May 2009 Rev 18 1/57
1
M25P40
4 Mbit, low voltage, serial Flash memory
with 75 MHz SPI bus interface
Features
4 Mbit of Flash memory
2.3 V to 3.6 V single supply voltage
SPI bus compatible serial interface
75 MHz clock rate (maximum)
Page Program (up to 256 bytes) in 0.8 ms
(typical)
Sector Erase (512 Kbit) in 0.6 s (typical)
Bulk Erase (4 Mbit) in 4.5 s (typical)
Deep Power-down mode 1 μA (typical)
Hardware Write Protection: protected area
size defined by three non-volatile bits (BP0,
BP1 and BP2)
Electronic signatures
– JEDEC standard two-byte signature
(2013h)
– Unique ID code (UID) with 16 bytes read-
only, available upon customer request
– RES instruction, one-byte, signature (12h),
for backward compatibility
Packages
– RoHS compliant
Automotive grade parts available
SO8W (MW)
208 mils width
SO8 (MN)
150 mils width
QFN8L (MS)
MLP8 6 x 5 mm
VFQPN8 (MP)
(MLP8 6 x 5 mm)
www.Numonyx.com
Contents M25P40
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Contents
1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Signal description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 Serial Data output (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Serial Data input (D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Serial Clock (C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Chip Select (S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.5 Hold (HOLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.6 Write Protect (W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.7 VCC supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.8 VSS ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3 SPI modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.1 Page Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.2 Sector Erase and Bulk Erase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Polling during a Write, Program or Erase cycle . . . . . . . . . . . . . . . . . . . . 12
4.4 Active Power, Standby Power and Deep Power-down modes . . . . . . . . . 12
4.5 Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.6 Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.7 Hold condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5 Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
6 Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6.1 Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6.2 Write Disable (WRDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.3 Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6.4 Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4.1 WIP bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4.2 WEL bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6.4.3 BP2, BP1, BP0 bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
M25P40 Contents
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6.4.4 SRWD bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6.5 Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6.6 Read Data Bytes (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
6.7 Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . . . . . . . . . 27
6.8 Page Program (PP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
6.9 Sector Erase (SE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.10 Bulk Erase (BE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.11 Deep Power-down (DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.12 Release from Deep Power-down and Read Electronic Signature (RES) . 33
7 Power-up and Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8 Initial delivery state . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
9 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
10 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
11 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
12 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
List of tables M25P40
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List of tables
Table 1. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2. Protected area sizes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3. Memory organization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 4. Instruction set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 5. Read Identification (RDID) data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 6. Status Register format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 7. Protection modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Table 8. Power-up timing and VWI threshold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Table 9. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Table 10. Operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 11. Device grade and AC table correlation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 12. Data retention and endurance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 13. Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Table 14. DC characteristics (device grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 15. DC characteristics (device grade 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 16. Instruction times, process technology T9HX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 17. Instruction times, process technology T7Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 18. AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 19. AC characteristics (25 MHz operation, device grade 3, VCC min = 2.7 V) . . . . . . . . . . . . . 42
Table 20. AC characteristics (50 MHz operation, device grade 6, VCC min = 2.7 V) . . . . . . . . . . . . . 43
Table 21. AC characteristics (*40 MHz operation, device grade 6, VCC min = 2.3 V) . . . . . . . . . . . . 44
Table 22. AC characteristics, 75 MHz operation, VCC min = 2.7 V . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 23. SO8 narrow – 8 lead plastic Small Outline, 150 mils body width,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 24. SO8 wide – 8 lead plastic small outline, 208 mils body width,
package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Table 25. QFN8L (MLP8) 8-lead dual flat package no lead, 6 x 5 mm package mechanical data. . . 50
Table 26. VFQFPN8 (MLP8) 8-lead Very thin Fine pitch Quad Flat Package No lead,
6 × 5 mm, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Table 27. Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 28. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
M25P40 List of figures
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List of figures
Figure 1. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 2. SO and MLP8 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Bus Master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 4. SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. Hold condition activation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 6. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 7. Write Enable (WREN) instruction sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 8. Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 9. Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 22
Figure 10. Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 23
Figure 11. Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 12. Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 26
Figure 13. Read Data Bytes at Higher Speed (FAST_READ) instruction sequence
and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 14. Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 15. Sector Erase (SE) instruction sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 16. Bulk Erase (BE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 17. Deep Power-down (DP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 18. Release from Deep Power-down and Read Electronic Signature (RES) instruction
sequence and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 19. Release from Deep Power-down (RES) instruction sequence . . . . . . . . . . . . . . . . . . . . . . 34
Figure 20. Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 21. AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 22. Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 23. Write Protect setup and hold timing during WRSR when SRWD = 1 . . . . . . . . . . . . . . . . . 46
Figure 24. Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 25. Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 26. SO8 narrow – 8 lead plastic Small Outline, 150 mils body width, package outline. . . . . . . 48
Figure 27. SO8W – 8 lead plastic small outline, 208 mils body width, package outline. . . . . . . . . . . . 49
Figure 28. QFN8L (MLP8) 8-lead, dual flat package no lead, 6 × 5 mm, package outline . . . . . . . . . 50
Figure 29. VFQFPN8 (MLP8) 8-lead Very thin Fine pitch Quad Flat Package No lead,
6 × 5 mm, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Description M25P40
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1 Description
The M25P40 is a 4 Mbit (512 K × 8) Serial Flash memory, with advanced write protection
mechanisms, accessed by a high speed SPI-compatible bus. The M25P40 features high
performance instructions allowing clock frequency up to 75 MHz.(1)
The memory can be programmed 1 to 256 bytes at a time, using the Page Program
instruction.
The memory is organized as 8 sectors, each containing 256 pages. Each page is 256 bytes
wide. Thus, the whole memory can be viewed as consisting of 2048 pages, or 524,288
bytes.
The whole memory can be erased using the Bulk Erase instruction, or a sector at a time,
using the Sector Erase instruction.
In order to meet environmental requirements, Numonyx offers the M25P40 in RoHS
compliant packages, which are Lead-free. RoHS specifications are available at:
www.Numonyx.com.
Important: Th i s datasheet details t he fun ct i onali ty of t he M 25P 40 dev i ces, base d on the previous T7 Y
proce ss or based on the current T 9HX process (availabl e sinc e Aug ust 2008). T he new
device in T9HX is completely backward compatibl e with the old one in T7Y and it additionaly
features:
- improved max frequency (Fast Read) to 75 MHz in the standard Vcc range 2.7 V to
3.6 V, while the max frequency (Fast Read) in the extended Vcc range 2.3 V to 2.7 V is
40 MH z
- UID/CFD protection feature
Figure 1. Logic diagram
1. 75 MHz operation is available only on the VCC range 2.7 V - 3.6 V and for process technology T9HX devices,
identified by process identification digit "4" in the device marking and process letter "B" in the part number.
AI04090
S
VCC
M25P40
HOLD
VSS
W
Q
C
D
M25P40 Description
7/57
Figure 2. SO and MLP8 connections
1. There is an exposed central pad on the underside of the MLP8 packages. This is pulled, internally, to VSS,
and must not be allowed to be connected to any other voltage or signal line on the PCB.
2. See Section 11: Package mechanical for package dimensions, and how to identify pin-1.
Table 1. Signal nam es
Signal name Function Direction
C Serial Clock Input
D Serial Data input Input
Q Serial Data output Output
SChip Select Input
WWrite Protect Input
HOLD Hold Input
VCC Supply voltage
VSS Ground
1
AI04091B
2
3
4
8
7
6
5DVSS C
HOLDQ
SV
CC
W
M25P40
Signal description M25P40
8/57
2 Signal description
2.1 Serial Data output (Q)
This output signal is used to transfer data serially out of the device. Data is shifted out on the
falling edge of Serial Clock (C).
2.2 Serial Data input (D)
This input signal is used to transfer data serially into the device. It receives instructions,
addresses, and the data to be programmed. Values are latched on the rising edge of Serial
Clock (C).
2.3 Serial Clock (C)
This input signal provides the timing of the serial interface. Instructions, addresses, or data
present at Serial Data input (D) are latched on the rising edge of Serial Clock (C). Data on
Serial Data output (Q) changes after the falling edge of Serial Clock (C).
2.4 Chip Select (S)
When this input signal is High, the device is deselected and Serial Data output (Q) is at high
impedance. Unless an internal Program, Erase or Write Status Register cycle is in progress,
the device will be in the Standby Power mode (this is not the Deep Power-down mode).
Driving Chip Select (S) Low selects the device, placing it in the Active Power mode.
After Power-up, a falling edge on Chip Select (S) is required prior to the start of any
instruction.
2.5 Hold (HOLD)
The Hold (HOLD) signal is used to pause any serial communications with the device without
deselecting the device.
During the Hold condition, the Serial Data output (Q) is high impedance, and Serial Data
input (D) and Serial Clock (C) are Don’t Care.
To start the Hold condition, the device must be selected, with Chip Select (S) driven Low.
2.6 Writ e Pr otect (W)
The main purpose of this input signal is to freeze the size of the area of memory that is
protected against program or erase instructions (as specified by the values in the BP2, BP1
and BP0 bits of the Status Register).
M25P40 Signal description
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2.7 VCC supply voltage
VCC is the supply voltage.
2.8 VSS ground
VSS is the reference for the VCC supply voltage.
SPI modes M25P40
10/57
3 SPI modes
These devices can be driven by a microcontroller with its SPI peripheral running in either of
the two following modes:
CPOL=0, CPHA=0
CPOL=1, CPHA=1
For these two modes, input data is latched in on the rising edge of Serial Clock (C), and
output data is available from the falling edge of Serial Clock (C).
The difference between the two modes, as shown in Figure 4, is the clock polarity when the
bus master is in Stand-by mode and not transferring data:
C remains at 0 for (CPOL=0, CPHA=0)
C remains at 1 for (CPOL=1, CPHA=1)
Figure 3. Bus Master and memory devices on the SPI bus
1. The Write Protect (W) and Hold (HOLD) signals should be driven, High or Low as appropriate.
Figure 3 shows an example of three devices connected to an MCU, on an SPI bus. Only
one device is selected at a time, so only one device drives the Serial Data output (Q) line at
a time, the other devices are high impedance. Resistors R (represented in Figure 3) ensure
that the M25P40 is not selected if the Bus Master leaves the S line in the high impedance
state. As the Bus Master may enter a state where all inputs/outputs are in high impedance at
the same time (for example, when the Bus Master is reset), the clock line (C) must be
connected to an external pull-down resistor so that, when all inputs/outputs become high
impedance, the S line is pulled High while the C line is pulled Low (thus ensuring that S and
C do not become High at the same time, and so, that the tSHCH requirement is met). The
typical value of R is 100 kΩ, assuming that the time constant R*Cp (Cp = parasitic
capacitance of the bus line) is shorter than the time during which the Bus Master leaves the
SPI bus in high impedance.
AI12836b
SPI Bus Master
SPI Memory
Device
SDO
SDI
SCK
CQD
S
SPI Memory
Device
CQD
S
SPI Memory
Device
CQD
S
CS3 CS2 CS1
SPI Interface with
(CPOL, CPHA) =
(0, 0) or (1, 1)
WHOLD WHOLD WHOLD
RR R
V
CC
V
CC
V
CC
V
CC
V
SS
V
SS
V
SS
V
SS
R
M25P40 SPI modes
11/57
Example: Cp = 50 pF, that is R*Cp = 5 μs <=> the application must ensure that the Bus
Master never leaves the SPI bus in the high impedance state for a time period shorter than
5μs.
Figure 4. SPI modes supported
AI01438
B
C
MSB
CPHA
D
0
1
CPOL
0
1
Q
C
MSB
Ope rating feat u res M25P40
12/57
4 Operating features
4.1 Page Programming
To program one data byte, two instructions are required: Write Enable (WREN), which is
one byte, and a Page Program (PP) sequence, which consists of four bytes plus data. This
is followed by the internal Program cycle (of duration tPP).
To spread this overhead, the Page Program (PP) instruction allows up to 256 bytes to be
programmed at a time (changing bits from 1 to 0), provided that they lie in consecutive
addresses on the same page of memory.
For optimized timings, it is recommended to use the Page Program (PP) instruction to
program all consecutive targeted bytes in a single sequence versus using several Page
Program (PP) sequences with each containing only a few bytes (see Page Pro gram (PP),
In st r uctio n t i mes, process technology T9 HX.
4.2 Sector Erase and Bulk Erase
The Page Program (PP) instruction allows bits to be reset from 1 to 0. Before this can be
applied, the bytes of memory need to have been erased to all 1s (FFh). This can be
achieved either a sector at a time, using the Sector Erase (SE) instruction, or throughout the
entire memory, using the Bulk Erase (BE) instruction. This starts an internal Erase cycle (of
duration tSE or tBE).
The Erase instruction must be preceded by a Write Enable (WREN) instruction.
4.3 Polling during a Write, Program or Erase cycle
A further improvement in the time to Write Status Register (WRSR), Program (PP) or Erase
(SE or BE) can be achieved by not waiting for the worst case delay (tW, tPP
, tSE, or tBE). The
Write In Progress (WIP) bit is provided in the Status Register so that the application program
can monitor its value, polling it to establish when the previous Write cycle, Program cycle or
Erase cycle is complete.
4.4 Active Power, Standby Power and Deep Power-down modes
When Chip Select (S) is Low, the device is selected, and in the Active Power mode.
When Chip Select (S) is High, the device is deselected, but could remain in the Active
Power mode until all internal cycles have completed (Program, Erase, Write Status
Register). The device then goes in to the Standby Power mode. The device consumption
drops to ICC1.
The Deep Power-down mode is entered when the specific instruction (the Deep Power-
down (DP) instruction) is executed. The device consumption drops further to ICC2. The
device remains in this mode until another specific instruction (the Release from Deep
Power-down and Read Electronic Signature (RES) instruction) is executed.
M25P40 O p er atin g fe atures
13/57
All other instructions are ignored while the device is in the Deep Power-down mode. This
can be used as an extra software protection mechanism, when the device is not in active
use, to protect the device from inadvertent Write, Program or Erase instructions.
4.5 Status Register
The Status Register contains a number of status and control bits that can be read or set (as
appropriate) by specific instructions. For a detailed description of the Status Register bits,
see Se ction 6.4: Rea d Status Register (RDSR).
4.6 Protection modes
The environments where non-volatile memory devices are used can be very noisy. No SPI
device can operate correctly in the presence of excessive noise. To help combat this, the
M25P40 features the following data protection mechanisms:
Power On Reset and an internal timer (tPUW) can provide protection against
inadvertent changes while the power supply is outside the operating specification.
Program, Erase and Write Status Register instructions are checked that they consist of
a number of clock pulses that is a multiple of eight, before they are accepted for
execution.
All instructions that modify data must be preceded by a Write Enable (WREN)
instruction to set the Write Enable Latch (WEL) bit. This bit is returned to its reset state
by the following events:
– Power-up
– Write Disable (WRDI) instruction completion
– Write Status Register (WRSR) instruction completion
– Page Program (PP) instruction completion
– Sector Erase (SE) instruction completion
– Bulk Erase (BE) instruction completion
The Block Protect (BP2, BP1, BP0) bits allow part of the memory to be configured as
read-only. This is the Software Protected Mode (SPM).
The Write Protect (W) signal allows the Block Protect (BP2, BP1, BP0) bits and Status
Register Write Disable (SRWD) bit to be protected. This is the Hardware Protected
Mode (HPM).
In addition to the low power consumption feature, the Deep Power-down mode offers
extra software protection from inadvertent Write, Program and Erase instructions, as all
instructions are ignored except one particular instruction (the Release from Deep
Power-down instruction).
Ope rating feat u res M25P40
14/57
4.7 Hold condition
The Hold (HOLD) signal is used to pause any serial communications with the device without
resetting the clocking sequence. However, taking this signal Low does not terminate any
Write Status Register, Program or Erase cycle that is currently in progress.
To enter the Hold condition, the device must be selected, with Chip Select (S) Low.
The Hold condition starts on the falling edge of the Hold (HOLD) signal, provided that this
coincides with Serial Clock (C) being Low (as shown in Figure 5).
The Hold condition ends on the rising edge of the Hold (HOLD) signal, provided that this
coincides with Serial Clock (C) being Low.
If the falling edge does not coincide with Serial Clock (C) being Low, the Hold condition
starts after Serial Clock (C) next goes Low. Similarly, if the rising edge does not coincide
with Serial Clock (C) being Low, the Hold condition ends after Serial Clock (C) next goes
Low. (This is shown in Figure 5).
During the Hold condition, the Serial Data output (Q) is high impedance, and Serial Data
input (D) and Serial Clock (C) are Don’t Care.
Normally, the device is kept selected, with Chip Select (S) driven Low, for the whole duration
of the Hold condition. This is to ensure that the state of the internal logic remains unchanged
from the moment of entering the Hold condition.
If Chip Select (S) goes High while the device is in the Hold condition, this has the effect of
resetting the internal logic of the device. To restart communication with the device, it is
necessary to drive Hold (HOLD) High, and then to drive Chip Select (S) Low. This prevents
the device from going back to the Hold condition.
Table 2. Pro tect ed area si z es
St atus Register
content Memory content
BP2
bit BP1
bit BP0
bit Protected area Unprotected area
0 0 0 none All sectors(1) (eight sectors: 0 to 7)
1. The device is ready to accept a Bulk Erase instruction if, and only if, all Block Protect (BP2, BP1, BP0) are
0.
0 0 1 Upper eighth (Sector 7) Lower seven-eighths (seven sectors: 0 to
6)
0 1 0 Upper quarter (two sectors: 6 and 7) Lower three-quarters (six sectors: 0 to 5)
0 1 1 Upper half (four sectors: 4 to 7) Lower half (four sectors: 0 to 3)
1 0 0 All sectors (eight sectors: 0 to 7) none
1 0 1 All sectors (eight sectors: 0 to 7) none
1 1 0 All sectors (eight sectors: 0 to 7) none
1 1 1 All sectors (eight sectors: 0 to 7) none
M25P40 O p er atin g fe atures
15/57
Figure 5. Hold condition activation
AI02029
D
HOLD
C
Hold
Condition
(standard use)
Hold
Condition
(non-standard use)
Memory organization M25P40
16/57
5 Memory organization
The memory is organized as:
524,288 bytes (8 bits each)
8 sectors (512 Kbits, 65536 bytes each)
2048 pages (256 bytes each).
Each page can be individually programmed (bits are programmed from 1 to 0). The device is
Sector or Bulk Erasable (bits are erased from 0 to 1) but not Page Erasable.
Table 3. Memory organization
Sector Address range
7 70000h 7FFFFh
6 60000h 6FFFFh
5 50000h 5FFFFh
4 40000h 4FFFFh
3 30000h 3FFFFh
2 20000h 2FFFFh
1 10000h 1FFFFh
0 00000h 0FFFFh
M25P40 Memory organi zation
17/57
Figure 6. Block diagram
AI04986
HOLD
S
WControl Logic High Voltage
Generator
I/O Shift Register
Address Register
and Counter 256 Byte
Data Buffer
256 Bytes (Page Size)
X Decoder
Y Decoder
Size of the
read-only
memory are
a
C
D
Q
Status
Register
00000h
7FFFFh
000FFh
Instructions M25P40
18/57
6 Instructions
All instructions, addresses and data are shifted in and out of the device, most significant bit
first.
Serial Data input (D) is sampled on the first rising edge of Serial Clock (C) after Chip Select
(S) is driven Low. Then, the one-byte instruction code must be shifted in to the device, most
significant bit first, on Serial Data input (D), each bit being latched on the rising edges of
Serial Clock (C).
The instruction set is listed in Table 4.
Every instruction sequence starts with a one-byte instruction code. Depending on the
instruction, this might be followed by address bytes, or by data bytes, or by both or none.
Chip Select (S) must be driven High after the last bit of the instruction sequence has been
shifted in.
In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed (Fast_Read),
Read Identification (RDID), Read Status Register (RDSR) or Release from Deep Power-
down, and Read Electronic Signature (RES) instruction, the shifted-in instruction sequence
is followed by a data-out sequence. Chip Select (S) can be driven High after any bit of the
data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Bulk Erase (BE), Write Status
Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (S) must be driven High exactly at a byte boundary, otherwise the
instruction is rejected, and is not executed. That is, Chip Select (S) must driven High when
the number of clock pulses after Chip Select (S) being driven Low is an exact multiple of
eight.
All attempts to access the memory array during a Write Status Register cycle, Program
cycle or Erase cycle are ignored, and the internal Write Status Register cycle, Program
cycle or Erase cycle continues unaffected.
M25P40 Instructions
19/57
6.1 Write Enable (WREN)
The Write Enable (WREN) instruction (Figure 7) sets the Write Enable Latch (WEL) bit.
The Write Enable Latch (WEL) bit must be set prior to every Page Program (PP), Sector
Erase (SE), Bulk Erase (BE) and Write Status Register (WRSR) instruction.
The Write Enable (WREN) instruction is entered by driving Chip Select (S) Low, sending the
instruction code, and then driving Chip Select (S) High.
Figu r e 7. Writ e E n ab l e (WR EN ) inst ru cti o n seq uen ce
Table 4. In stru ction set
Instruction Description One-byte instruction
code Address
bytes Dummy
bytes Da ta
bytes
WREN Write Enable 0000 0110 06h 0 0 0
WRDI Write Disable 0000 0100 04h 0 0 0
RDID(1)
1. The Read Identification (RDID) instruction is available only in products with Process Technology code X
and 4 (see Application Note AN1995).
Read Identification 1001 1111 9Fh 0 0 1 to 3
RDSR Read Status Register 0000 0101 05h 0 0 1 to ∞
WRSR Write Status Register 0000 0001 01h 0 0 1
READ Read Data Bytes 0000 0011 03h 3 0 1 to ∞
FAST_READ Read Data Bytes at Higher
Speed 0000 1011 0Bh 3 1 1 to ∞
PP Page Program 0000 0010 02h 3 0 1 to 256
SE Sector Erase 1101 1000 D8h 3 0 0
BE Bulk Erase 1100 0111 C7h 0 0 0
DP Deep Power-down 1011 1001 B9h 0 0 0
RES
Release from Deep Power-
down, and Read Electronic
Signature 1010 1011 ABh
0 3 1 to ∞
Release from Deep Power-
down 0 0 0
C
D
AI02281E
S
Q
21 34567
High Impedance
0
Instruction
Instructions M25P40
20/57
6.2 Write Disable (WRDI)
The Write Disable (WRDI) instruction (Figure 8) resets the Write Enable Latch (WEL) bit.
The Write Disable (WRDI) instruction is entered by driving Chip Select (S) Low, sending the
instruction code, and then driving Chip Select (S) High.
The Write Enable Latch (WEL) bit is reset under the following conditions:
Power-up
Write Disable (WRDI) instruction completion
Write Status Register (WRSR) instruction completion
Page Program (PP) instruction completion
Sector Erase (SE) instruction completion
Bulk Erase (BE) instruction completion
Fig u re 8. Write Di sable (W RDI ) instruction sequ ence
C
D
AI03750D
S
Q
21 34567
High Impedance
0
Instruction
M25P40 Instructions
21/57
6.3 Read Identification (RDID)
The Read Identification (RDID) instruction allows to read the device identification data:
Manufacturer identification (1 byte)
Device identification (2 bytes)
A Unique ID code (UID) (17 bytes, of which 16 available upon customer request).(2)
The manufacturer identification is assigned by JEDEC, and has the value 20h for Numonyx.
The device identification is assigned by the device manufacturer, and indicates the memory
type in the first byte (20h), and the memory capacity of the device in the second byte (13h).
The UID contains the length of the following data in the first byte (set to 10h), and 16 bytes
of the optional Customized Factory Data (CFD) content. The CFD bytes are read-only and
can be programmed with customers data upon their demand. If the customers do not make
requests, the devices are shipped with all the CFD bytes programmed to zero (00h). Any
Read Identification (RDID) instruction while an Erase or Program cycle is in progress, is not
decoded, and has no effect on the cycle that is in progress. The device is first selected by
driving Chip Select (S) Low. Then, the 8-bit instruction code for the instruction is shifted in.
After this, the 24-bit device identification, stored in the memory, the 8-bit CFD length
followed by 16 bytes of CFD content will be shifted out on Serial Data output (Q). Each bit is
shifted out during the falling edge of Serial Clock (C).
The instruction sequence is shown in Figure 9.
The Read Identification (RDID) instruction is terminated by driving Chip Select (S) High at
any time during data output.
When Chip Select (S) is driven High, the device is put in the Stand-by Power mode. Once in
the Stand-by Power mode, the device waits to be selected, so that it can receive, decode
and execute instructions.
2. The UID feature is available only for process technology T9HX devices, identified by with process identification
digit "4" in the device marking and process letter "B" in the part number.
Table 5. Read Identification (RDID) data-out sequence
Manufa cturer iden tificati o n Device identification UID
Memory type Memory capacity CFD length CFD content
20h 20h 13h 10h 16 bytes
Instructions M25P40
22/57
Figure 9. Read Identification (RDID) instruction sequenc e and data-out sequence
6.4 Re ad Status Register (RDSR)
The Read Status Register (RDSR) instruction allows the Status Register to be read. The
Status Register may be read at any time, even while a Program, Erase or Write Status
Register cycle is in progress. When one of these cycles is in progress, it is recommended to
check the Write In Progress (WIP) bit before sending a new instruction to the device. It is
also possible to read the Status Register continuously, as shown in Figure 10.
The status and control bits of the Status Register are as follows:
6.4.1 WIP bit
The Write In Progress (WIP) bit indicates whether the memory is busy with a Write Status
Register, Program or Erase cycle. When set to 1, such a cycle is in progress, when reset to
0 no such cycle is in progress.
6.4.2 WEL bit
The Write Enable Latch (WEL) bit indicates the status of the internal Write Enable Latch.
When set to 1 the internal Write Enable Latch is set, when set to 0 the internal Write Enable
Latch is reset and no Write Status Register, Program or Erase instruction is accepted.
C
D
S
21 3456789101112131415
Instruction
0
AI06809b
Q
Manufacturer Identification
High Impedance
MSB
15 1413 3210
Device Identification
MSB
16 17 18 28 29 30 31
Table 6. Status Re g i ster fo rma t
b7 b0
SRWD 0 0 BP2 BP1 BP0 WEL WIP
Status Register Write Protect
Block Protect bits
Write Enable Latch bit
Write In Progress bit
M25P40 Instructions
23/57
6.4.3 BP2, BP1, BP0 bits
The Block Protect (BP2, BP1, BP0) bits are non-volatile. They define the size of the area to
be software protected against Program and Erase instructions. These bits are written with
the Write Status Register (WRSR) instruction. When one or more of the Block Protect (BP2,
BP1, BP0) bits is set to 1, the relevant memory area (as defined in Table 2) becomes
protected against Page Program (PP) and Sector Erase (SE) instructions. The Block Protect
(BP2, BP1, BP0) bits can be written provided that the Hardware Protected mode has not
been set. The Bulk Erase (BE) instruction is executed if, and only if, all Block Protect (BP2,
BP1, BP0) bits are 0.
6.4.4 SRWD bit
The Status Register Write Disable (SRWD) bit is operated in conjunction with the Write
Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect (W)
signal allow the device to be put in the Hardware Protected mode (when the Status Register
Write Disable (SRWD) bit is set to 1, and Write Protect (W) is driven Low). In this mode, the
non-volatile bits of the Status Register (SRWD, BP2, BP1, BP0) become read-only bits and
the Write Status Register (WRSR) instruction is no longer accepted for execution.
Figure 10. Read Status Register (R D SR) instruct i on sequence and data-out
sequence
C
D
S
21 3456789101112131415
Instruction
0
AI02031E
Q76543210
Status Register Out
High Impedance
MSB
76543210
Status Register Out
MSB
7
Instructions M25P40
24/57
6.5 Writ e Status Re giste r (WRSR)
The Write Status Register (WRSR) instruction allows new values to be written to the Status
Register. Before it can be accepted, a Write Enable (WREN) instruction must previously
have been executed. After the Write Enable (WREN) instruction has been decoded and
executed, the device sets the Write Enable Latch (WEL).
The Write Status Register (WRSR) instruction is entered by driving Chip Select (S) Low,
followed by the instruction code and the data byte on Serial Data input (D).
The instruction sequence is shown in Figure 11.
The Write Status Register (WRSR) instruction has no effect on b6, b5, b1 and b0 of the
Status Register. b6 and b5 are always read as 0.
Chip Select (S) must be driven High after the eighth bit of the data byte has been latched in.
If not, the Write Status Register (WRSR) instruction is not executed. As soon as Chip Select
(S) is driven High, the self-timed Write Status Register cycle (whose duration is tW) is
initiated. While the Write Status Register cycle is in progress, the Status Register may still
be read to check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP)
bit is 1 during the self-timed Write Status Register cycle, and is 0 when it is completed.
When the cycle is completed, the Write Enable Latch (WEL) is reset.
The Write Status Register (WRSR) instruction allows the user to change the values of the
Block Protect (BP2, BP1, BP0) bits, to define the size of the area that is to be treated as
read-only, as defined in Table 2. The Write Status Register (WRSR) instruction also allows
the user to set or reset the Status Register Write Disable (SRWD) bit in accordance with the
Write Protect (W) signal. The Status Register Write Disable (SRWD) bit and Write Protect
(W) signal allow the device to be put in the Hardware Protected Mode (HPM). The Write
Status Register (WRSR) instruction is not executed once the Hardware Protected Mode
(HPM) is entered.
Figure 11. Write Status Regi st er (W RSR) instruction seque nce
C
D
AI02282D
S
Q
21 3456789101112131415
High Impedance
Instruction Status
Register In
0
765432 0
1
MSB
M25P40 Instructions
25/57
The protection features of the device are summarized in Table 7.
When the Status Register Write Disable (SRWD) bit of the Status Register is 0 (its initial
delivery state), it is possible to write to the Status Register provided that the Write Enable
Latch (WEL) bit has previously been set by a Write Enable (WREN) instruction, regardless
of the whether Write Protect (W) is driven High or Low.
When the Status Register Write Disable (SRWD) bit of the Status Register is set to 1, two
cases need to be considered, depending on the state of Write Protect (W):
If Write Protect (W) is driven High, it is possible to write to the Status Register provided
that the Write Enable Latch (WEL) bit has previously been set by a Write Enable
(WREN) instruction.
If Write Protect (W) is driven Low, it is not possible to write to the Status Register even
if the Write Enable Latch (WEL) bit has previously been set by a Write Enable (WREN)
instruction. (Attempts to write to the Status Register are rejected, and are not accepted
for execution). As a consequence, all the data bytes in the memory area that are
software protected (SPM) by the Block Protect (BP2, BP1, BP0) bits of the Status
Register, are also hardware protected against data modification.
Regardless of the order of the two events, the Hardware Protected Mode (HPM) can be
entered:
by setting the Status Register Write Disable (SRWD) bit after driving Write Protect (W)
Low
or by driving Write Protect (W) Low after setting the Status Register Write Disable
(SRWD) bit.
The only way to exit the Hardware Protected Mode (HPM) once entered is to pull Write
Protect (W) High.
If Write Protect (W) is permanently tied High, the Hardware Protected Mode (HPM) can
never be activated, and only the Software Protected Mode (SPM), using the Block Protect
(BP2, BP1, BP0) bits of the Status Register, can be used.
Table 7. Protection modes
W
signal SRWD
bit Mode Write Protection of the
Status Register
Memor y cont ent
Protected area(1)
1. As defined by the values in the Block Protect (BP2, BP1, BP0) bits of the Status Register, as shown in
Table 2.
Unprotected area(1)
10
Software
Protected
(SPM)
Status Register is
Writable (if the WREN
instruction has set the
WEL bit)
The values in the SRWD,
BP2, BP1 and BP0 bits
can be changed
Protected against
Page Program,
Sector Erase and
Bulk Erase
Ready to accept
Page Program and
Sector Erase
instructions
00
11
01
Hardware
Protected
(HPM)
Status Register is
Hardware write protected
The values in the SRWD,
BP2, BP1 and BP0 bits
cannot be changed
Protected against
Page Program,
Sector Erase and
Bulk Erase
Ready to accept
Page Program and
Sector Erase
instructions
Instructions M25P40
26/57
6.6 Read Data Bytes (READ)
The device is first selected by driving Chip Select (S) Low. The instruction code for the Read
Data Bytes (READ) instruction is followed by a 3-byte address (A23-A0), each bit being
latched-in during the rising edge of Serial Clock (C). Then the memory contents, at that
address, is shifted out on Serial Data output (Q), each bit being shifted out, at a maximum
frequency fR, during the falling edge of Serial Clock (C).
The instruction sequence is shown in Figure 12.
The first byte addressed can be at any location. The address is automatically incremented
to the next higher address after each byte of data is shifted out. The whole memory can,
therefore, be read with a single Read Data Bytes (READ) instruction. When the highest
address is reached, the address counter rolls over to 000000h, allowing the read sequence
to be continued indefinitely.
The Read Data Bytes (READ) instruction is terminated by driving Chip Select (S) High. Chip
Select (S) can be driven High at any time during data output. Any Read Data Bytes (READ)
instruction, while an Erase, Program or Write cycle is in progress, is rejected without having
any effects on the cycle that is in progress.
Fig u re 12. Read Data Bytes (R EAD ) inst ructi on sequence and data-out sequence
1. Address bits A23 to A19 are Don’t Care.
C
D
AI03748
D
S
Q
23
21 345678910 2829303132333435
2221 3210
36 37 38
76543 1 7
0
High Impedance Data Out 1
Instruction 24-Bit Address
0
MSB
MSB
2
39
Data Out 2
M25P40 Instructions
27/57
6.7 Re ad Data Bytes at Higher Speed (FAST_READ)
The device is first selected by driving Chip Select (S) Low. The instruction code for the Read
Data Bytes at Higher Speed (FAST_READ) instruction is followed by a 3-byte address (A23-
A0) and a dummy byte, each bit being latched-in during the rising edge of Serial Clock (C).
Then the memory contents, at that address, is shifted out on Serial Data output (Q), each bit
being shifted out, at a maximum frequency fC, during the falling edge of Serial Clock (C).
The instruction sequence is shown in Figure 13.
The first byte addressed can be at any location. The address is automatically incremented
to the next higher address after each byte of data is shifted out. The whole memory can,
therefore, be read with a single Read Data Bytes at Higher Speed (FAST_READ)
instruction. When the highest address is reached, the address counter rolls over to
000000h, allowing the read sequence to be continued indefinitely.
The Read Data Bytes at Higher Speed (FAST_READ) instruction is terminated by driving
Chip Select (S) High. Chip Select (S) can be driven High at any time during data output. Any
Read Data Bytes at Higher Speed (FAST_READ) instruction, while an Erase, Program or
Write cycle is in progress, is rejected without having any effects on the cycle that is in
progress.
Figure 13. Read Data Bytes at Higher Speed (FAST_READ) instruc tion se quenc e
and data-out sequence
1. Address bits A23 to A19 are Don’t Care.
C
D
AI04006
S
Q
23
21 345678910 28293031
2221 3210
High Impedance
Instruction 24 BIT ADDRESS
0
C
D
S
Q
32 33 34 36 37 38 39 40 41 42 43 44 45 46
765432 0
1
DATA OUT 1
Dummy Byte
MSB
76543210
DATA OUT 2
MSB MSB
7
47
765432 0
1
35
Instructions M25P40
28/57
6.8 Page Program (PP)
The Page Program (PP) instruction allows bytes to be programmed in the memory
(changing bits from 1 to 0). Before it can be accepted, a Write Enable (WREN) instruction
must previously have been executed. After the Write Enable (WREN) instruction has been
decoded, the device sets the Write Enable Latch (WEL).
The Page Program (PP) instruction is entered by driving Chip Select (S) Low, followed by
the instruction code, three address bytes and at least one data byte on Serial Data input (D).
If the 8 least significant address bits (A7-A0) are not all zero, all transmitted data that goes
beyond the end of the current page are programmed from the start address of the same
page (from the address whose 8 least significant bits (A7-A0) are all zero). Chip Select (S)
must be driven Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 14.
If more than 256 bytes are sent to the device, previously latched data are discarded and the
last 256 data bytes are guaranteed to be programmed correctly within the same page. If less
than 256 Data bytes are sent to device, they are correctly programmed at the requested
addresses without having any effects on the other bytes of the same page.
For optimized timings, it is recommended to use the Page Program (PP) instruction to
program all consecutive targeted bytes in a single sequence versus using several Page
Program (PP) sequences with each containing only a few bytes (see Instr uc tio n time s,
process t echno l og y T9 HX.
Chip Select (S) must be driven High after the eighth bit of the last data byte has been
latched in, otherwise the Page Program (PP) instruction is not executed.
As soon as Chip Select (S) is driven High, the self-timed Page Program cycle (whose
duration is tPP) is initiated. While the Page Program cycle is in progress, the Status Register
may be read to check the value of the Write In Progress (WIP) bit. The Write In Progress
(WIP) bit is 1 during the self-timed Page Program cycle, and is 0 when it is completed. At
some unspecified time before the cycle is completed, the Write Enable Latch (WEL) bit is
reset.
A Page Program (PP) instruction applied to a page which is protected by the Block Protect
(BP2, BP1, BP0) bits (see Table 3 and Table 2) is not executed.
M25P40 Instructions
29/57
Figure 14. Page Program (PP) instruct ion sequence
1. Address bits A23 to A19 are Don’t Care.
C
D
AI04082B
S
4241 43 44 45 46 47 48 49 50 52 53 54 5540
C
D
S
23
21 345678910 2829303132333435
2221 3210
36 37 38
Instruction 24-Bit Address
0
765432 0
1
Data Byte 1
39
51
765432 0
1
Data Byte 2
765432 0
1
Data Byte 3 Data Byte 256
2079
2078
2077
2076
2075
2074
2073
765432 0
1
2072
MSB MSB
MSB MSB MSB
Instructions M25P40
30/57
6.9 Sector Erase (SE)
The Sector Erase (SE) instruction sets to 1 (FFh) all bits inside the chosen sector. Before it
can be accepted, a Write Enable (WREN) instruction must previously have been executed.
After the Write Enable (WREN) instruction has been decoded, the device sets the Write
Enable Latch (WEL).
The Sector Erase (SE) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code, and three address bytes on Serial Data input (D). Any address inside the
Sector (see Table 3) is a valid address for the Sector Erase (SE) instruction. Chip Select (S)
must be driven Low for the entire duration of the sequence.
The instruction sequence is shown in Figure 15.
Chip Select (S) must be driven High after the eighth bit of the last address byte has been
latched in, otherwise the Sector Erase (SE) instruction is not executed. As soon as Chip
Select (S) is driven High, the self-timed Sector Erase cycle (whose duration is tSE) is
initiated. While the Sector Erase cycle is in progress, the Status Register may be read to
check the value of the Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1
during the self-timed Sector Erase cycle, and is 0 when it is completed. At some unspecified
time before the cycle is completed, the Write Enable Latch (WEL) bit is reset.
A Sector Erase (SE) instruction applied to a page which is protected by the Block Protect
(BP2, BP1, BP0) bits (see Table 3 and Table 2) is not executed.
Fig ur e 15. Se ctor E r ase (SE) instruction sequence
1. Address bits A23 to A19 are Don’t Care.
24 Bit Address
C
D
AI03751D
S
21 3456789 293031
Instruction
0
23 22 2 0
1
MSB
M25P40 Instructions
31/57
6.10 Bulk Erase (BE)
The Bulk Erase (BE) instruction sets all bits to 1 (FFh). Before it can be accepted, a Write
Enable (WREN) instruction must previously have been executed. After the Write Enable
(WREN) instruction has been decoded, the device sets the Write Enable Latch (WEL).
The Bulk Erase (BE) instruction is entered by driving Chip Select (S) Low, followed by the
instruction code on Serial Data input (D). Chip Select (S) must be driven Low for the entire
duration of the sequence.
The instruction sequence is shown in Figure 16.
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the Bulk Erase instruction is not executed. As soon as Chip Select (S)
is driven High, the self-timed Bulk Erase cycle (whose duration is tBE) is initiated. While the
Bulk Erase cycle is in progress, the Status Register may be read to check the value of the
Write In Progress (WIP) bit. The Write In Progress (WIP) bit is 1 during the self-timed Bulk
Erase cycle, and is 0 when it is completed. At some unspecified time before the cycle is
completed, the Write Enable Latch (WEL) bit is reset.
The Bulk Erase (BE) instruction is executed only if all Block Protect (BP2, BP1, BP0) bits
are 0. The Bulk Erase (BE) instruction is ignored if one, or more, sectors are protected.
Figure 16. B ulk Erase (BE) instruction sequence
C
D
AI03752D
S
21 345670
Instruction
Instructions M25P40
32/57
6.11 Deep Power-down (DP)
Executing the Deep Power-down (DP) instruction is the only way to put the device in the
lowest consumption mode (the Deep Power-down mode). It can also be used as an extra
software protection mechanism, while the device is not in active use, since in this mode, the
device ignores all Write, Program and Erase instructions.
Driving Chip Select (S) High deselects the device, and puts the device in the Standby Power
mode (if there is no internal cycle currently in progress). But this mode is not the Deep
Power-down mode. The Deep Power-down mode can only be entered by executing the
Deep Power-down (DP) instruction, subsequently reducing the standby current (from ICC1 to
ICC2, as specified in Table 14).
Once the device has entered the Deep Power-down mode, all instructions are ignored
except the Release from Deep Power-down and Read Electronic Signature (RES)
instruction. This releases the device from this mode. The Release from Deep Power-down
and Read Electronic Signature (RES) instruction and the Read Identification (RDID)
instruction also allow the Electronic Signature of the device to be output on Serial Data
output (Q).
The Deep Power-down mode automatically stops at Power-down, and the device always
Powers-up in the Standby Power mode.
The Deep Power-down (DP) instruction is entered by driving Chip Select (S) Low, followed
by the instruction code on Serial Data input (D). Chip Select (S) must be driven Low for the
entire duration of the sequence.
The instruction sequence is shown in Figure 17.
Chip Select (S) must be driven High after the eighth bit of the instruction code has been
latched in, otherwise the Deep Power-down (DP) instruction is not executed. As soon as
Chip Select (S) is driven High, it requires a delay of tDP before the supply current is reduced
to ICC2 and the Deep Power-down mode is entered.
Any Deep Power-down (DP) instruction, while an Erase, Program or Write cycle is in
progress, is rejected without having any effects on the cycle that is in progress.
Figure 17. Deep Power-do wn (D P ) instru ction sequence
C
D
AI03753D
S
21 345670t
DP
Deep Power-down Mode
Stand-by Mode
Instruction
M25P40 Instructions
33/57
6.12 Release from Deep Power-down and Read Electronic
Signature (RES)
Once the device has entered the Deep Power-down mode, all instructions are ignored
except the Release from Deep Power-down and Read Electronic Signature (RES)
instruction. Executing this instruction takes the device out of the Deep Power-down mode.
The instruction can also be used to read, on Serial Data output (Q), the 8-bit Electronic
Signature, whose value for the M25P40 is 12h.
Except while an Erase, Program or Write Status Register cycle is in progress, the Release
from Deep Power-down and Read Electronic Signature (RES) instruction always provides
access to the 8-bit Electronic Signature of the device, and can be applied even if the Deep
Power-down mode has not been entered.
Any Release from Deep Power-down and Read Electronic Signature (RES) instruction while
an Erase, Program or Write Status Register cycle is in progress, is not decoded, and has no
effect on the cycle that is in progress.
The device is first selected by driving Chip Select (S) Low. The instruction code is followed
by 3 dummy bytes, each bit being latched-in on Serial Data input (D) during the rising edge
of Serial Clock (C). Then, the 8-bit Electronic Signature, stored in the memory, is shifted out
on Serial Data output (Q), each bit being shifted out during the falling edge of Serial Clock
(C).
The instruction sequence is shown in Figure 18.
The Release from Deep Power-down and Read Electronic Signature (RES) instruction is
terminated by driving Chip Select (S) High after the Electronic Signature has been read at
least once. Sending additional clock cycles on Serial Clock (C), while Chip Select (S) is
driven Low, cause the Electronic Signature to be output repeatedly.
When Chip Select (S) is driven High, the device is put in the Standby Power mode. If the
device was not previously in the Deep Power-down mode, the transition to the Standby
Power mode is immediate. If the device was previously in the Deep Power-down mode,
though, the transition to the Standby Power mode is delayed by tRES2, and Chip Select (S)
must remain High for at least tRES2(max), as specified in Table 19. Once in the Standby
Power mode, the device waits to be selected, so that it can receive, decode and execute
instructions.
Driving Chip Select (S) High after the 8-bit instruction byte has been received by the device,
but before the whole of the 8-bit Electronic Signature has been transmitted for the first time
(as shown in Figure 19), still ensures that the device is put into Standby Power mode. If the
device was not previously in the Deep Power-down mode, the transition to the Standby
Power mode is immediate. If the device was previously in the Deep Power-down mode,
though, the transition to the Standby Power mode is delayed by tRES1, and Chip Select (S)
must remain High for at least tRES1(max), as specified in Table 19. Once in the Standby
Power mode, the device waits to be selected, so that it can receive, decode and execute
instructions.
Instructions M25P40
34/57
Figure 18. Relea se from Deep P ower-down and Read Elect ronic Sign atu re (RE S) instruction
sequence and data-out sequence
1. The value of the 8-bit Electronic Signature, for the M25P40, is 12h.
Figure 19. Release from Deep Power-down (RES) instruction sequence
C
D
AI04047C
S
Q
23
21 345678910 2829303132333435
2221 3210
36 37 38
765432 0
1
High Impedance Electronic Signature Out
Instruction 3 Dummy Bytes
0
MSB
Stand-by Mode
Deep Power-down Mode
MSB
tRES2
C
D
AI04078B
S
21 345670t
RES1
Stand-by Mode
Deep Power-down Mode
QHigh Impedance
Instruction
M25P40 Pow er- up and Power-down
35/57
7 Power-up and Power-down
At Power-up and Power-down, the device must not be selected (that is Chip Select (S) must
follow the voltage applied on VCC) until VCC reaches the correct value:
VCC(min) at Power-up, and then for a further delay of tVSL
VSS at Power-down
A safe configuration is provided in Sectio n 3: SPI modes.
To avoid data corruption and inadvertent write operations during power-up, a Power On
Reset (POR) circuit is included. The logic inside the device is held reset while VCC is less
than the Power On Reset (POR) threshold voltage, VWI – all operations are disabled, and
the device does not respond to any instruction.
Moreover, the device ignores all Write Enable (WREN), Page Program (PP), Sector Erase
(SE), Bulk Erase (BE) and Write Status Register (WRSR) instructions until a time delay of
tPUW has elapsed after the moment that VCC rises above the VWI threshold. However, the
correct operation of the device is not guaranteed if, by this time, VCC is still below VCC(min).
No Write Status Register, Program or Erase instructions should be sent until the later of:
tPUW after VCC passed the VWI threshold
tVSL after VCC passed the VCC(min) level
These values are specified in Table 9.
If the delay, tVSL, has elapsed, after VCC has risen above VCC(min), the device can be
selected for READ instructions even if the tPUW delay is not yet fully elapsed.
At Power-up, the device is in the following state:
The device is in the Standby Power mode (not the Deep Power-down mode).
The Write Enable Latch (WEL) bit is reset.
The Write In Progress (WIP) bit is reset.
Normal precautions must be taken for supply rail decoupling, to stabilize the VCC supply.
Each device in a system should have the VCC rail decoupled by a suitable capacitor close to
the package pins. (Generally, this capacitor is of the order of 100 nF).
At Power-down, when VCC drops from the operating voltage, to below the Power On Reset
(POR) threshold voltage, VWI, all operations are disabled and the device does not respond
to any instruction. (The designer needs to be aware that if a Power-down occurs while a
Write, Program or Erase cycle is in progress, some data corruption can result.)
Power-up and Power- down M25P40
36/57
Figure 20. Power-up timing
Table 8. Power-up timing and VWI threshold
Symbol Parameter Min. Max. Unit
tVSL(1)
1. These parameters are characterized only.
VCC(min) to S low 10 μs
tPUW(1) Time delay to Write instruction 1 10 ms
VWI(1) Write Inhibit voltage (device grade 6) 1 2.1 V
Write Inhibit voltage (device grade 3) 1 2.1 V
VCC
AI04009C
VCC(min)
VWI
Reset State
of the
Device
Chip Selection Not Allowed
Program, Erase and Write Commands are Rejected by the Device
tVSL
tPUW
time
Read Access allowed Device fully
accessible
VCC(max)
M25P40 Ini tial deli v er y s ta te
37/57
8 Initial delivery state
The device is delivered with the memory array erased: all bits are set to 1 (each byte
contains FFh). The Status Register contains 00h (all Status Register bits are 0).
9 Maximum rating
Stressing the device above the rating listed in the Absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the Numonyx SURE Program
and other relevant quality documents.
Table 9. Absolute maximu m ratin g s
Symbol Parameter Min. Max. Unit
TSTG Storage temperature –65 150 °C
TLEAD Lead temperature during soldering see (1)
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly) and the European
directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU.
°C
VIO Input and output voltage (with respect to Ground)(2)
2. The minimum voltage may reach the value of -2 V for no more than 20 ns during transitions; The maximum
voltage may reach the value of VCC+2 V for no more than 20 ns during transitions..
–0.6 VCC +
0.6 V
VCC Supply voltage –0.6 4.0 V
VESD Electrostatic Discharge voltage (Human Body model)(3)
3. JEDEC Std JESD22-A114A (C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
–2000 2000 V
DC and AC parameters M25P40
38/57
10 DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC
characteristics of the device. The parameters in the DC and AC characteristic tables that
follow are derived from tests performed under the Measurement Conditions summarized in
the relevant tables. Designers should check that the operating conditions in their circuit
match the measurement conditions when relying on the quoted parameters.
Table 1 1. Device grade and AC table correlation
Table 10. Operating conditions
Symbol Parameter Min. Max. Unit
VCC Supply voltage 2.3 3.6 V
TA
Ambient operating temperature (device grade 6) –40 85
°C
Ambient operating temperature (device grade 3) –40 125
Device
Grade
150n m Versio n 110nm(T9HX)
Vcc(min) f (max) AC Table Vcc(min) f (max) AC Table
Grade 3 2.7V 25 MHz Table 19. 2.7V 75 MHz Tab le 22.
Grade 6 2.3V 40 MHz Table 21. 2.3V 40 MHz Tab le 21.
Grade 6 2.7V 50 MHz Table 20. 2.7V 75 MHz Tab le 22.
Table 12. Data ret ent i on and enduranc e
Parameter Condition Min. Max. Unit
Erase/Program
cycles
Device grade 6 100,000
cycles per sector
Device grade 3 100,000
Data Retention at 55°C 20 years
Table 13. Capacitance(1)
1. Sampled only, not 100% tested, at TA=25 °C and a frequency of 25 MHz.
Symbol Parameter Test condition Min. Max. Unit
COUT Output capacitance (Q) VOUT = 0 V 8 pF
CIN Input capacitance (other pins) VIN = 0 V 6 pF
M25P40 DC and AC parameters
39/57
Table 14. DC character istics (devic e gr ade 6)
Symbol Parameter Test condition (in addition to
those i n Table 10)Min. Max. Unit
ILI Input leakage current ± 2 μA
ILO Output leakage current ± 2 μA
ICC1 Standby current S = VCC, VIN = VSS or VCC 50 μA
ICC2 Deep Power-down current S = VCC, VIN = VSS or VCC 10 μA
ICC3 Operating current (READ)
C = 0.1VCC / 0.9.VCC at
40 MHz, 50 MHz, and 75 MHz,
Q = open
8mA
C = 0.1VCC / 0.9.VCC at
25 MHz and 33 MHz, Q = open 4mA
ICC4 Operating current (PP) S = VCC 15 mA
ICC5 Operating current (WRSR) S = VCC 15 mA
ICC6 Operating current (SE) S = VCC 15 mA
ICC7 Operating current (BE) S = VCC 15 mA
VIL Input low voltage –0.5 0.3VCC V
VIH Input high voltage 0.7VCC VCC+0.4 V
VOL Output low voltage IOL = 1.6 mA 0.4 V
VOH Output high voltage IOH = –100 μAV
CC–0.2 V
DC and AC parameters M25P40
40/57
Table 15. DC character istics (devic e gr ade 3)
Symbol Parameter Test condition (in addition to
those in Table 10)Min(1)
1. This is preliminary data.
Max(1) Unit
ILI Input leakage current ± 2 μA
ILO Output leakage current ± 2 μA
ICC1 Standby current S = VCC, VIN = VSS or VCC 100 μA
ICC2 Deep Power-down current S = VCC, VIN = VSS or VCC 50 μA
ICC3 Operating current (READ)
C = 0.1VCC / 0.9.VCC at 25 MHz
and 75 MHz, Q = open 8mA
C = 0.1VCC / 0.9.VCC at 20 MHz
and 33 MHz, Q = open 4mA
ICC4 Operating current (PP) S = VCC 15 mA
ICC5 Operating current (WRSR) S = VCC 15 mA
ICC6 Operating current (SE) S = VCC 15 mA
ICC7 Operating current (BE) S = VCC 15 mA
VIL Input low voltage – 0.5 0.3VCC V
VIH Input high voltage 0.7VCC VCC+0.4 V
VOL Output low voltage IOL = 1.6 mA 0.4 V
VOH Output high voltage IOH = –100 μAV
CC–0.2 V
Table 16. Instruction times, process technology T9H X(1)
1. Technology T9HX devices are identified by process identification digit "4" in the device marking and
process letter "B" in the part number.
Test conditions specified in Table 10 and Table 18
Symbol Alt. Parameter Min. Typ. Max. Unit
tWWrite Status Register cycle time 1.3 15 ms
tPP (2)
2. When using the Page Program (PP) instruction to program consecutive bytes, optimized timings are
obtained with one sequence including all the bytes versus several sequences of only a few bytes. (1 ≤ n ≤
256)
Page Program cycle time (256 bytes) 0.8
5ms
Page Program cycle time (n bytes) int (n/8) ×
0.025 (2)
tSE Sector Erase cycle time 0.6 3 s
tBE Bulk Erase cycle time 4.5 10 s
M25P40 DC and AC parameters
41/57
1. Output Hi-Z is defined as the point where data out is no longer driven.
Fig u re 21. AC me asur eme n t I/ O waveform
Table 17. Instruction times, process technology T7Y(1)
1. Technology T7Y devices are identified by process identification digit "X" in the device marking.
Test conditions specified in Table 10 and Table 18
Symbol Alt. Parameter Min. Typ. Max. Unit
tWWrite Status Register cycle time 5 15 ms
tPP (2)
2. When using the Page Program (PP) instruction to program consecutive bytes, optimized timings are
obtained with one sequence including all the bytes versus several sequences of only a few bytes. (1 ≤ n ≤
256)
Page Program cycle time (256 bytes) 1.4
5ms
Page Program cycle time (n bytes) 0.4+n*1/
256(2)
tSE Sector Erase cycle time 1 3 s
tBE Bulk Erase cycle time 4.5 10 s
Table 18. AC measu reme n t co n dit ions
Symbol Parameter Min. Max. Unit
CLLoad capacitance 30 pF
Input rise and fall times 5 ns
Input pulse voltages 0.2VCC to 0.8VCC V
Input timing reference voltages 0.3VCC to 0.7VCC V
Output timing reference voltages VCC / 2 V
AI07455
0
.8VCC
0
.2VCC
0.7VC
C
0.3VC
C
Input and Outp
ut
Timing Reference Leve
ls
I
nput Levels
0.5VC
C
DC and AC parameters M25P40
42/57
Table 19. AC charac teristics (25 MHz operatio n , d evi ce g rad e 3, VCC min = 2.7 V)
Identified with device belonging to X technology version; Test conditions specified in
Table 10 and Table 18
Symbol Alt. Parameter Min. Typ. Max. Unit
fCfC
Clock frequency for the following
instructions: FAST_READ, PP, SE, BE, DP,
RES, WREN, WRDI, RDSR, WRSR
D.C. 25 MHz
fRClock frequency for READ instructions D.C. 20 MHz
tCH(1)
1. tCH + tCL must be greater than or equal to 1/ fC
tCLH Clock High time 18 ns
tCL(1) tCLL Clock Low time 18 ns
tCLCH(2)
2. Value guaranteed by characterization, not 100% tested in production.
Clock Rise time(3) (peak to peak)
3. Expressed as a slew-rate.
0.1 V/ns
tCHCL(2) Clock Fall time(3) (peak to peak) 0.1 V/ns
tSLCH tCSS S Active Setup time (relative to C) 10 ns
tCHSL S Not Active Hold time (relative to C) 10 ns
tDVCH tDSU Data In Setup time 5 ns
tCHDX tDH Data In Hold time 5 ns
tCHSH S Active Hold time (relative to C) 10 ns
tSHCH S Not Active Setup time (relative to C) 10 ns
tSHSL tCSH S Deselect time 100 ns
tSHQZ(2) tDIS Output Disable time 15 ns
tCLQV tVClock Low to Output Valid 15 ns
tCLQX tHO Output Hold time 0 ns
tHLCH HOLD Setup time (relative to C) 10 ns
tCHHH HOLD Hold time (relative to C) 10 ns
tHHCH HOLD Setup time (relative to C) 10 ns
tCHHL HOLD Hold time (relative to C) 10 ns
tHHQX(2) tLZ HOLD to Output Low-Z 15 ns
tHLQZ(2) tHZ HOLD to Output High-Z 20 ns
tWHSL(4)
4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
Write Protect Setup time 20 ns
tSHWL(4) Write Protect Hold time 100 ns
tDP(2) S High to Deep Power-down mode 3 μs
tRES1(2) S High to Standby Power mode without
Electronic Signature Read 30 μs
tRES2(2) S High to Standby Power mode with
Electronic Signature Read 30 μs
M25P40 DC and AC parameters
43/57
Table 20. AC charac teristics (50 MHz operatio n , d evi ce g rade 6, VCC min = 2.7 V)
Test conditions specified in Table 10 an d Table 18
Symbol Alt. Parameter Min. Typ. Max. Unit
fCfC
Clock frequency for the following
instructions: FAST_READ, PP, SE, BE, DP,
RES, WREN, RDID, WRDI, RDSR, WRSR
D.C. 50 MHz
fRClock frequency for READ instructions D.C. 25 MHz
tCH(1)
1. tCH + tCL must be greater than or equal to 1/ fC
tCLH Clock High time 9 ns
tCL(1) tCLL Clock Low time 9 ns
tCLCH(2)
2. Value guaranteed by characterization, not 100% tested in production.
Clock Rise time(3) (peak to peak)
3. Expressed as a slew-rate.
0.1 V/ns
tCHCL(2) Clock Fall time(3) (peak to peak) 0.1 V/ns
tSLCH tCSS S Active Setup time (relative to C) 5 ns
tCHSL S Not Active Hold time (relative to C) 5 ns
tDVCH tDSU Data In Setup time 2 ns
tCHDX tDH Data In Hold time 5 ns
tCHSH S Active Hold time (relative to C) 5 ns
tSHCH S Not Active Setup time (relative to C) 5 ns
tSHSL tCSH S Deselect time 100 ns
tSHQZ(2) tDIS Output Disable time 8 ns
tCLQV tVClock Low to Output Valid 8 ns
tCLQX tHO Output Hold time 0 ns
tHLCH HOLD Setup time (relative to C) 5 ns
tCHHH HOLD Hold time (relative to C) 5 ns
tHHCH HOLD Setup time (relative to C) 5 ns
tCHHL HOLD Hold time (relative to C) 5 ns
tHHQX(2) tLZ HOLD to Output Low-Z 8 ns
tHLQZ(2) tHZ HOLD to Output High-Z 8 ns
tWHSL(4)
4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
Write Protect Setup time 20 ns
tSHWL(4) Write Protect Hold time 100 ns
tDP(2) S High to Deep Power-down mode 3 μs
tRES1(2) S High to Standby Power mode without
Electronic Signature Read 30 μs
tRES2(2) S High to Standby Power mode with
Electronic Signature Read 30 μs
DC and AC parameters M25P40
44/57
Table 21. AC characteristics (*40 MHz operation, device grade 6, VCC min = 2.3 V)
Test conditions specified in Table 10 an d Table 18
Symbol Alt. Parameter Min. Typ. Max. Unit
fCfC
Clock frequency for the following
instructions: FAST_READ, PP, SE, BE, DP,
RES, WREN, RDID, WRDI, RDSR, WRSR
D.C. 40 MHz
fRClock frequency for READ instructions D.C. 25 MHz
tCH(1)
1. tCH + tCL must be greater than or equal to 1/ fC
tCLH Clock High time 11 ns
tCL(1) tCLL Clock Low time 11 ns
tCLCH(2)
2. Value guaranteed by characterization, not 100% tested in production.
Clock Rise time(3) (peak to peak)
3. Expressed as a slew-rate.
0.1 V/ns
tCHCL(2) Clock Fall time(3) (peak to peak) 0.1 V/ns
tSLCH tCSS S Active Setup time (relative to C) 5 ns
tCHSL S Not Active Hold time (relative to C) 5 ns
tDVCH tDSU Data In Setup time 2 ns
tCHDX tDH Data In Hold time 5 ns
tCHSH S Active Hold time (relative to C) 5 ns
tSHCH S Not Active Setup time (relative to C) 5 ns
tSHSL tCSH S Deselect time 100 ns
tSHQZ(2) tDIS Output Disable time 8 ns
tCLQV tVClock Low to Output Valid 8 ns
tCLQX tHO Output Hold time 0 ns
tHLCH HOLD Setup time (relative to C) 5 ns
tCHHH HOLD Hold time (relative to C) 5 ns
tHHCH HOLD Setup time (relative to C) 5 ns
tCHHL HOLD Hold time (relative to C) 5 ns
tHHQX(2) tLZ HOLD to Output Low-Z 8 ns
tHLQZ(2) tHZ HOLD to Output High-Z 8 ns
tWHSL(4)
4. Only applicable as a constraint for a WRSR instruction when SRWD is set at 1.
Note: *40 MHz = max frequency device operation in extended Vcc range 2.3 to 2.7 V .
Write Protect Setup time 20 ns
tSHWL(4) Write Protect Hold time 100 ns
tDP(2) S High to Deep Power-down mode 3 μs
tRES1(2) S High to Standby Power mode without
Electronic Signature Read 30 μs
tRES2(2) S High to Standby Power mode with
Electronic Signature Read 30 μs
M25P40 DC and AC parameters
45/57
Table 22. AC characteristi cs, 75 MH z op eratio n , VCC m in = 2.7 V
Applies only to products made with T9HX technology, identified with process digit ‘4’ and
process letter “B” in th e pa rt number (1) (2)
Test conditions specified in Table 10 and Table 13
Symbol Alt. Parameter Min Typ(3) Max Unit
fCfC
Clock frequency for the following instructions:
FAST_READ, PP, SE, BE, DP, RES, WREN,
WRDI, RDID, RDSR, WRSR
D.C. 75 MHz
fRClock frequency for READ instructions D.C. 33 MHz
tCH(4) tCLH Clock High time 6 ns
tCL(3) tCLL Clock Low time 6 ns
tCLCH(5) Clock Rise time(6) (peak to peak) 0.1 V/ns
tCHCL(5) Clock Fall time(6) (peak to peak) 0.1 V/ns
tSLCH tCSS S Active Setup time (relative to C) 5 ns
tCHSL S Not Active Hold time (relative to C) 5 ns
tDVCH tDSU Data In Setup time 2 ns
tCHDX tDH Data In Hold time 5 ns
tCHSH S Active Hold time (relative to C) 5 ns
tSHCH S Not Active Setup time (relative to C) 5 ns
tSHSL tCSH S Deselect time 100 ns
tSHQZ(5) tDIS Output Disable time 8 ns
tCLQV tVClock Low to Output Valid under 30 pF/10 pF 8/6 ns
tCLQX tHO Output Hold time 0 ns
tHLCH HOLD Setup time (relative to C) 5 ns
tCHHH HOLD Hold time (relative to C) 5 ns
tHHCH HOLD Setup time (relative to C) 5 ns
tCHHL HOLD Hold time (relative to C) 5 ns
tHHQX(5) tLZ HOLD to Output Low-Z 8 ns
tHLQZ(5) tHZ HOLD to Output High-Z 8 ns
tWHSL(7) Write Protect Setup time 20 ns
tSHWL(7) Write Protect Hold time 100 ns
tDP(5) S High to Deep Power-down mode 3 μs
tRES1(5) S High to Standby mode without Read
Electronic Signature 30 μs
tRES2(5) S High to Standby mode with Read Electronic
Signature 30 μs
DC and AC parameters M25P40
46/57
Figure 22. Serial input timing
Figure 23. Wr ite Protect setup and hold timing during WRSR when SRWD = 1
1. Details of how to find the technology process in the marking are given in AN1995, see also Section 12:
Part numbering.
2. 75 MHz operation is available only on the VCC range 2.7 V - 3.6 V; the maximum frequency in the
extended Vcc range 2.3 V to 2.7 V is 40 MHz.
3. Typical values given for TA = 25 °C.
4. tCH + tCL must be greater than or equal to 1/ fC.
5. Value guaranteed by characterization, not 100% tested in production.
6. Expressed as a slew-rate.
7. Only applicable as a constraint for a WRSR instruction when SRWD is set at ‘1’.
C
D
S
MSB IN
Q
tDVCH
High Impedance
LSB IN
tSLCH
tCHDX
tCHCL
tCLCH
tSHCH
tSHSL
tCHSHtCHSL
C
D
S
Q
High Impedance
W
tWHSL tSHWL
AI07439
M25P40 DC and AC parameters
47/57
Figure 24. Hold timing
Figure 25. Output timing
C
Q
AI02032
S
D
HOLD
tCHHL
tHLCH
tHHCH
tCHHH
tHHQXtHLQZ
C
Q
AI01449
e
S
LSB OUT
D
ADDR.
LSB IN
tSHQZ
tCH
tCL
tQLQH
tQHQL
tCLQX
tCLQV
tCLQX
tCLQV
Package mechanical M25P40
48/57
11 Package mechanical
40 MHz is the maximum frequency for the devices operation in the extended Vcc range 2.3 V to 2.7 V.
Figure 26. SO8 narrow – 8 lead plastic Sma ll Outline, 150 mils body width, packag e
outline
1. Drawing is not to scale.
2. The ‘1’ that appears in the top view of the package shows the position of pin 1.
Table 23 . SO8 narrow – 8 lead plastic Sma ll Outline, 15 0 mils body width,
package mechanical data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 1.75 0.069
A1 0.10 0.25 0.004 0.010
A2 1.25 0.049
b 0.28 0.48 0.011 0.019
c 0.17 0.23 0.007 0.009
ccc 0.10 0.004
D 4.90 4.80 5.00 0.193 0.189 0.197
E 6.00 5.80 6.20 0.236 0.228 0.244
E1 3.90 3.80 4.00 0.154 0.150 0.157
e 1.27 – – 0.050 – –
h 0.25 0.50 0.010 0.020
k0°8°0°8°
L 0.40 1.27 0.016 0.050
L1 1.04 0.041
SO-A
E1
8
ccc
be
A
D
c
1
E
h x 45˚
A2
k
0.25 mm
L
L1
A1
GAUGE PLANE
M25P40 Packag e me ch anical
49/57
Figure 27. SO8W – 8 lead plastic small outline, 208 mils body width, package outline
1. Drawing is not to scale.
Table 24 . SO8 wide – 8 lead plasti c small outlin e, 208 mils body width,
package mechanical data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 2.50 0.098
A1 0.00 0.25 0.000 0.010
A2 1.51 2.00 0.059 0.079
b 0.40 0.35 0.51 0.016 0.014 0.020
c 0.20 0.10 0.35 0.008 0.004 0.014
CP 0.10 0.004
D 6.05 0.238
E 5.02 6.22 0.198 0.245
E1 7.62 8.89 0.300 0.350
e 1.27 – – 0.050 – –
k 0° 10° 0° 10°
L 0.50 0.80 0.020 0.031
N8 8
6L_ME
E
N
CP
be
A2
D
c
LA1 k
E1
A
1
Package mechanical M25P40
50/57
Fig ur e 28. QFN8L (ML P8) 8-lead, d u al flat packa g e n o lead, 6 × 5 mm, packag e
outline
1. Drawing is not to scale.
Table 25. QFN8L (ML P8) 8-lead du al f lat package no lea d , 6 x 5 mm package
mechanica l data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 0.90 0.80 1.00 0.035 0.031 0.039
A1 0.02 0.00 0.05 0.001 0.000 0.002
A3 0.20 0.008
b 0.40 0.35 0.48 0.016 0.014 0.019
D 6.00 0.236
D2 3.00 2.80 3.20 0.118 0.110 0.126
E 5.00 0.197
E2 3.00 2.80 3.20 0.118 0.110 0.126
e 1.27 0.050
L 0.60 0.50 0.75 0.024 0.020 0.030
0.08
D2
L
b
5X_ME
E2
e
E
D
AA3 A1 E2/2
0PIN 1 ID OPTION
M25P40 Packag e me ch anical
51/57
Figure 29. VFQFPN8 (MLP8) 8-lead Very thin Fine pitch Quad Flat Packa ge No lead,
6 × 5 mm, package outline
1. Drawing is not to scale.
2. The circle in the top view of the package indicates the position of pin 1.
Table 26. VFQFPN8 (MLP8 ) 8-lead Very thin Fine pitch Quad Flat Packa ge No lead,
6 × 5 mm, package m ech anica l data
Symbol millimeters inches
Typ Min Max Typ Min Max
A 0.85 0.80 1.00 0.0335 0.0315 0.0394
A1 0.00 0.05 0.0000 0.0020
A2 0.65 0.0256
A3 0.20 0.0079
b 0.40 0.35 0.48 0.0157 0.0138 0.0189
D 6.00 0.2362
D1 5.75 0.2264
D2 3.40 3.20 3.60 0.1339 0.1260 0.1417
E 5.00 0.1969
E1 4.75 0.1870
E2 4.00 3.80 4.30 0.1575 0.1496 0.1693
e 1.27 – – 0.0500 – –
R1 0.10 0.00 0.0039 0.0000
L 0.60 0.50 0.75 0.0236 0.0197 0.0295
Q 12° 12°
aaa 0.15 0.0059
bbb 0.10 0.0039
ddd 0.05 0.0020
D
E
70-M
E
A2
AA3
A1
E1
D1
eE2
D2
L
b
θ
R1
ddd
bbb
C
CAB
aaa CA
A
B
aaa CB
M
0.10 CA
0.10 CB
2x
Part numbering M25P40
52/57
12 Part numbering
Note: For a list of available options (speed, package, etc.) or for further information on any aspect
of t hi s devi ce, pl ease contac t y our neare st Numonyx Sales O ffi ce. T he category of second-
Table 27. Ordering information sc hem e
Example: M25P40 – V MN 6 T P B A
Device Type
M25P = Serial Flash memory for code storage
Device Function
40 = 4 Mbit (512 K x 8)
Secu rit y fea tur es(1)
– = no extra security
S = CFD programmed with UID
Operating Volt age
V = VCC = 2.3 V to 3.6 V
Package(2)
MN = SO8 (150 mil width)
MP = VFQFPN8 6 x 5 mm (MLP8)
MW = SO8W (208 mils width)
MS = QFN8L (MLP8) (2), 6 x 5 mm
Device grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3(3) = Automotive temperature range (–40 to 125 °C)
Device tested with High Reliability Certified Flow(4).
Option
blank = Standard Packing
T = Tape and Reel Packing
Plating technology
P or G = RoHS compliant
Lithography(5)
/X = T7Y, 150 nm technology
/4 = 110 nm, Catania Diffusion Plant
B = 110 nm , Fab 2 Diffusion Plant
Automotive Grade
A (4) = Automotive part (–40 to 125 °C)
Device tested with High Reliability Certified Flow (3)
1. Secure options are available upon customer request.
2. Exposed pad of 3 x 3 mm.
3. Device grade 3 available in an SO8 RoHS compliant package.
4. Numonyx strongly recommends the use of the Automotive Grade devices (Autograde 6 and grade 3) for use in an
automotive environment. The High Reliability Certified Flow (HRCF) is described in the quality note QNEE9801. Please ask
your nearest Numonyx sales office for a copy.
5. The letter (/X) denotes the automotive grade 3 device in 150 nm technology. The 110 nm device lithography is denoted by
the identification marking letter B. For more information on how to identify products by the Process Identification Letter,
please refer to AN1995: Serial Flash Memory Device Marking or contact your nearest Numonyx Sales Office.
M25P40 Par t number ing
53/57
Level Interconnect is marked on the package and on the inner box label, in compliance with
JE DE C Standard JESD 97. The maxim um ratings rel ate d to sol dering condit i ons ar e al so
marked on the inner box label.
Revisio n h istory M25P40
54/57
13 Revision history
Table 28. D ocum ent revision history
Date Revision Changes
12-Apr-2001 1.0 Document written.
25-May-2001 1.1 Serial Paged Flash Memory renamed as Serial Flash Memory.
11-Sep-2001 1.2
Changes to text: Signal Description/Chip Select; Hold Condition/1st para; Protection
modes; Release from Power-down and Read Electronic Signature (RES); Power-
up.
Repositioning of several tables and illustrations without changing their contents.
Power-up timing illustration; SO8W package removed.
Changes to tables: Abs Max Ratings/VIO; DC Characteristics/VIL.
16-Jan-2002 1.3
FAST_READ instruction added. Document revised with new timings, VWI, ICC3 and
clock slew rate. Descriptions of Polling, Hold Condition, Page Programming,
Release for Deep Power-down made more precise. Value of tW(max) modified.
12-Sep-2002 1.4
Clarification of descriptions of entering Standby Power mode from Deep Power-
down mode, and of terminating an instruction sequence or data-out sequence.
VFQFPN8 package (MLP8) added. Document promoted to Preliminary Data.
13-Dec-2002 1.5
Typical Page Program time improved. Deep Power-down current changed. Write
Protect setup and hold times specified, for applications that switch Write Protect to
exit the Hardware Protection mode immediately before a WRSR, and to enter the
Hardware Protection mode again immediately after.
12-Jun-2003 1.6 Document promoted from Preliminary Data to full Datasheet.
24-Nov-2003 2.0
Table of contents, warning about exposed paddle on MLP8, and Pb-free options
added.
40 MHz AC Characteristics table included as well as 25 MHz. ICC3(max), tSE(typ)
and tBE(typ) values improved. Change of naming for VDFPN8 package.
12-Mar-2004 3.0 Automotive range added. Soldering temperature information clarified for RoHS
compliant devices.
05-Aug-2004 4.0 Device grade information clarified. Data-retention measurement temperature
corrected. Details of how to find the date of marking added.
03-Jan-2005 5.0
Small text changes. Notes 2 and 3 removed from Table 27: Ordering information
scheme.
End timing line of tSHQZ modified in Figure 25: Ou tput timing.
01-Aug-2005 6.0 Updated Page Program (PP) instructions in Page Programming, Page Program
(PP), Instruction times, process tec hnology T9HX.
24-Oct-2005 7.0
50 MHz operation added (see Table 20: AC characteri stics (50 MHz operation,
device grade 6, VCC min = 2.7 V)). All packages are RoHS compliant. Blank option
removed from under Plating technology in Table 27: Ordering information scheme.
MLP package renamed as VFQFPN, silhouette and package mechanical drawing
updated (see on page 1 and Figure 29: VFQFPN8 (MLP8) 8-lead V ery thin Fine
pitch Quad Flat Package No lead, 6 × 5 mm, package outline.
M25P40 Revision history
55/57
22-Dec-2005 8.0
Note 2 added below Figure 26 and note 3 added below Figure 29
tRES1 and tRES2 modified in Table 20: AC characteristics (50 MHz operation, device
grade 6, VCC min = 2.7 V).
Read Id enti fi ca tio n (RD ID ) added. Titles of Figure 29 and Table 26 corrected.
14-Apr-2006 9
The data contained in Table 12 and Table 19 is no longer preliminary data.
Figure 3: Bus Master and memory devic es on the SPI bus modified and Note 2
added.
40 MHz frequency condition modified for ICC3 in Tabl e 15: DC characte ri sti cs
(device grade 3).
Condition changed for the Data Retention parameter in Table 12: Da ta reten tion and
endurance. VWI parameter for device grade 3 added to Tabl e 8: Power - up timing
and VW I thr esho ld.
SO8 package specifications updated (see Figure 26 and Table 23).
/X process added to Table 27: Ordering information scheme.
05-Jun-2006 10
tRES1 and tRES2 parameter timings changed for devices produced with the “X”
process technology in Table 19 and Table 19.
SO8 Narrow package specifications updated (see Figure 26 and Table 23).
18-Dec-2006 11
Hardware Write Protection feature added on page 1. Small text changes.
Section 2.7: VCC supply voltage and Se ction 2.8: VSS ground added.
Fi gur e 3: Bu s Ma ster an d memor y de vi ces on t he SPI bu s modified, note 2 removed
and replaced by explanatory paragraph.
WIP bit behavior specified at Power-up in Section 7: Power-up and Power-down.
TLEAD added to Tab le 9: Ab so lu te max im um ra ti n g s and VIO max modified.
VFQFPN8 package specifications updated (see Table 26 and Figure 29).
25-Jan-2007 12
VCC voltage range from W17 2007 is extended to 2.3 V to 3.6 V.
Table 21: AC characteristics (33 MHz operation, device grade 6, VCCmin =2.3 V)
added.
AC characteristics at 40 MHz removed.
15-May-2007 13
40 MHz operation added (see Table 2 1: AC characteristics (*40 MHz operation,
dev i ce gra de 6, VC C m in = 2. 3 V).
Removed the note below Tabl e 10.
Removed “AC characteristics (33 MHz operation, device grade 6, VCCmin =2.3 V)”
Ta b le .
26-Jun-2007 14
Modified the note below Table 13.
Changed test condition for ICC3 in Table 14.
Changed clock frequency, from 20 to 25 MHz, in Table 20 and Table 21.
10-Dec-2007 15 Added Numonyx Branding.
15-Oct-2008 16
Changed frequency up to 75 MHz (only in the standard Vcc range).
Added new packages.
Added UID/CFD protection.
Extended Vcc range to 2.3 V.
Table 28. D ocument revision history (co ntinued)
Date Revision Changes
Revisio n h istory M25P40
56/57
18-February-
2009 17
Revised the following:
– Table 8: Vwi Min (Grade 3) = 1V vs. 2.1V or (remove one row & Grade indication)
– Table 11: Erase/Program cycles = 100000 cycles also for Grade 3 (instead of
10000)
– Table 13: Icc3 Operating Current (READ) ' change on section Test Condition
OLD: C = 0.1VCC / 0.9.VCC at 40 MHz and 75 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 40 MHz, 50 MHz and 75 MHz, Q = open
OLD: C = 0.1VCC / 0.9.VCC at 25 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 25 MHz and 33 MHz, Q = open
– Table 14: Icc3 Operating Current (READ) ' change on section Test Condition
OLD: C = 0.1VCC / 0.9.VCC at 25 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 25 MHz and 75 MHz, Q = open
OLD: C = 0.1VCC / 0.9.VCC at 20 MHz, Q = open
NEW: C = 0.1VCC / 0.9.VCC at 20 MHz and 33 MHz, Q = open
– Table 15: this is valid also for grade 3:
OLD: Instruction times, process technology T9HX(1) (device grade 6)
NEW: Instruction times, process technology T9HX(1)
– Table 16: this is valid also for grade 3:
OLD: Instruction times, process technology T7Y(1) (device grade 6)
NEW: Instruction times, process technology T7Y(1)
– Table 17: with last 2 previous modifications it is possible to remove it
– Table 19: Insert in heading:” identified with device belonging to X technology
version;” Change tRES1 = 30us & tRES2 = 30us (remove 3us & 1.8us & note 5)
14-May-2009 18 Revised cross references in Table 11.: De vice grade and AC table correl ation.
Table 28. D ocument revision history (co ntinued)
Date Revision Changes
M25P40
57/57
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