3.0 &

Remove (See Figure 2) in Sections 5.2 and 5.3 April 4, 2008

registered trademarks are the property of their respective

companies.

Printed in the U.S.A. 03/08