cExpress-SL
COM Express Compact Size Type 6 Module with
6th Gen Intel
®
Core™ and Celeron
®
Processors
Features
●
6th Generation Intel
®
Core™ and Celeron
®
Processors
●
Up to 32GB Dual Channel non-ECC DDR4 at 1867/2133MHz
●
Two DDI channels, one LVDS (build option 4 lanes eDP),
supports up to 3 independent displays
●
GbE, up to 6 PCIe x1 (build option)
●
Up to three SATA 6 Gb/s, four USB 3.0 and four USB 2.0
●
Supports Smart Embedded Management Agent (SEMA
®
) functions
●
Extreme Rugged operating temperature: -40°C to +85°C
(build option)
New
Specications
● Core System
CPU
6th Generation Intel
®
Core™ and Celeron
®
Processors - Mobile 14nm process
(formerly “Skylake-U”)
Core™ i7-6600U 2.6/3.4GHz (Turbo), 4M, 15W (7.5W cTDP)(2C/GT2)
Core™ i5-6300U 2.4/3.0GHz (Turbo), 3M, 15W (7.5W cTDP) (2C/GT2)
Core™ i3-6100U 2.3GHz, 3M, 15W (7.5W cTDP) (2C/GT2)
Celeron
®
3955U 2GHz, 2M, 15W (10W cTDP) (2C/GT1)
Supports: Intel
®
VT, Intel
®
TXT, Intel
®
SSE4.2, Intel
®
HT Technology, Intel
®
64
Architecture, Execute Disable Bit, Intel
®
Turbo Boost Technology 2.0, Intel
®
AVX2, Intel
®
AES-NI, PCLMULQDQ Instruction, Intel
®
Secure Key and Intel
®
TSX.
Note: Availability of features may vary between processor SKUs.
Memory
Dual channel 1867/2133 MHz non-ECC DDR4 memory up to 32GB in dual
SODIMM socket
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS with Intel
®
AMT 11.0 support
(AMT support available on Core™ i7/i5 only)
Cache
4MB for Core™ i7, 3MB for Core™ i5 and Core™ i3, 2MB for Celeron®
Expansion Busses
Up to 6 PCI Express x1 (AB): Lanes 0-5 (congurable to x2, x4, Lane 5 by build
option)
Note: Gen3 for Core™ i7/i5/i3, Gen2 for Celeron® LPC bus, SMBus (system) , I2C (user)
SEMA Board Controller
Supports : Voltage/current monitoring, power sequence debug support,
AT/ATX mode control, logistics and forensic information, at panel control,
general purpose I
2
C, failsafe BIOS (dual BIOS ), watchdog timer and fan
control
Debug Headers
40-pin multipurpose at cable connector for use with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS ashing, power
testpoints, debug LEDs
60-pin XDP header for ICE debug of CPU/chipset
● Video
GPU Feature Support
Intel
®
Generation 9 LP Graphics Core Architecture, supporting 3 independent
and simultaneous display combinations of DisplayPort/HDMI/LVDS or eDP
outputs
Hardware encode/transcode HD content (including HEVC DirectX 12, DirectX
11.2, DirectX 11.1, DirectX 11, DirectX 10.1, DirectX 10, DirectX 9 support
OpenGL 5.0, 4.4/4.3 and ES 2.0 support
OpenCL 2.1, 2.0/1.2 support
Digital Display Interface
DDI1/2 supporting DisplayPort/HDMI/DVI
LVDS
Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC
eDP
4 lane support build option, in place of LVDS
● Audio
Chipset
Intel
®
HD Audio integrated in SOC
Audio Codec
On carrier Express-BASE6 (ALC886 standard support)
● Ethernet
Intel
®
MAC/PHY: i219LM with AMT 11.0 support
Interface: 10/100/1000 GbE connection
● I/O Interfaces
USB: 4x USB 1.1/2.0/3.0 (USB 0,1,2,3) and 4x USB 1.1/2.0 (USB 4,5,6,7)
SATA: Up to three ports SATA 6 Gb/s (SATA 0,1,2; Celeron
®
supports two ports
only
Serial: 2 UART ports with console redirection
GPIO: 4 GPO and 4 GPI from BMC
Note: “build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that these “build option” part numbers will need to be newly created and this will result in production lead times.
Note: “Build option” indicates an alternative BOM conguration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Specications
● Super I/O
Supported on carrier if needed (standard support for W83627DHG-P)
● TPM
Chipset: Atmel AT97SC3204
Type: TPM 1.2
● Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Wide Input: ATX = 5-20V / 5Vsb ±5% or AT = 5-20V
Management: ACPI 5.0 compliant, Smart Battery support
Power States: C1-C6, S0, S1, S3, S4, S5 , S5 ECO mode (Wake on USB S3/S4,
WOL S3/S4/S5)
ECO mode: support deep S5 mode for power saving
● Operating Systems
Standard Support
Windows 7 32/64-bit, Windows 10/8.1 64-bit, Linux 64-bit
Extended Support (BSP)
WES7 32/64-bit, Linux 64-bit
● Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 2.1 Type 6
Dimension: Compact size: 95 mm x 95 mm
Operating Temperature
Standard: 0°C to 60°C
Extreme Rugged™: -40°C to +85°C (build option)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A,
Table 214-I, Condition D
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
Functional Diagram
GbE
6th Generaon
Intel® Core®/Celeron
Processor
SoC
(formerly “Skylake-U”)
SODIMM
4-16 GB DDR4
non ECC
DDI1 (4 lanes)
DP/HDMI
4x PCIe x1 Gen3/2
(port 0-3) (support x2, x4)
HD Audio
2x SATA 6Gb/s (port 0/1)
8x USB 2.0/1.0
(ports 0-7)
XDP
60
DDI2 (4 lanes)
DP/HDMI
4x USB 3.0 upgrade
(port 0-3)
Single/dual channel
18/24-bit LVDS
UART0, UART1
eDP
LM73
GPIO
PCA9535
GP I2C
SPI 0
BIOS
LPC bus
SPI
SPI 1
BIOS
DDC I2C
SPI_CS#
SODIMM
4-16 GB DDR4
non ECC
eDP 4 lanes (build opon)
1x PCIe x1 Gen3/2
(port 4)
1x SATA 6Gb/s (port 2)
(only i7/i5/i3)
SMBus
SMBus
1x PCIe x1 Gen3/2
(port 5, build opon)
LPC
to
UART
New
SEMA
BMC
TPM
4x GPO, 4x GPI
LVDS
eDP to LVDS
www.adlinktech.com
All products and company name listed are trademarks or trade names of their respective companies.
Updated Oct. 14, 2016. ©2016 ADLINK Technology, Inc. All Rights Reserved.
All specifications are subject to change without further notice.
Ordering Information
●
cExpress-SL-i7-6600U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i7-
6600U and GT2 graphics
●
cExpress-SL-i5-6300U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i5-
6300U and GT2 graphics
●
cExpress-SL-i3-6100U
Compact COM Express
®
Type 6 module with Intel
®
Core™ i3-
6100U and GT2 graphics
●
cExpress-SL-3955U
Compact COM Express
®
Type 6 module with Intel
®
Celeron
®
3955U and GT1 graphics
Accessories
Heat Spreaders
●
HTS-cSL-B
Heatspreader for cExpress-SL with threaded standoffs for
bottom mounting
●
HTS-cSL-BT
Heatspreader for cExpress-SL with through hole standoffs for
top mounting
Passive Heatsinks
●
THS-cSL-B
Low profile heatsink for cExpress-SL with threaded standoffs
for bottom mounting
●
THS-cSL-BT
Low profile heatsink for cExpress-SL with through hole
standoffs for top mounting
●
THSH-cSL-B
High profile heatsink for cExpress-SL with threaded standoffs
for bottom mounting
Active Heatsink
●
THSF-cSL-B
High profile heatsink with Fan for cExpress-SL with threaded
standoffs for bottom mounting
Starter Kit
●
COM Express Type 6 Starter Kit Plus
COM Express formfactor starter kit with Express-BASE6 board,
power supply, and accessory kit
