LM239A-EP www.ti.com SCLS496C - MAY 2003 - REVISED JULY 2010 QUAD DIFFERENTIAL COMPARATOR Check for Samples: LM239A-EP FEATURES 1 * * * * * * * * * Wide Supply Ranges - Single Supply: 2 V to 36 V (Tested to 30 V for Non-V Devices and 32 V for V-Suffix Devices) - Dual Supplies: 1 V to 18 V (Tested to 15 V for Non-V Devices and 16 V for V-Suffix Devices) Low Supply-Current Drain Independent of Supply Voltage: 0.8 mA (Typ) Low Input Bias Current: 25 nA (Typ) Low Input Offset Current: 5 nA (Typ) Low Input Offset Voltage: 2 mV (Typ) Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage: 36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS * * * * * * * Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Military (-55C/125C) Temperature Range (1) Extended Product Life Cycle Extended Product-Change Notification Product Traceability D OR PW PACKAGE (TOP VIEW) 1OUT 2OUT VCC 2IN- 2IN+ 1IN- 1IN+ (1) 1 14 2 13 3 12 4 11 5 10 6 9 7 8 OUT3 OUT4 GND 4IN+ 4IN- 3IN+ 3IN- Custom temperature ranges available DESCRIPTION/ORDERING INFORMATION These devices consist of four independent voltage comparators that are designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible, as long as the difference between the two supplies is 2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve wired-AND relationships. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2010, Texas Instruments Incorporated LM239A-EP SCLS496C - MAY 2003 - REVISED JULY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Table 1. ORDERING INFORMATION (1) PACKAGE (2) TA -40C to 125C -55C to 125C (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING SOP - D Tape and reel LM239AQDREP LM239AEP SOP - D Tape and reel LM239AMDREP LM239AME TSSOP - PW Tape and reel LM239AMPWREP LM239AE For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. SYMBOL (EACH COMPARATOR) IN+ OUT IN- SCHEMATIC (EACH COMPARATOR) VCC 80-A Current Regulator 10 A 60 A 10 A 80 A IN+ OUT IN- GND All current values shown are nominal. 2 Submit Documentation Feedback Copyright (c) 2003-2010, Texas Instruments Incorporated Product Folder Link(s): LM239A-EP LM239A-EP www.ti.com SCLS496C - MAY 2003 - REVISED JULY 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) VO Output voltage IO Output current -0.3 Duration of output short circuit to ground (4) qJA Package thermal impedance, junction to free air (5) TJ Tstg (1) (2) (3) (4) (5) (6) (7) MAX UNIT 36 V 36 V 36 V 36 V 20 mA Unlimited (6) 86 C/W Operating virtual-junction temperature 136 C Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 C 150 C Storage temperature range (7) -65 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground. Differential voltages are at IN+ with respect to IN-. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ (max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ (max) - TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging. Submit Documentation Feedback Copyright (c) 2003-2010, Texas Instruments Incorporated Product Folder Link(s): LM239A-EP 3 LM239A-EP SCLS496C - MAY 2003 - REVISED JULY 2010 www.ti.com ELECTRICAL CHARACTERISTICS at specified free-air temperature, VCC = 5 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIO Input offset voltage VCC = 5 V to 30 V, VIC = VICR min, VO = 1.4 V IIO Input offset current VO = 1.4 V IIB Input bias current VO = 1.4 V VICR Common-mode input-voltage range (3) TA (2) 25C 1 25C -25 Full range VID = 1 V VOL Low-level output voltage VID = -1 V, IOL = 4 mA IOL Low-level output current VID = -1 V, VOL = 1.5 V 25C ICC Supply current (four comparators) VO = 2.5 V, No load 25C -250 -400 0 to VCC - 1.5 25C High-level output current 50 150 Full range IOH UNIT 2.5 5 Full range VCC = 15 V, VO = 1.4 V to 11.4 V, RL 15 k to VCC MAX 5.5 25C Large-signal differential-voltage amplification (3) TYP Full range AVD (1) (2) MIN 25C VCC VOH = 5 V 25C VOH = 30 V Full range 200 150 Full range 50 nA 1 mA 400 700 6 nA V/mV 0.1 25C nA V 0 to -2 50 mV 16 mV mA 0.8 2 mA All characteristics are measured with zero common-mode input voltage, unless otherwise specified. Full range (MIN to MAX) for LM139 and LM139A is -55C to 125C. All characteristics are measured with zero common-mode input voltage, unless otherwise specified. The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ - 1.5 V; however, one input can exceed VCC, and the comparator will provide a proper output state as long as the other input remains in the common-mode range. Either or both inputs can go to 30 V without damage. SWITCHING CHARACTERISTICS VCC = 5 V, TA = 25C PARAMETER Response time (1) (2) 4 TEST CONDITIONS RL connected to 5 V through 5.1 k, CL = 15 pF (1) (2) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT ms CL includes probe and jig capacitance. The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. Submit Documentation Feedback Copyright (c) 2003-2010, Texas Instruments Incorporated Product Folder Link(s): LM239A-EP LM239A-EP www.ti.com SCLS496C - MAY 2003 - REVISED JULY 2010 TYPICAL CHARACTERISTICS SUPPLY CURRENT vs SUPPLY VOLTAGE INPUT BIAS CURRENT vs SUPPLY VOLTAGE 80 1.8 1.6 IIN - Input Bias Current - nA 1.4 ICC - Supply Current - mA 70 TA = -55C TA = 25C TA = 0C 1.2 1 TA = 70C 0.8 TA = 125C 0.6 0.4 TA = -55C 60 TA = 0C 50 TA = 25C 40 TA = 70C 30 TA = 125C 20 10 0.2 0 0 0 5 10 15 20 25 30 35 0 5 VCC - Supply Voltage - V 10 15 20 25 30 35 VCC - Supply Voltage - V OUTPUT SATURATION VOLTAGE VO - Saturation Voltage - V 10 1 TA = 125C TA = 25C 0.1 TA = -55C 0.01 0.001 0.01 0.1 1 10 100 IO - Output Sink Current - mA Submit Documentation Feedback Copyright (c) 2003-2010, Texas Instruments Incorporated Product Folder Link(s): LM239A-EP 5 LM239A-EP SCLS496C - MAY 2003 - REVISED JULY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) RESPONSE TIME FOR VARIOUS OVERDRIVES NEGATIVE TRANSITION RESPONSE TIME FOR VARIOUS OVERDRIVES POSITIVE TRANSITION 6 6 5 5 VO - Output Voltage - V VO - Output Voltage - V Overdrive = 5 mV 4 Overdrive = 20 mV 3 Overdrive = 100 mV 2 1 0 -1 -0.3 Overdrive = 5 mV 4 Overdrive = 20 mV 3 Overdrive = 100 mV 2 1 0 0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 -1 -0.3 0 t - Time - s 6 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 t - Time - s Submit Documentation Feedback Copyright (c) 2003-2010, Texas Instruments Incorporated Product Folder Link(s): LM239A-EP PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) LM239AMDREP ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LM239AMPWREP ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office LM239AQDREP ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office V62/03672-01XE ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office V62/03672-02XE ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office V62/03672-02YE ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Contact TI Distributor or Sales Office (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 27-Jul-2010 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LM239A-EP : * Catalog: LM239A * Automotive: LM239A-Q1 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM239AMDREP SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LM239AMPWREP TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LM239AQDREP SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM239AMDREP SOIC D 14 2500 333.2 345.9 28.6 LM239AMPWREP TSSOP PW 14 2000 367.0 367.0 35.0 LM239AQDREP SOIC D 14 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated