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Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

Features

Low Voltage and Standard Voltage Operation Available

1.7V (VCC = 1.7V to 5.5V)

2.5V (VCC = 2.5V to 5.5V)

Internally Organized 262,144 x 8 (2-Mbit, 256-Kbyte)

I2C-Compatible (2-wire) Serial Interface

100kHz Standard Mode, 1.7V to 5.5V

400kHz Fast Mode, 1.7 to 5.5V

1MHz Fast Mode Plus (FM+) 2.5V to 5.5V

Schmitt Trigger, Filtered Inputs for Noise Suppression

Bidirectional Data Transfer Protocol

Write Protect Pin for Full Array Hardware Data Protection

256-byte Page Write Mode

Byte Write and Partial Page Writes Allowed

Self-timed Write Cycle

All Write operations complete within 10ms max

Random and Sequential Read Modes

Built in Error Detection and Correction

High Reliability

Endurance: 1,000,000 write cycles

Data retention: 100 years

Green Package Options (Lead-free/Halide-free/RoHS Compliant)

8-lead JEDEC SOIC and Thin or Standard Thickness 8-ball WLCSP

Die Sale Options: Wafer Form and Tape and Reel Available

Description

The Atmel® AT24CM02 provides 2,097,152 bits of Serial Electrically Erasable and

Programmable Read-Only Memory (EEPROM) organized as 262,144 words of

8 bits each. The device’s cascadable feature allows up to two devices to share a

common 2-wire bus. The device is optimized for use in many industrial and

commercial applications where low power and low voltage operation are

essential. The device is available in space-saving 8-lead JEDEC SOIC and 8-ball

WLCSP packages. In addition, the entire family is available in 1.7V (1.7V to 5.5V)

and 2.5V (2.5V to 5.5V) versions.

AT24CM02

I2C-Compatible (2-wire) Serial EEPROM

2-Mbit (262,144 x 8)

DATASHEET

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

Table of Contents

1. Pin Descriptions and Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2. Device Block Diagram and System Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3. Device Operation and Communication . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Clock and Data Transition Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2 Start and Stop Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2.1 Start Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.2.2 Stop Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.3 Acknowledge and No-Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.4 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3.5 Software Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

4. Memory Organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

4.1 Device Addressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

5. Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.1 Byte Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.2 Page Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

5.3 Internal Writing Methodology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5.4 Acknowledge Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5.5 Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

5.6 Write Protection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

6. Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6.1 Current Address Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6.2 Random Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

6.3 Sequential Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

7. Device Default Condition from Atmel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

8. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.2 DC and AC Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.3 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

8.4 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

8.5 Power-Up Requirements and Reset Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.5.1 Device Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.6 Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

8.7 EEPROM Cell Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

9. Ordering Code Detail . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

10. Ordering Code Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

11. Part Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

12. Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.1 8S1 — 8-lead JEDEC SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

12.2 8U-11 — 8-ball WLCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

12.3 8U-18 — 8-ball WLCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

13. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

1. Pin Descriptions and Pinouts

Table 1-1. Pin Descriptions

Note: 1. If either the A2 pin or the WP pin are not driven, they are internally pulled down to GND. In order to operate in a

wide variety of application environments, the pull-down mechanism is intentionally designed to be somewhat

strong. Once these pins are biased above the CMOS input buffer’s trip point (~0.5 x VCC), the pull-down

mechanism disengages. In any case, Atmel recommends connecting these pins to a known state whenever

possible.

Number

Symbol Pin Name and Functional Description

Asserted

State

Type

1, 2 NC No Connect: The NC pin is not bonded to a die pad. This pin can be

connected to GND or left floating. — —

3 A2

Device Address Inputs: The A2 pin is used to select the device address

and corresponds to the fifth bit of the I2C seven bit slave address. This

pin can be directly connected to VCC or GND, allowing up to two devices

on the same bus for a total of 4-Mbit of EEPROM.

Refer to Note 1 for behavior of the pin when not connected.

— Input

4 GND Ground: The ground reference for the power supply. GND should be

connected to the system ground. — Power

5 SDA

Serial Data: The SDA pin is an open-drain bidirectional input/output pin

used to serially transfer data to and from the device.

The SDA pin must be pulled-high using an external pull-up resistor (not to

exceed 10K in value) and may be wire-ORed with any number of other

open-drain or open-collector pins from other devices on the same bus.

—Input/

Output

6 SCL

Serial Clock: The SCL pin is used to provide a clock to the device and is

used to control the flow of data to and from the device. Command and

input data present on the SDA pin is always latched in on the rising edge

of SCL, while output data on the SDA pin is always clocked out on the

falling edge of SCL.

The SCL pin must either be forced high when the serial bus is idle or

pulled-high using an external pull-up resistor.

— Input

7 WP

Write Protect: Connecting the WP pin to GND will ensure normal write

operations. When WP is connected to VCC all write operations to the

memory are inhibited.

Refer to Note 1 for behavior of the pin when not connected.

High Input

8 VCC

Device Power Supply: The VCC pin is used to supply the source voltage

to the device. Operations at invalid VCC voltages may produce spurious

results and should not be attempted.

— Power

GND

VCC

SCL

SDA

8-lead SOIC

Top View

* Note: Drawings are not to scale

8-ball WLCSP

Thin or Standard Thickness

VCC

SCL

SDA

GND

Top Vi e w

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

2. Device Block Diagram and System Configuration

Figure 2-1. Block Diagram

Figure 2-2. System Configuration Using 2-Wire Serial EEPROMs

1 page

Start

Stop

Detector

GND

Memory

System Control

Module

High Voltage

Generation Circuit

Data & ACK

Input/Output Control

Address Register

and Counter

Write

Protection

Control

OUT

Hardware

Address

Comparator

VCC

SCL

SDA

Power

On Reset

Generator

EEPROM Array

Column Decoder

Row Decoder

Data Register

I2C Bus Master:

Microcontroller

GND

SCL

SDA

RPUP(max) = tR(max)

0.8473 x CL

RPUP(min) = VCC - VOL(max)

IOL

Slave 0

AT24Cxxx

VCC

SDA

SCL

GND

Slave 1

AT24Cxxx

VCC

SDA

SCL

GND

VCC

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

3. Device Operation and Communication

The AT24CM02 operates as a slave device and utilizes a simple I2C-compatible 2-wire digital serial interface to

communicate with a host controller, commonly referred to as the bus Master. The Master initiates and controls

all Read and Write operations to the slave devices on the serial bus, and both the Master and the slave devices

can transmit and receive data on the bus.

The serial interface is comprised of just two signal lines: Serial Clock (SCL) and Serial Data (SDA). The SCL pin

is used to receive the clock signal from the Master, while the bidirectional SDA pin is used to receive command

and data information from the Master as well as to send data back to the Master. Data is always latched into the

AT24CM02 on the rising edge of SCL and always output from the device on the falling edge of SCL. Both the

SCL and SDA pin incorporate integrated spike suppression filters and Schmitt Triggers to minimize the effects

of input spikes and bus noise.

All command and data information is transferred with the Most-Significant Bit (MSB) first. During bus

communication, one data bit is transmitted every clock cycle, and after eight bits (one byte) of data have been

transferred, the receiving device must respond with either an acknowledge (ACK) or a no-acknowledge (NACK)

response bit during a ninth clock cycle (ACK/NACK clock cycle) generated by the Master. Therefore, nine clock

cycles are required for every one byte of data transferred. There are no unused clock cycles during any Read or

Write operation, so there must not be any interruptions or breaks in the data stream during each data byte

transfer and ACK or NACK clock cycle.

During data transfers, data on the SDA pin must only change while SCL is low, and the data must remain stable

while SCL is high. If data on the SDA pin changes while SCL is high, then either a Start or a Stop condition will

occur. Start and Stop conditions are used to initiate and end all serial bus communication between the Master

and the slave devices. The number of data bytes transferred between a Start and a Stop condition is not limited

and is determined by the Master. In order for the serial bus to be idle, both the SCL and SDA pins must be in the

logic high state at the same time.

3.1 Clock and Data Transition Requirements

The SDA pin is an open drain terminal and therefore must be pulled high with an external pull-up resistor. Data

on the SDA pin may change only during SCL low time periods. The SCL pin must be forced high when the serial

bus is idle, therefore an external pull-up resistor is recommended. Data changes during SCL high periods will

indicate a Start or Stop condition as defined below.

3.2 Start and Stop Conditions

3.2.1 Start Condition

A Start condition occurs when there is a high-to-low transition on the SDA pin while the SCL pin is stable in the

Logic 1 state. The Master uses a Start condition to initiate any data transfer sequence, therefore the Start

condition must precede any command. The AT24CM02 will continuously monitor the SDA and SCL pins for a

Start condition but the device will not respond unless one is given. Please refer to Figure 3-1 for more details.

3.2.2 Stop Condition

A Stop condition occurs when there is a low-to-high transition on the SDA pin while the SCL pin is stable in the

Logic 1 state. The Master uses the Stop condition to end a data transfer sequence to the AT24CM02 which will

subsequently return to the idle state. The Master can also utilize a repeated Start condition instead of a Stop

condition to end the current data transfer if the Master will perform another operation. Please refer to Figure 3-1

for more details.

AT24CM02 [DATASHEET]
Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016
 6
3.3 Acknowledge and No-Acknowledge 
After every byte of data is received, the receiving device must confirm to the Master that it has successfully 
received the data byte by responding with what is known as an acknowledge (ACK). An ACK is accomplished 
by the transmitting device first releasing the SDA line at the falling edge of the eighth clock cycle followed by the 
receiving device responding with a Logic 0 during the entire high period of ninth clock cycle. 
When the AT24CM02 is transmitting data to the Master, the Master can indicate that it is done receiving data 
and wants to end the operation by sending a Logic 1 response to the AT24CM02 instead of an ACK response 
during the ninth clock cycle. This is known as a no-acknowledge (NACK) and when the Master sends this 
Logic 1 during the ninth clock cycle, the AT24CM02 will release the SDA line so that the Master can then 
generate a Stop or Start condition.
The transmitting device, which can be the bus Master or the Serial EEPROM, must release the SDA line at the 
falling edge of the eighth clock cycle to allow the receiving device to pull the SDA line low to ACK the previous 
8-bit word. The receiving device must release the SDA line at the end of the ninth clock cycle to allow the 
transmitter to continue sending new data. A timing diagram has been provided in Figure 3-1 to better illustrate 
these requirements.
Figure 3-1. Start Condition, Data Transitions, Stop Condition and Acknowledge
The relationship of the AC timing parameters with respect to SCL and SDA for the AT24CM02 are show in 
Figure 8-1 timing waveform on page 15. The AC timing characteristics and specifications are outlined in 
Section 8.4 “AC Characteristics” on page 15.
3.4 Standby Mode
The AT24CM02 features a low power standby mode which is enabled when: 
A valid power-up sequence is performed (see Section 8.5).
A Stop condition received by the device unless it initiates an internal write cycle (see Section 5.).
At the completion of an internal write cycle (see Section 5.).
An unsuccessful match of the device type identifier or hardware address in the Device Address byte (see 
Section 4.1).
The bus Master does not ACK the receipt of data read out from the device; instead it sends a NACK 
response (see Section 6.).
SCL
SDA
SDA
Must Be
Stable
SDA
Change
Allowed
SDA
Change
Allowed
Acknowledge
Valid
Stop
Condition
Start
Condition
12 89
SDA
Must Be
Stable Acknowledge Window
The transmitting device (Master or Slave) 
must release the SDA line at this point to allow 
the receiving device (Master or Slave) to drive the 
SDA line low to ACK the previous 8-bit word.
The receiver (Master or Slave)
must release the SDA line at
this point to allow the transmitter 
to continue sending new data.

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

3.5 Software Reset

After an interruption in protocol, power loss, or system reset, any 2-wire part can be protocol reset by following

these steps:

1. Create a Start condition (if possible).

2. Clock nine cycles.

3. Create another Start condition followed by a Stop condition as seen in Figure 3-2.

The device should be ready for the next communication after above steps have been completed. In the event

that the device is still non-responsive or remains active on the SDA bus, a power cycle must be used to reset

the device (see Section 8.5.1 “Device Reset” ).

Figure 3-2. Software Reset

SCL 9

Start

Condition Start

Condition

Stop

Condition

8321

SDA

Dummy Clock Cycles

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

4. Memory Organization

The AT24CM02 is internally organized as 1,024 pages of 256 bytes each.

4.1 Device Addressing

The most significant 4 bits of the device address word is referred to as the device type identifier. The

AT24CM02 will respond to the device type identifier 1010b (Ah) in bit seven through bit four positions of the

device address byte (see Table 4-1).

Following the 4-bit device type identifier (bit 3) is the hardware address bit, A2. This bit can be used to expand

the contiguous address space to a total of 4-Mbit by allowing up to two AT24CM02 devices on the same bus.

The A2 value must correlate with the voltage level on the corresponding hardwired input pin, A2.

The A2 pin uses an internal proprietary circuit that automatically biases it to a Logic 0 state if any of the pins are

allowed to float. In order to operate in a wide variety of application environments, the pull-down mechanism is

intentionally designed to be somewhat strong. Once the pin is biased above the CMOS input buffer’s trip point

(~0.5 x VCC), the pull-down mechanism disengages. Atmel recommends connecting the A2 pin to a known state

whenever possible.

The next bits in the device address byte are A17 (bit 2) and A16 (bit 1) which are the most significant bits of the

data Word Address that follows in the subsequent two bytes.

The eighth bit of the device address (bit 0) is the read/write operation select bit. A read operation is initiated if

this bit is a Logic 1 and a write operation is initiated if this bit is Logic 0.

Upon a successful comparison of the device address, the EEPROM will return an ACK. If a valid comparison is

not made, the device will NACK and return to a standby state.

Table 4-1. Device Address Byte

For all operations except the Current Address Read, a two-byte Word Address must be transmitted to the

device immediately following the Device Address byte. The Word Address bytes contain the lower sixteen

significant memory array address bits, and is used to specify which location in the EEPROM to start reading or

writing. Please refer to Table 4-2 and Table 4-3 to review these bit positions.

Table 4-2. First Word Address Byte

Table 4-3. Second Word Address Byte

Package Type

Device Type Identifier

Hardware

Address Bit MSB Address Bits

Read/

Write

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

SOIC, WLCSP 1 0 1 0 A2A17 A16 R/W

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

A15 A14 A13 A12 A11 A10 A9 A8

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

A7 A6 A5 A4 A3 A2 A1 A0

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

5. Write Operations

All write operation sequences for the AT24CM02 begin with Master sending a Start condition, followed by a

device address byte with the R/W bit set to Logic 0, and then by the first and second Word Address bytes. The

data value(s) to be written to the device immediately follow the Word Address bytes.

5.1 Byte Write

The AT24CM02 supports writing of single 8-bit bytes. Selecting a data word in the 2-Mbit memory requires an

18-bit word address. This 18-bit word address field consists of the A17 and A16 bits in the Device Address byte

followed by the first and second Word Address bytes in the next two bytes.

Upon receipt of the proper Device Address and Word Address bytes, the EEPROM will send an Acknowledge.

The device will then be ready to receive the first 8-bit data word. Following receipt of the 8-bit data word, the

EEPROM will respond with an Acknowledge. The addressing device, such as a bus Master, must then terminate

the write sequence with a Stop condition. At that time the EEPROM will enter an internally self-timed write cycle,

which will complete within a time of tWR, while the data word is being programmed into the nonvolatile

EEPROM. All inputs are disabled during this write cycle and the EEPROM will not respond until the write is

complete.

Figure 5-1. Byte Write

5.2 Page Write

A Page Write operation allows up to 256 bytes to be written in the same write cycle, provided that all bytes are

in the same row of the memory array (where address bits A17 through A8 are the same). Partial Page Writes of

less than 256 bytes are allowed.

A Page Write is initiated the same way as a Byte Write, but the bus Master does not send a Stop condition after

the first data word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the bus

Master can transmit up to 255 additional data words. The EEPROM will respond with an ACK after each data

word is received. The bus Master must terminate the Page Write operation with a Stop condition (see

Figure 5-2) at which time the internally self-timed write cycle will begin.

The lower eight bits of the word address are internally incremented following the receipt of each data word. The

higher order address bits are not incremented, and retain the memory page row location. Page Write operations

are limited to writing bytes within a single physical page, regardless of the number of bytes actually being

written. When the incremented word address reaches the page boundary, the address counter will “roll over” to

the beginning of the same page. Nevertheless, creating a roll over event should be avoided as previously

loaded data in the page could become unintentionally altered during the write cycle.

SCL

SDA

Device Address Byte First Word Address Byte

Data Word

Start

Master

ACK

from

Slave

MSB MSB

Stop

Master

MSB

1 2 3 4 5 6 7 8 9

1 0 1 0 A2 A17 A16 0 0

1 2 3 4 5 6 7 8 9

D7 D6 D5 D4 D3 D2 D1 D0 0

Second Word Address Byte

MSB

1 2 3 4 5 6 7 8 9

A7 A6 A5 A4 A3 A2 A1 A0 0

A15 A14 A13 A12 A11 A10 A9 A8 0

1 2 3 4 5 6 7 8 9

ACK

from

Slave

ACK

from

Slave

ACK

from

Slave

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

Figure 5-2. Page Write

5.3 Internal Writing Methodology

The AT24CM02 incorporates a built in error detection and correction (EDC) logic scheme. The EEPROM array

is internally organized as a group of four connected 8-bit bytes plus an additional six ECC (Error Correction

Code) bits of EEPROM. These 38 bits are referred to as the internal physical data word. During a read

sequence, the EDC logic compares each 4-byte physical data word with its corresponding six ECC bits. If a

single bit out of the 4-byte region reads incorrectly, the EDC logic will detect the bad bit and replace it with the

correct value before the data is serially clocked out. This architecture significantly improves the reliability of the

AT24CM02 compared to an implementation that does not utilize EDC.

It is important to note that data is always physically written to the part at the internal physical data word level,

regardless of the number of bytes written. Writing single bytes is still possible with the Byte Write operation, but

internally, the other three bytes within that 4-byte location where the single byte was written, along with the six

ECC bits will be updated. Due to this architecture, the AT24CM02 EEPROM write endurance is rated at the

internal physical data word level (4-byte word). The system designer needs to optimize the application writing

algorithms to observe these internal word boundaries in order to reach the 1,000,000 cycle endurance rating.

5.4 Acknowledge Polling

An Acknowledge Polling routine can be implemented to optimize time sensitive applications that would prefer to

not wait the fixed maximum write cycle time (tWR). This method allows the application to know immediately when

the Serial EEPROM write cycle has completed, so a subsequent operation can begin.

Once the internally self-timed write cycle has started, an Acknowledge Polling routine can be initiated. This

involves repeatedly sending a Start condition followed by a valid device address byte. The device will not

respond with an ACK while the write cycle is ongoing. Once the internal write cycle has completed, the

EEPROM will respond with an ACK, allowing a new read or write sequence to be initiated.

Figure 5-3. Acknowledge Polling Flow Chart

SCL

SDA

Start

Master

ACK

from

Slave

ACK

from

Slave

Device Address Byte First Word Address Byte

MSB MSB

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

1 0 1 0 A2 A17 A16 0 0

ACK

from

Slave

ACK

from

Slave

Stop

Master

ACK

from

Slave

Second Word Address Byte Data Word (n) Data Word (n+x), max of 255 without rollover

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

A7 A6 A5 A4 A3 A2 A1 A0 0 D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 0

MSB MSB MSB

A15 A14 A13 A12 A11 A10 A9 A8

Did

the Device

ACK?

Send Any

Write

Protocol

Send

Stop

Condition

to Initiate

Write Cycle

Send Start

Condition

followed

by valid

Device Address

Byte

Continue to

Next Operation

YES

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

5.5 Write Cycle Timing

The length of the self-timed write cycle, or tWR, is defined as the amount of time from the valid Stop condition

that begins the internal write operation, to the Start condition of the first device address byte sent to the

AT24CM02 that it subsequently responds to with an ACK. The figure below has been included to show this

measurement.

Figure 5-4. Write Cycle Timing

5.6 Write Protection

The AT24CM02 utilizes a hardware data protection scheme that allows the user to write protect the entire

memory contents when the WP pin is at VCC. No write protection exists if the WP pin is at GND or left floating.

Table 5-1. AT24CM02 Write Protect Behavior

The status of the WP pin is sampled at the Stop condition for every Byte Write or Page Write command prior to

the start of an internally self-timed Write operation. Changing the WP pin state after the Stop condition has been

sent to the device will not alter or interrupt the execution of the write cycle. The WP pin state must be valid with

respect to the associated setup (tSU.WP) and hold (tHD.WP) timing as shown in Figure 5-5 below. The WP setup

time is the amount of time that the WP state must be stable before the Stop condition is issued. The WP hold

time is the amount of time after the Stop condition that the WP must remain stable (see Table 8-3, “AC

Characteristics,” on page 15 for timing specs for tHD.WP and tSU.WP).

If an attempt is made to write to the device while the WP pin has been asserted (at VCC), the device will

acknowledge the device address, word address bytes, and data bytes, but no write cycle will occur when the

Stop condition is issued, and the device will immediately be ready to accept a new Read or Write command.

Figure 5-5. Write Protect Setup and Hold Timing

Stop

Condition

Start

Condition

Data Word n

ACKD0

SDA

Stop

Condition

SCL

ACK

First Acknowledge from the device

to a valid device address sequence after

write cycle is initiated. The minumum t

can only be determined through

the use of an ACK Polling routine.

WP Pin Voltage Part of the Array Protected

VCC Full Array

GND None — Write Protection Not Enabled

SCL

SDA IN

1 2 8 9

D7 D6 D0

SU.WP

Stop

Maste

Data Word Input - Page/Byte Write Sequence

ACK

Slave t

HD.WP

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

6. Read Operations

Read operations are initiated the same way as write operations with the exception that the read/write select bit

in the device address word must be a Logic 1. There are three read operations: Current Address Read, Random

Address Read, and Sequential Read.

6.1 Current Address Read

The internal data word address counter maintains the last address accessed during the last read or write

operation, incremented by one. This address stays valid between operations as long as VCC is maintained to the

part. The address “roll over” during read is from the last byte of the last page to the first byte of the first page of

the memory.

A Current Address Read sequence will output data according to the location of the internal data word address

counter. This is initiated with a Start condition, followed by a valid device address byte with the R/W bit set to

Logic 1. The device will acknowledge this sequence and the current address data word is serially clocked out on

the SDA line. All types of Read operations will be terminated if the bus Master does not respond with an ACK (it

NACKs) during the ninth clock cycle, which will force the device into standby mode. After the NACK response,

the Master can send a Stop condition to complete the protocol, or it can send a Start condition to begin the next

sequence.

While the two most significant bits of the data word address (A17 and A16) are embedded in the Device

Address byte, they will not take precedence over the existing values of the A17 and A16 bits in the internal

address counter during a Current Address Read and are therefore represented as don’t care bits below in

Figure 6-1.

Figure 6-1. Current Address Read

6.2 Random Read

A Random Read begins in the same way as a Byte Write operation to load in a new data word address. This is

known as a “dummy write” operation. However, the Stop condition of the byte write must be omitted to prevent

the part from entering an internal write cycle. Once the device address word and data word address are clocked

in and acknowledged by the EEPROM, the bus Master must generate another Start condition.

The bus Master now initiates a Current Address Read by sending a Start condition, followed by a valid device

address byte with the R/W bit set to Logic 1. While the two most significant bits of the data word address (A17

and A16) are embedded in the Device Address byte, they will not take precedence over the existing values of

the A17 and A16 bits in the internal address counter set during the dummy write and are represented as don’t

care bits in Figure 6-2.

The EEPROM acknowledges the device address and serially clocks out the data word on the SDA line. The

Random Read operation is terminated when the bus Master does not respond with an ACK (it NACKs) and

generates a Stop condition in the next SCL clock cycle.

SCL

SDA

Device Address Byte Data Word (n)

Start

Master

ACK

from

Slave

NACK

from

Master

Stop

Master

MSB MSB

1 0 1 0 A2 X X 1 0 D7 D6 D5 D4 D3 D2 D1 D0 1

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

Figure 6-2. Random Read

6.3 Sequential Read

Sequential Reads are initiated by either a Current Address Read or a Random Read that have been described

previously. As such, the A17 and A16 bits sent in the Device Address byte are don’t care values as they will not

change the values in the address pointer. This is depicted in Figure 6-3.

After the bus Master receives a data word, it responds with an acknowledge. As long as the EEPROM receives

an acknowledge, it will continue to increment the data word address and serially clock out sequential data

words. When the memory address maximum address is reached, the data word address will “roll over” and the

sequential read will continue from the beginning of the memory array. The Sequential Read operation is

terminated when the bus Master does not respond with an ACK (it NACKs) and generates a Stop condition in

the next SCL clock cycle.

Figure 6-3. Sequential Read

7. Device Default Condition from Atmel

The AT24CM02 is delivered with the EEPROM array set to Logic 1, resulting in FFh data in all locations.

SCL

SDA

Start

Master

Device Address Byte First Word Address Byte

MSB MSB

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

1 0 1 0 A2 A17 A16 0 0

Dummy Write

Start

Master

Device Address Byte Data Word (n)

Stop

Maste

MSB MSB

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

1 0 1 0 A2 X X 1 0 D7 D6 D5 D4 D3 D2 D1 D0 1

Second Word Address Byte

MSB

1 2 3 4 5 6 7 8 9

A15 A14 A13 A12 A11 A10 A9 A8 0

ACK

from

Slave

A7 A6 A5 A4 A3 A2 A1 A0 0

ACK

from

Slave

ACK

from

Slave

ACK

from

Slave

NACK

from

Master

SCL

SDA

Start

Master

ACK

from

Slave

ACK

from

Master

Device Address Byte Data Word (n)

MSB MSB

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

1 0 1 0 A2 X X 1 0 D7 D6 D5 D4 D3 D2 D1 D0 0

ACK

from

Master

NACK

from

Master

Stop

Master

ACK

from

Master

Data Word (n+1) Data Word (n+2) Data Word (n+x)

1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9

D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 0 D7 D6 D5 D4 D3 D2 D1 D0 1

MSB MSB MSB

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

8. Electrical Specifications

8.1 Absolute Maximum Ratings

8.2 DC and AC Operating Range

Table 8-1. DC and AC Operating Range

8.3 DC Characteristics

Table 8-2. DC Characteristics

Notes: 1. Typical values characterized at TA = +25°C unless otherwise noted.

2. This parameter is characterized but is not 100% tested in production.

Temperature under Bias. . . . . . . -55C to +125C

Storage Temperature . . . . . . . . . -65C to +150C

Supply Voltage

with respect to ground . . . . . . . . .-0.5V to +6.25V

Voltage on any pin

with respect to ground . . . . . . . . . .-1.0V to +7.0V

DC Output Current . . . . . . . . . . . . . . . . . . . 5.0mA

Functional operation at the “Absolute Maximum Ratings” or any

other conditions beyond those indicated in the operational range

shown in Section 8.2 is not implied or guaranteed. Stresses beyond

those listed under “Absolute Maximum Ratings” and/or exposure to

the “Absolute Maximum Ratings” for extended periods may affect

device reliability and cause permanent damage to the device.

Voltage extremes referenced in the “Absolute Maximum Ratings”

are intended to accommodate short duration undershoot/overshoot

pulses that the device may be subjected to during the course of

normal operation and does not imply or guarantee functional

device operation at these levels for any extended period of time.

AT24CM02

Operating Temperature (Case) Industrial Temperature Range -40C to +85C

VCC Power Supply

Low Voltage Grade 1.7V to 5.5V

Standard Voltage Grade 2.5V to 5.5V

Parameter are applicable over operating range in Section 8.2, unless otherwise noted.

Symbol Parameter Test Condition Min Typical(1) Max Units

VCC1 Supply Voltage

1.7 5.5

VCC2 2.5 5.5

ICC Supply Current, Read

VCC = 1.8V(2) Read at 400kHz 0.1 0.5

VCC = 5.0V Read at 1MHz 0.3 1.0

ICC1 Supply Current, Write

VCC = 1.8V(2)

Averaged during tWR

0.4 1.0

VCC = 5.0V 1.7 3.0

ISB Standby Current

VCC = 1.8V(2)

VIN = VCC or VSS

0.08 1.0

μAVCC = 2.5V 0.08 2.0

VCC = 5.5V 0.15 3.0

ILI Input Leakage Current VIN = VCC or VSS 0.10 3.0

μA

ILO Output Leakage Current VOUT = VCC or VSS 0.05 3.0

VIL Input Low Level(2) –0.6 VCC x 0.3

VIH Input High Level(2) VCC x 0.7 VCC + 0.5

VOL1 Output Low Level

VCC = 1.7V IOL = 0.15mA 0.2

VOL2 VCC = 3.0V IOL = 2.1mA 0.4

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

8.4 AC Characteristics

Table 8-3. AC Characteristics

Notes: 1. These parameters are determined through product characterization and are not tested 100% in production.

2. AC measurement conditions:

CL : 100pF

RPUP (SDA bus line pull-up resistor to VCC): 1.3 k (1000kHz), 4k (400kHz), 10k (100kHz)

Input pulse voltages: 0.3 VCC to 0.7 VCC

Input rise and fall times:  50ns

Input and output timing reference voltages: 0.5 x VCC

Figure 8-1. Bus Timing

Parameters are applicable over operating range in Section 8.2 unless otherwise noted. Test conditions shown in Note 2.

Symbol Parameter

Standard Mode Fast Mode Fast Mode Plus

Units

VCC1.7V to 5.5V VCC1.7V to 5.5V VCC  2.5V to 5.5V

Min Max Min Max Min Max

fSCL Clock Frequency, SCL 100 400 1000 kHz

tLOW Clock Pulse Width Low 4,700 1,300 500 ns

tHIGH Clock Pulse Width High 4,000 600 400 ns

tIInput Filter Spike Rejection (SCL, SDA)(1) 100 100 50 ns

tAA Clock Low to Data Out Valid 4,500 900 450 ns

tBUF Bus Free Time between Stop and Start(1) 4,700 1,300 500 ns

tHD.STA Start Hold Time 4,000 600 250 ns

tSU.STA Start Set-up Time 4,700 600 250 ns

tHD.DAT Data In Hold Time 0 0 0 ns

tSU.DAT Data In Set-up Time 200 100 100 ns

tRInputs Rise Time(1) 1,000 300 100 ns

tFInputs Fall Time(1) 300 300 100 ns

tSU.STO Stop Set-up Time 4,700 600 250 ns

tSU.WP Write Protect Setup Time 4,000 600 250 ns

tHD.WP Write Protect Hold Time 4,000 600 250 ns

tDH Data Out Hold Time 100 50 50 ns

tWR Write Cycle Time 10 10 10 ms

SCL

SDA IN

SDA OUT

tHIGH

tLOW

tAA tDH tBUF

tSU.STO

tSU.DAT

tHD.DAT

tHD.STA

tSU.STA

AT24CM02 [DATASHEET]
Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016
 16
8.5 Power-Up Requirements and Reset Behavior
During a power-up sequence, the VCC supplied to the AT24CM02 should monotonically rise from GND to the 
minimum VCC level as specified in Section 8.2 on page 14, with no greater than a slew rate of 1V/μs.
8.5.1 Device Reset
To prevent inadvertent write operations or any other spurious events from occurring during a power-up 
sequence, the AT24CM02 includes a power-on-reset (POR) circuit. Upon power-up, the device will not respond 
to any commands until the VCC level crosses the internal voltage threshold (VPOR) that brings the device out of 
reset and into standby mode. 
The system designer must ensure that no instruction is sent to the device until the VCC supply has reached a 
stable value greater than the minimum VCC level. Additionally, once the VCC supply has surpassed the minimum 
VCC level, the bus Master must wait at least tPUP before sending the first command to the device. See Table 8-4 
for the values associated with these power-up parameters.
Table 8-4. Power-up Conditions(1)
Note: 1. These parameters are characterized but they are not 100% tested in production.
If an event occurs in the system where the VCC level supplied to the AT24CM02 drops below the maximum VPOR 
level specified, it is recommended that a full power cycle sequence be performed by first driving the VCC pin to 
GND, waiting at least the minimum tPOFF time, and then performing a new power-up sequence in compliance 
with the requirements defined in this section. 
8.6 Pin Capacitance
Table 8-5. Pin Capacitance(1)
Note: 1. This parameter is characterized and is not 100% tested.
8.7 EEPROM Cell Performance Characteristics
Table 8-6. EEPROM Cell Performance Characteristics
Notes: 1. The Write endurance is determined through product characterization and the qualification process.
2. Due to the memory array architecture, the Write Cycle Endurance is specified for writes in groups of 4 data 
bytes. The beginning of any 4-byte boundaries can be determined by multiplying any integer (N) by four 
(i.e. 4*N). The end address can be found by adding three to the beginning value (i.e. 4*N+3). See Section 5.3 
“Internal Writing Methodology” on page 10 for more details on this implementation.
3. The data retention capability is determined by qualification and checked on each device during production.
Symbol Parameter Min Max Units
tPUP Time required after VCC is stable before the device can accept commands 100 — μs
VPOR Power-On Reset Threshold Voltage — 1.5 V
tPOFF Minimum time at VCC = 0V between power cycles 1 — ms
Applicable over recommended operating range from TA = 25C, f = 1.0MHz, VCC = 5.5V
Symbol Test Condition Max Units Conditions
CI/O Input/Output Capacitance (SDA) 8 pF VI/O = 0V
CIN Input Capacitance (A2, SCL) 6 pF VIN = 0V
Operation or Parameter Test Condition Min Max Units
Write Endurance(1) TA = 25°C, VCC(min) < VCC < VCC(max)
Byte(2) or Page Write Mode  1,000,000 — Write Cycles
Data Retention(3) TA = 55°C, VCC(min) < VCC < VCC(max) 100 — Years

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

9. Ordering Code Detail

Atmel Designator

Product Family

24C = Standard

Serial EEPROM

Device Density

Shipping Carrier Option

Package Device Grade or

Wafer/Die Thickness

Package Option

M = Megabit Family

02 = 2 Megabit

T = Tape and reel

B = Bulk (tubes)

Operating Voltage

M = 1.7V to 5.5V

D = 2.5V to 5.5V

U = Green, SnAgCu WLCSP ball

Industrial Temperature range

(-40°C to +85°C)

H = Green, NiPdAu lead finish

Industrial Temperature range

(-40°C to +85°C)

11 = 11mil wafer thickness

SS = JEDEC SOIC

U1 = 8-ball, 4x4 Grid, Thin WLCSP

U2 = 8-ball, 4x4 Grid, Standard WLCSP

WWU = Wafer unsawn

AT24CM02-SSHMxx-T

Product Variation

xx = Applies to select packages only.

See ordering table for variation

details.

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

10. Ordering Code Information

Notes: 1. This device includes a backside coating to increase product robustness.

2. CAUTION: Exposure to ultraviolet (UV) light can degrade the data stored in EEPROM cells. Therefore, customers who

use a WLCSP package or the product at a die level must ensure that exposure to ultraviolet light does not occur.

3. For wafer sales, please contact Atmel Sales

Atmel Ordering Code Lead Finish Package Voltage

Delivery Information Operation

Range

Form Quantity

AT24CM02-SSHM-T

NiPdAu

Lead-free/Halogen-free 8S1

1.7V to 5.5V

Tape and Reel 4,000 per Reel

Industrial

Temperature

(-40C to 85C)

AT24CM02-SSHM-B Bulk (Tubes) 100 per Tube

AT24CM02-SSHD-T

2.5V to 5.5V

Tape and Reel 4,000 per Reel

AT24CM02-SSHD-B Bulk (Tubes) 100 per Tube

AT24CM02-U1UM0B-T(1)(2) SnAgCu Ball

Lead-free/Halogen-free

8U-11

1.7V to 5.5V

Tape and Reel 5,000 per Reel

AT24CM02-U2UM-T(2) 8U-18

AT24CM02-WWU11M(2) N/A Wafer Sale Note 3

Package Type

8S1 8-lead, 0.150” wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8U-11 8-ball, 4 x 4 Ball Grid Array, 0.5mm Pitch, Thin Wafer Level Chip Scale Package (WLCSP)

8U-18 8-ball, 4 x 4 Ball Grid Array, 0.5mm Pitch, Standard Thickness Wafer Level Chip Scale Package (WLCSP)

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

11. Part Markings

DRAWING NO. REV.

TITLE

Catalog Number Truncation

AT24CM02 Truncation Code ##: 2H

AAAAAAAA

## % @

ATMLHYWW

8-lead SOIC

Note 2: Package drawings are not to scale

Note 1: designates pin 1

8-ball WLCSP

Thin and Standard Thickness Options

## % @

ATMLUYWW

AAAAAA

4/7/2016

Date Codes Voltages

Y = Year WW = Work Week of Assembly % = Minimum Voltage

5: 2015 9: 2019 02: Week 2 M: 1.7V min

6: 2016 0: 2020 04: Week 4 D: 2.5V min

7: 2017 1: 2021 ...

8: 2018 2: 2022 52: Week 52

Country of Assembly Lot Number Grade/Lead Finish Material

@ = Country of Assembly AAA...A = Atmel Wafer Lot Number H: Industrial/NiPdAu

U: Industrial/SnAgCu

Atmel Truncation

ATML: Atmel

AT24CM02: Package Marking Information

Package Mark Contact:

DL-CSO-Assy_eng@atmel.com

24CM02SM, AT24CM02 Package Marking Information 24CM02SM

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

12. Packaging Information

12.1 8S1 — 8-lead JEDEC SOIC

DRAWING NO. REV. TITLE GPC

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN NOM MAX NOTE

A1 0.10 – 0.25

A – – 1.75

b 0.31 – 0.51

C 0.17 – 0.25

D 4.90 BSC

E 6.00 BSC

E1 3.90 BSC

e 1.27 BSC

L 0.40 – 1.27

0° – 8°

TOP VIEW

END VIEW

SIDE VIEW

Package Drawing Contact:

packagedrawings@atmel.com

8S1 H

3/6/2015

Notes: This drawing is for general information only.

Refer to JEDEC Drawing MS-012, Variation AA

for proper dimensions, tolerances, datums, etc.

8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing

Small Outline (JEDEC SOIC) SWB

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

12.2 8U-11 — 8-ball WLCSP

DRAWING NO. REV.

TITLE GPC

8U-11 E

8/7/15

8U-11, 8-ball 4x4 Array, Custom Pitch

Wafer Level Chip Scale Package (WLCSP) with BSC GEN

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN TYP MAX NOTE

A 0.313 0.334 0.355

A1 — 0.094 —

A2 — 0.240 — 3

D Contact Atmel for details

d1 1.00 BSC

d2 1.40 BSC

E Contact Atmel for details

e 0.50 BSC

e1 2.10 BSC

b 0.170 0.185 0.200

Package Drawing Contact:

packagedrawings@atmel.com

NC = Not Connected

PIN ASSIGNMENT MATRIX

1 2 3

n/a

SCL

n/a

VCC

n/a

SDA

n/a

GND

n/a

BOTTOM SIDE

TOP VIEW

SIDE VIEW

k0.20 C

vd0.015 C

0.05 C A B

Note: 1. Dimensions are NOT to scale.

2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.

3. Product offered with Back Side Coating.

43 21

Dd1

SEATING PLANE

12 34

A1 CORNER

k0.015 (4X)

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

12.3 8U-18 — 8-ball WLCSP

DRAWING NO. REV.

TITLE GPC

8U-18 01

4/5/16

8U-18, 8-ball 4x4 Array, Custom Pitch

Wafer Level Chip Scale Package (WLCSP) GQA

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL MIN TYP MAX NOTE

A 0.456 0.495 0.534

A1 — 0.190 —

A2 — 0.305 —

D Contact Atmel for details.

d1 1.00 BSC

d2 1.40 BSC

E Contact Atmel for details.

e 0.50 BSC

e1 2.10 BSC

b — 0.270 —

Package Drawing Contact:

packagedrawings@atmel.com

NC = Not Connected

PIN ASSIGNMENT MATRIX

1 2 3

n/a

SCL

n/a

VCC

n/a

SDA

n/a

GND

n/a

SIDE VIEW

Note: 1. Dimensions are NOT to scale.

2. Solder ball composition is 95.5Sn-4.0Ag-0.5Cu.

43 21

Dd1

-C-

SEATING PLANE

12 34

k0.20 C

BOTTOM SIDE

0.015 (4X)

TOP VIEW

vd0.015 C

0.05 C A B

A1 CORNER A1 CORNER

AT24CM02 [DATASHEET]

Atmel-8828D-SEEPROM-AT24CM02-Datasheet_052016

13. Revision History

Doc. Rev. Date Comments

8828D 05/2016 Added the 8U-18 standard thickness WLCSP package option. Updated the “Clock and Data

Transition Requirements” section and the “DC Characteristics” table.

8828C 11/2015 Corrected 8-ball WLCSP pinout.

8828B 08/2015 Updated the 8U-11 package drawing, data retention discrepancy, and 8-ball pinout.

8828A 05/2015 Initial document release.

XXX

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