LP38512-1.8
March 6, 2009
1.5A Fast-Transient Response Low-Dropout Linear
Voltage Regulator with Error Flag
General Description
The LP38512-1.8 Fast-Transient Response Low-Dropout
Voltage Regulator offers the highest-performance in meeting
AC and DC accuracy requirements for powering Digital
Cores. The LP38512-1.8 uses a proprietary control loop that
enables extremely fast response to change in line conditions
and load demands. Output Voltage DC accuracy is guaran-
teed at 2.5% over line, load and full temperature range from
-40°C to +125°C. The LP38512-1.8 is designed for inputs
from the 2.5V, 3.3V, and 5.0V rail, is stable with 10 μF ceramic
capacitors, and has a fixed 1.8V output. An Error Flag feature
monitors the output voltage and notifies the system processor
when the output voltage falls more than 15% below the nom-
inal value. The LP38512-1.8 provides excellent transient per-
formance to meet the demand of high performance digital
core ASICs, DSPs, and FPGAs found in highly-intensive ap-
plications such as servers, routers/switches, and base sta-
tions.
Features
2.25V to 5.5V Input Voltage Range
1.8V Fixed Output Voltage
1.5A Output Load Current
±2.5% Accuracy over Line, Load, and Full-Temperature
Range from -40°C to +125°C
Stable with tiny 10 µF ceramic capacitors
0.20% Output Voltage Load Regulation from 10 mA to
1.5A
Enable pin
Error Flag Indicates Status of Output Voltage
1uA of Quiescent current in Shutdown
40dB of PSRR at 100 kHz
Over-Temperature and Over-Current Protection
TO-263 and TO-263 THIN Surface Mount Packages
Applications
Digital Core ASICs, FPGAs, and DSPs
Servers
Routers and Switches
Base Stations
Storage Area Networks
DDR2 Memory
Typical Application Circuit
20183001
© 2009 National Semiconductor Corporation 201830 www.national.com
LP38512-1.8 1.5A Fast-Transient Response Low-Dropout Linear Voltage Regulator
Ordering Information
TABLE 1. Package Marking and Ordering Information
Output
Voltage
Order Number Package Type Package Marking Supplied As:
1.8
LP38512TJ-1.8 TO263-5 THIN LP38512TJ-1.8 Tape and Reel
LP38512TS-1.8 TO263-5 LP38512TS-1.8 Rail
LP38512TSX-1.8 TO263-5 LP38512TS-1.8 Tape and Reel
Connection Diagrams
20183004
Top View
TO-263 5 Pin Package
20183005
Top View
TO-263 THIN 5 Pin Package
Pin Descriptions for TO-263 and TO-263 THIN Packages
Pin # Pin Name Function
1 EN Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias
and must be tied to the input voltage, or actively driven.
2 IN Input Supply Pin
3 GND Ground
4 OUT Regulated Output Voltage Pin
5 ERROR ERROR Flag. A high level indicates that VOUT is within typically 15% (VOUT falling) of the
nominal regulated voltage.
TAB/DAP TAB/DAP
The TO-263 TAB, and the TO-263 THIN DAP, is used as a thermal connection to remove
heat from the device to an external heatsink. The TAB/DAP is internally connected to device
pin 3, and is electrical ground connection.
www.national.com 2
LP38512-1.8
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Storage Temperature Range −65°C to +150°C
Soldering Temperature (Note 3)
TO-220, Wave 260°C, 10s
TO-263 235°C, 30s
ESD Rating (Note 2) ±2 kV
Power Dissipation(Note 4) Internally Limited
Input Pin Voltage (Survival) −0.3V to +6.0V
Enable Pin Voltage (Survival) −0.3V to +6.0V
Output Pin Voltage (Survival) −0.3V to +6.0V
ERROR Pin Voltage (Survival) 0.3V to +6.0V
IOUT(Survival) Internally Limited
Operating Ratings (Note 1)
Input Supply Voltage, VIN 2.25V to 5.5V
Enable Input Voltage, VEN 0.0V to 5.5V
ERROR Pin Voltage 0.0V to VIN
Output Current (DC) 0 mA to 1.5A
Junction Temperature (Note 4) −40°C to +125°C
Electrical Characteristics
Unless otherwise specified: VIN = 2.5V, IOUT = 10 mA, CIN = 10 µF, COUT = 10 µF, VEN = VIN. Limits in standard type are for TJ =
25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum
limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at
TJ = 25°C, and are provided for reference purposes only.
Symbol Parameter Conditions Min Typ Max Units
VOUT
Output Voltage Tolerance
(Note 7)
2.25V VIN 5.5V
10 mA IOUT 1.5A
-1.0
−2.5 0+1.0
+2.5 %
ΔVOUTVIN
Output Voltage Line
Regulation
(Notes 5, 7)
2.25V VIN 5.5V -0.02
0.06 - %/V
ΔVOUTIOUT
Output Voltage Load
Regulation
(Notes 6, 7)
10 mA IOUT 1.5A -0.25
0.40 - %/A
VDO
Dropout Voltage
(Note 8) IOUT = 1.5A - 250 340
400 mV
IGND
Ground Pin Current, Output
Enabled
IOUT = 10 mA
ERROR pin = GND - 7.5 11
12 mA
IOUT = 1.5A
ERROR pin = GND - 9.5 13
14
Ground Pin Current, Output
Disabled
VEN = 0.50V
ERROR pin = GND - 0.1 3.5
12 µA
ISC Short Circuit Current VOUT = 0V - 2.5 - A
Enable Input
VEN(ON) Enable ON Threshold VEN rising from 0.50V until
VOUT = ON
0.90
0.80 1.20 1.50
1.60 V
VEN(OFF) Enable OFF Threshold VEN falling from 1.60V until
VOUT = OFF
0.60
0.50 1.00 1.40
1.50
VEN(HYS) Enable Hysteresis VEN(ON) - VEN(OFF) - 200 - mV
td(OFF) Turn-off delay Time from VEN < VEN(OFF) to VOUT =
OFF, ILOAD = 1.5A - 1 -
µs
td(ON) Turn-on delay Time from VEN >VEN(ON) to VOUT =
ON, ILOAD = 1.5A - 25 -
IEN Enable Pin Current VEN = VIN - 1 - nA
VEN = 0V - -1 -
3 www.national.com
LP38512-1.8
Symbol Parameter Conditions Min Typ Max Units
ERROR Flag
VTH
Error Flag Threshold
(Note 9)
VOUT rising threshold where
ERROR Flag goes high 78 90 98
%
VOUT falling threshold where
ERROR Flag goes low 74 85 93
VERROR(SAT)
ERROR Flag Saturation
Voltage ISINK = 100 µA - 12.5 45 mV
Ilk
ERROR Flag Pin Leakage
Current VERROR = 5.5V - 1 - nA
tdERROR Flag Delay time - 1 - µs
AC Parameters
PSRR Ripple Rejection
VIN = 2.5V
f = 120Hz - 73 -
dB
VIN = 2.5V
f = 1 kHz - 73 -
en
Output Noise Density f = 120Hz - 2 - nV/Hz
Output Noise Voltage BW = 100Hz – 100kHz - 75 - µV (RMS)
Thermal Characteristics
TSD Thermal Shutdown TJ rising - 165 - °C
ΔTSD Thermal Shutdown Hysteresis TJ falling from TSD - 10 -
θJ-A
Thermal Resistance
Junction to Ambient
(Note 4)
TO-263 and TO-263 THIN - 60 - °C/W
θJ-C
Thermal Resistance
Junction to Case TO-263 and TO-263 THIN - 3 - °C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but does not guarantee specific performance limits. For guaranteed specifications and conditions, see the Electrical Characteristics.
Note 2: The human body model is a 100pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.
Note 3: Refer to JEDEC J-STD-020C for surface mount device (SMD) package reflow profiles and conditions. Unless otherwise stated, the temperatures and
times are for Sn-Pb (STD) only.
Note 4: Device operation must be evaluated, and derated as needed, based on ambient temperature (TA), power dissipation (PD), maximum allowable operating
junction temperature (TJ(MAX)), and package thermal resistance (θJA).
Note 5: Output voltage line regulation is defined as the change in output voltage from the nominal value (ΔVOUT) due to a change in the voltage at the input
(ΔVIN).
Note 6: Output voltage load regulation is defined as the change in output voltage from the nominal value (ΔVOUT) due to a change in the load current at the output
(ΔIOUT).
Note 7: The line and load regulation specification contains only the typical number. However, the limits for line and load regulation are included in the output
voltage tolerance specification.
Note 8: Dropout voltage is defined as the minimum input to output differential voltage at which the output drops 2% below the nominal value. For the LP38512-1.8
the minimum VIN operating voltage is the limiting factor.
Note 9: The ERROR Flag thresholds are specified as percentage of the nominal regulated output voltage. See Application Information.
www.national.com 4
LP38512-1.8
Typical Performance Characteristics Unless otherwise specified: TJ = 25°C, VIN = 2.5V, VEN = VIN,
CIN = 10 µF, COUT = 10 µF, IOUT = 10 mA.
VOUT vs Temperature
20183011
VOUT vs VIN
20183037
Ground Pin Current (IGND) vs VIN
20183012
Ground Pin Current (IGND) vs Temperature
20183013
Ground Pin Current(IGND) vs Temperature, VEN = 0.5V
20183014
Enable Thresholds vs Temperature
20183016
5 www.national.com
LP38512-1.8
VOUT vs VEN (td(ON))
20183032
VOUT vs VEN (td(OFF))
20183030
VOUT ERROR Flag Threshold vs Temperature
20183017
ERROR Flag Low vs Temperature
20183018
Load regulation vs Temperature
20183020
Line Regulation vs Temperature
20183021
www.national.com 6
LP38512-1.8
Current Limit vs Temperature
20183022
Load Transient, 10 mA to 1.5A
COUT = 10 μF Ceramic
20183023
Load Transient, 10 mA to 1.5A
COUT = 10 µF Ceramic + 100 µF Aluminum
20183024
Load Transient, 500 mA to 1.5A
COUT = 10 µF Ceramic
20183025
Load Transient, 500 mA to 1.5A
COUT = 10 μF Ceramic + 100 µF Aluminum
20183026
Line Transient
20183027
7 www.national.com
LP38512-1.8
PSRR, 10Hz to 1MHz
20183029
Noise
20183031
www.national.com 8
LP38512-1.8
Block Diagram
20183007
Application Information
EXTERNAL CAPACITORS
Like any low-dropout regulator, external capacitors are re-
quired to assure stability. These capacitors must be correctly
selected for proper performance.
Input Capacitor
A ceramic input capacitor of at least 10 µF is required. For
general usage across all load currents and operating condi-
tions, a 10 µF ceramic input capacitor will provide satisfactory
performance.
Output Capacitor
A ceramic capacitor with a minimum value of 10 µF is required
at the output pin for loop stability. It must be located less than
1 cm from the device and connected directly to the output and
ground pin using traces which have no other currents flowing
through them. As long as the minimum of 10 µF ceramic is
met, there is no limitation on any additional capacitance.
X7R and X5R dielectric ceramic capacitors are strongly rec-
ommended, as they typically maintain a capacitance range
within ±20% of nominal over full operating ratings of temper-
ature and voltage. Of course, they are typically larger and
more costly than Z5U/Y5U types for a given voltage and ca-
pacitance.
Z5U and Y5V dielectric ceramics are not recommended as
the capacitance will drops severely with applied voltage. A
typical Z5U or Y5V capacitor can lose 60% of its rated ca-
pacitance with half of the rated voltage applied to it. The Z5U
and Y5V also exhibit a severe temperature effect, losing more
than 50% of nominal capacitance at high and low limits of the
temperature range.
REVERSE VOLTAGE
A reverse voltage condition will exist when the voltage at the
output pin is higher than the voltage at the input pin. Typically
this will happen when VIN is abruptly taken low and COUT con-
tinues to hold a sufficient charge such that the input to output
voltage becomes reversed. A less common condition is when
an alternate voltage source is connected to the output.
There are two possible paths for current to flow from the out-
put pin back to the input during a reverse voltage condition.
While VIN is high enough to keep the control circuity alive, and
the Enable pin is above the VEN(ON) threshold, the control cir-
cuitry will attempt to regulate the output voltage. Since the
input voltage is less than the output voltage the control circuit
will drive the gate of the pass element to the full on condition
when the output voltage begins to fall. In this condition, re-
verse current will flow from the output pin to the input pin,
limited only by the RDS(ON) of the pass element and the output
to input voltage differential. Discharging an output capacitor
up to 1000 µF in this manner will not damage the device as
the current will rapidly decay. However, continuous reverse
current should be avoided.
The internal PFET pass element in the LP38512 has an in-
herent parasitic diode. During normal operation, the input
voltage is higher than the output voltage and the parasitic
diode is reverse biased. However, if the output voltage to input
voltage differential is more than 500 mV (typical) the parasitic
diode becomes forward biased and current flows from the
output pin to the input through the diode. The current in the
parasitic diode should limited to less than 1A continuous and
5A peak.
If used in a dual-supply system where the regulator output
load is returned to a negative supply, the output pin must be
diode clamped to ground. A Schottky diode is recommended
for this protective clamp.
SHORT-CIRCUIT PROTECTION
The LP38512 is short circuit protected, and in the event of a
peak over-current condition the short-circuit control loop will
rapidly drive the output PMOS pass element off. Once the
power pass element shuts down, the control loop will rapidly
cycle the output on and off until the average power dissipation
causes the thermal shutdown circuit to respond to servo the
9 www.national.com
LP38512-1.8
on/off cycling to a lower frequency. Please refer to the POW-
ER DISSIPATION/HEATSINKING section for power dissipa-
tion calculations.
ENABLE OPERATION
The Enable ON threshold is typically 1.2V, and the OFF
threshold is typically 1.0V. To ensure reliable operation the
Enable pin voltage must rise above the maximum VEN(ON)
threshold and must fall below the minimum VEN(OFF) thresh-
old. The Enable threshold has typically 200mV of hysteresis
to improve noise immunity.
The Enable pin (EN) has no internal pull-up or pull-down to
establish a default condition and, as a result, this pin must be
terminated either actively or passively.
If the Enable pin is driven from a single ended device (such
as discrete transistor) a pull-up resistor to VIN, or a pull-down
resistor to ground, will be required for proper operation. A
1 k to 100 k resistor can be used as the pull-up or pull-
down resistor to establish default condition for the EN pin. The
resistor value selected should be appropriate to swamp out
any leakage in the external single ended device, as well as
any stray capacitance.
If the Enable pin is driven from a source that actively pulls high
and low (such as a CMOS rail to rail comparator output), the
pull-up, or pull-down, resistor is not required.
If the application does not require the Enable function, the pin
should be connected to directly to the adjacent VIN pin.
The status of the Enable pin also affects the behavior of the
ERROR Flag. While the Enable pin is high the regulator con-
trol loop will be active and the ERROR Flag will report the
status of the output voltage. When the Enable pin is taken low
the regulator control loop is shutdown, the output is turned off,
and the ERROR Flag pin is immediately forced low.
ERROR FLAG OPERATION
When the LP38512 Enable pin is high, the ERROR Flag pin
will produce a logic low signal when the output drops by more
than 15% (typical) from the nominal output voltage. The drop
in output voltage may be due to low input voltage, current
limiting, or thermal limiting. This flag has a built in hysteresis.
The output voltage will need to rise to within 10% (typical) of
the nominal output voltage for the ERROR Flag to return to a
logic high state. It should also be noted that when the Enable
pin is pulled low, the ERROR Flag pin is forced to be low as
well.
The internal ERROR flag comparator has an open drain out-
put stage. Hence, the ERROR pin requires an external
pull-up resistor. The value of the pull-up resistor should be in
the range of 10 k to 1 M. The ERROR Flag pin should not
be pulled-up to any voltage source higher than VIN as current
flow through an internal parasitic diode may cause unexpect-
ed behavior. The ERROR Flag must be connected to ground
if this function is not used.
The timing diagram in Figure 1 shows the relationship be-
tween the ERROR flag and the output voltage.
20183008
FIGURE 1. ERROR Flag Operation, see Typical Application
www.national.com 10
LP38512-1.8
20183034
FIGURE 2. ERROR Flag Operation, biased from VIN
POWER DISSIPATION/HEATSINKING
A heatsink may be required depending on the maximum pow-
er dissipation (PD(MAX)), maximum ambient temperature
(TA(MAX)) of the application, and the thermal resistance (θJA)
of the package. Under all possible conditions, the junction
temperature (TJ) must be within the range specified in the
Operating Ratings. The total power dissipation of the device
is given by:
PD = ( (VIN−VOUT) x IOUT) + (VIN x IGND) (1)
where IGND is the operating ground current of the device
(specified under Electrical Characteristics).
The maximum allowable junction temperature rise (ΔTJ) de-
pends on the maximum expected ambient temperature (TA
(MAX)) of the application, and the maximum allowable junction
temperature (TJ(MAX)):
ΔTJ = TJ(MAX)− TA(MAX) (2)
The maximum allowable value for junction to ambient Ther-
mal Resistance, θJA, can be calculated using the formula:
θJA = ΔTJ / PD(MAX) (3)
HEATSINKING TO-263 PACKAGE
The TO-263 and the TO-263 THIN packages use the copper
plane on the PCB as a heatsink. The tab, or DAP, of these
packages are soldered to the copper plane for heat sinking.
Figure 3 shows a curve for the θJA of TO-263 package for
different copper area sizes, using a typical PCB with 1 ounce
copper and no solder mask over the copper area for heat
sinking.
20183035
FIGURE 3. θJA vs Copper (1 Ounce) Area for TO-263
package
As shown in the figure, increasing the copper area beyond 1
square inch produces very little improvement. The minimum
value for θJA for the TO-263 package mounted to a two-layer
PCB is 32°C/W.
Figure 4 shows the maximum allowable power dissipation for
TO-263 packages for different ambient temperatures, assum-
ing θJA is 35°C/W and the maximum junction temperature is
125°C.
20183036
FIGURE 4. Maximum Power Dissipation vs Ambient
Temperature for TO-263 Package
11 www.national.com
LP38512-1.8
Physical Dimensions inches (millimeters) unless otherwise noted
TO-263, Molded, 5-Lead, 0.067in (1.7mm) Pitch, Surface Mount Package
NS Package Number TS5B
TO-263 THIN, Molded, 5-Lead, 1.7mm Pitch, Surface Mount Package
NS Package Number TJ5A
www.national.com 12
LP38512-1.8
Notes
13 www.national.com
LP38512-1.8
Notes
LP38512-1.8 1.5A Fast-Transient Response Low-Dropout Linear Voltage Regulator
For more National Semiconductor product information and proven design tools, visit the following Web sites at:
Products Design Support
Amplifiers www.national.com/amplifiers WEBENCH® Tools www.national.com/webench
Audio www.national.com/audio App Notes www.national.com/appnotes
Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns
Data Converters www.national.com/adc Samples www.national.com/samples
Interface www.national.com/interface Eval Boards www.national.com/evalboards
LVDS www.national.com/lvds Packaging www.national.com/packaging
Power Management www.national.com/power Green Compliance www.national.com/quality/green
Switching Regulators www.national.com/switchers Distributors www.national.com/contacts
LDOs www.national.com/ldo Quality and Reliability www.national.com/quality
LED Lighting www.national.com/led Feedback/Support www.national.com/feedback
Voltage Reference www.national.com/vref Design Made Easy www.national.com/easy
PowerWise® Solutions www.national.com/powerwise Solutions www.national.com/solutions
Serial Digital Interface (SDI) www.national.com/sdi Mil/Aero www.national.com/milaero
Temperature Sensors www.national.com/tempsensors SolarMagic™ www.national.com/solarmagic
Wireless (PLL/VCO) www.national.com/wireless Analog University® www.national.com/AU
THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION
(“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY
OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO
SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS,
IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS
DOCUMENT.
TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT
NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL
PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR
APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND
APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE
NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS.
EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO
LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE
AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY
RIGHT.
LIFE SUPPORT POLICY
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL
COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein:
Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected
to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness.
National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other
brand or product names may be trademarks or registered trademarks of their respective holders.
Copyright© 2009 National Semiconductor Corporation
For the most current product information visit us at www.national.com
National Semiconductor
Americas Technical
Support Center
Email: support@nsc.com
Tel: 1-800-272-9959
National Semiconductor Europe
Technical Support Center
Email: europe.support@nsc.com
National Semiconductor Asia
Pacific Technical Support Center
Email: ap.support@nsc.com
National Semiconductor Japan
Technical Support Center
Email: jpn.feedback@nsc.com
www.national.com