!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
BNX
188
188
191
195
197
201
202
Series Line Up
Function Example
Product Detail
!Caution/Notice
Soldering and Mounting
Packaging
Design Kits
Block Type EMIFILr
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
188
70
60
50
40
30
20
10 0 200 400 600 800 1000
Frequency (MHz)
Level (dBuV/m)
70
60
50
40
30
20
10 0 200 400 600 800 1000
Frequency (MHz)
Level (dBuV/m)
Digital Block
AC100V
12Vdc
12V
100µF
Power
Circuit
(SW)
OUT
5V
Power Block
Clock Drive
(30MHz)
IN
BNX012
Noise Suppression of Radiation Noise from Power Line Cab le
Antenna Test Board
AC
Adaptor
Cable
DC-DC Converter
cTest Result
Without Filter With BNX012-01
Part NumberType Rated Voltage Effective Frequency Range Rated Current
SMD Type
for Power Lines
Lead Type
for Power Lines
Lead Type
Low Profile for Power Lines
p191
p193
p194
BNX022-01 50Vdc
Thickness
(mm)
3.1
3.1
18.0
18.0
18.5
8.0
8.0
10A1MHz to 1GHz:35dB min.
BNX023-01 3.5BNX024H01 3.5BNX025H01
100Vdc
50Vdc
25Vdc
15A
15A
15A
1MHz to 1GHz:35dB min.
100kHz to 1GHz:35dB min.
50kHz to 1GHz:35dB min.
BNX002-01 50Vdc 10A1MHz to 1GHz:40dB min.
BNX003-01 150Vdc 10A5MHz to 1GHz:40dB min.
BNX005-01 50Vdc 15A1MHz to 1GHz:40dB min.
BNX012-01 50Vdc 15A1MHz to 1GHz:40dB min.
BNX016-01 25Vdc 15A100kHz to 1GHz:40dB min.
Block T ype EMIFILrSeries Line Up / Function Example
BNX
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
189
BNX
5000
4000
3000
2000
1000
-1000
-10 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
0
+B CB
PSG CG
60dB
(40dB+20dB)
ATT
BNX002-01 BNX012-01 BNX022-01
4kV
ESD Countermeasure
cWithout Filter
Applied Impulse Voltage: 4kV/50nS
Y-AXIS: 1kV/div
cWith Filter
ESD W av ef orm Comparison
Time (nsec)
Wa ve Voltage (V)
Impulse Noise
Generator:
INS-4420
(4kV, 50nsec)
Oscilloscope:
TDS7254
Initial
with BNX022-01
Impulse Noise Countermeasure
BNX Function Example
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
190
BNX Series
EMI
Suppression
Effect
Example of Impulse Noise Suppression
Type of Filter EMI Suppression Effect
Suppression of Ripple Noise of DC Side in the Switching Power Supply
Type of Filter EMI Suppression Effect / Description
Impulse Noise
2000V/50ns
Y-axis: 500V/div
X-axis: 10ns/sec
Y-axis: 500V/div
X-axis: 10ns/sec
Without Filter
When BNX002
is used
Without Filter
When BNX002-01
is used
There is high frequency noise
of 0.5V maximum.
BNX002-01 can suppress most of noise.
+5.0V
50µs/div
0.2V/div
+5.0V
50µs/div
0.2V/div
+5V
CG
BNX002-01
Test Circuit
Switching Power Supply
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Power Lines Type
191
SMD package of block type EMIFILr.
BNX02pSeries
BNX Series Power Lines Type Block Type EMIFILr
Dimensions Equivalent Circuit
Packaging
Dimensions Equivalent Circuit
Packaging
Insertion Loss Characteristics
Rated Value (p: packaging code) Refer to pages from p.197 to p.200 for mounting information.
BNX02p
BNX022/023 BNX024H01
BNX022/BNX023
BNX024H/BNX025H
Continued on the following page.
Code Packaging
Minimum
Quantity
L
180mm Reel Embossed Tape
400
K
330mm Reel Embossed Tape
1500
BBulk(Bag) 100
Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance
(min.) Insertion Loss
(20 to 25 degrees C line impedance=50 ohm)
BNX022-01p50Vdc 125Vdc 10A 500M ohm 1MHz to 1GHz:35dB min.
BNX023-01p100Vdc 250Vdc 15A 500M ohm 1MHz to 1GHz:35dB min.
Operating Temperature Range: -40°C to +125°C (BNX022/BNX023), -55°C to +125°C (BNX024H/BNX025H)
Code Packaging Minimum
Quantity
L
180mm Reel Embossed Tape
400
K
330mm Reel Embossed Tape
1500
BBulk(Bag) 100
BNX024H01p50Vdc 125Vdc 15A 100M ohm 100kHz to 1GHz:35dB min.
BNX025H01p25Vdc 62.5Vdc 15A 50M ohm 50kHz to 1GHz:35dB min.
BNX02p*
12.1±0.2
Part Number
*
BNX022-01
BNX023-01
Appearance
BNX022
BNX023
9.1±0.2
1.6±0.3
4.2±0.3 (2.45)
1.3±0.2
0.3±0.1
0.3±0.1
7.0±0.2
2.5±0.2
1.55±0.2
1.55±0.2
1.0±0.3
3.1±0.2
1.05±0.2
(1) (2)
(3) (4)
(1)
(3) (4)
(2)
(4)
(4)
(1) (3) (4) (2)
: Electrode
(in mm)
Frequency (MHz)
Insertion Loss (dB)
1 10 100
0
20
40
60
80
1000.1 1000
BNX022-01
BNX023-01
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 100010010
Frequency (MHz)
Insertion Loss (dB)
L2
C2
L1 L3
C1
B
PSG
CB
CG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
(1) (2)
(3) (4)
BNX02p*
12.1±0.2
Part Number
*
BNX024H01
BNX025H01
Appearance
BNX024
BNX025
9.1±0.2
1.6±0.3
4.2±0.3 (2.45)
1.3±0.2
0.3±0.1
0.3±0.1
7.0±0.2
2.5±0.2
1.55±0.2
1.55±0.2
1.0±0.3
3.5±0.2
1.05±0.2
(1) (2)
(3) (4)
(1)
(3) (4)
(2)
(4)
(4)
(1) (3) (4) (2)
: Electrode
(in mm)
L2
C2
L1 L3
C1
B
PSG
CB
CG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
(1) (2)
(3) (4)
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Power Lines Type
192
Insertion Loss Characteristics
Notice (Rating)
BNX025H01
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 100010010
Frequency (MHz)
Insertion Loss (dB)
In operating temperatures exceeding
+85°C, derating of current is necessary for
BNX022 series. Please apply the derating
curve shown in chart according to the
operating temperature.
10
0
1
85-40 125
Operating Temperature (°C)
Derated Current (A)
Derating
In operating temperatures exceeding
+85°C, derating of current is necessary for
BNX024H/025H series. Please apply the
derating curve shown in chart according to
the operating temperature.
15
0
1
85-40 125
Operating Temperature (°C)
Derated Current (A)
Derating
In operating temperatures exceeding
+85°C, derating of current is necessary for
BNX023 series. Please apply the derating
curve shown in chart according to the
operating temperature.
15
0
1
85-40 125
Operating Temperature (°C)
Derated Current (A)
Derating
BNX Series Power Lines Type Block Type EMIFILr
BNX02p Series BNX02p
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Power Lines Type
193
Large insertion loss from several hundred kHz to several GHz.
BNX00pSeries
BNX Series Power Lines Type Block Type EMIFILr
Dimensions Equivalent Circuit
Packaging
Dimensions Equivalent Circuit
Packaging
Insertion Loss Characteristics
Rated Value
BNX002/BNX003
BNX005
Refer to pages from p.197 to p.200 for mounting information.
BNX00p
Code Packaging Minimum Quantity
-Box 100
Code Packaging Minimum Quantity
-Box 100
Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance
(min.) Insertion Loss
(20 to 25 degrees C line impedance=50 ohm)
BNX002-01 50Vdc 125Vdc 10A 100M ohm 1MHz to 1GHz:40dB min.
BNX003-01 150Vdc 375Vdc 10A 100M ohm 5MHz to 1GHz:40dB min.
BNX005-01 50Vdc 125Vdc 15A 100M ohm 1MHz to 1GHz:40dB min.
Operating Temperature Range: -30°C to +85°C
ø0.8
3.5±1.0
7.5±0.2 2.5±0.2
12.0±0.5
13 max.
5.0±0.5 18 max.
0.8
±0.1
11.0±0.5
ø0.8 ø0.8
0.6
±0.1
2.5±0.2 2.5±0.2
(in mm)
PSG: Power supply ground
CG: Load circuit ground
CB: Load circuit + Bias
CG
CB
CG
B
PSG
(in mm)
ø1.0
3.5±1.0
7.5±0.2 2.5±0.2
12.0±0.5
13.5 max.
5.0±0.5
18.5 max.
0.8
±0.1
11.0±0.5
ø1.0 ø1.0
0.6
±0.1
2.5±0.2 2.5±0.2
PSG: Power supply ground
CG: Load circuit ground
CB: Load circuit + Bias
CG
CB
CG
B
PSG
Frequency (MHz)
Insertion Loss (dB)
(50 - 50)
0
0.001 0.01 0.1 1 10 100 1000
BNX002-01
(BNX005-01)
BNX003-01
100
80
60
40
20
L2
C2
L1 L3
C1
B
PSG
CB
CG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
(1) (2)
(3) (4)
L2
C2
L1 L3
C1
B
PSG
CB
CG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
(1) (2)
(3) (4)
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Power Lines Type
194
Low profile version of BNX series.
BNX01pSeries
BNX Series Power Lines Type Block Type EMIFILr
Dimensions Equivalent Circuit
Packaging
Insertion Loss Characteristics
Rated Value
Notice (Rating)
Refer to pages from p.197 to p.200 for mounting information.
BNX01p
Code Packaging Minimum Quantity
-Box 150
Part Number Rated Voltage Withstand Voltage Rated Current Insulation Resistance
(min.) Insertion Loss
(20 to 25 degrees C line impedance=50 ohm)
BNX012-01 50Vdc 125Vdc 15A 500M ohm 1MHz to 1GHz:40dB min.
BNX016-01 25Vdc 62.5Vdc 15A 50M ohm 100kHz to 1GHz:40dB min.
Operating Temperature Range: -40°C to +125°C
12.0±0.2
8.0±0.5
4.0±0.5
2.5±0.2
0.6
±0.1
ø0.8
±0.1 ø0.8
±0.1
0.8
±0.1
0.8
±0.1
2.5±0.2
7.5±0.2
11.0±0.2
12.0±0.5
3.2±0.5
BNX***
*** : 012/016
(in mm)
PSG: Power supply ground
CG: Load circuit ground
CB: Load circuit + Bias
CG
CB
CG
B
PSG
Frequency (MHz)
Insertion Loss (dB)
(50 - 50)
80
100
60
40
20
0
0.001 0.01 0.1 1 10 100 1000
BNX012-01
BNX016-01
In operating temperatures exceeding
+85°C, derating of current is necessary for
BNX01p series. Please apply the derating
curve shown in chart according to the
operating temperature.
15
10
5
0
1
85-40 125102.5 120
Operating Temperature [°C]
Derated Current [A]
Derating
" Connecting ± power line
In case of using ± power line, please
connect to each terminal as shown.
Power Supply
(BNX Input) CircuitBNX
PSG
BCG
CB
PSG
BCG
CB
Power Supply Ground
Power Supply +Bias
Power Supply Ground
Power Supply -Bias
(BNX Output)
Load Circuit Ground
Load Circuit +Bias
Load Circuit Ground
Load Circuit -Bias
L2
C2
L1 L3
C1
B
PSG
CB
CG
(1)-(4): Terminal Number
PSG: Power Supply Ground
CG: Circuit Ground
CB: Circuit+B
(1) (2)
(3) (4)
!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
!Caution/
Notice
195
Block Type EMIFILr SMD Type !Caution/Notice
Notice (Soldering and Mounting)
<Operating Environment>
Do not use products in a chemical atmosphere such as
chlorine gas, acid or sulfide gas.
Do not use products in the environment close to the
organic solvent.
<Storage and Handling Requirements>
1. Storage Period
BNX series should be used within 12 months.
Solderability should be checked if this period is
exceeded.
2. Storage Conditions
(1) Storage temperature: -10 to +40˚C
Relative humidity: 15 to 85%
Avoid sudden changes in temperature and humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
1. Cleaning
Do not clean BNX series (SMD Type).
Before cleaning, please contact Murata engineering.
2. Soldering
Reliability decreases with improper soldering methods.
Please solder by the standard soldering conditions
shown in mounting information.
3. Other
Noise suppression levels resulting from Murata's EMI
suppression filters EMIFILr may vary, depending on
the circuits and ICs used, type of noise, mounting
pattern, mounting location, and other operating
conditions. Be sure to check and confirm in advance
the noise suppression effect of each filter, in actual
circuits, etc. before applying the filter in a commercial-
purpose equipment design.
Rating
!Caution
Handling
1. Resin Coating
Using resin for coating/molding products may affect
the products performance.
So please pay careful attention in selecting resin.
Prior to use, please make the reliability evaluation with
the product mounted in your application set.
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
Storage and Operating Conditions
Notice
2. Handling of a Substrate (for BNX02p)
After mounting products on a substrate, do not apply
any stress to the product caused by bending or
twisting to the substrate when cropping the substrate,
inserting and removing a connector from the substrate
or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in
the Product.
Bending Twisting
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr!Caution/
Notice
196
Block Type EMIFILr Lead Type
Do not use products beyond the rated current and rated
voltage as this may create excessive heat and
deteriorate the insulation resistance.
!Caution/Notice
Notice (Soldering and Mounting)
<Operating Environment>
1. Do not use products in a chemical atmosphere such
as chlorine gas, acid or sulfide gas.
2. Do not use products near water, oil or organic
solvents.
<Storage and Handling Requirements>
1. Storage Period
BNX Series should be used within 12 months.
Solderability should be checked if this period is
exceeded.
2. Storage Conditions
(1) Storage temperature: -10 to +40˚C
Relative humidity: 15 to 85%
Avoid sudden changes in temperature and humidity.
(2) Do not store products in a chemical atmosphere
such as chlorine gas, acid or sulfide gas.
1. Cleaning
Failure and degradation of a product are caused
by the cleaning method. When you clean in conditions
that are not in mounting information, please contact
Murata engineering.
2. Soldering
Reliability decreases with improper soldering
methods. Please solder by the standard soldering
conditions shown in mounting information.
3. Other
Noise suppression levels resulting from Murata's
EMI suppression filters "EMIFIL" may vary,
depending on the circuits and ICs used, type of
noise, mounting pattern, lead wire length, mounting
location, and other operating conditions. Be sure
to check and confirm in advance the noise
suppression effect of each filter, in actual
circuits, etc. before applying the filter in a
commercial-purpose equipment design.
Rating
!Caution
Storage and Operating Conditions
Notice
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering
and Mounting
197
BNX
1. Standard Land Pattern Dimensions
Soldering and Mounting
Block Type EMIFILr SMD Type
When reflow soldering the block type EMIFILr, the
printing must be conducted in accordance with the
following cream solder printing conditions.
If too much solder is applied, the chip will be prone to
damage by mechanical and thermal stress from the PCB
and may crack.
Standard land dimensions should be used for resist and
copper foil patterns.
BNX022
BNX023
BNX024
BNX025
(1) A double-sided print board (or multilayer board) as shown in
the left figure is designed, and please apply a soldering Cu
electrode with a product electrode to a "Land Pattern", apply
resist to a "Land Pattern + Solder Resist" at Cu electrode.
(2) This product has large rated current of 10A/15A. Please
consider real current and make Cu electrode thick enough.
(Please design line resistance suitable for real current)
(3) Please drop CG on a ground electrode on the back layer
(the same also in a multilayer case) by the through hole. And
a surface grand electrode layer may also take a large area
as much as possible.
(4) It is recommended to use a double-sided printed circuit
board with BNX mounting on one side and the ground
pattern on the other in order to maximize filtering
performance, multiple feed through holes are required to
maximize the BNX's connection to ground.
(5) The ground pattern should be designed to be as large as
possible to achieve maximum filtering performance.
B
PSG
CG
CG
CB
CG
12.5
10.2
9.9
9.6
7.1
6.2
5.3
2.8
2.3
0
0
3.8
5.8
10.3
13.7
17.5
13.2
2. Solder Paste Printing and Adhesive Application
BNX022
BNX023
BNX024
BNX025
oGuideline of solder paste thickness:
150-200µm
Series Solder Paste Printing Adhesive Application
B
PSG
CG
CG
CG
12.5
10.2
9.6
7.1
5.3
2.8
2.3
0
0
3.8
5.8
10.3
13.7
17.5
CB
Land Pattern
Land Pattern
+ Solder Resist
Solder Resist (in mm)
o PCB Warping (for BNX02p)
PCB should be designed so that products are not
subjected to the mechanical stress caused by warping
the board.
Poor example
Products should be located in the sideways direction
(Length: a<b) to the mechanical stress.
Good example
a
b
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering
and Mounting
198
4. Cleaning
Soldering and MountingBNX Block Type EMIFILr SMD Type
oReflow Soldering Profile
(Sn-3.0Ag-0.5Cu solder)
Series
Standard Profile Limit Profile
Temp. (T1) Time. (t1)
Heating Cycle
of Reflow
Peak
Temperature
(T2) Temp. (T3) Time. (t2)
Heating Cycle
of Reflow
Peak
Temperature
(T4)
BNX022/023/024/025 220°C min. 30 to 60s 250±3°C2 times
max. 230°C min. 260°C/10s 2 times
max.
60s max.
150
180
T2 T4
T3
T1
Temperature (°C)
90s±30s Time (s)
t2
t1 Limit Profile
Standard Profile
Pre-heating
(2) Soldering Profile
Do not clean BNX022/023/024/025 series. In case of cleaning, please contact Murata engineering.
(3) Reworking with Solder Iron
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150°C 60s min.
Soldering iron power output: 100W max.
Temperature of soldering iron tip / Soldering time / Times:
450°C max. / 5s max. / 1 time
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
3. Standard Soldering Conditions
(1) Soldering Methods
Use reflow soldering methods only.
Use standard soldering conditions when soldering block
type EMIFILrSMD type.
In cases where several different parts are soldered, each
having different soldering conditions, use those
conditions requiring the least heat and minimum time.
Solder: Use Sn-3.0Ag-0.5Cu solder. Use of Sn-Zn based
solder will deteriorate performance of products.
Flux:
o Use Rosin-based flux.
In case of using RA type solder, products should be
cleaned completely with no residual flux.
o Do not use strong acidic flux (with chlorine content
exceeding 0.20wt%)
o Do not use water-soluble flux.
For additional mounting methods, please contact Murata.
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering
and Mounting
199
1. Mounting Hole
2. Using the Block Type EMIFILr (Lead Type) Effectively
Mounting holes should be designed as specified below.
BNX00p/01pTerminal Layout (Bottom figure)Component Side
7.5±0.1
(PSG) (B)
(CG)
(CG) (CG)
(CB)
5.0±0.1
2.5±0.1
2.5±0.12.5±0.1
ø1.2
PSG: Power supply ground
CG: Load circuit ground
CB: Load circuit + Bias
CG
CB
CG
B
PSG
This product effectively prevents undesired radiation and
external noise from going out / entering the circuit by
grounding the high frequency components which cause
noise problems. Therefore, grounding conditions may affect
the performance of the filter and attention should be paid to
the following for effective use.
(a) Design maximized grounding area in the P.C. board,
and grounding pattern for all the grounding terminals
of the product to be connected. (Please follow the
specified recommendations.)
(b) Minimize the distance between ground of the P.C.
board and the ground plate of the product.
(Recommend unsing the through hole connection
between grounding area both of component side and
bottom side.)
(c) Insert the terminals into the holes on P.C. board
completely.
(d) Don't connect PSG terminal with CG terminal directly.
(See the item 1. Terminal Layout)
(1) How to use effectively
Use a bilateral P.C. board. Insert the BNX into the P.C.board until
the root of the terminal is secured, then solder.
PSG
B
B
CG CG CG CG
CG
CG CB CB
PSG
PSG B
Copper foil pattern
PSGB
(1) Component Side View (2) Bottom View
Shield plate
P. C. Board Patterns
Though this product has a large rated current, localized
selfheating may be caused depending on soldering
conditions. To avoid this, attention should be paid to the
following:
(a) Use P.C. board with our recommendation on hole
diameter / land pattern dimensions, mentioned in the
right hand drawing, especially for 4 terminals which
pass current.
(b) Solder the terminals to the P.C. board with
soldercover area at least 90%. Otherwise, excess self-
heating at connection between terminals and P.C.
board may lead to smoke and / or fire of the product
even when operating at rated current.
(c) After installing this product in your product, please
make sure the self-heating is within the rated current
recommended.
(2) Self-heating
Copper foil pattern
(in mm)
Through holes
Recommended Land Pattern
PSG
B
CG CG
CG
CB
7.5
5.0
2.5
2.52.5
3.2
3.2 3.2
ø1.2
BNX Soldering and Mounting
Block Type EMIFILr Lead Type
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILr
Soldering
and Mounting
200
3. Soldering
4. Cleaning
Clean the block Type EMIFILr(Lead Type) in the following
conditions.
(1) Cleaning temperature should be limited to 60°C max.
(40°C max for alcohol type cleaner).
(2) Ultrasonic cleaning should comply with the following
conditions, avoiding the resonance phenomenon at the
mounted products and P.C.B.
Power: 20W/liter max.
Frequency: 28 to 40kHz
Time: 5 min. max.
(3) Cleaner
(a) Alcohol type cleaner
Isopropyl alcohol (IPA)
(b) Aqueous agent
Pine Alpha ST-100S
(4) There should be no residual flux or residual cleaner left
after cleaning.
In the case of using aqueous agent, products should be
dried completely after rinsing with de-ionized water in
order to remove the cleaner.
(5) The surface of products may become dirty after cleaning,
but there is no deterioration on mechanical, electrical
characteristics and reliability.
(6) Other cleaning: Please contact us.
(1) Use Sn-3.0Ag-0.5Cu solder.
(2) Use Rosin-based flux. Do not use strong acidic flux with
halide content exceeding 0.2wt% (chlorine conversion
value).
(3) Products and the leads should not be subjected to any
mechanical stress during the soldering process, or while
subjected to the equivalent high temperatures.
(4) Standard flow soldering profile
Solder
Soldering Temperature
Soldering Time
Sn-3.0Ag-0.5Cu solder 250 to 260˚C 4 to 6s
Pre-heating
Soldering
Gradual cooling
(in air)
150°C
300
250
200
150
100
50
Temperature (°C)
60s min. Soldering Time
Soldering temperature
Soldering and MountingBNX Block Type EMIFILr Lead Type
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrPackaging
201
BNXBlock Type EMIFILr SMD Type
(in mm)
Minimum Quantity and Dimensions of 24mm Width Embossed Tape
BNX022/023
Part Number Cavity Size Minimum Qty. (pcs.)
12.4 9.4 3.3
cba
400 1500
ø180mm Reel ø330mm Reel
100
Bulk
4.0x10pitch=40.0±0.2
12.0±0.1
b: 9.4±0.1
3° max.
4.0±0.1 2.0±0.1
3.3±0.1
11.5±0.1
a: 12.4±0.1
0.3±0.1
c: 3.3±0.1 c: Depth of Cavity
Dimension of the cavity is measured at the bottom side.
24.0±0.2
1.75±0.1
ø1.5 +0.1
-
0
ø1.5 +0.5
-
0
Packaging
"Minimum Quantity" means the number of units of each delivery or order. The quantity should be an integral multiple of the "Minimum Quantity".
BNX024/025
Part Number Cavity Size Minimum Qty. (pcs.)
12.4 9.4 3.6
cba
400 1500
ø180mm reel ø330mm reel
100
Bulk
4.0x10pitch=40.0±0.2
12.0±0.1
b: 9.4±0.1
4.0±0.1 2.0±0.1
3.6±0.1
11.5±0.1
a: 12.4±0.1
0.3±0.1
c: 3.6±0.1
24.0±0.2
1.75±0.1
ø1.5 +0.1
-
0
ø1.5 +0.5
-
0
Dimension of the cavity is measured at the bottom side.
!Note Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering. C31E.pdf
Mar.28,2011
Chip Ferrite BeadChip EMIFILr
Chip Common Mode Choke Coil
Block Type EMIFILrDesign Kits
202
Part NumberNo. Rated Current
(A)
Rated Voltage
(Vdc)
Insertion Loss
Quantity
(pcs.)
Part NumberNo. Rated Current
(A)
Rated Voltage
(Vdc)
Insertion Loss
Quantity
(pcs.)
oEKEPBNX0A
oEKEPBLCKA
BNX002-01
BNX012-01
BNX016-01
BNX012H01
BNX022-01
BNX023-01
BNX024H01
BNX025H01
1
2
3
4
5
6
7
8
1
1
1
1
3
3
3
3
1MHz to 1GHz : 40dB min.
1MHz to 1GHz : 40dB min.
100kHz to 1GHz : 40dB min.
1MHz to 1GHz : 40dB min.
1MHz to 1GHz : 35dB min.
1MHz to 1GHz : 35dB min.
100kHz to 1GHz : 35dB min.
50kHz to 1GHz : 35dB min.
BNX002-01
BNX003-01
BNX005-01
BNX012-01
BNX016-01
BNX012H01
BNP002-02
BNX022-01
BNX023-01
BNX024H01
BNX025H01
1
2
3
4
5
6
7
8
9
10
11
1
1
1
1
1
1
1
3
3
3
3
1MHz to 1GHz : 40dB min.
5MHz to 1GHz : 40dB min.
1MHz to 1GHz : 40dB min.
1MHz to 1GHz : 40dB min.
100kHz to 1GHz : 40dB min.
1MHz to 1GHz : 40dB min.
20MHz to 500MHz : 40dB min.
1MHz to 1GHz : 35dB min.
1MHz to 1GHz : 35dB min.
100kHz to 1GHz : 35dB min.
50kHz to 1GHz : 35dB min.
50
50
25
50
50
100
50
25
10
15
15
15
10
15
15
15
50
150
50
50
25
50
50
50
100
50
25
10
10
15
15
15
15
10
10
15
15
15
Block Type EMIFILr
BNX Design Kits