!Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 Chip Ferrite Bead BNX 188 Function Example 188 Product Detail 191 !Caution/Notice 195 Soldering and Mounting 197 Packaging 201 Design Kits 202 Block Type EMIFILr Chip Common Mode Choke Coil Series Line Up Chip EMIFILr Block Type EMIFILr !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 Chip Ferrite Bead BNX Type p191 SMD Type for Power Lines p193 Lead Type for Power Lines p194 Lead Type Low Profile for Power Lines Chip EMIFILr Series Line Up / Function Example Block Type EMIFILr Part Number Thickness (mm) Rated Voltage Effective Frequency Range Rated Current BNX022-01 BNX023-01 BNX024H01 BNX025H01 BNX002-01 BNX003-01 BNX005-01 BNX012-01 BNX016-01 3.1 3.1 3.5 3.5 18.0 18.0 18.5 8.0 8.0 50Vdc 100Vdc 50Vdc 25Vdc 50Vdc 150Vdc 50Vdc 50Vdc 25Vdc 1MHz to 1GHz:35dB min. 1MHz to 1GHz:35dB min. 100kHz to 1GHz:35dB min. 50kHz to 1GHz:35dB min. 1MHz to 1GHz:40dB min. 5MHz to 1GHz:40dB min. 1MHz to 1GHz:40dB min. 1MHz to 1GHz:40dB min. 100kHz to 1GHz:40dB min. 10A 15A 15A 15A 10A 10A 15A 15A 15A Noise Suppression of Radiation Noise from Power Line Cable Antenna Test Board DC-DC Converter BNX012 AC Adaptor Power Circuit (SW) 12Vdc Clock Drive (30MHz) 100F Cable Chip Common Mode Choke Coil OUT 5V IN 12V AC100V Power Block Digital Block cTest Result With BNX012-01 70 60 60 Level (dBuV/m) Block Type EMIFILr Level (dBuV/m) Without Filter 70 50 40 30 20 50 40 30 20 10 10 0 200 400 600 Frequency (MHz) 800 1000 0 200 400 600 800 1000 Frequency (MHz) !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 188 BNX Function Example +B CB Impulse Noise Generator: INS-4420 (4kV, 50nsec) 60dB (40dB+20dB) ATT PSG Chip Ferrite Bead Impulse Noise Countermeasure Oscilloscope: TDS7254 CG BNX Chip EMIFILr cWithout Filter Applied Impulse Voltage: 4kV/50nS Y-AXIS: 1kV/div 4kV BNX002-01 BNX012-01 ESD Countermeasure Chip Common Mode Choke Coil cWith Filter BNX022-01 ESD Waveform Comparison 5000 Block Type EMIFILr Wave Voltage (V) 4000 3000 Initial 2000 1000 with BNX022-01 0 -1000 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 Time (nsec) !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 189 Chip Ferrite Bead EMI Suppression Effect BNX Series Suppression of Ripple Noise of DC Side in the Switching Power Supply Test Circuit BNX002-01 +5V Switching Power Supply CG Type of Filter EMI Suppression Effect / Description There is high frequency noise of 0.5V maximum. Chip EMIFILr Without Filter +5.0V 50s/div 0.2V/div BNX002-01 can suppress most of noise. Chip Common Mode Choke Coil When BNX002-01 is used +5.0V 50s/div 0.2V/div Example of Impulse Noise Suppression Type of Filter EMI Suppression Effect Impulse Noise 2000V/50ns Without Filter Block Type EMIFILr Y-axis: 500V/div X-axis: 10ns/sec When BNX002 is used Y-axis: 500V/div X-axis: 10ns/sec !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 190 BNX Series Power Lines Type Block Type EMIFILr BNX02p BNX02p Series Dimensions 12.10.2 Equivalent Circuit L1 BNX02p* * Part Number Appearance (4) BNX022-01 BNX022 BNX023-01 BNX023 0.30.1 (4) 1.30.2 (4) 7.00.2 1.550.2 4.20.3 (3) (2) C2 L2 CG (4) (3) PSG (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B Packaging Code Packaging L 180mm Reel Embossed Tape 400 K 330mm Reel Embossed Tape 1500 B Bulk(Bag) 100 : Electrode 2.50.2 1.550.2 (in mm) (4) Equivalent Circuit L1 9.10.2 BNX02p* * Part Number Appearance (4) BNX024H01 BNX024 BNX025H01 BNX025 (4) 1.30.2 (4) 7.00.2 1.550.2 4.20.3 (3) (2) L3 C2 B CB (2) C1 L2 CG (4) (3) PSG (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B Packaging Code Packaging (4) Minimum Quantity L 180mm Reel Embossed Tape 400 K 330mm Reel Embossed Tape 1500 B Bulk(Bag) 100 (2) 1.00.3 0.30.1 (1) 1.60.3 1.050.2 0.30.1 (3) (2.45) (1) (1) (2) 3.50.2 (3) Minimum Quantity (4) Dimensions 12.10.2 (1) CB (2) C1 Chip EMIFILr 1.00.3 BNX024H/BNX025H L3 B (2) 0.30.1 (1) 1.60.3 (3) (2.45) (1) 1.050.2 3.10.2 (3) (1) (2) 9.10.2 (1) : Electrode 2.50.2 1.550.2 (in mm) (4) Refer to pages from p.197 to p.200 for mounting information. Rated Value (p: packaging code) Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance (min.) Insertion Loss (20 to 25 degrees C line impedance=50 ohm) BNX022-01p 50Vdc 125Vdc 10A 500M ohm 1MHz to 1GHz:35dB min. BNX023-01p 100Vdc 250Vdc 15A 500M ohm 1MHz to 1GHz:35dB min. BNX024H01p 50Vdc 125Vdc 15A 100M ohm 100kHz to 1GHz:35dB min. BNX025H01p 25Vdc 62.5Vdc 15A 50M ohm 50kHz to 1GHz:35dB min. Chip Common Mode Choke Coil BNX022/BNX023 Chip Ferrite Bead SMD package of block type EMIFILr. Operating Temperature Range: -40C to +125C (BNX022/BNX023), -55C to +125C (BNX024H/BNX025H) Insertion Loss Characteristics BNX022/023 BNX024H01 Power Lines Type Block Type EMIFILr 0 0 10 20 BNX022-01 BNX023-01 40 Insertion Loss (dB) Insertion Loss (dB) 20 60 30 40 50 60 70 80 80 90 100 0.1 1 10 Frequency (MHz) 100 1000 100 0.01 0.1 1 10 Frequency (MHz) 100 1000 Continued on the following page. !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 191 BNX Series Power Lines Type Block Type EMIFILr BNX02p Series BNX02p BNX025H01 0 10 20 30 Insertion Loss (dB) Chip Ferrite Bead Insertion Loss Characteristics 40 50 60 70 80 90 Chip EMIFILr 100 0.01 0.1 1 10 Frequency (MHz) 100 1000 Notice (Rating) In operating temperatures exceeding +85C, derating of current is necessary for BNX022 series. Please apply the derating curve shown in chart according to the operating temperature. In operating temperatures exceeding +85C, derating of current is necessary for BNX023 series. Please apply the derating curve shown in chart according to the operating temperature. Derating Derating Chip Common Mode Choke Coil Derated Current (A) Derated Current (A) 15 10 1 0 -40 85 125 Operating Temperature (C) 1 0 -40 85 125 Operating Temperature (C) In operating temperatures exceeding +85C, derating of current is necessary for BNX024H/025H series. Please apply the derating curve shown in chart according to the operating temperature. Derating Derated Current (A) Block Type EMIFILr Power Lines Type 15 1 0 -40 85 125 Operating Temperature (C) !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 192 BNX Series Power Lines Type Block Type EMIFILr BNX00p BNX00p Series Dimensions Equivalent Circuit 12.00.5 11.00.5 L1 0.8 0.1 2.50.2 2.50.2 CB CG CG PSG (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B o0.8 0.6 0.1 o0.8 PSG: Power supply ground CG: Load circuit ground CB: Load circuit + Bias B Packaging Code Packaging Minimum Quantity - Box 100 (in mm) Dimensions BNX005 Equivalent Circuit 12.00.5 11.00.5 L1 13.5 max. 18.5 max. 0.8 0.1 5.00.5 3.51.0 (1) o1.0 C2 CG (4) (3) PSG o1.0 CB (2) C1 (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B o1.0 0.6 0.1 2.50.2 2.50.2 CB CG CG PSG L3 B L2 2.50.2 7.50.2 CB (2) CG (4) (3) PSG 2.50.2 7.50.2 C2 C1 Chip EMIFILr o0.8 L3 B L2 18 max. 5.00.5 3.51.0 13 max. (1) PSG: Power supply ground CG: Load circuit ground CB: Load circuit + Bias B Packaging Code Packaging Minimum Quantity - Box 100 (in mm) Refer to pages from p.197 to p.200 for mounting information. Rated Value Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance (min.) Insertion Loss (20 to 25 degrees C line impedance=50 ohm) BNX002-01 50Vdc 125Vdc 10A 100M ohm 1MHz to 1GHz:40dB min. BNX003-01 150Vdc 375Vdc 10A 100M ohm 5MHz to 1GHz:40dB min. BNX005-01 50Vdc 125Vdc 15A 100M ohm 1MHz to 1GHz:40dB min. Operating Temperature Range: -30C to +85C Chip Common Mode Choke Coil BNX002/BNX003 Chip Ferrite Bead Large insertion loss from several hundred kHz to several GHz. Insertion Loss Characteristics (50 - 50) 0 BNX003-01 Power Lines Type Block Type EMIFILr Insertion Loss (dB) 20 BNX002-01 (BNX005-01) 40 60 80 100 0.001 0.01 0.1 1 Frequency (MHz) 10 100 1000 !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 193 BNX Series Power Lines Type Block Type EMIFILr BNX01p BNX01p Series Chip Ferrite Bead Low profile version of BNX series. Dimensions Equivalent Circuit 11.00.2 0.8 0.1 0.8 0.1 7.50.2 L1 (1) 12.00.5 3.20.5 BNX*** 4.00.5 8.00.5 12.00.2 L3 C2 B L2 CG (4) (3) PSG o0.8 0.1 0.6 0.1 o0.8 0.1 2.50.2 CB (2) C1 (1)-(4): Terminal Number PSG: Power Supply Ground CG: Circuit Ground CB: Circuit+B 2.50.2 *** : 012/016 PSG: Power supply ground CG: Load circuit ground CB: Load circuit + Bias CB CG CG Chip EMIFILr PSG B Packaging Code Packaging Minimum Quantity - Box 150 (in mm) Refer to pages from p.197 to p.200 for mounting information. Rated Value Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance (min.) Insertion Loss (20 to 25 degrees C line impedance=50 ohm) BNX012-01 50Vdc 125Vdc 15A 500M ohm 1MHz to 1GHz:40dB min. BNX016-01 25Vdc 62.5Vdc 15A 50M ohm 100kHz to 1GHz:40dB min. Operating Temperature Range: -40C to +125C Insertion Loss Characteristics Notice (Rating) (50 - 50) 0 BNX012-01 60 Derating BNX016-01 80 100 0.001 0.01 0.1 1 Frequency (MHz) 10 100 1000 Derated Current [A] Insertion Loss (dB) 40 15 10 5 1 0 -40 85 102.5 120 125 Operating Temperature [C] " Connecting power line In case of using power line, please connect to each terminal as shown. Block Type EMIFILr Power Lines Type Chip Common Mode Choke Coil 20 In operating temperatures exceeding +85C, derating of current is necessary for BNX01p series. Please apply the derating curve shown in chart according to the operating temperature. Power Supply (BNX Input) Power Supply +Bias Power Supply Ground Power Supply -Bias Power Supply Ground BNX Circuit (BNX Output) B PSG CB CG Load Circuit +Bias B PSG CB CG Load Circuit -Bias Load Circuit Ground Load Circuit Ground !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 194 Block Type EMIFILr SMD Type !Caution/Notice Chip Ferrite Bead !Caution Rating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Storage and Operating Conditions Handling <Operating Environment> Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. Do not use products in the environment close to the organic solvent. <Storage and Handling Requirements> 1. Storage Period BNX series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -10 to +40C Relative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 1. Resin Coating Using resin for coating/molding products may affect the products performance. So please pay careful attention in selecting resin. Prior to use, please make the reliability evaluation with the product mounted in your application set. 2. Handling of a Substrate (for BNX02p) After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the Product. Bending Chip EMIFILr Notice Twisting Notice (Soldering and Mounting) !Caution/ Notice Block Type EMIFILr Chip Common Mode Choke Coil 1. Cleaning Do not clean BNX series (SMD Type). Before cleaning, please contact Murata engineering. 2. Soldering Reliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters EMIFILr may vary, depending on the circuits and ICs used, type of noise, mounting pattern, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercialpurpose equipment design. !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 195 Block Type EMIFILr Lead Type !Caution/Notice Chip Ferrite Bead !Caution Rating Do not use products beyond the rated current and rated voltage as this may create excessive heat and deteriorate the insulation resistance. Notice Storage and Operating Conditions Chip EMIFILr <Operating Environment> 1. Do not use products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 2. Do not use products near water, oil or organic solvents. <Storage and Handling Requirements> 1. Storage Period BNX Series should be used within 12 months. Solderability should be checked if this period is exceeded. 2. Storage Conditions (1) Storage temperature: -10 to +40C Relative humidity: 15 to 85% Avoid sudden changes in temperature and humidity. (2) Do not store products in a chemical atmosphere such as chlorine gas, acid or sulfide gas. 1. Cleaning Failure and degradation of a product are caused by the cleaning method. When you clean in conditions that are not in mounting information, please contact Murata engineering. 2. Soldering Reliability decreases with improper soldering methods. Please solder by the standard soldering conditions shown in mounting information. 3. Other Noise suppression levels resulting from Murata's EMI suppression filters "EMIFIL" may vary, depending on the circuits and ICs used, type of noise, mounting pattern, lead wire length, mounting location, and other operating conditions. Be sure to check and confirm in advance the noise suppression effect of each filter, in actual circuits, etc. before applying the filter in a commercial-purpose equipment design. !Caution/ Notice Block Type EMIFILr Chip Common Mode Choke Coil Notice (Soldering and Mounting) !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 196 BNX SMD Type Block Type EMIFILr Soldering and Mounting 1. Standard Land Pattern Dimensions Land Pattern Solder Resist CG 2.8 2.3 B CB PSG CG 10.3 5.8 3.8 0 17.5 CG 0 (in mm) (1) A double-sided print board (or multilayer board) as shown in the left figure is designed, and please apply a soldering Cu electrode with a product electrode to a "Land Pattern", apply resist to a "Land Pattern + Solder Resist" at Cu electrode. (2) This product has large rated current of 10A/15A. Please consider real current and make Cu electrode thick enough. (Please design line resistance suitable for real current) (3) Please drop CG on a ground electrode on the back layer (the same also in a multilayer case) by the through hole. And a surface grand electrode layer may also take a large area as much as possible. (4) It is recommended to use a double-sided printed circuit board with BNX mounting on one side and the ground pattern on the other in order to maximize filtering performance, multiple feed through holes are required to maximize the BNX's connection to ground. (5) The ground pattern should be designed to be as large as possible to achieve maximum filtering performance. Chip EMIFILr 12.5 10.2 9.9 9.6 7.1 6.2 5.3 13.2 13.7 BNX022 BNX023 BNX024 BNX025 Chip Ferrite Bead Land Pattern + Solder Resist o PCB Warping (for BNX02p) Products should be located in the sideways direction (Length: a<b) to the mechanical stress. PCB should be designed so that products are not subjected to the mechanical stress caused by warping the board. a b Good example Chip Common Mode Choke Coil Poor example 2. Solder Paste Printing and Adhesive Application damage by mechanical and thermal stress from the PCB and may crack. Standard land dimensions should be used for resist and copper foil patterns. When reflow soldering the block type EMIFILr, the printing must be conducted in accordance with the following cream solder printing conditions. If too much solder is applied, the chip will be prone to Series Adhesive Application 12.5 CG 10.2 9.6 CB PSG CG CG Soldering and Mounting 5.8 3.8 0 0 17.5 2.8 2.3 B 13.7 7.1 5.3 Block Type EMIFILr oGuideline of solder paste thickness: 150-200m 10.3 BNX022 BNX023 BNX024 BNX025 Solder Paste Printing !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 197 BNX Block Type EMIFILr SMD Type Soldering and Mounting Chip Ferrite Bead 3. Standard Soldering Conditions (1) Soldering Methods Use reflow soldering methods only. Use standard soldering conditions when soldering block type EMIFILr SMD type. In cases where several different parts are soldered, each having different soldering conditions, use those conditions requiring the least heat and minimum time. Flux: o Use Rosin-based flux. In case of using RA type solder, products should be cleaned completely with no residual flux. o Do not use strong acidic flux (with chlorine content exceeding 0.20wt%) o Do not use water-soluble flux. Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based solder will deteriorate performance of products. For additional mounting methods, please contact Murata. (2) Soldering Profile Chip EMIFILr oReflow Soldering Profile (Sn-3.0Ag-0.5Cu solder) Temperature (C) T4 T2 T1 T3 180 150 Limit Profile Pre-heating t1 Standard Profile t2 90s30s Time (s) Standard Profile Series Temp. (T1) Chip Common Mode Choke Coil BNX022/023/024/025 Limit Profile Peak Cycle Temperature of Reflow (T2) Time. (t1) Heating 220C min. 30 to 60s 2503C (3) Reworking with Solder Iron The following conditions must be strictly followed when using a soldering iron. Pre-heating: 150C 60s min. Soldering iron power output: 100W max. Temperature of soldering iron tip / Soldering time / Times: 450C max. / 5s max. / 1 time 2 times max. Temp. (T3) Peak Cycle Temperature of Reflow (T4) Time. (t2) 230C min. 60s max. Heating 260C/10s 2 times max. Do not allow the tip of the soldering iron to directly contact the chip. For additional methods of reworking with a soldering iron, please contact Murata engineering. 4. Cleaning Soldering and Mounting Block Type EMIFILr Do not clean BNX022/023/024/025 series. In case of cleaning, please contact Murata engineering. !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 198 BNX Block Type EMIFILr Lead Type Soldering and Mounting 1. Mounting Hole BNX00p/01p Component Side Chip Ferrite Bead Mounting holes should be designed as specified below. Terminal Layout (Bottom figure) (PSG) (B) (CG) (CG) (CG) 2.50.1 2.50.1 2.50.1 o1.2 CB CG CG (CB) 5.00.1 7.50.1 PSG B PSG: Power supply ground CG: Load circuit ground CB: Load circuit + Bias Use a bilateral P.C. board. Insert the BNX into the P.C.board until the root of the terminal is secured, then solder. (1) Component Side View PSG (2) Bottom View B B PSG B PSG Shield plate CG B CG CG CG CB CG CB CG Chip Common Mode Choke Coil PSG Copper foil pattern Recommended Land Pattern 3.2 3.2 Through holes o1.2 B Block Type EMIFILr PSG 2.5 CG CG CG CB 3.2 (in mm) Soldering and Mounting (2) Self-heating Though this product has a large rated current, localized selfheating may be caused depending on soldering conditions. To avoid this, attention should be paid to the following: (a) Use P.C. board with our recommendation on hole diameter / land pattern dimensions, mentioned in the right hand drawing, especially for 4 terminals which pass current. (b) Solder the terminals to the P.C. board with soldercover area at least 90%. Otherwise, excess selfheating at connection between terminals and P.C. board may lead to smoke and / or fire of the product even when operating at rated current. (c) After installing this product in your product, please make sure the self-heating is within the rated current recommended. P. C. Board Patterns 2.5 (1) How to use effectively This product effectively prevents undesired radiation and external noise from going out / entering the circuit by grounding the high frequency components which cause noise problems. Therefore, grounding conditions may affect the performance of the filter and attention should be paid to the following for effective use. (a) Design maximized grounding area in the P.C. board, and grounding pattern for all the grounding terminals of the product to be connected. (Please follow the specified recommendations.) (b) Minimize the distance between ground of the P.C. board and the ground plate of the product. (Recommend unsing the through hole connection between grounding area both of component side and bottom side.) (c) Insert the terminals into the holes on P.C. board completely. (d) Don't connect PSG terminal with CG terminal directly. (See the item 1. Terminal Layout) Chip EMIFILr 2. Using the Block Type EMIFILr (Lead Type) Effectively 2.5 5.0 Copper foil pattern 7.5 !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 199 BNX Block Type EMIFILr Lead Type Soldering and Mounting Chip Ferrite Bead 3. Soldering (1) Use Sn-3.0Ag-0.5Cu solder. (2) Use Rosin-based flux. Do not use strong acidic flux with halide content exceeding 0.2wt% (chlorine conversion value). (3) Products and the leads should not be subjected to any mechanical stress during the soldering process, or while subjected to the equivalent high temperatures. (4) Standard flow soldering profile Pre-heating Chip EMIFILr Temperature (C) 300 Soldering Gradual cooling (in air) Soldering temperature 250 200 150 150C 100 50 60s min. Solder Sn-3.0Ag-0.5Cu solder Soldering Time Soldering Temperature Soldering Time 250 to 260C 4 to 6s Clean the block Type EMIFILr(Lead Type) in the following conditions. (1) Cleaning temperature should be limited to 60C max. (40C max for alcohol type cleaner). (2) Ultrasonic cleaning should comply with the following conditions, avoiding the resonance phenomenon at the mounted products and P.C.B. Power: 20W/liter max. Frequency: 28 to 40kHz Time: 5 min. max. (3) Cleaner (a) Alcohol type cleaner Isopropyl alcohol (IPA) (b) Aqueous agent Pine Alpha ST-100S (4) There should be no residual flux or residual cleaner left after cleaning. In the case of using aqueous agent, products should be dried completely after rinsing with de-ionized water in order to remove the cleaner. (5) The surface of products may become dirty after cleaning, but there is no deterioration on mechanical, electrical characteristics and reliability. (6) Other cleaning: Please contact us. Soldering and Mounting Block Type EMIFILr Chip Common Mode Choke Coil 4. Cleaning !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 200 BNX Block Type EMIFILr SMD Type Packaging 4.0x10pitch=40.00.2 o1.5 +0.1 -0 c: 3.30.1 a: 12.40.1 11.50.1 12.00.1 c: Depth of Cavity 24.00.2 2.00.1 1.750.1 4.00.1 Chip Ferrite Bead Minimum Quantity and Dimensions of 24mm Width Embossed Tape 3.30.1 3 max. o1.5 +0.5 -0 0.30.1 BNX022/023 Cavity Size Minimum Qty. (pcs.) o180mm Reel o330mm Reel a b c 12.4 9.4 3.3 400 4.0x10pitch=40.00.2 +0.1 -0 3.60.1 o1.5 100 c: 3.60.1 a: 12.40.1 11.50.1 12.00.1 Bulk 24.00.2 o1.5 1.750.1 4.00.1 2.00.1 1500 +0.5 -0 Chip Common Mode Choke Coil Part Number Dimension of the cavity is measured at the bottom side. Chip EMIFILr b: 9.40.1 0.30.1 b: 9.40.1 Dimension of the cavity is measured at the bottom side. Part Number BNX024/025 Cavity Size Minimum Qty. (pcs.) a b c 12.4 9.4 3.6 o180mm reel o330mm reel 400 1500 Bulk 100 Packaging Block Type EMIFILr (in mm) "Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity". !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 201 Block Type EMIFILr Design Kits Chip Ferrite Bead BNX Chip EMIFILr oEKEPBNX0A No. Part Number Quantity (pcs.) Insertion Loss Rated Voltage (Vdc) Rated Current (A) 1 2 3 4 5 6 7 8 BNX002-01 BNX012-01 BNX016-01 BNX012H01 BNX022-01 BNX023-01 BNX024H01 BNX025H01 1 1 1 1 3 3 3 3 1MHz to 1GHz : 40dB min. 1MHz to 1GHz : 40dB min. 100kHz to 1GHz : 40dB min. 1MHz to 1GHz : 40dB min. 1MHz to 1GHz : 35dB min. 1MHz to 1GHz : 35dB min. 100kHz to 1GHz : 35dB min. 50kHz to 1GHz : 35dB min. 50 50 25 50 50 100 50 25 10 15 15 15 10 15 15 15 No. Part Number Quantity (pcs.) Insertion Loss Rated Voltage (Vdc) Rated Current (A) 1 2 3 4 5 6 7 8 9 10 11 BNX002-01 BNX003-01 BNX005-01 BNX012-01 BNX016-01 BNX012H01 BNP002-02 BNX022-01 BNX023-01 BNX024H01 BNX025H01 1 1 1 1 1 1 1 3 3 3 3 1MHz to 1GHz : 40dB min. 5MHz to 1GHz : 40dB min. 1MHz to 1GHz : 40dB min. 1MHz to 1GHz : 40dB min. 100kHz to 1GHz : 40dB min. 1MHz to 1GHz : 40dB min. 20MHz to 500MHz : 40dB min. 1MHz to 1GHz : 35dB min. 1MHz to 1GHz : 35dB min. 100kHz to 1GHz : 35dB min. 50kHz to 1GHz : 35dB min. 50 150 50 50 25 50 50 50 100 50 25 10 10 15 15 15 15 10 10 15 15 15 Design Kits Block Type EMIFILr Chip Common Mode Choke Coil oEKEPBLCKA !Note * Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc. * This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf Mar.28,2011 202