cExpress-SL COM Express Compact Size Type 6 Module with 6th Gen Intel(R) CoreTM and Celeron(R) Processors Features 6th Generation Intel(R) CoreTM and Celeron(R) Processors Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz Two DDI channels, one LVDS (build option 4 lanes eDP), GbE, up to 6 PCIe x1 (build option) Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0 Supports Smart Embedded Management Agent (SEMA(R)) functions Extreme Rugged operating temperature: -40C to +85C New supports up to 3 independent displays (build option) Specifications Core System CPU 6th Generation Intel(R) CoreTM and Celeron(R) Processors - Mobile 14nm process (formerly "Skylake-U") CoreTM i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2) CoreTM i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2) CoreTM i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2) Celeron(R) 3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1) Supports: Intel(R) VT, Intel(R) TXT, Intel(R) SSE4.2, Intel(R) HT Technology, Intel(R) 64 Architecture, Execute Disable Bit, Intel(R) Turbo Boost Technology 2.0, Intel(R) AVX2, Intel(R) AES-NI, PCLMULQDQ Instruction, Intel(R) Secure Key and Intel(R) TSX. Note: Availability of features may vary between processor SKUs. Memory Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual SODIMM socket Embedded BIOS AMI EFI with CMOS backup in 8MB SPI BIOS with Intel(R) AMT 11.0 support (AMT support available on CoreTM i7/i5 only) Cache 4MB for CoreTM i7, 3MB for CoreTM i5 and CoreTM i3, 2MB for Celeron(R) Expansion Busses Up to 6 PCI Express x1 (AB): Lanes 0-5 (configurable to x2, x4, Lane 5 by build option) Note: Gen3 for CoreTM i7/i5/i3, Gen2 for Celeron(R) LPC bus, SMBus (system) , I2C (user) SEMA Board Controller Supports : Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat panel control, general purpose I2C, failsafe BIOS (dual BIOS ), watchdog timer and fan control Debug Headers 40-pin multipurpose flat cable connector for use with DB-40 debug module providing BIOS POST code LED, BMC access, SPI BIOS flashing, power testpoints, debug LEDs 60-pin XDP header for ICE debug of CPU/chipset Video GPU Feature Support Intel(R) Generation 9 LP Graphics Core Architecture, supporting 3 independent and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP outputs Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX 11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support OpenGL 5.0, 4.4/4.3 and ES 2.0 support OpenCL 2.1, 2.0/1.2 support Digital Display Interface DDI1/2 supporting DisplayPort/HDMI/DVI LVDS Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC eDP 4 lane support build option, in place of LVDS Audio Chipset Intel(R) HD Audio integrated in SOC Audio Codec On carrier Express-BASE6 (ALC886 standard support) Ethernet Intel(R) MAC/PHY: i219LM with AMT 11.0 support Interface: 10/100/1000 GbE connection I/O Interfaces USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7) SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron(R) supports two ports only Serial: 2 UART ports with console redirection GPIO: 4 GPO and 4 GPI from BMC Note: "build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that these "build option" part numbers will need to be newly created and this will result in production lead times. Specifications Super I/O Supported on carrier if needed (standard support for W83627DHG-P) TPM Chipset: Atmel AT97SC3204 Type: TPM 1.2 Power Standard Input: ATX = 12V5% / 5Vsb 5% or AT = 12V5% Wide Input: ATX = 5-20V / 5Vsb 5% or AT = 5-20V Management: ACPI 5.0 compliant, Smart Battery support Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) ECO mode: support deep S5 mode for power saving Operating Systems Standard Support Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit Mechanical and Environmental Form Factor: PICMG COM.0: Rev 2.1 Type 6 Dimension: Compact size: 95 mm x 95 mm Operating Temperature Standard: 0C to 60C Extreme RuggedTM: -40C to +85C (build option) Humidity 5-90% RH operating, non-condensing 5-95% RH storage (and operating with conformal coating) Shock and Vibration IEC 60068-2-64 and IEC-60068-2-27 MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D HALT Thermal Stress, Vibration Stress, Thermal Shock and Combined Test Extended Support (BSP) WES7 32/64-bit, Linux 64-bit Note: "Build option" indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product. Be aware that part numbers for SKUs with "build options" will need to be created and may cause production lead times. Functional Diagram SODIMM Single/dual channel 18/24-bit LVDS LVDS eDP to LVDS 4-16 GB DDR4 non ECC eDP SODIMM eDP 4 lanes (build option) 8x USB 2.0/1.0 (ports 0-7) 4x PCIe x1 Gen3/2 (port 0-3) (support x2, x4) 1x PCIe x1 Gen3/2 (port 4) 1x PCIe x1 Gen3/2 (port 5, build option) 6th Generation Intel(R) Core(R)/Celeron Processor 4-16 GB DDR4 non ECC DDI1 (4 lanes) DP/HDMI DDI2 (4 lanes) DP/HDMI SoC (formerly "Skylake-U") GbE 4x USB 3.0 upgrade (port 0-3) 2x SATA 6Gb/s (port 0/1) 1x SATA 6Gb/s (port 2) (only i7/i5/i3) XDP 60 HD Audio UART0, UART1 LPC to UART TPM LPC bus SMBus GPIO PCA9535 SMBus 4x GPO, 4x GPI GP I2C DDC I2C SPI_CS# SPI New SEMA BMC SPI 0 BIOS SPI 1 BIOS LM73 Ordering Information Accessories cExpress-SL-i7-6600U Compact COM Express(R) Type 6 module with Intel(R) CoreTM i76600U and GT2 graphics cExpress-SL-i5-6300U Compact COM Express(R) Type 6 module with Intel(R) CoreTM i56300U and GT2 graphics cExpress-SL-i3-6100U Compact COM Express(R) Type 6 module with Intel(R) CoreTM i36100U and GT2 graphics cExpress-SL-3955U Compact COM Express(R) Type 6 module with Intel(R) Celeron(R) 3955U and GT1 graphics Starter Kit Heat Spreaders HTS-cSL-BT Heatspreader for cExpress-SL with through hole standoffs for top mounting Passive Heatsinks COM Express Type 6 Starter Kit Plus COM Express formfactor starter kit with Express-BASE6 board, power supply, and accessory kit HTS-cSL-B Heatspreader for cExpress-SL with threaded standoffs for bottom mounting THS-cSL-B Low profile heatsink for cExpress-SL with threaded standoffs for bottom mounting THS-cSL-BT Low profile heatsink for cExpress-SL with through hole standoffs for top mounting THSH-cSL-B High profile heatsink for cExpress-SL with threaded standoffs for bottom mounting Active Heatsink THSF-cSL-B High profile heatsink with Fan for cExpress-SL with threaded standoffs for bottom mounting www.adlinktech.com All products and company name listed are trademarks or trade names of their respective companies. Updated Oct. 14, 2016. (c)2016 ADLINK Technology, Inc. All Rights Reserved. All specifications are subject to change without further notice.