General Description
The MAX3736 is a compact, +3.3V multirate laser driver
for SFP/SFF applications up to 3.2Gbps. The device
accepts differential data and provides bias and modula-
tion currents for driving a laser. DC-coupling to the laser
allows for multirate applications, and reduces the num-
ber of external components.
The wide 5mA to 60mA (85mA AC-coupled) modulation
current range and 1mA to 100mA bias current make the
MAX3736 ideal for driving FP/DFB laser diodes in fiber-
optic modules. The laser current setting can be con-
trolled by a current DAC, a voltage DAC, or a resistor.
Very low power dissipation, small package size, and
reduced component count, make this part an ideal solu-
tion for SFP-module applications.
The MAX3736 is available in dice or in a small 3mm x
3mm, 16-pin thin QFN package. It operates over a -40°C
to +85°C temperature range.
Applications
Gigabit Ethernet SFP/SFF Transceiver Modules
1G/2G Fibre-Channel SFP/SFF Transceiver
Modules
Multirate OC-3 to OC-48 FEC SFP/SFF
Transceiver Modules
10G Ethernet LX-4 Modules
Features
♦Fully Compatible with SFP and SFF-8472
Specifications
♦Programmable Modulation Current from 5mA to
60mA (DC-Coupled)
♦Programmable Modulation Current from 5mA to
85mA (AC-Coupled)
♦Programmable Bias Current from 1mA to 100mA
♦56ps Edge Transition Times
♦22mA (typ) Power-Supply Current
♦Multirate Operation Up to 3.2Gbps
♦On-Chip Pullup Resistor for DIS
♦16-Pin, 3mm ×3mm Thin QFN Package
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
________________________________________________________________ Maxim Integrated Products 1
Ordering Information
+3.3V
SUPPLY FILTER
VCC
OUT-
OUT+
BIAS
BIASSET
MODSET
IN+
IN-
MOD-DEF1
MOD-DEF2
TX_DISABLE LASER CONTROLLER
15Ω56Ω
10Ω
8.2pF
0.01µF
FERRITE
BEAD
0.1µF
0.1µF
GND
DIS
SERDES
HOST FILTER
VCC_RX
BC_MON
50Ω
50Ω
HOST BOARD SFP OPTICAL TRANSMITTER
MAX3736
Typical Application Circuit
19-3116; Rev 1; 2/06
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
*Dice are designed to operate from -40°C to +85°C, but are test-
ed and guaranteed only at TA= +25°C.
+Denotes lead-free package.
PART TEMP RANGE PIN-
PACKAGE
PKG
CODE
MAX3736E/D -40°C to +85°C Dice* —
MAX3736ETE -40°C to +85°C 16 Thin QFN T1633-2
MAX3736ETE+ -40°C to +85°C 16 Thin QFN T1633-2
Pin Configuration appears at end of data sheet.
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VCC = +2.97V to +3.63V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, IBIAS = 20mA, IMOD = 30mA, TA= +25°C, unless
otherwise noted.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Power-Supply Voltage VCC ..................................-0.5V to +6.0V
Voltage at IN+, IN-, DIS…..…………………-0.5V to (VCC + 0.5V)
Voltage at BC_MON, MODSET, BIASSET .............-0.5V to +3.0V
Voltage at OUT+, OUT-.……………………+0.5V to (VCC + 1.5V)
Voltage at BIAS ............……………………+0.5V to (VCC + 0.5V)
Current into BIAS, OUT+, OUT- ......................-20mA to +150mA
Current into IN+, IN-......…………………………-20mA to +20mA
Continuous Power Dissipation (TA= +85°C)
16-Pin Thin QFN (derate 25mW/°C above +85°C) .............2W
Operating Junction Temperature Range ..........-55°C to +150°C
Storage Temperature Range .............................-55°C to +150°C
Die Attach Temperature ..................................................+400°C
Lead Temperature (soldering, 10s) .................................+300°C
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Power-Supply Current ICC Excludes the laser bias and modulation
currents (Note 2) 22 35 mA
I/O SPECIFICATIONS
Differential Input Voltage VID VID = VIN+ - VIN-, Figure 1 0.2 2.4 VP-P
Common-Mode Input Voltage VINCM 0.6 ×
VCC V
Differential Input Resistance RIN 85 100 115 Ω
DIS Input Pullup Resistance RPULL 4.7 7.2 10.0 kΩ
VDIS = VCC 15
DIS Input Current VDIS = GND, VCC = 3.3V, RPULL = 7.4kΩ-450 µA
DIS Input High Voltage VIH 2.0 V
DIS Input Low Voltage VIL 0.8 V
BIAS GENERATOR
Bias Current Range IBIAS Current into BIAS pin 1 100 mA
Bias Off-Current IBIASOFF Current into BIAS pin, DIS asserted high 100 µA
5mA ≤ IBIAS ≤ 10mA 70 85 95
BIASSET Current Gain GBIAS (Note 3) 10mA ≤ IBIAS ≤ 100mA 79 85 91 A/A
BIASSET Current Gain Stability 10mA ≤ IBIAS ≤ 100mA (Note 4) -4.4 +4 %
BIASSET Current Gain Linearity 10mA ≤ IBIAS ≤ 100mA (Note 5) -2.3 +2.3 %
Bias Overshoot During SFP module hot plugging;
see Figure 3 (Notes 5, 6) 10 %
Bias-Current Monitor Gain (Note 5) 13.7 mA/A
1mA ≤ IBIAS ≤ 5mA |4|
5mA ≤ IBIAS ≤ 10mA -7 |2.8|+7
Bias-Current Monitor Gain
Stability (Notes 4, 5) 10mA ≤ IBIAS ≤ 100mA -5 |2.4|+5
%
Current into OUT+, RL = 15Ω,
VOUT+ and VOUT- ≥ 0.6V (DC-coupled) 560
Modulation Current Range IMOD Current into OUT+, RL = 15Ω,
VOUT+ and VOUT- ≥ 2.0V (AC-coupled) 585
mAP-P
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
_______________________________________________________________________________________ 3
Note 1: Specifications at -40°C are guaranteed by design and characterization. Dice are tested at TA= +25°C only.
Note 2: Maximum value is specified at IMOD = 60mA and IBIAS = 100mA. BC_MON connected to VCC.
Note 3: Modulation current gain, GMOD, is defined as GMOD = IMOD / IMODSET. Bias current gain, GBIAS, is defined as GBIAS =
IBIAS / IBIASSET. The nominal gain is measured at VCC = +3.3V and TA= +25°C.
Note 4: Gain stability is defined as [(Gain) - (Nom_Gain)] / (Nom_Gain) over the listed current range, temperature, and supply
variation. Nominal gain is measured at VCC = +3.3V, TA= +25°C. The voltage at the BC_MON pin must not exceed 1.39V.
Note 5: Guaranteed by design and characterization; see Figure 2.
Note 6: VCC turn-on time must be less than 0.8s, DC-coupled interface.
Note 7: The gain matching is defined as ABS [(GMOD/GBIAS - GMODNOM/GBIASNOM)/(GMODNOM/GBIASNOM)] over the specified
temperature and voltage supply range.
Note 8: For supply noise tolerance, noise is added to the supply (100mVP-P) up to 2MHz; see Figure 3.
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.97V to +3.63V, TA = -40°C to +85°C. Typical values are at VCC = +3.3V, IBIAS = 20mA, IMOD = 30mA, TA= +25°C, unless
otherwise noted.) (Note 1)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
MODULATOR
5mA ≤ IMOD ≤ 10mA 70 85 95
Modulation Current Gain GMOD (Note 3) 10mA ≤ IMOD ≤ 85mA 79 85 91 A/A
Modulation Current Gain Stability 10mA ≤ IMOD ≤ 85mA (Notes 4, 5) -4.4 +4 %
Modulation Current Gain Linearity 10mA ≤ IMOD ≤ 85mA (Note 5) -3.3 +3.3 %
IBIASSET = 0.15mA; IMODSET = 0.7mA 2.3
IBIASSET = IMODSET = 0.15mA 0.1 1.4
IBIASSET = IMODSET = 0.4mA 0.1 1
IBIASSET = IMODSET = 0.6mA 0.1 1
Bias Current Gain and
Modulation Current Gain
Matching (Notes 5, 7)
IBIASSET = IMODSET = 0.9mA 0.1 1
%
Modulation OFF Current IMODOFF DIS asserted high 100 µA
Rise Time tR20% to 80%; 10mA ≤ IMOD ≤ 60mA (Note 5) 48 80 ps
Fall Time tF80% to 20%; 10mA ≤ IMOD ≤ 60mA (Note 5) 58 80 ps
10mA ≤ IMOD ≤ 60mA; 2.67Gbps;
223-1 PRBS 16 38
10mA ≤ IMOD ≤ 60mA; 3.2Gbps;
K28.5 pattern 17 38
10mA ≤ IMOD ≤ 60mA; 155Mbps;
223-1 PRBS 30
psP-P
Deterministic Jitter
(Notes 5, 8)
10mA ≤ IMOD ≤ 60mA; 3.2Gbps; K28.5;
TA = +100°C 6.3 ps
Random Jitter 10mA ≤ IMOD ≤ 60mA (Note 5) 0.6 1 psRMS
OPTICAL EYE
(155Mbps)
MAX3736 toc01
919ps/div
117 MHz FILTER, 231 - 1 PRBS
1310nm FP LASER
C4
OPTICAL EYE
(2.488Gbps)
MAX3736 toc02
58ps/div
ER = 8.2dB, OC-48 FILTER
231 - 1 PRBS, 1310 FP LASER
ELECTRICAL EYE
(2.488Gbps)
MAX3736 toc03
58ps/div
1870MHz FILTER
223 - 1 PRBS
Typical Operating Characteristics
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA= +25°C, unless otherwise noted.)
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
4 _______________________________________________________________________________________
SOURCE
NOISE
VOLTAGE
SUPPLY 0.1µF 0.1µFOPTIONAL
OPTIONAL
TO LASER
DRIVER VCC
10µF
1µH
HOST BOARD
FILTER DEFINED BY SFP MSA
MODULE
Figure 3. Supply Filter
100mV MIN
1200mV MAX
CURRENT
VOLTAGE
VIN+
VIN-
(VIN+) - (VIN-)
IOUT+
200mVP-P MIN
2400mVP-P MAX
IMOD
Figure 1. Definition of Single-Ended Input Voltage Range
MAX3736
OSCILLOSCOPE
OUT-
OUT+
1.1pF
25Ω26Ω
130Ω
IOUT+
30Ω
VCC
VCC
50Ω
Figure 2. Output Termination for Characterization
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
_______________________________________________________________________________________ 5
SUPPLY CURRENT vs. TEMPERATURE
MAX3736 toc05
TEMPERATURE (°C)
SUPPLY CURRENT (mA)
603510-15
20
30
40
50
60
70
80
10
-40 85
EXCLUDES IBIAS AND IMOD
BIAS CURRENT MONITOR GAIN
vs. TEMPERATURE
GAIN (mA/A)
12
14
16
18
20
10
MAX3736 toc06
TEMPERATURE (°C)
603510-15-40 85
MODULATION CURRENT
vs. MODSET RESISTANCE (ZL = 15Ω)
MAX3736 toc07
RMODSET (kΩ)
IMOD (mAP-P)
10
10
20
30
40
50
60
70
80
0
1100
BIAS CURRENT vs. BIAS RESISTANCE
MAX3736 toc08
RBIASSET (kΩ)
IBIAS (mA)
10
10
20
30
40
50
60
70
80
90
100
0
1100
EDGE TRANSITION TIME
vs. MODULATION AMPLITUDE
IMOD (mA)
EDGE TRANSITION TIME (ps)
5040302010 60
MAX3736 toc09
20
30
40
50
60
70
80
10
FALL TIME
RISE TIME
Typical Operating Characteristics (continued)
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA= +25°C, unless otherwise noted.)
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
6 _______________________________________________________________________________________
Pin Description
PIN NAME FUNCTION
1, 4, 9,
12, 15 VCC +3.3V Supply Voltage. All pins must be connected to VCC.
2 IN+ Noninverted Data Input
3 IN- Inverted Data Input
5 BIASSET A current DAC, a voltage DAC, or a resistor, connected from this pin to ground, sets the desired bias
current for the laser (see the Programming the Laser Bias Current section).
6 MODSET A current DAC, a voltage DAC, or a resistor, connected from this pin to ground, sets the desired bias
current for the laser (see the Programming the Laser Modulation Current section).
7 BC_MON Bias Current Monitor Output. Current out of this pin develops a ground-referenced voltage across an
external resistor that is proportional to the bias current.
8 BIAS Laser Bias Current Output
10 OUT+ Noninverted Modulation Current Output. IMOD flows into this pin when input data is high.
11 OUT- Inverted Modulation Current Output. IMOD flows into this pin when input data is low.
13, 14 GND Ground
16 DIS Transmitter Disable, TTL. Laser output is disabled when DIS is asserted high or left
unconnected. The laser output is enabled when this pin is asserted low.
EP Exposed
Pad
Ground. Must be soldered to the circuit board ground for proper thermal and electrical performance
(see the Exposed Pad Package section).
Typical Operating Characteristics (continued)
(Typical values are at VCC = 3.3V, IBIAS = 20mA, IMOD = 30mA, TA= +25°C, unless otherwise noted.)
DETERMINISTIC JITTER
vs. MODULATION CURRENT
MAX3736 toc10
IMOD (mAP-P)
DJ (psP-P)
50403020
10
20
30
40
50
60
0
10 60
2.7Gbps
223-1 PRBS
DIFFERENTIAL S11 vs. FREQUENCY
MAX3736 toc11
FREQUENCY (GHz)
IS11I (dB)
8642
-25
-20
-15
-10
-5
0
-30
010
Detailed Description
The MAX3736 laser driver consists of three operational
blocks: a bias current generator, a modulation current
generator, and a high-speed modulation path. The
laser-biasing block includes a monitor output for bias-
sensing purposes. Both the bias and modulation gener-
ating blocks are enabled and disabled by the DIS pin.
The high-speed modulation path provides a 100Ω
differential input resistance.
Bias Current Generator
To maintain constant average optical power, the
MAX3736 is designed to interface to a laser controller
IC. The laser controller IC controls the MAX3736, and
maintains a constant laser power using an automatic
power-control (APC) circuit. A back-facet photodiode,
mounted in the laser package, is used to convert the
optical power into a photocurrent. The laser controller
IC adjusts the laser bias current so the monitor photodi-
ode’s current matches the level programmed by the
user. It does this by adjusting the current sourced by
the MAX3736’s BIASSET pin. The MAX3736 reacts by
increasing or decreasing the laser current at BIAS.
Bias Current Monitor
The MAX3736 features a bias current monitor
(BC_MON). This monitor is realized by mirroring a frac-
tion of the bias current and developing a voltage
across an external resistor connected to ground. For
example, connecting a 100Ωresistor to ground gives
the following relationship:
VBC_MON = (IBIAS / 73) x 100Ω. For compliance, the
voltage on BC_MON must be kept below 1.39V.
Modulation Current Generator
The laser’s modulation amplitude can be controlled by
placing a resistor from MODSET to ground. To set the
modulation amplitude, see the IMOD vs. RMODSET
graph in the Typical Operating Characteristics. A more
advanced control scheme employs the use of a laser
controller IC to control modulation current to
stabilize the extinction ratio. For more information on
controlling the extinction ratio refer to Maxim
Application Note HFAN-02.3.1: Maintaining Average
Power and Extinction Ratio, Part 1, Slope Efficiency and
Threshold Current.
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
_______________________________________________________________________________________ 7
IN+
1.2V 1.2V
x85
x1 x85
DIS
VCC VCC
VCC
VCC
VCC
16kΩ
82pF 7.2kΩ
24kΩ
50Ω50Ω
BIASSET MODSET
BIAS
BC_MON
IN-
OUT+
OUT-
MAX3736
Figure 4. Functional Diagram
MAX3736
High-Speed Modulation Driver
The output stage is composed of a high-speed differ-
ential pair and a programmable modulation current
source. The MAX3736 is optimized for driving a 15Ω
load; the minimum instantaneous voltage required at
OUT+ is 0.6V. Modulation current swings up to 60mA
are possible.
To interface with the laser diode, a damping resistor
(RD) is required for impedance matching. The com-
bined resistance of the series damping resistor and the
equivalent series resistance of the laser diode should
equal 15Ω. To reduce optical output aberrations and
duty-cycle distortion caused by laser diode parasitic
inductance, an RC shunt network might be necessary.
Refer to Maxim Application Note HFAN 02.0:
Interfacing Maxim’s Laser Drivers to Laser Diodes for
more information.
At high data rates, e.g., 2.5Gbps, any capacitive load at
the cathode of a laser diode degrades optical output per-
formance. Because the BIAS output is directly connected
to the laser cathode, minimize the parasitic capacitance
associated with the pin by using an inductor to isolate the
BIAS pin parasitics from the laser cathode.
In the absence of input data, the modulation current
switches to OUT-, squelching the transceiver output.
Disable
The DIS pin disables the modulation and bias current.
The typical enable time is 2µs for bias current and 1µs
for modulation current. The typical disable time is 200ns
for bias current and 250µs for modulation current. The
DIS pin has a 7.4kΩinternal pullup resistor.
Design Procedure
Programming the Modulation Current
There are three methods for setting the modulation cur-
rent on the MAX3736 laser driver. The current can be
set by using a current DAC, a voltage DAC in series with
a resistor, or by using a resistor connected to GND.
To program the laser modulation current using a cur-
rent DAC, attach the DAC to the MODSET pin and set
the current using the following equation:
To program the laser modulation current using a volt-
age DAC, attach the DAC to the MODSET pin through a
series resistor, RSERIES, and set the current using the
following equation:
To program the laser modulation current using a resis-
tor, place the resistor from MODSET to ground. IMOD
current can be calculated by the following equation:
Programming the Bias Current
There are three methods for setting the bias current on
the MAX3736 laser driver. The current can be set by
using a current DAC, a voltage DAC in series with a
resistor, or by using a resistor connected to GND.
To program the laser bias current using a current DAC,
attach the DAC to the BIASSET pin and set the current
using the following equation:
To program the laser bias current using a voltage DAC,
attach the DAC to the BIASSET pin through a series
resistor, RSERIES, and set the current using the follow-
ing equation:
To program the laser bias current using a resistor,
place the resistor from BIASSET to ground. IBIAS cur-
rent can be calculated by the following equation:
IV
R
BIAS BIASET
=×
12 85
.
IVV
R
BIAS DAC
SERIES
=−×
12 85
.
II
BIAS BIASET
=×85
IV
R
MOD MODSET
=×
12 85
.
IVV
R
MOD DAC
SERIES
=−×
12 85
.
II
MOD MODSET
=×85
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
8 _______________________________________________________________________________________
Input Termination Requirements
The MAX3736 data inputs are SFP MSA compliant. On-
chip 100Ω, differential input impedance is provided for
optimal termination (Figure 5). Because of the on-chip
biasing network, the MAX3736 inputs self-bias to the
proper operating point to accommodate AC-coupling.
Applications Information
Data Input Logic Levels
The MAX3736 is directly compatible with +3.3V reference
CML. Either DC or AC-coupling can be used for CML ref-
erenced to +3.3V. For all other logic types, AC-coupling
should be used. DC coupling to CML is fine, but it
negates the squelching function on the modulation path.
Modulation Currents Exceeding 60mA
For applications requiring a modulation current greater
than 60mA, headroom is insufficient for proper operation
of the laser driver if the laser is DC-coupled. To avoid
this problem, the MAX3736 modulation output can be
AC-coupled to the cathode of a laser diode. An external
pullup inductor is necessary to DC-bias the modulation
output at VCC. Such a configuration isolates laser for-
ward voltage from the output circuitry and allows the out-
put at OUT+ to swing above and below the supply
voltage (VCC). When AC-coupled, the MAX3736 modula-
tion current can be programmed from 5mA to 85mA.
Refer to Maxim Application Note HFAN 02.0: Interfacing
Maxim’s Laser Drivers to Laser Diodes for more informa-
tion on AC-coupling laser drivers to laser diodes.
Interface Models
Figures 5 and 6 show simplified input and output cir-
cuits for the MAX3736 laser driver. If dice are used,
replace package parasitic elements with bondwire par-
asitic elements.
Wire-Bonding Die
The MAX3736 uses gold metalization with a thickness
of 5µm (typ). Maxim characterized this circuit with gold-
wire ball bonding (1-mil diameter wire). Die-pad size is
94 mils (2388µm) square, and die thickness is 15 mils
(381µm). Refer to Maxim Application Note HFAN-
08.0.1: Understanding Bonding Coordinates and
Physical Die Size for additional information.
Layout Considerations
To minimize loss and crosstalk, keep the connections
between the MAX3736 output and the laser as short as
possible. Use good high-frequency layout techniques
and multilayer boards with an uninterrupted ground
plane to minimize EMI and crosstalk.
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
_______________________________________________________________________________________ 9
MAX3736
0.11pF
0.65nH
VCC
VCC
VCC
0.11pF
0.65nH
IN+
IN-
PACKAGE
50Ω
50Ω
24kΩ
16kΩ82pF
Figure 5. Simplified Input Circuit Schematic
0.11pF
PACKAGE
OUT-
0.11pF
0.43nH
0.43nH OUT+
VCC
MAX3736
Figure 6. Simplified Output Circuit Schematic
MAX3736
Exposed-Pad Package
The exposed pad on the 16-pin QFN provides a very
low thermal resistance path for heat removal from the
IC. The pad is also electrical ground on the MAX3736
and must be soldered to the circuit board ground for
proper thermal and electrical performance. Refer to
Maxim Application Note HFAN-08.1: Thermal
Considerations for QFN and Other Exposed-Pad
Packages for additional information.
Laser Safety and IEC 825
Using the MAX3736 laser driver alone does not ensure
that a transmitter design is compliant with IEC 825. The
entire transmitter circuit and component selections must
be considered. Customers must determine the level of
fault tolerance required by their application. Please rec-
ognize that Maxim products are not designed or autho-
rized for use as components in systems intended for
surgical implant into the body, for applications intended
to support or sustain life, or for any other application
where the failure of a Maxim product could create a situ-
ation where personal injury or death may occur.
Chip Topography/
Pad Configuration
The origin for pad coordinates is defined as the bottom
left corner of the bottom left pad. All pad locations are
referenced from the origin, and indicate the center of
the pad where the bond wire should be connected.
Refer to Maxim Application Note HFAN-08.0.1:
Understanding Bonding Coordinates and Physical Die
Size for detailed information.
TRANSISTOR COUNT: 1385
PROCESS: SiGe BIPOLAR
SUBSTRATE CONNECTED TO GND
DIE THICKNESS: 15 mils
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
10 ______________________________________________________________________________________
16
1
2
3
4
12
11
10
9
15 14 13
5678
DIS
VCC
GND
GND
VCC
OUT-
OUT+
VCC
IN+
IN-
VCC
THE EXPOSED PAD MUST BE CONNECTED TO GROUND
FOR PROPER THERMAL AND ELECTRICAL PERFORMANCE
BIASSET
MODSET
THIN QFN (3mm x 3mm)
BC_MON
BIAS
VCC
TOP VIEW
MA3736
GND DIS GND GND GND
VCC
OUT-
OUT-
OUT+
OUT+
VCC
BIASBC_MONMODSET
1.55mm
(61mils)
1.14mm
(45mils)
BIASSET
VCC
(0,0)
IN-
IN+
VCC
VCC
Chip Topography
Pin Configuration
MAX3736
3.2Gbps, Low-Power, Compact,
SFP Laser Driver
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11
© 2006 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.
Table 1. MAX3736 Bondpad Locations
COORDINATES (µm)
PAD
NUMBER PAD NAME XY
BP1 VCC 0 520.8
BP2 IN+ 0 351.4
BP3 IN- 0 169.4
BP4 VCC 00
BP5 BIASSET 298.3 -222.1
BP6 MODSET 526.5 -222.1
BP7 BC_MON 737.7 -223.5
BP8 BIAS 1104.8 -224.9
BP9 VCC 1258.9 -107.9
BP10 OUT+ 1258.9 32.1
BP11 OUT+ 1258.9 179.1
BP12 OUT- 1258.9 342.9
BP13 OUT- 1258.9 490
BP14 VCC 1258.9 629.9
BP15 GND 1060 630.9
BP16 GND 896.1 632.3
BP17 GND 712.7 630.9
BP18 VCC 550.3 630.9
BP19 DIS 378.1 631
BP20 GND 191.8 630.9
Package Information
For the latest package outline information, go to
www.maxim-ic.com/packages.
Bonding Coordinates
