Part Number 460EX Revision 1.19 - June 17, 2009 460EX Preliminary Data Sheet PowerPC 460EX Embedded Processor Features * PowerPC(R) 440 processor operating between 600MHz and 1.000GHz with 32KB I-cache and Dcache and 256KB L2/SRAM with parity checking * On-chip memory (64KB) * Two Ethernet 10/100/1000Mbps half- or fullduplex interfaces. Operational modes supported are MII, GMII, RGMII, and SGMII with QoS, Jumbo frames, interrupt coalescing, and TCP/IP acceleration * Floating Point Unit * Up to four serial (UART) ports (16750 compatible) * Processor Local Bus (PLB) with 128-bit width * USB 2.0 Host/Device OTG and Host interface * Double Data Rate 2/1 (DDR2/1) Synchronous DRAM (SDRAM) interface * Two IIC interfaces (one with boot parameter read capability) * One four-channel DMA (Direct Memory Access) for internal and external peripherals * NAND Flash interface * SPI interface * One single-channel, high-performance DMA for internal use * External 32-bit peripheral bus (EBC) for up to six devices. Up to 100MHz * Programmable Interrupt Controller (UIC) with up to 16 external interrupts * Programmable General Purpose Timers (GPTs) * Two PCI Express 1.1 interfaces--one 4-lane and one 1-lane * SATA controller * General Purpose I/O (GPIO) interface * JTAG interface for board level testing * Boot from PCI memory, NOR Flash on the external peripheral bus, or NAND Flash on the NAND Flash interface * Optional security feature with KASUMI * Available in RoHS compliant, lead-free package * PCI V2.3 interface. Thirty-two bits at up to 66MHz Description Designed specifically to address high-end embedded applications, the PowerPC 460EX (PPC460EX) provides a high-performance, low-power solution that interfaces to a wide range of peripherals and incorporates on-chip power management features. Technology: CMOS Cu-08, 90nm. This chip contains a high-performance RISC processor, on-chip memory, a floating point unit, a DDR2/1 SDRAM controller, PCI and PCI Express bus interfaces, control for external ROM and peripherals, DMA with scatter/gather support, Ethernet ports, serial ports, IIC interfaces, SPI interface, USB ports, NAND Flash interface, SATA interface, an optional security feature with KASUMI, and general purpose I/O. Typical power: Less than 5W at 1GHz with DDR2. AMCC Proprietary Package: 35mm, 728-ball thermally and electrically enhanced plastic ball grid array (TE-EPBGA). RoHS compliant package available. Supply voltages required: 3.3V, 2.5V (DDR1, Ethernet), 1.8V (DDR2), 1.2V. 1 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Contents Ordering and PVR Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 PPC460EX Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 PowerPC 440 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Floating Point Unit (FPU) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 L2 Cache/SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 On-Chip Memory (OCM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Internal Buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Security Function (Optional) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 PCI Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 PCI Express Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 DDR2/1 SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 External Peripheral Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Ethernet Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 DMA 4-Channel Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 I2O/DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Serial Ports (UART) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 IIC Bus Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Serial Peripheral Controller (SPI/SCP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Universal Serial Bus 2.0 (USB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Serial ATA (SATA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 NAND Flash Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 General Purpose Timers (GPT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Package Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Assembly Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 DDR2/1 SDRAM Interface Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91 PCI Express Interface Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Serial ATA (SATA) Interface Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 PCI-E and SATA Reference Clock AC Coupling Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Boot Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 Revision Log . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103 2 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Figures Figure 1. Order Part Number Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2. PPC460EX Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3. 35mm, 728-Ball TE-PBGA Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 4. Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Figure 5. Input Setup and Hold Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Figure 6. Output Delay and Float Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 Figure 7. Setup and Hold Timing Waveforms for RGMII Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Figure 8. DDR SDRAM Simulation Signal Termination Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Figure 9. DDR SDRAM Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Figure 10. DDR SDRAM Memory Data and DQS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 Figure 11. LVDS PCIe or SATA Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Figure 12. LVPECL PCIe or SATA Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 Figure 13. CML PCIe or SATA Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 Figure 14. HCSL PCIe or SATA Reference Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 AMCC Proprietary 3 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Tables Table 1. System Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 2. DCR Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 3. Recommended Reflow Soldering Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 4. JEDEC Moisture Sensitivity Level and Ball Composition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 5. Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 6. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Table 7. Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61 Table 8. Non-Functional Ball Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Table 9. Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 10. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74 Table 11. Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 12. 3.3V, 2.5V, and LVDS I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Table 13. Typical DC Power Supply Requirements Using DDR2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 14. Typical DC Power Supply Requirements Using DDR1 Memory . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 16. Maxiumum DC Power Supply Requirements Using DDR1 Memory . . . . . . . . . . . . . . . . . . . . . . 78 Table 15. Maxiumum DC Power Supply Requirements Using DDR2 Memory . . . . . . . . . . . . . . . . . . . . . . 78 Table 17. DC Power Supply Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 18. Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Table 19. Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 Table 20. Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 Table 21. RGMII I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87 Table 22. AC I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88 Table 23. DDR I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Table 24. DDR SDRAM Output Driver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92 Table 25. DDR SDRAM Operation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93 Table 26. I/O Timing--DDR SDRAM TDS for 200 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94 Table 27. I/O Timing--DDR SDRAM TSA, and THA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Table 28. I/O Timing--DDR SDRAM Write Timing TSD and THD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 Table 29. I/O Timing--DDR SDRAM Read Timing TSD and THD for 200MHz . . . . . . . . . . . . . . . . . . . . . . 96 Table 30. PCI Express Transmitter Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97 Table 31. PCI Express Receiver Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Table 32. PCI Express Reference Clock Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Table 33. SATA Transmitter Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 34. SATA Receiver Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 35. SATA Reference Clock Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99 Table 36. Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102 4 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Ordering and PVR Information For information on the availability of the following parts, contact your local AMCC sales office. For additional information on the part number structure see Figure 1. Product Name Order Part Number (see Notes) Package Revision Level PVR Value JTAG ID PPC460EX PPC460EX-opAfff(f)T 35mm 728-ball TE-EPBGA A 0x130218A2 0x144101E1 PPC460EX PPC460EX-opBfff(f)T 35mm 728-ball TE-EPBGA B 0x130218A4 0x144101E1 Notes: Characters following the dash (-): 1. 2. 3. 4. 5. o = Security option: S = security feature present, N = no security p = Package type: U = lead-free (RoHS compliant), T = contains lead. A = Chip revision level A, B = Chip revision level B fff(f) = Processor frequency: fff = 600 = 600MHz, fff = 800 = 800MHz, ffff = 1000 = 1GHz T = Case temperature range of -40C to +85C. Each part number contains a revision code. This is the die mask revision number and is included in the part number for identification purposes only. The PVR (Processor Version Register) and the JTAG ID register are software accessible (read-only) and contain information that uniquely identifies the part. Refer to the PowerPC 460EX/EXr/GT Embedded Processor User's Manual for details on accessing these registers. Figure 1. Order Part Number Key PPC460EX-SUB1000T AMCC Part Number Security Feature Package Case Temperature Range Processor Frequency Revision Level Note: The example P/N above contains the security feature, is lead-free, is capable of running at 1GHz, and is shipped in a tray (tape-and-reel packaging is not available). AMCC Proprietary 5 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Block Diagram Figure 2. PPC460EX Functional Block Diagram Clock Control Reset 16 External Interrupts Power Mgmt DCRs Timers External Bus Controller NAND Flash Controller On-chip Peripheral Bus (OPB)-32 bits, 100MHz Arb UART IIC(x2) x4 BSC MMU UIC PPC440 SPI GPT GPIO DCR Bus Processor FPU JTAG Trace 32 KB I-Cache 32 KB D-Cache SRAM Cntl S2 OCM 64KB DMA Cntl (4-Ch) HSDMA Cntl S7 S1 Security Engine OPB Bridge S3 S0 M1 Arb S5 S4 Low Latency (LL) Segment 256KB L2 Cache M0 TRNG/ PKA w/KASUMI S6 M4 M6 M7 M8 M9 Processor Local Bus (PLB)-128 bits, 200MHz M3 M5 M2 High Bandwidth (HB) Segment S4 S3 S2 M11 M10 S1 PLB-to-AHB Bridge MAL w/ Int. Coalescing S0 M1 S1 AHB Bus-32 bits, 200MHz PCI-Express Int PCI-E0 PCI-E1 (x1) Hand (x4) 1 lane 4 lanes HSS x1 PCI 33/66 MHz Memory Queue 32-bit DDR 1 and 2 SDRAM Cntrlr TAH/QoS 10/100/1000 x2 S6 DMA Cntl M1 USB 2.0 USB 2.0 OTG Host Cntl Cntl Ethernet RGMII Bridge 64 + 8 Arb ZMII Bridge ICM HSS x1/x4 SGMII SATA ULPI SDR Interface x2 Sn = Slave n Mn = Master n The PPC460EX is a system on a chip (SOC). 6 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Address Maps The PPC460EX incorporates two address maps. The first is a fixed processor System Memory Address Map. This address map defines the possible contents of various address regions which the processor can access. The second is the DCR Address Map for Device Configuration Registers (DCRs). The DCRs are accessed by software running on the PPC460EX processor through the use of mtdcr and mfdcr instructions. Table 1. System Memory Address Map (Part 1 of 3) Function Local Memory (LL)1 Internal PLB Interfaces (LL)1 Sub Function Start Address End Address Size DDR SDRAM 0000 0000 0000 0000 0000 0003 FFFF FFFF 16GB SRAM (L2 Cache) 0000 0004 0000 0000 0000 0004 0003 FFFF 256KB On-Chip Memory (OCM) 0000 0004 0004 0000 0000 0004 0004 FFFF 64KB Reserved 0000 0004 0005 0000 0000 0004 000F FFFF 704KB I2O/DMA 0000 0004 0010 0000 0000 0004 0010 FFFF 64KB I2O Registers 0000 0004 0010 0000 0000 0004 0010 00FF 256B Reserved 0000 0004 0010 0100 0000 0004 0010 01FF 256B HSDMA Registers 0000 0004 0010 0200 0000 0004 0010 02FF 256B Reserved 0000 0004 0010 0300 0000 0004 0010 FFFF 63.25KB PKA & TRNG (EIPPKP) 0000 0004 0011 0000 0000 0004 0011 FFFF 64KB Reserved 0000 0004 0012 0000 0000 0004 0017 FFFF 384KB Security Function (EIP94) 0000 0004 0018 0000 0000 0004 001F FFFF 512KB Reserved 0000 0004 0020 0000 0000 0004 BFF7 FFFF ~3GB USB 2.0 OTG 0000 0004 BFF8 0000 0000 0004 BFFB FFFF 256KB Reserved 0000 0004 BFFC 0000 0000 0004 BFFC FFFF 64KB USB 2.0 Host (OHCI) 0000 0004 BFFD 0000 0000 0004 BFFD 03FF 1KB USB 2.0 Host (EHCI) 0000 0004 BFFD 0400 0000 0004 BFFD 07FF 1KB AHBDMA for SATA 0000 0004 BFFD 0800 0000 0004 BFFD 0BFF 1KB Reserved 0000 0004 BFFD 0C00 0000 0004 BFFD 0FFF 1KB SATA 0000 0004 BFFD 1000 0000 0004 BFFD 17FF 2KB Reserved 0000 0004 BFFD 1800 0000 0004 BFFD 1FFF 2KB AHB Arbiter 0000 0004 BFFD 2000 0000 0004 BFFD 23FF 1KB Reserved 0000 0004 BFFD 2400 0000 0004 BFFF FFFF 183KB Internal AHB Peripherals (LL) AMCC Proprietary 7 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 1. System Memory Address Map (Part 2 of 3) Function Sub Function Start Address End Address Size 0000 0004 C000 0000 0000 0004 E7FF FFFF 640MB Reserved 0000 0004 E800 0000 0000 0004 EF5F FFFF 118MB General Purpose Timer 0000 0004 EF60 0000 0000 0004 EF60 01FF 512B Reserved 0000 0004 EF60 0200 0000 0004 EF60 02FF 256B UART0 0000 0004 EF60 0300 0000 0004 EF60 0307 8B Reserved 0000 0004 EF60 0308 0000 0004 EF60 03FF 248B UART1 0000 0004 EF60 0400 0000 0004 EF60 0407 8B Reserved 0000 0004 EF60 0408 0000 0004 EF60 04FF 248B UART2 0000 0004 EF60 0500 0000 0004 EF60 0507 8B Reserved 0000 0004 EF60 0508 0000 0004 EF60 05FF 248B UART3 0000 0004 EF60 0600 0000 0004 EF60 0607 8B Reserved 0000 0004 EF60 0608 0000 0004 EF60 06FF 248B IIC0 0000 0004 EF60 0700 0000 0004 EF60 071F 32B Reserved 0000 0004 EF60 0720 0000 0004 EF60 07FF 224B IIC1 0000 0004 EF60 0800 0000 0004 EF60 081F 32B Reserved 0000 0004 EF60 0820 0000 0004 EF60 08FF 224B SPI 0000 0004 EF60 0900 0000 0004 EF60 090F 16B Reserved 0000 0004 EF60 0910 0000 0004 EF60 09FF 240B OPB Arbiter 0000 0004 EF60 0A00 0000 0004 EF60 0A3F 64B Reserved 0000 0004 EF60 0A40 0000 0004 EF60 0AFF 192B GPIO0 Controller 0000 0004 EF60 0B00 0000 0004 EF60 0B7F 128B Reserved 0000 0004 EF60 0B80 0000 0004 EF60 0BFF 128B GPIO1 Controller 0000 0004 EF60 0C00 0000 0004 EF60 0C7F 128B Reserved 0000 0004 EF60 0C80 0000 0004 EF60 0CFF 128B Ethernet PHY ZMII 0000 0004 EF60 0D00 0000 0004 EF60 0D0F 16B Reserved 0000 0004 EF60 0D10 0000 0004 EF60 0DFF 240B EMAC0 Controller 0000 0004 EF60 0E00 0000 0004 EF60 0EFF 256B EMAC1 Controller 0000 0004 EF60 0F00 0000 0004 EF60 0FFF 256B Reserved 0000 0004 EF60 1000 0000 0004 EF60 12FF 768B TAHOE0 Accelerator 0000 0004 EF60 1300 0000 0004 EF60 13FF 256B TAHOE1 Accelerator 0000 0004 EF60 1400 0000 0004 EF60 14FF 256B RGMII0 Controller 0000 0004 EF60 1500 0000 0004 EF60 150F 16B Reserved 0000 0004 EF60 1510 0000 0004 FEFF FFFF ~250MB EBC Memory Bank 0 0000 0004 FF00 0000 0000 0004 FFFF FFFF 16MB Internal PLB Interfaces (LL) Reserved 0000 0005 0000 0000 0000 0007 FFFF FFFF 12GB Local Memory Alias (HB) Aliased DDR SDRAM 0000 0008 0000 0000 0000 000B FFFF FFFF 16GB EBC Memory except Bank 0 Internal OPB Peripherals (LL) Boot ROM 8 2, 3 6 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 1. System Memory Address Map (Part 3 of 3) Function PCI/PCIE Space (HB) Sub Function Start Address End Address Size PCI Express Memory 0000 000C 0000 0000 0000 000C 07FF FFFF 128MB PCI I/O 0000 000C 0800 0000 0000 000C 0800 FFFF 64KB PC Express Memory 0000 000C 0801 0000 0000 000C 087F FFFF ~8MB PCI Extra I/O 0000 000C 0880 0000 0000 000C 0BFF FFFF ~56MB PCI Express Memory 0000 000C 0C00 0000 0000 000C 0EBF FFFF ~44MB PCI Configuration Registers 0000 000C 0EC0 0000 0000 000C 0EC0 0007 8B Reserved 0000 000C 0EC0 0008 0000 000C 0EC7 FFFF ~512KB PCI Local Registers 0000 000C 0EC8 0000 0000 000C 0EC8 11FF 4.75KB Reserved 0000 000C 0EC8 1200 0000 000C 0ECF FFFF ~512KB PCI Special Cycle 0000 000C 0ED0 0000 0000 000C 0ED0 0003 4B Reserved 0000 000C 0ED0 0004 0000 000C 0FFF FFFF ~19MB PCI Express Interrupt Handler 0000 000C 1000 0000 0000 000C 1000 00FF 256B PCI, PCI Express Memory 0000 000C 1000 0100 0000 000C FEFF FFFF ~3.8MB PCI Boot ROM (PCI Memory) 0000 000C FF00 0000 0000 000C FFFF FFFF 16MB PCI, PCI Express Memory 0000 000D 0000 0000 0000 000F FFFF FFFF 12GB Reserved 4 0000 0010 0000 0000 03FF FFFF FFFF FFFF 5 0400 0000 0000 0000 0FFF FFFF FFFF FFFF Reserved XOR Space (HB) XOR 1000 0000 0000 0000 1FFF FFFF FFFF FFFF PCI/PCIE Space (HB) PCI, PCI Express Memory 2000 0000 0000 0000 FFFF FFFF FFFF FFFF Notes: 1. DDR SDRAM, SRAM (L2 Cache) and On-Chip Memory (OCM) can be located anywhere in the Local Memory area of the memory map. 2. The Boot ROM area of the memory map are intended for use by ROM or Flash-type devices. While locating volatile DDR SDRAM and SRAM in this region is supported, use of these regions for this purpose is not recommended. 3. When the optional boot from PCI Memory is selected, the PCI Boot ROM address space begins at 0000 000C FF00 0000 (16 MB). 4. Never decoded. 5. Unpredictable results on Read and Write operations. 6. Accessed by means of EBC Peripheral Bank Configuration Registers. AMCC Proprietary 9 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 2. DCR Address Map Function Base Address Total DCR Address Space1 Start Address End Address Size 000 3FF 1KW (4KB)1 000 00B 12W By function: Reserved Clocking Power On Reset (CPR) 00 0000 110x 00C 00D 2W System DCRs (SDR) 00 0000 111x 00E 00F 2W Memory Controller 00 0001 000x 010 011 2W External Bus Controller (EBC) 00 0001 001x 012 013 2W 014 01F 12W Reserved L2 Cache as SRAM 00 0010 xxxx 020 02F 16W L2 Controller 00 0011 xxxx 030 03F 16W Memory Queue 00 010x xxxx 040 04F 16W 050 05F 16W Reserved I2O/DMA Controller 00 011x xxxx 060 07F 32W PLB Arbiter 00 1000 xxxx 080 08F 16W PLB-to-OPB Bridge 00 1001 xxxx 090 09F 16W PLB-to-AHB Bridge 00 1010 xxxx 0A0 0AF 16W On-Chip Memory (OCM) 00 1011 xxxx 0B0 0BF 16W Universal Interrupt Controller 0 00 1100 xxxx 0C0 0CF 16W Universal Interrupt Controller 1 00 1101 xxxx 0D0 0DF 16W Universal Interrupt Controller 2 00 1110 xxxx 0E0 0EF 16W Universal Interrupt Controller 3 00 1111 xxxx 0F0 0FF 16W PCI Express 0 01 000x xxxx 100 11F 32W PCI Express 1 01 001x xxxx 120 13F 32W 140 15F 32W 160 167 8W 168 17F 24W Reserved Power Management 01 011x xxxx Reserved Ethernet MAL 01 1xxx xxxx 180 1FF 128W DMA Controller 10 00xx xxxx 200 23F 64W 240 3FF 448W Reserved Notes: 1. DCR addresses are 10 bits (1024 or 1K unique addresses). Each unique address represents a single 32-bit (word) register. One kiloword (1024W) equals 4KB (4096 B). 10 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet PPC460EX Features The following sections provide information on the features of the chip. PowerPC 440 Processor The PowerPC 440 processor (in 90nm technology) is designed for high-end applications: RAID controllers, SAN, iSCSI, routers, switches, printers, set-top boxes, etc. It implements the Book E PowerPC embedded architecture and uses the 128-bit version of IBM's on-chip CoreConnect Bus Architecture. Features include: * Up to 1.000GHz operation * PowerPC Book E architecture * 32KB I-cache, 32KB D-cache - UTLB Word Wide parity on data and tag address parity with exception force * Three logical regions in D-cache: locked, transient, normal * D-cache full line flush capability * 41-bit virtual address, 36-bit (64GB) physical address * Superscalar, out-of-order execution * 7-stage pipeline * Three execution pipelines * Dynamic branch prediction * Memory management unit - 64-entry, full associative, unified TLB with optional parity - Separate instruction and data micro-TLBs - Storage attributes for write-through, cache-inhibited, guarded, and big or little endian * Debug facilities - Multiple instruction and data range breakpoints - Data value compare - Single step, branch, and trap events - Non-invasive real-time trace interface * 24 DSP instructions - Single cycle multiply and multiply-accumulate - 32 x 32 integer multiply - 16 x 16 -> 32-bit MAC Floating Point Unit (FPU) The chip has a built-in super scalar FPU that supports both single- and double-precision operations, and offers single cycle through put on most instructions. Features include: * Five stages with 2 MFlops/MHz * Hardware support for IEEE 754 * Single- and double-precision * Single-cycle throughput on most instructions * Thirty-two 64-bit floating point registers AMCC Proprietary 11 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet L2 Cache/SRAM The PPC460EX also provides a 256KB L2 cache between the Processor Local Bus and the processor's D- and I-caches. This memory unit can be alternatively programmed to function as 256KB of SRAM. Features include: * Four banks of 64KB each * Memory cycles supported: - Single beat read and write, 1 to 16 bytes - Quadword Read and Write burst for 12-bit master - Guarded memory accesses on 4KB boundaries * Sustainable 3.2GB/s peak bandwidth at 200MHz * Use as an L2 cache improves processor performance and reduces the PLB load - Cache coherency maintained by a hardware snoop mechanism on the Low Latency (LL) Processor Local Bus (PLB) or by software - Data Array and Tag Array parity - Unified data and instruction cache - Four-way set associative - 36-bit addressing - Full LRU replacement algorithm - Write through, look aside On-Chip Memory (OCM) The PPC460EX provides 64KB of on-chip memory. Features include: * Up to 128-bit bus width * 128-bit slave attachment, addressable by any PLB master * Transfers by PLB slave cycles: - Single-beat read and write (1 to 8 bytes for 64-bit masters, 1 to 16 bytes for 128-bit masters) - 4- and 8-word line reads and writes - Double word read and write bursts for 64-bit masters - Quadword read and write bursts for 128-bit masters - Slave-terminated double word and quadword fixed length bursts - Master-terminated variable length bursts * Guarded memory access on 4KB boundaries * Data parity checking * Data transfers at PLB bus speeds * Power management * Use as storage area for DMA descriptors and packet data for processing by Ethernet and Security Function. Internal Buses The PowerPC 460EX features four standard internal buses: one Processor Local Bus (PLB), one On-chip Peripheral Bus (OPB), the Advanced High-performance Bus (AHB), and the Device Control Register bus (DCR). The high performance, high bandwidth functions such as the PowerPC 440 processor, the DDR SDRAM memory controller, PCI Express, PCI, and the AHB bridge, connect to the PLB. The OPB hosts lower data rate peripherals. The daisy-chained DCR provides a lower bandwidth path for passing status and control information between the processor and the other on-chip cores. The PLB has a Crossbar arbiter that supports data transfer between the PLB master and two slave segments identified as the Low Latency (LL) and High Bandwidth (HB) segments. The LL segment allows PLB masters CPU and I2O, that are adversely affected by latency, to communicate with slave devices with minimal latency. The HB segment allows PLB masters DMA, PCI and PCI Express to exchange large blocks of data with SDRAM, PCI and PCI Express without interfering with the low latency PLB masters. 12 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Features include: * PLB4 (128-bit) - 128-bit implementation of the PLB architecture - Separate and simultaneous read and write data paths - 64-bit address - Simultaneous control, address, and data phases - Four levels of pipelining - Byte-enable capability supporting unaligned transfers - 32- and 64-byte burst transfers - 200MHz, maximum 12.8GB/s (simultaneous read and write) - Processor:bus clock ratios of N:1 * AHB - 32-bit data path - 32-bit address - Synchronous to the PLB - Up to 200MHz, maximum 800MB/s * OPB - 32-bit data path with dynamic sizing for 32-, 16-, and 8-bit width - 32-bit address - 100MHz * DCR - 32-bit data path - 10-bit address Security Function (Optional) The built-in security function is a cryptographic engine attached to the PLB with built-in DMA and interrupt controllers. Features include: * Federal Information Processing Standard (FIPS) 140-2 design * Support for an unlimited number of Security Associations (SA) * Different SA formats for each supported protocol (IPsec/SSL/TLS/sRTP) * Internet Protocol Security (IPSec) features - Full packet transforms, Encapsulated Security Payload (ESP) and Authentication Header (AH) - Complete header and trailer processing (IPv4 and IPv6) - Multi-mode automatic padding - "Mutable bit" handler for AH, including IPv4 option and IPv6 extension headers - Extended Sequence Number (ESN) processing for ESP and AH * Secure Socket Layer (SSL) and Transport Layer Security (TLS) features and Datagram Transport Layer Security (DTLS) features - Packet transforms - One-pass hash-then-encrypt for SSL and TLS packet transforms for inbound packet using Stream Cipher * Secure Real-Time Protocol (sRTP) features - Packet transforms - Roll Over Counter (ROC) removal and TAG insertion - Variable bypass offset of header length per packet * Media Access Control Security (MACSec) features - MSDU (User data) encryption 0, 30, or 50 bytes offset - Header insertion and removal - SecTAG header with or without Secure Channel Identifier (SCI) field - 128-bit key, 96-bit IV (nonce) and 128-bit ICV - IV from SA record or from input buffer (as part of SecTAG) - ICV generation and validation AMCC Proprietary 13 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet * SGT features: - GCM-AES with 128-bit key, 96-bit IV (nonce) and 128-bit ICV - SecTAG header with or without Secure Channel Identifier (SCI) field - Replay protection "Strict order Mode" and "Out of Order Mode" - Header insertion and removal - ICV generation and validation * IPsec/SSL security acceleration engine * DES, 3DES, AES, ARC-4 encryption (no support for hashing of zero length messages) * MD-5, SHA-1, and SHA-2 (224-, 256-, 384-, and 512-bit) hashing, HMAC encrypt-hash and hash-decrypt * Public key acceleration (PKA) for RSA, DSA and Diffie-Hellman * True (TRNG) or pseudo (PRNG) random number generators - Non-deterministic true random numbers - Pseudo random numbers with lengths of 8 or 16 bytes - ANSI X9.17 Annex C compliant using a DES algorithm * Interrupt controller - Fifteen programmable, maskable interrupts - Initiate commands by means of an input interrupt - Sixteen programmable interrupts indicating completion of certain operations - All interrupts mapped to one level- or edge-sensitive programmable interrupt output * DMA controller - Autonomous, 4-channel - 1024 words (32 bits/word) per DMA transfer - Scatter/gather capability with byte aligned addressing PCI Controller The PCI interface allows connection of PCI devices to the PowerPC processor and local memory. This interface is designed to Version 2.3 of the PCI Specification and supports 32- bit PCI devices. Reference Specifications: * PCI Specification Version 2.3 * PCI Bus Power Management Interface Specification Version 1.1 Features include: * Frequency to 66MHz * 32-bit bus * PCI Host Bus Bridge or an Adapter Device's PCI interface * Internal PCI arbitration function, supporting up to four external devices, that can be disabled for use with an external arbiter * Support for inbound and outbound Message Signaled Interrupts (MSI) * Simple message passing capability * Asynchronous to the PLB * PCI Power Management 1.1 * PCI register set addressable both from on-chip processor and PCI device sides * Ability to boot from PCI bus memory * Error tracking/status * Supports initiation of transfers of the following types: - Single beat I/O reads and writes - Single beat and burst memory reads and writes - Single beat configuration reads and writes (type 0 and type 1) - Single beat special cycles * Vital Product Data (VPD) support 14 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet PCI Express Controller There are two independent PCI Express interfaces compliant with PCI Express base specification 1.1. One interface can be configured as one to four lanes while the other functions as one-lane only. Both can be Root or Endpoint Ports. The single lane interface shares a High-Speed SERDES with the Serial ATA (SATA) interface. Features include: * Two independent PCI Express interfaces - One 4 lanes - One 1 lane - 2.5 GB/sec full duplex per lane * Compliant with PCI Express base specification 1.1 * Each PCI Express port can be End Point or Root Complex. (Upstream & Downstream) - Applications compliant with MSI rules are limited to one Endpoint port per PPC460EX * Power Management * Supports one virtual channel (VC0) no Traffic Class (TC) filtering * Maximum Payload block size 512 Bytes * Supports up to 512 Bytes maximum Read request size * Requests supported: - up to 4 (x4) or 2 (x1) posted outbound Write requests (memory and messages) - up to 4 (x4) or 2 (x1) posted inbound Write requests - up to 4 (x4) or 2 (x1) outbound Read requests outstanding on PCI Express - up to 4 (x4) or 2 (x1) inbound Read requests outstanding on PCI Express - Outbound I/O request as a PCI Express Root Port - Inbound I/O request as a PCI Express Endpoint * Buffering in each PCI Express port for the following transaction types: - 2KB Replay buffer: up to 4 in flight transactions - 2KB (x4) or 1KB (x1) for Outbound posted Writes - 2KB (x4) or 1KB (x1) for Outbound Reads completion - 2KB (x4) or 1KB (x1) for Inbound posted Writes - 2KB (x4) or 1KB (x1) for Inbound Reads completion * Parity checking on each buffer * Programmable Outbound Memory (POM) regions: 3 memory, 1 I/O, 1 message, 1 configuration, 1 internal register * Programmable Inbound Memory (PIM) regions: 4 memory, 1 I/O, 1 expansion ROM * INTx Interrupts support (legacy PCI): - Up to four INTx Termination for Root Ports. A/B/C/D interrupts are wired to the UIC - A/B/C/D INTx types generation for Endpoints * MSI - Message Signaled Interrupts - MSI generation for Endpoint - MSI termination for Root Ports - MSI_X termination for Root Ports AMCC Proprietary 15 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet DDR2/1 SDRAM Memory Controller The Double Data Rate 2/1 (DDR2/1) SDRAM memory controller supports industry standard 184-pin DIMMs, SODIMMs, and other discrete devices. Global memory timings, address and bank sizes, and memory addressing modes are programmable. This controller interfaces to the PLB through a Memory Queue (MQ) function that includes six high-speed 1KB FIFO buffers. The correct I/O supply voltage must be provided for the two types of DDR devices: DDR1 devices require +2.5V and DDR2 devices require +1.8V. Features include: * Registered and non-registered industry standard DIMMs * DDR2 333/400 support * 64- and 32-bit memory interfaces with optional 8-bit ECC (SEC/DED) * 3.2GB/s peak bandwidth for the 64-bit interface * 1.6GB/s peak bandwidth for the 32-bit interface * Four chip (bank) select signals supporting four external banks * CAS latencies of 2, 3, 4, 5, 6, and 7 * Page mode accesses (up to 32 open pages) with configurable paging policy * Look-ahead request queue with programmable depth of four commands * Optional optimized command scheduling (activate/precharge non-conflicting banks while accessing the current bank) * Up to 8GB in four external banks * Up to two MemClkOut signals * Programmable address mapping and timing * Hardware and software initiated self-refresh * Sync DRAM configuration by means of mode register and extended mode register set commands * Power management (self-refresh, suspend, sleep) * Low Latency and High Bandwidth PLB ports * Selectable PLB read response (immediate or deferred) * Programmable Low Latency and High Bandwidth arbitration schemes * High Bandwidth port has four 1KB read buffers and two 1KB write buffers * Low Latency port has four 128B read buffers and two 128B write buffers 16 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet External Peripheral Bus Controller (EBC) The External Bus Controller (EBC) transfers data between the PLB and external memory or peripheral devices attached to the external peripheral bus. The EBC allows for direct attachment of memory devices such as ROM and SRAM, DMA device-paced memory devices, and DMA peripheral devices. Features include: * Up to six ROM, EPROM, SRAM, Flash memory, and slave peripheral I/O banks supported * Up to 100MHz operation * Burst and non-burst devices * 32-bit byte-addressable data bus * Data parity * 27-bit address * Peripheral Device pacing with external Ready * Latch data on Ready, synchronous or asynchronous * Programmable access timing per device - 256 Wait States for non-burst - 32 Burst Wait States for first access and up to eight Wait States for subsequent accesses - Programmable CSon, CSoff relative to address - Programmable OEon, WEon, WEoff (1 to 4 clock cycles) relative to CS * Programmable address mapping * External DMA Slave Support Ethernet Controller Two 10/100/1000 Ethernet ports are supported. Features include: * Compliant with ANSI/IEEE Standard 802.3 and IEEE 802.3u supplement * Compliant with IEEE Standard 802.3z (Gigabit Ethernet) * Two 10/100/1000 interfaces running in full- and half-duplex modes providing: - One Gigabit Media Independent Interface (GMII) - One Media Independent Interface (MII) - Two Reduced Gigabit MII (RGMII) - Two Serial GMIIs (SGMII) * Quality of Service (QoS) support - Support of IEEE 802.1p priority queueing for up to 8 priorities - Recognizes TCI field in VLAN-tagged frames where the priority field is coded * Jumbo frame support (9018 bytes) - Support for Ethernet II formatted frames (RFC894) - Support for IEEE formatted frames (RFC1042) - Handles VLAN-tagged frames (IEEE 802.2ac) * TCP/IP Acceleration Hardware (TAH) support * Off loads Gigabit Ethernet protocol processing from the CPU * Checksum verification for TCP/UDP/IP headers in the receive path * Checksum generation for TCP/UDP/IP headers in the transmit path * TCP segmentation support in the transmit path * IPv4 and IPv6 support * IPv6 header extension support * Wake On LAN handling * 256-bit hash table to filter multicast frames * DMA capability * Interrupt coalescence AMCC Proprietary 17 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet DMA 4-Channel Controller The 4-channel DMA controller provides a DMA interface between the PLB memories and internal and external peripheral devices. Features include: * Supports the following transfers: - Memory-to-memory - Buffered peripheral to memory - Buffered memory to peripheral * Scatter/Gather capability for programming multiple DMA operations * 8-, 16-, 32-bit peripheral support (OPB and external) * 64-bit addressing * 128 byte FIFO buffer * Address increment or decrement * Support for: - Internal and external peripherals - Memory mapped peripherals - Peripherals running on slower frequency buses I2O/DMA Controller The I2O/DMA controller provides one High Speed DMA (HSDMA) interface to the PLB and support for I2O messaging. The HSDMA provides single-channel direct memory access support to ease the CPU burden. I2O manages Message Frame Address (MFA) FIFOs or queues in memory in response to I2O register reads and writes and transfers message frames. DMA features include: * Programmable Command Pointer FIFO and Completion FIFO size (up to 2048 DMA operations queued) * Separate 512-byte buffering for transmit and receive - 1.4GB throughput (local read) - 1.0GB throughput (remote read) * Simultaneous fill and drain (PLB read/write pipelining) * Any source PLB address to any destination address * No memory alignment restrictions on source or destination * 32-byte command descriptor block * Maximum transfer size of 16MB * 64-bit addressing * Prefetch indicators for PCI buffer management * Supports initiation of transfer to the following address spaces: - Single beat I/O reads and writes - Single beat and burst memory reads and writes - Single beat configuration reads and writes (type 0 and type 1) - Single beat special cycles I2O features include: * I2O pull- and push-messaging methods * Dynamic message frame size * Programmable FIFO size (4096 64-bit MFAs maximum) * 64- and 32-bit MFA sizes * Three interrupt gathering methods * Registered MFA prefetch and posting * 32-bit inbound and outbound doorbell registers * Four 32-bit scratch pad registers 18 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Serial Ports (UART) The Universal Asynchronous Receiver/Transmitter (UART) interface provides one 8-signal port, or two 4-signal ports, or four 2-signal ports. The UART performs serial-to-parallel conversion on data received from a peripheral device or a modem, and parallel-to-serial conversion on data received from the processor. Features include: * Up to four ports in the following combinations: - One 8-pin (UART0) - Two 4-pin (UART0 and UART1) - Four 2-pin (UART0, UART1, UART2, and UART3) * Selectable internal or external serial clock to allow wide range of baud rates * Register compatibility with 16750 register set * Complete status reporting capability * Fully programmable serial-interface characteristics * Supports DMA using the 4-channel internal DMA function * 64-byte FIFOs for buffering transmit and receive data IIC Bus Controller The Inter-Integrated Circuit (IIC) interface provides a Philips(R) I2CTM compatible interface operating up to 400 kHz either as a master, a slave, or both, with a Bootstrap Controller (BSC) included. During chip reset, the Bootstrap Controller can read configuration data from an IIC-compatible memory device (for example, EEPROM). This data can be used to replace the default configuration settings provided by the chip. Features include: * Two IIC interfaces * Support for Philips Semiconductors I2C Specification, dated 1995 * Operation at 100kHz or 400kHz * 8-bit data * 10- or 7-bit address * Slave transmitter and receiver * Master transmitter and receiver * Multiple bus masters * Supports fixed VDD IIC interface * Two independent 4 x 1 byte data buffers * Twelve memory-mapped, fully programmable configuration registers * One programmable interrupt request signal * Provides full management of all IIC bus protocols * Programmable error recovery * Port 0 includes an integrated BSC that supports a serial Bootstrap ROM with default override parameters at initialization AMCC Proprietary 19 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Serial Peripheral Controller (SPI/SCP) The Serial Peripheral Interface (also known as the Serial Communications Port) is a full-duplex, synchronous, character-oriented (byte) port that allows the exchange of data with other serial devices. The SPI is a master on the serial port supporting a 3-wire interface (receive, transmit, and clock), and is a slave on the OPB. Features include: * Three-wire serial port interface * Full-duplex synchronous operation * SPI bus master * OPB bus slave * Programmable clock rate divider * Clock inversion * Reverse data * Local data loop back for test Universal Serial Bus 2.0 (USB) Two USB 2.0 interfaces provide both Device and Host support. These interfaces are provided as one USB 2.0 OnThe-Go (OTG) controller (Host and Device) and one USB 2.0 Host controller. Both controllers provide support to an external PHY device through separate ULPI SDR interfaces. Features include: * USB 2.0 Host - Fully compliant to the following specifications: * Universal Serial Bus Specification, Revision 2.0 * Enhanced Host Controller Interface (EHCI) Specification for USB, Revision 1.0 * Open Host Controller Interface (OHCI) Specification for USB, Revision 1.0a - One EHCI high speed (480Mbps) Host interface - One OHCI full/low speed (12Mbps/1.5Mbps) Host interface - Maximum packet sizes of 1024B for isochronous transfers and 512B for bulk transfers - Isochronous traffic can have three packets per microframe (196.6 Mbps throughput) - Data and descriptor prefetch to optimize performance and off load CPU - 4 KB buffer * USB 2.0 OTG - Fully compliant to the following specifications * Universal Serial Bus Specification, Revision 2.0 * On-The-Go Supplement to the USB 2.0 Specification, Revision 1.0a - Configurable as a Host-only or Device-only controller - Supports high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) transfers - Maximum packet sizes of 1024B for isochronous transfers and 512B for bulk transfers - Isochronous traffic can have three packets per microframe (196.6 Mbps throughput) - Integrated DMA support to optimize performance and off load CPU - Device support provides six Endpoints (3 IN, 3 OUT) - 8192-byte FIFO by Endpoint (supports high-bandwidth isochronous transfers, double buffering of 1024byte packets) - FIFOs are not shared between IN and OUT Endpoints - Two USB 2.0 device Endpoints have DMA dedicated channels - 16KB buffer 20 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Serial ATA (SATA) The Serial Advanced Technology Attachment (ATA) interface provides an interface to physical storage devices. It shares the High-Speed SERDES with the PCI-Express interface with 1-Lane. Features include: * Compliant with Serial ATA Revision 2.5 Specification * Supports SATA 1.5Gbps Generation 1 and 3Gbps Generation 2 speeds * Supports device hot-plugging * Supports power management * Supports BIST loopback modes * Dedicated DMA controller support to optimize performance and off load CPU * Separate 512B transmit and receive buffers NAND Flash Controller The NAND Flash controller provides a simple interface between the EBC and up to four separate external NAND Flash devices. It provides both direct command, address, and data access to the external device as well as a memory-mapped linear region that generates data accesses. NAND Flash data is transferred on the peripheral data bus. Features include: * One to four banks supported on EBC * Direct interface to: - Discrete NAND Flash devices (up to four devices) - SmartMedia Card socket (22-pins) * Device sizes of 4MB and larger supported for read/write access * (512 + 16)-B or (2K + 64)-B page sizes supported * Boot from NAND supported with execution of up to 4KB of boot code out of block 0 * ECC generation - hamming code, single-bit correction, double-bit detection (SEC/DED): - ECC generation assist software with ECC checking of SLC NAND - No ECC checking supported when booting directly from block 0 * Chip select pins are multiplexed with EBC General Purpose Timers (GPT) Provides a separate time base counter and additional system timers in addition to those defined in the processor. Features include: * Time Base Counter (32 bits) driven by the OPB bus clock * Seven 32-bit compare timers General Purpose IO (GPIO) Controller Controller functions and GPIO registers are programmed and accessed by means of memory-mapped OPB bus master accesses. Features include: * Sixty-four GPIOs multiplexed with other functions. DCRs control whether a GPIO pin acts as a GPIO or is used for another purpose. * Each GPIO output is separately programmable to emulate an open drain driver (that is, drives to zero, tri-stated if output bit is 1). AMCC Proprietary 21 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Universal Interrupt Controller (UIC) Universal Interrupt Controllers (UICs) provide control, status, and communications necessary between the external and internal sources of interrupts and the on-chip PowerPC processor. Note: Processor specific interrupts (for example, page faults) do not use UIC resources. Features include: * Sixteen external interrupts * Edge triggered or level-sensitive * Positive or negative active * Non-critical or critical interrupt to the on-chip processor * Programmable interrupt priority ordering * Programmable critical interrupt vector for faster vector processing JTAG Features include: * IEEE 1149.1 Test Access Port * JTAG Boundary Scan Description Language (BSDL) * IBM RISCWatch support Refer to http://www.amcc.com/Embedded/Partners for a list of AMCC partners supplying probes for use with this port. 22 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Package Diagram Figure 3. 35mm, 728-Ball TE-PBGA Package Top View Logo View Part Number (R) 30 24 TYP TYP PPC460EX e1 PPC460EX-nprfff(f)T ccccccc 1YWWBZZZZZ MMDDQL Heat Slug Side View 2.65 max Mold Compound Lot Number (ZZZZZ) PCB Substrate Gold Gate Release Corresponds to A01 Ball Location Bottom View 0.4 - 0.6 35.0 33.0 AP AM AK AH AF AD AB Y V T P M K H F D B AN AL 1.0 AJ AG AE AC Thermal Balls AA Notes: 1. All dimensions are in mm. 2. Package is available with lead or lead-free (RoHS compliant). 3. Package conforms to JEDEC MS-034. 4. Optional solder ball diameter is 0.63 +0.07/-0.13. W U R N 7.0 L J G E C A 01 03 05 07 09 11 13 15 17 19 21 23 25 27 29 31 33 02 04 06 08 10 12 14 16 18 20 22 24 26 28 30 32 34 AMCC Proprietary 728 x 0.60 0.10 Solder Ball 23 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Assembly Recommendations Assembly recommendations from JEDEC standard J-STD-020 should be used unless recommended differently in the following table. Table 3. Recommended Reflow Soldering Profile Sn-Pb Eutectic Assembly (PPC460EX-STxfff) Profile Feature Pb Free Reflow Assembly (PPC460EX-SUxfff) Average ramp-up rate 3C/second max 3C/second max Preheat: * Temperature Min * Temperature Max * Time (min to max) 100C 150C 60-120 seconds 150C 200C 60-120 seconds Time Maintained Above: * Temperature * Time 183C 60-150 seconds 217C 60-150 seconds Peak Temperature 225C 260C Time within 5C of Actual Peak Temperature 20 seconds max 30 seconds max Ramp-down Rate 6C/second max 6C/second max Time 25C to Peak Temperature 6 minutes max 8 minutes max Table 4. JEDEC Moisture Sensitivity Level and Ball Composition Sn-Pb (PPC460EX-STxfff) Pb Free (PPC460EX-SUxfff) MSL Level 3 3 Solder Ball Metallurgy 63Sn/37Pb Sn/4Ag/05Cu 24 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Signal Lists The following table lists all the external signals in alphabetical order and shows the ball (pin) number on which the signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and alternate signals in brackets. Multiplexed signals appear alphabetically multiple times in the list--once for each signal name on the ball. The page number listed gives the page in Table 9 on page 64 where the signals in the indicated interface group begin. In cases where signals in the same interface group (for example, Ethernet) have different names to distinguish variations in the mode of operation, the names are separated by a comma with the primary mode name appearing first. In cases where the signals have the same function but are associated with different ports (for example, UART), the signals are separated by a slash (/). These signals are listed only once, and appear alphabetically by the primary mode or primary port name. Alphabetical Signal List Table 5. Signals Listed Alphabetically (Part 1 of 26) Signal Name Ball AGND L01 AGND L02 AGND M04 AGND M06 AGND P03 AGND P04 AGND P06 AGND R01 AGND R02 AGND R06 AGND U01 AGND U04 AGND U05 AGND Y01 AGND Y03 AGND Y05 AGND AA04 AMCC Proprietary Interface Group Power Page 73 25 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 2 of 26) Signal Name Ball AVDD L03 AVDD L06 AVDD M03 AVDD M05 AVDD N03 AVDD N06 AVDD P05 AVDD T03 AVDD U02 AVDD U03 AVDD U06 AVDD V03 AVDD V06 AVDD W03 AVDD W06 AVDD Y02 AVDD Y04 AVDD AB04 BA0 AN32 BA1 AP31 BA2 AM31 BankSel0 AL28 BankSel1 AP29 BankSel2 AM29 BankSel3 AN29 CAS AL29 ClkEn0 AE29 ClkEn1 AF34 ClkEn2 AE33 ClkEn3 AE31 [DMAAck0]GPIO47[PerAddr06][IRQ14] C31 [DMAAck1]GPIO44[PerCS4][IRQ11] E21 [DMAAck2]GPIO31[PerPar1][IRQ8] A16 [DMAAck3]GPIO36[UART0CTS][UART3Rx] E31 [DMAReq0]GPIO46[PerAddr05][IRQ13] B32 [DMAReq1]GPIO43[PerCS3][NFCE3][IRQ10] A22 [DMAReq2]GPIO30[PerPar0][IRQ7] A20 [DMAReq3]GPIO33[PerPar3][IRQ4] F13 26 Interface Group Page Power 73 DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 DMA 69 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 3 of 26) Signal Name Ball DM0 P31 DM1 U30 DM2 V30 DM3 AB34 DM4 AM25 DM5 AP23 DM6 AN20 DM7 AM17 DM8 AD34 DQS0 P33 DQS0 P32 DQS1 U32 DQS1 U31 DQS2 W31 DQS2 W32 DQS3 AA30 DQS3 AA31 DQS4 AP25 DQS4 AN25 DQS5 AN22 DQS5 AM22 DQS6 AM19 DQS6 AL19 DQS7 AK17 DQS7 AL17 DQS8 AD32 DQS8 AD33 E1OVDD Y14 E1OVDD AA15 E1OVDD AD06 E1OVDD AF02 E1OVDD AG05 E1OVDD AJ11 E1OVDD AK02 E1OVDD AK08 E1OVDD AN05 E1OVDD AN09 E2OVDD AK13 E2OVDD AN16 AMCC Proprietary Interface Group Page DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 Power 73 Power 73 27 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 4 of 26) Signal Name Ball EAGND AP12 EAVDD AP11 ECC0 AC31 ECC1 AC30 ECC2 AE32 ECC3 AE34 ECC4 AC34 ECC5 AC32 ECC6 AD31 ECC7 AD30 [EOT0/TC0]GPIO48[PerAddr07][IRQ15] D30 [EOT1/TC1]GPIO45[PerCS5][IRQ12] D21 [EOT2/TC2]GPIO32[PerPar2][IRQ9] A14 [EOT3/TC3]GPIO37[UART0RTS][UART3Tx] D33 ExtReset FSOURCE0 28 Interface Group Page Power 73 DDR2/1 SDRAM 66 DMA 69 F22 External Peripheral 69 E17 System 72 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 5 of 26) Signal Name Ball GMC0CD, GMC1RxClk AP05 GMC0CrS, GMC1TxClk AL07 GMC0GTxClk, GMC0TxClk AN06 GMC0RxClk, GMC0RxClk AM07 GMC0RxD0, GMC0RxD0 AL09 GMC0RxD1, GMC0RxD1 AK09 GMC0RxD2, GMC0RxD2 AP08 GMC0RxD3, GMC0RxD3 AJ09 GMC0RxD4, GMC1RxD0 AN08 GMC0RxD5, GMC1RxD1 AL08 GMC0RxD6, GMC1RxD2 AM08 GMC0RxD7, GMC1RxD3 AP07 GMC0RxDV, GMC0RxCtl AL06 GMC0RxEr, GMC1RxCtl AJ10 GMC0TxClk AN04 GMC0TxD0, GMC0TxD0 AM02 GMC0TxD1, GMC0TxD1 AK04 GMC0TxD2, GMC0TxD2 AL02 GMC0TxD3, GMC0TxD3 AL01 GMC0TxD4, GMC1TxD0 AK03 GMC0TxD5, GMC1TxD1 AM01 GMC0TxD6, GMC1TxD2 AH05 GMC0TxD7, GMC1TxD3 AL03 GMC0TxEn, GMC0TxCtl AM05 GMC0TxEr, GMC1TxCtl AJ08 GMCMDClk AJ03 GMCMDIO AK01 GMCRefClk AP09 AMCC Proprietary Interface Group Page Ethernet 0 67 Ethernet 0 67 29 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 6 of 26) Signal Name Ball GND A01 GND A02 GND A03 GND A33 GND A34 GND B01 GND B02 GND B03 GND B07 GND B12 GND B23 GND B28 GND B33 GND B34 GND C01 GND C02 GND C03 GND C16 GND C32 GND D04 GND D31 GND E05 GND E10 GND E23 GND E25 GND E28 GND E30 GND F06 GND F16 GND F19 GND F29 GND F30 GND F31 GND F32 Interface Group Power 30 Page 73 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 7 of 26) Signal Name Ball GND G02 GND G31 GND G33 GND H01 GND J01 GND J03 GND J30 GND J32 GND K02 GND K05 GND K06 GND K30 GND M30 GND M33 GND P14 GND P16 GND P19 GND P21 GND R15 GND R16 GND R19 GND R20 GND T14 GND T15 GND T16 GND T17 GND T18 GND T19 GND T20 GND T21 GND T30 GND U16 GND U17 GND U18 GND U19 AMCC Proprietary Interface Group Power Page 73 31 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 8 of 26) Signal Name Ball GND V16 GND V17 GND V18 GND V19 GND W14 GND W15 GND W16 GND W17 GND W18 GND W19 GND W20 GND W21 GND W29 GND Y15 GND Y16 GND Y19 GND Y20 GND AA14 GND AA16 GND AA19 GND AA21 GND AC01 GND AC03 GND AC04 GND AC05 GND AC33 GND AD01 GND AE03 GND AE05 GND AE30 GND AF05 GND AF29 GND AF30 GND AG29 GND AH02 GND AH33 Interface Group Power 32 Page 73 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 9 of 26) Signal Name Ball GND AJ06 GND AJ13 GND AJ16 GND AJ23 GND AJ25 GND AJ26 GND AJ27 GND AJ29 GND AJ30 GND AJ31 GND AK05 GND AK06 GND AK07 GND AK10 GND AK14 GND AK19 GND AK24 GND AK25 GND AK28 GND AK29 GND AK30 GND AL04 GND AL05 GND AL22 GND AL25 GND AL30 GND AL31 GND AL32 GND AL33 GND AL34 GND AM03 GND AM04 GND AM06 GND AM10 GND AM30 GND AM32 Interface Group Power AMCC Proprietary Page 73 33 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 10 of 26) Signal Name Ball GND AN01 GND AN02 GND AN03 GND AN07 GND AN12 GND AN23 GND AN28 GND AN31 GND AN33 GND AN34 GND AP01 GND AP02 GND AP03 GND AP04 GND AP06 GND AP16 GND AP17 GND AP33 GND AP34 34 Interface Group Power Page 73 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 11 of 26) Signal Name Ball GPIO00[USB2HD0] AG01 GPIO01[USB2HD1] AD05 GPIO02[USB2HD2] AE04 GPIO03[USB2HD3] AF01 GPIO04[USB2HD4] AE02 GPIO05[USB2HD5] AE01 GPIO06[USB2HD6] AB05 GPIO07[USB2HD7] AD03 GPIO08[USB2DD0] AH04 GPIO09[USB2DD1] AJ05 GPIO10[USB2DD2] AG06 GPIO11[USB2DD3] AJ02 GPIO12[USB2DD4] AJ04 GPIO13[USB2DD5] AH03 GPIO14[USB2DD6] AJ01 GPIO15[USB2DD7] AH01 GPIO16[USB2HStop] AF04 GPIO17[USB2HNext] AG02 GPIO18[USB2HDir] AG04 GPIO19[USB2DStop] AF03 GPIO20[USB2DNext] AG03 GPIO21[USB2DDir] AD04 GPIO22[NFRdyBusy] C24 GPIO23[NFREn] B24 GPIO24[NFWEn] A24 GPIO25[NFCLE] F26 GPIO26[NFALE] A25 GPIO27[IRQ0] D12 GPIO28[IRQ1] E12 GPIO29[IRQ2] F12 GPIO30[PerPar0][DMAReq2][IRQ7] A20 GPIO31[PerPar1][DMAAck2][IRQ8] A16 Interface Group System AMCC Proprietary Page 72 35 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 12 of 26) Signal Name Ball GPIO32[PerPar2][EOT2/TC2][IRQ9] A14 GPIO33[PerPar3][DMAReq3][IRQ4] F13 GPIO34[UART0DCD][UART1CTS][UART2Tx] E34 GPIO35[UART0DSR][UART1RTS][UART2Rx] E32 GPIO36[UART0CTS][DMAAck3][UART3Rx] E31 GPIO37[UART0RTS][EOT3/TC3][UART3Tx] D33 GPIO38[UART0DTR][UART1Tx][IRQ5] D32 GPIO39[UART0RI][UART1Rx][IRQ6] D34 GPIO40[IRQ3] C12 GPIO41[PerCS1][NFCE1] B22 GPIO42[PerCS2][NFCE2] D25 GPIO43[PerCS3][NFCE3][DMAReq1][IRQ10] A22 GPIO44[PerCS4][DMAAck1][IRQ11] E21 GPIO45[PerCS5][EOT1/TC1][IRQ12] D21 GPIO46[PerAddr05][DMAReq0][IRQ13] B32 GPIO47[PerAddr06][DMAAck0][IRQ14] C31 GPIO48[PerAddr07][EOT0/TC0][IRQ15] D30 GPIO49[TrcBS0] H33 GPIO50[TrcBS1] J34 GPIO51[TrcBS2] H34 GPIO52[TrcES0] L30 GPIO53[TrcES1] L31 GPIO54[TrcES2] K33 GPIO55[TrcES3] L32 GPIO56[TrcES4] K34 GPIO57[TrcTS0] L33 GPIO58[TrcTS1] N29 GPIO59[TrcTS2] M31 GPIO60[TrcTS3] L34 GPIO61[TrcTS4] M32 GPIO62[TrcTS5] M34 GPIO63[TrcTS6] N31 Halt Interface Group Page System 72 H32 System 72 HISRRst B11 DDR2/1 SDRAM 66 IIC0SClk J31 IIC0SData H31 IIC Peripheral 70 [IIC1SClk]SPIClkOut K31 [IIC1SData]SPIDO G34 36 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 13 of 26) Signal Name Ball [IRQ0]GPIO27 D12 [IRQ1]GPIO28 E12 [IRQ2]GPIO29 F12 [IRQ3]GPIO40 C12 [IRQ4]GPIO33[PerPar3][DMAReq3] F13 [IRQ5]GPIO38[UART0DTR][UART1Tx] D32 [IRQ6]GPIO39[UART0RI][UART1Rx] D34 [IRQ7]GPIO30[PerPar0][DMAReq2] A20 [IRQ8]GPIO31[PerPar1][DMAAck2] A16 [IRQ9]GPIO32[PerPar2][EOT2/TC2] A14 [IRQ10]GPIO43[PerCS3][NFCE3][DMAReq1] A22 [IRQ11]GPIO44[PerCS4][DMAAck1] E21 [IRQ12]GPIO45[PerCS5][EOT1/TC1] D21 [IRQ13]GPIO46[PerAddr05][DMAReq0] B32 [IRQ14]GPIO47[PerAddr06][DMAAck0] C31 [IRQ15]GPIO48[PerAddr07][EOT0/TC0] D30 MemAddr00 AK34 MemAddr01 AJ33 MemAddr02 AJ32 MemAddr03 AJ34 MemAddr04 AH30 MemAddr05 AH31 MemAddr06 AH32 MemAddr07 AG31 MemAddr08 AH34 MemAddr09 AG32 MemAddr10 AG33 MemAddr11 AF31 MemAddr12 AG34 MemAddr13 AC29 MemAddr14 AF32 MemClkOut0 AP27 MemClkOut0 AN27 MemClkOut1 AK31 MemClkOut1 AK32 AMCC Proprietary Interface Group Page Interrupt 71 DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 37 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 14 of 26) Signal Name Ball MemData00 P30 MemData01 N34 MemData02 R32 MemData03 R30 MemData04 N33 MemData05 N32 MemData06 P34 MemData07 R31 MemData08 R34 MemData09 T34 MemData10 V34 MemData11 T32 MemData12 R33 MemData13 T31 MemData14 U33 MemData15 U34 MemData16 V32 MemData17 V31 MemData18 Y32 MemData19 W30 MemData20 V33 MemData21 W34 MemData22 Y34 MemData23 Y33 MemData24 AA33 MemData25 AA32 MemData26 AB31 MemData27 Y30 MemData28 AA34 MemData29 Y31 MemData30 AB33 MemData31 AB32 Interface Group DDR2/1 SDRAM 38 Page 66 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 15 of 26) Signal Name Ball MemData32 AM26 MemData33 AP26 MemData34 AK21 MemData35 AN24 MemData36 AL26 MemData37 AK26 MemData38 AL24 MemData39 AM24 MemData40 AL23 MemData41 AM23 MemData42 AM21 MemData43 AN21 MemData44 AK23 MemData45 AP24 MemData46 AP22 MemData47 AL21 MemData48 AL20 MemData49 AM20 MemData50 AL18 MemData51 AM18 MemData52 AK20 MemData53 AP21 MemData54 AP20 MemData55 AP19 MemData56 AP18 MemData57 AN17 MemData58 AL16 MemData59 AP15 MemData60 AK18 MemData61 AN18 MemData62 AM16 MemData63 AK16 MemDCFdbkD AM33 MemDCFdbkR AM34 MemODT0 AP28 MemODT1 AM27 MemODT2 AM28 MemODT3 AL27 AMCC Proprietary Interface Group Page DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 DDR2/1 SDRAM 66 39 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 16 of 26) Signal Name Ball MemVRef1A AJ19 MemVRef1B AB29 MemVRef2A AJ22 MemVRef2B T29 [NFALE]GPIO26 A25 [NFCE0]PerCS0 E24 [NFCE1]GPIO41[PerCS1 B22 [NFCE2]GPIO42[PerCS2] D25 [NFCE3]GPIO43[PerCS3][DMAReq1][IRQ10] A22 [NFCLE]GPIO25 F26 [NFRdyBusy]GPIO22 C24 [NFREn]GPIO23 B24 [NFWEn]GPIO24 A24 OVDD B05 OVDD B09 OVDD B16 OVDD B19 OVDD B26 OVDD B30 OVDD E02 OVDD E08 OVDD E13 OVDD E22 OVDD E27 OVDD E33 OVDD F11 OVDD F24 OVDD H05 OVDD H30 OVDD J02 OVDD J33 OVDD L29 OVDD P15 OVDD P20 OVDD R14 OVDD R21 PAVDD T06 PAVDD AA05 40 Interface Group Page DDR2/1 SDRAM 66 NAND Flash 71 Power 73 Power 73 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 17 of 26) Signal Name Ball PCI0AD00 D11 PCI0AD01 E11 PCI0AD02 B10 PCI0AD03 A10 PCI0AD04 C10 PCI0AD05 F10 PCI0AD06 D10 PCI0AD07 A09 PCI0AD08 D09 PCI0AD09 A08 PCI0AD10 F09 PCI0AD11 B08 PCI0AD12 C08 PCI0AD13 D08 PCI0AD14 A07 PCI0AD15 F08 PCI0AD16 A05 PCI0AD17 A04 PCI0AD18 D05 PCI0AD19 B04 PCI0AD20 D02 PCI0AD21 F04 PCI0AD22 E03 PCI0AD23 D03 PCI0AD24 E01 PCI0AD25 E04 PCI0AD26 G05 PCI0AD27 G04 PCI0AD28 F02 PCI0AD29 H06 PCI0AD30 F01 PCI0AD31 F05 PCI0C/BE0 C09 PCI0C/BE1 C07 PCI0C/BE2 C05 PCI0C/BE3 F03 PCI0Clk K01 PCI0DevSel A06 PCI0Frame E06 AMCC Proprietary Interface Group Page PCI 64 PCI 64 PCI 64 41 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 18 of 26) Signal Name Ball PCI0Gnt0/Req G03 PCI0Gnt1 H04 PCI0Gnt2 G01 PCI0Gnt3 H03 PCI0IDSel D01 PCI0Int J04 PCI0IRdy C04 PCI0M66En E09 PCI0Par D07 PCI0PErr B06 PCI0Req0/Gnt J06 PCI0Req1 H02 PCI0Req2 K04 PCI0Req3 J05 PCI0Reset K03 PCI0SErr E07 PCI0Stop C06 PCI0TRdy D06 PCIE0AVReg[SATA0AVReg] AA01 PCIE0CalRN[SATA0CalRN] AB02 PCIE0CalRP[SATA0CalRP] AB01 PCIE0RefClk[SATA0RefClk] AA02 PCIE0RefClk[SATA0RefClk] AA03 PCIE0Rx0[SATA0Rx0] W04 PCIE0Rx0[SATA0Rx0] W05 PCIE0Tx0[SATA0Tx0] W02 PCIE0Tx0[SATA0Tx0] W01 42 Interface Group Page PCI 64 PCI 64 PCI 64 PCI 64 PCI Express 0 64 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 19 of 26) Signal Name Ball PCIE1AVReg R05 PCIE1CalRN P01 PCIE1CalRP P02 PCIE1RefClk R04 PCIE1RefClk R03 PCIE1Rx0 L05 PCIE1Rx0 L04 PCIE1Rx1 N05 PCIE1Rx1 N04 PCIE1Rx2 T04 PCIE1Rx2 T05 PCIE1Rx3 V05 PCIE1Rx3 V04 PCIE1Tx0 M02 PCIE1Tx0 M01 PCIE1Tx1 N02 PCIE1Tx1 N01 PCIE1Tx2 T02 PCIE1Tx2 T01 PCIE1Tx3 V02 PCIE1Tx3 V01 AMCC Proprietary Interface Group PCI Express 1 Page 65 43 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 20 of 26) Signal Name Ball Interface Group Page External Peripheral 69 [PerAddr05]GPIO46[DMAReq0][IRQ13] B32 [PerAddr06]GPIO47[DMAAck0][IRQ14] C31 [PerAddr07]GPIO48[EOT0/TC0][IRQ15] D30 PerAddr08 A32 PerAddr09 E29 PerAddr10 C30 PerAddr11 B31 PerAddr12 A30 PerAddr13 A31 PerAddr14 D29 PerAddr15 C29 PerAddr16 A29 PerAddr17 D28 PerAddr18 C28 PerAddr19 B29 PerAddr20 C27 PerAddr21 A28 PerAddr22 D26 PerAddr23 F27 PerAddr24 B27 PerAddr25 D27 PerAddr26 A27 PerAddr27 C26 PerAddr28 A26 PerAddr29 C25 PerAddr30 B25 PerAddr31 D24 PerBLast F25 External Peripheral 69 PerClk F23 External Peripheral 69 PerCS0[NFCE0] E24 [PerCS1]GPIO41[NFCE1] B22 [PerCS2]GPIO42[NFCE2] D25 External Peripheral 69 [PerCS3]GPIO43[NFCE3][DMAReq1][IRQ10] A22 [PerCS4]GPIO44[DMAAck1][IRQ11] E21 [PerCS5]GPIO45[EOT1/TC1][IRQ12] D21 44 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 21 of 26) Signal Name Ball Interface Group Page External Peripheral 69 External Peripheral 69 PerData00 C21 PerData01 B21 PerData02 A21 PerData03 E20 PerData04 D20 PerData05 C20 PerData06 D18 PerData07 B20 PerData08 E19 PerData09 D19 PerData10 E18 PerData11 C19 PerData12 A19 PerData13 C18 PerData14 B18 PerData15 A18 PerData16 D17 PerData17 B17 PerData18 A15 PerData19 B15 PerData20 E15 PerData21 C15 PerData22 D16 PerData23 D15 PerData24 E16 PerData25 C14 PerData26 E14 PerData27 D14 PerData28 B14 PerData29 A13 PerData30 B13 PerData31 C13 [PerPar0]GPIO30[DMAReq2][IRQ7] A20 [PerPar1]GPIO31[DMAAck2][IRQ8] A16 [PerPar2]GPIO32[EOT2/TC2][IRQ9] A14 [PerPar3]GPIO33[DMAReq3][IRQ4] F13 PerErr D13 External Peripheral 69 PerOE E26 External Peripheral 69 PerR/W D23 External Peripheral 69 AMCC Proprietary 45 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 22 of 26) Signal Name Ball PerReady C17 PerWBE0 C23 PerWBE1 A23 PerWBE2 D22 PerWBE3 C22 RAS AP30 Reserved A17 Reserved AL13 Reserved AM13 Reserved AL12 Reserved AM12 Reserved AM15 Reserved AN15 Reserved AP10 Reserved AN10 [SATA0AVReg]PCIE0AVReg AA01 [SATA0CalRN]PCIE0CalRN AB02 [SATA0CalRP]PCIE0CalRP AB01 [SATA0RefClk]PCIE0RefClk AA02 [SATA0RefClk]PCIE0RefClk AA03 [SATA0Rx0]PCIE0Rx0 W04 [SATA0Rx0]PCIE0Rx0 W05 [SATA0Tx0]PCIE0Tx0 W02 [SATA0Tx0]PCIE0Tx0 W01 SGMII0RxClk AK15 SGMII0RxClk AL15 SGMII0RxD AN14 SGMII0RxD AP14 SGMII0TxD AM11 SGMII0TxD AN11 SGMII1RxClk AL14 SGMII1RxClk AM14 SGMII1RxD AN13 SGMII1RxD AP13 SGMII1TxD AK11 SGMII1TxD AL11 SGMIITxClk AJ12 SGMIITxClk AK12 46 Interface Group Page External Peripheral 69 External Peripheral 69 DDR2/1 SDRAM 66 Other 73 Serial ATA 68 Ethernet SGMII 0 68 Ethernet SGMII 1 68 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 23 of 26) Signal Name Ball SOVDD N30 SOVDD T33 SOVDD W33 SOVDD Y21 SOVDD AA20 SOVDD AB30 SOVDD AD29 SOVDD AF33 SOVDD AG30 SOVDD AJ24 SOVDD AK22 SOVDD AK27 SOVDD AK33 SOVDD AN19 SOVDD AN26 SOVDD AN30 SPAGND A11 SPAVDD A12 SPIClkOut[IIC1SClk] K31 SPIDI K32 SPIDO[IIC1SData] G34 SysClk AD02 SysErr AB03 SysReset AC02 TCK J29 TDI F34 TDO F33 TestEn K29 TherMonA AM09 TherMonB AL10 TmrClk Interface Group Page Power 73 Power 73 Serial Peripheral 71 System 72 JTAG 72 System 72 C11 System 72 TMS G32 JTAG 72 [TrcBS0]GPIO49 H33 [TrcBS1]GPIO50 J34 Trace 72 [TrcBS2]GPIO51 H34 AMCC Proprietary 47 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 24 of 26) Signal Name Ball TrcClk M29 [TrcES0]GPIO52 L30 [TrcES1]GPIO53 L31 [TrcES2]GPIO54 K33 [TrcES3]GPIO55 L32 [TrcES4]GPIO56 K34 [TrcTS0]GPIO57 L33 [TrcTS1]GPIO58 N29 [TrcTS2]GPIO59 M31 [TrcTS3]GPIO60 L34 [TrcTS4]GPIO61 M32 [TrcTS5]GPIO62 M34 [TrcTS6]GPIO63 N31 TRST Interface Group Page Trace 72 Trace 72 H29 JTAG 72 UARTSerClk[LeakTest] G30 UART Peripheral 70 [UART0CTS]GPIO36[DMAAck3][UART3Rx] E31 [UART0DCD]GPIO34[UART1CTS][UART2Tx] E34 [UART0DSR]GPIO35[UART1RTS][UART2Rx] E32 [UART0DTR]GPIO38[UART1Tx][IRQ5] D32 UART Peripheral 70 [UART0RI]GPIO39[UART1Rx][IRQ6] D34 [UART0RTS]GPIO37[EOT3/TC3][UART3Tx] D33 UART0Rx C34 UART0Tx C33 [UART1CTS][UART0DCD]GPIO34[UART2Tx] E34 [UART1RTS][UART0DSR]GPIO35[UART2Rx] E32 [UART1Rx][UART0RI]GPIO39[IRQ6] D34 [UART1Tx][UART0DTR]GPIO38[IRQ5] D32 UART Peripheral 70 [UART2Rx][UART0DSR]GPIO35[UART1RTS] E32 [UART2Tx][UART0DCD]GPIO34[UART1CTS] E34 [UART3Rx][UART0CTS]GPIO36[DMAAck3] E31 [UART3Tx][UART0RTS]GPIO37[EOT3/TC3] D33 48 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 25 of 26) Signal Name Ball USB2DClk AF06 [USB2DD0]GPIO08 AH04 [USB2DD1]GPIO09 AJ05 [USB2DD2]GPIO10 AG06 [USB2DD3]GPIO11 AJ02 [USB2DD4]GPIO12 AJ04 [USB2DD5]GPIO13 AH03 [USB2DD6]GPIO14 AJ01 [USB2DD7]GPIO15 AH01 [USB2DDir]GPIO21 AD04 [USB2DNext]GPIO20 AG03 [USB2DStop]GPIO19 AF03 USB2HClk AC06 USB2HClk48 AE06 [USB2HD0]GPIO00 AG01 [USB2HD1]GPIO01 AD05 [USB2HD2]GPIO02 AE04 [USB2HD3]GPIO03 AF01 [USB2HD4]GPIO04 AE02 [USB2HD5]GPIO05 AE01 [USB2HD6]GPIO06 AB05 [USB2HD7]GPIO07 AD03 [USB2HDir]GPIO18 AG04 [USB2HNext]GPIO17 AG02 [USB2HStop]GPIO16 AF04 AMCC Proprietary Interface Group Page USB 2.0 70 USB 2.0 70 USB 2.0 70 USB 2.0 Host 71 USB 2.0 Host 71 USB 2.0 Host 71 49 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 5. Signals Listed Alphabetically (Part 26 of 26) Signal Name Ball VDD F14 VDD F15 VDD F17 VDD F18 VDD F20 VDD F21 VDD P17 VDD P18 VDD P29 VDD R17 VDD R18 VDD R29 VDD U14 VDD U15 VDD U20 VDD U21 VDD U29 VDD V14 VDD V15 VDD V20 VDD V21 VDD V29 VDD Y06 VDD Y17 VDD Y18 VDD Y29 VDD AA06 VDD AA17 VDD AA18 VDD AA29 VDD AB06 VDD AJ14 VDD AJ15 VDD AJ17 VDD AJ18 VDD AJ20 VDD AJ21 WE AP32 50 Interface Group Page Power 73 DDR2/1 SDRAM 66 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Signals in Ball Assignment Order In the following table, only the default signal name is shown for each ball. Multiplexed or multifunction signals are marked with an asterisk (*). To determine what other signals or functions can be programmed to those balls, look up the default signal name in Table 5 on page 25. AMCC Proprietary 51 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 1 of 9) Ball 52 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name A01 GND B01 GND C01 GND D01 PCI0IDSel A02 GND B02 GND C02 GND D02 PCI0AD20 A03 GND B03 GND C03 GND D03 PCI0AD23 A04 PCI0AD17 B04 PCI0AD19 C04 PCI0IRdy D04 GND A05 PCI0AD16 B05 OVDD C05 PCI0C/BE2 D05 PCI0AD18 A06 PCI0DevSel B06 PCI0PErr C06 PCI0Stop D06 PCI0TRdy A07 PCI0AD14 B07 GND C07 PCI0C/BE1 D07 PCI0Par A08 PCI0AD09 B08 PCI0AD11 C08 PCI0AD12 D08 PCI0AD13 A09 PCI0AD07 B09 OVDD C09 PCI0C/BE0 D09 PCI0AD08 A10 PCI0AD03 B10 PCI0AD02 C10 PCI0AD04 D10 PCI0AD06 A11 SPAGND B11 HISRRst C11 TmrClk D11 PCI0AD00 A12 SPAVDD B12 GND C12 GPIO40 * D12 GPIO27 * A13 PerData29 B13 PerData30 C13 PerData31 D13 PerErr A14 GPIO32 * B14 PerData28 C14 PerData25 D14 PerData27 A15 PerData18 B15 PerData19 C15 PerData21 D15 PerData23 A16 GPIO31 * B16 OVDD C16 GND D16 PerData22 A17 Reserved B17 PerData17 C17 PerReady D17 PerData16 A18 PerData15 B18 PerData14 C18 PerData13 D18 PerData06 A19 PerData12 B19 OVDD C19 PerData11 D19 PerData09 A20 GPIO30 * B20 PerData07 C20 PerData05 D20 PerData04 A21 PerData02 B21 PerData01 C21 PerData00 D21 GPIO45 * A22 GPIO43 * B22 GPIO41 * C22 PerWBE3 D22 PerWBE2 A23 PerWBE1 B23 GND C23 PerWBE0 D23 PerR/W A24 GPIO24 * B24 GPIO23 * C24 GPIO22 * D24 PerAddr31 A25 GPIO26 * B25 PerAddr30 C25 PerAddr29 D25 GPIO42 * A26 PerAddr28 B26 OVDD C26 PerAddr27 D26 PerAddr22 A27 PerAddr26 B27 PerAddr24 C27 PerAddr20 D27 PerAddr25 A28 PerAddr21 B28 GND C28 PerAddr18 D28 PerAddr17 A29 PerAddr16 B29 PerAddr19 C29 PerAddr15 D29 PerAddr14 A30 PerAddr12 B30 OVDD C30 PerAddr10 D30 GPIO48 * A31 PerAddr13 B31 PerAddr11 C31 GPIO47 * D31 GND A32 PerAddr08 B32 GPIO46 * C32 GND D32 GPIO38 * A33 GND B33 GND C33 UART0Tx D33 GPIO37 * A34 GND B34 GND C34 UART0Rx D34 GPIO39 * AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 2 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name E01 PCI0AD24 F01 PCI0AD30 G01 PCI0Gnt2 H01 GND E02 OVDD F02 PCI0AD28 G02 GND H02 PCI0Req1 E03 PCI0AD22 F03 PCI0C/BE3 G03 PCI0Gnt0/Req H03 PCI0Gnt3 E04 PCI0AD25 F04 PCI0AD21 G04 PCI0AD27 H04 PCI0Gnt1 E05 GND F05 PCI0AD31 G05 PCI0AD26 H05 OVDD E06 PCI0Frame F06 GND G06 No ball H06 PCI0AD29 E07 PCI0SErr F07 No ball G07 No Ball H07 No Ball E08 OVDD F08 PCI0AD15 G08 No Ball H08 No Ball E09 PCI0M66En F09 PCI0AD10 G09 No Ball H09 No Ball E10 GND F10 PCI0AD05 G10 No Ball H10 No Ball E11 PCI0AD01 F11 OVDD G11 No Ball H11 No Ball E12 GPIO28 * F12 GPIO29 * G12 No Ball H12 No Ball E13 OVDD F13 GPIO33 * G13 No Ball H13 No Ball E14 PerData26 F14 VDD G14 No Ball H14 No Ball E15 PerData20 F15 VDD G15 No Ball H15 No Ball E16 PerData24 F16 GND G16 No Ball H16 No Ball E17 FSOURCE0 F17 VDD G17 No Ball H17 No Ball E18 PerData10 F18 VDD G18 No Ball H18 No Ball E19 PerData08 F19 GND G19 No Ball H19 No Ball E20 PerData03 F20 VDD G20 No Ball H20 No Ball E21 GPIO44 * F21 VDD G21 No Ball H21 No Ball E22 OVDD F22 ExtReset G22 No Ball H22 No Ball E23 GND F23 PerClk G23 No Ball H23 No Ball E24 PerCS0 F24 OVDD G24 No Ball H24 No Ball E25 GND F25 PerBLast G25 No Ball H25 No Ball E26 PerOE F26 GPIO25 * G26 No Ball H26 No Ball E27 OVDD F27 PerAddr23 G27 No Ball H27 No Ball E28 GND F28 No ball G28 No Ball H28 No Ball E29 PerAddr09 F29 GND G29 No ball H29 TRST E30 GND F30 GND G30 UARTSerClk H30 OVDD E31 GPIO36 * F31 GND G31 GND H31 IIC0SData E32 GPIO35 * F32 GND G32 TMS H32 Halt E33 OVDD F33 TDO G33 GND H33 GPIO49 * E34 GPIO34 * F34 TDI G34 SPIDO * H34 GPIO51 * AMCC Proprietary 53 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 3 of 9) Ball 54 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name J01 GND K01 PCI0Clk L01 AGND M01 PCIE1Tx0 J02 OVDD K02 GND L02 AGND M02 PCIE1Tx0 J03 GND K03 PCI0Reset L03 AVDD M03 AVDD J04 PCI0Int K04 PCI0Req2 L04 PCIE1Rx0 M04 AGND J05 PCI0Req3 K05 GND L05 PCIE1Rx0 M05 AVDD J06 PCI0Req0/Gnt K06 GND L06 AVDD M06 AGND J07 No Ball K07 No Ball L07 No Ball M07 No Ball J08 No Ball K08 No Ball L08 No Ball M08 No Ball J09 No Ball K09 No Ball L09 No Ball M09 No Ball J10 No Ball K10 No Ball L10 No Ball M10 No Ball J11 No Ball K11 No Ball L11 No Ball M11 No Ball J12 No Ball K12 No Ball L12 No Ball M12 No Ball J13 No Ball K13 No Ball L13 No Ball M13 No Ball J14 No Ball K14 No Ball L14 No Ball M14 No Ball J15 No Ball K15 No Ball L15 No Ball M15 No Ball J16 No Ball K16 No Ball L16 No Ball M16 No Ball J17 No Ball K17 No Ball L17 No Ball M17 No Ball J18 No Ball K18 No Ball L18 No Ball M18 No Ball J19 No Ball K19 No Ball L19 No Ball M19 No Ball J20 No Ball K20 No Ball L20 No Ball M20 No Ball J21 No Ball K21 No Ball L21 No Ball M21 No Ball J22 No Ball K22 No Ball L22 No Ball M22 No Ball J23 No Ball K23 No Ball L23 No Ball M23 No Ball J24 No Ball K24 No Ball L24 No Ball M24 No Ball J25 No Ball K25 No Ball L25 No Ball M25 No Ball J26 No Ball K26 No Ball L26 No Ball M26 No Ball J27 No Ball K27 No Ball L27 No Ball M27 No Ball J28 No Ball K28 No Ball L28 No Ball M28 No Ball J29 TCK K29 TestEn L29 OVDD M29 TrcClk J30 GND K30 GND L30 GPIO52 * M30 GND J31 IIC0SClk K31 SPIClkOut * L31 GPIO53 * M31 GPIO59 * J32 GND K32 SPIDI * L32 GPIO55 * M32 GPIO61 * J33 OVDD K33 GPIO54 * L33 GPIO57 * M33 GND J34 GPIO50 * K34 GPIO56 * L34 GPIO60 * M34 GPIO62 * AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 4 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name N01 PCIE1Tx1 P01 PCIE1CalRN R01 AGND T01 PCIE1Tx2 N02 PCIE1Tx1 P02 PCIE1CalRP R02 AGND T02 PCIE1Tx2 N03 AVDD P03 AGND R03 PCIE1RefClk T03 AVDD N04 PCIE1Rx1 P04 AGND R04 PCIE1RefClk T04 PCIE1Rx2 N05 PCIE1Rx1 P05 AVDD R05 PCIE1AVReg T05 PCIE1Rx2 N06 AVDD P06 AGND R06 AGND T06 PAVDD N07 No Ball P07 No Ball R07 No Ball T07 No Ball N08 No Ball P08 No Ball R08 No Ball T08 No Ball N09 No Ball P09 No Ball R09 No Ball T09 No Ball N10 No Ball P10 No Ball R10 No Ball T10 No Ball N11 No Ball P11 No Ball R11 No Ball T11 No Ball N12 No Ball P12 No Ball R12 No Ball T12 No Ball N13 No Ball P13 No Ball R13 No Ball T13 No Ball N14 No Ball P14 GND R14 OVDD T14 GND N15 No Ball P15 OVDD R15 GND T15 GND N16 No Ball P16 GND R16 GND T16 GND N17 No Ball P17 VDD R17 VDD T17 GND N18 No Ball P18 VDD R18 VDD T18 GND N19 No Ball P19 GND R19 GND T19 GND N20 No Ball P20 OVDD R20 GND T20 GND N21 No Ball P21 GND R21 OVDD T21 GND N22 No Ball P22 No Ball R22 No Ball T22 No Ball N23 No Ball P23 No Ball R23 No Ball T23 No Ball N24 No Ball P24 No Ball R24 No Ball T24 No Ball N25 No Ball P25 No Ball R25 No Ball T25 No Ball N26 No Ball P26 No Ball R26 No Ball T26 No Ball N27 No Ball P27 No Ball R27 No Ball T27 No Ball N28 No Ball P28 No Ball R28 No Ball T28 No Ball N29 GPIO58 * P29 VDD R29 VDD T29 MEMVRef2B N30 SOVDD P30 MemData00 R30 MemData03 T30 GND N31 GPIO63 * P31 DM0 R31 MemData07 T31 MemData13 N32 MemData05 P32 DQS0 R32 MemData02 T32 MemData11 N33 MemData04 P33 DQS0 R33 MemData12 T33 SOVDD N34 MemData01 P34 MemData06 R34 MemData08 T34 MemData09 AMCC Proprietary 55 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 5 of 9) Ball 56 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name U01 AGND V01 PCIE1Tx3 W01 PCIE0Tx0 Y01 AGND U02 AVDD V02 PCIE1Tx3 W02 PCIE0Tx0 Y02 AVDD U03 AVDD V03 AVDD W03 AVDD Y03 AGND U04 AGND V04 PCIE1Rx3 W04 PCIE0RX0 Y04 AVDD U05 AGND V05 PCIE1Rx3 W05 PCIE0RX0 Y05 AGND U06 AVDD V06 AVDD W06 AVDD Y06 VDD U07 No Ball V07 No Ball W07 No Ball Y07 No Ball U08 No Ball V08 No Ball W08 No Ball Y08 No Ball U09 No Ball V09 No Ball W09 No Ball Y09 No Ball U10 No Ball V10 No Ball W10 No Ball Y10 No Ball U11 No Ball V11 No Ball W11 No Ball Y11 No Ball U12 No Ball V12 No Ball W12 No Ball Y12 No Ball U13 No Ball V13 No Ball W13 No Ball Y13 No Ball U14 VDD V14 VDD W14 GND Y14 E1OVDD U15 VDD V15 VDD W15 GND Y15 GND U16 GND V16 GND W16 GND Y16 GND U17 GND V17 GND W17 GND Y17 VDD U18 GND V18 GND W18 GND Y18 VDD U19 GND V19 GND W19 GND Y19 GND U20 VDD V20 VDD W20 GND Y20 GND U21 VDD V21 VDD W21 GND Y21 SOVDD U22 No Ball V22 No Ball W22 No Ball Y22 No Ball U23 No Ball V23 No Ball W23 No Ball Y23 No Ball U24 No Ball V24 No Ball W24 No Ball Y24 No Ball U25 No Ball V25 No Ball W25 No Ball Y25 No Ball U26 No Ball V26 No Ball W26 No Ball Y26 No Ball U27 No Ball V27 No Ball W27 No Ball Y27 No Ball U28 No Ball V28 No Ball W28 No Ball Y28 No Ball U29 VDD V29 VDD W29 GND Y29 VDD U30 DM1 V30 DM2 W30 MemData19 Y30 MemData27 U31 DQS1 V31 MemData17 W31 DQS2 Y31 MemData29 U32 DQS1 V32 MemData16 W32 DQS2 Y32 MemData18 U33 MemData14 V33 MemData20 W33 SOVDD Y33 MemData23 U34 MemData15 V34 MemData10 W34 MemData21 Y34 MemData22 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 6 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AA01 PCIE0AVReg AB01 PCIE0CalRP AC01 GND AD01 GND AA02 PCIE0RefClk AB02 PCIE0CalRN AC02 SysReset AD02 SysClk AA03 PCIE0RefClk AB03 SysErr AC03 GND AD03 GPIO07 * AA04 AGND AB04 AVDD AC04 GND AD04 GPIO21 * AA05 PAVDD AB05 GPIO06 * AC05 GND AD05 GPIO01 * AA06 VDD AB06 VDD AC06 USB2HClk AD06 E1OVDD AA07 No Ball AB07 No Ball AC07 No Ball AD07 No Ball AA08 No Ball AB08 No Ball AC08 No Ball AD08 No Ball AA09 No Ball AB09 No Ball AC09 No Ball AD09 No Ball AA10 No Ball AB10 No Ball AC10 No Ball AD10 No Ball AA11 No Ball AB11 No Ball AC11 No Ball AD11 No Ball AA12 No Ball AB12 No Ball AC12 No Ball AD12 No Ball AA13 No Ball AB13 No Ball AC13 No Ball AD13 No Ball AA14 GND AB14 No Ball AC14 No Ball AD14 No Ball AA15 E1OVDD AB15 No Ball AC15 No Ball AD15 No Ball AA16 GND AB16 No Ball AC16 No Ball AD16 No Ball AA17 VDD AB17 No Ball AC17 No Ball AD17 No Ball AA18 VDD AB18 No Ball AC18 No Ball AD18 No Ball AA19 GND AB19 No Ball AC19 No Ball AD19 No Ball AA20 SOVDD AB20 No Ball AC20 No Ball AD20 No Ball AA21 GND AB21 No Ball AC21 No Ball AD21 No Ball AA22 No Ball AB22 No Ball AC22 No Ball AD22 No Ball AA23 No Ball AB23 No Ball AC23 No Ball AD23 No Ball AA24 No Ball AB24 No Ball AC24 No Ball AD24 No Ball AA25 No Ball AB25 No Ball AC25 No Ball AD25 No Ball AA26 No Ball AB26 No Ball AC26 No Ball AD26 No Ball AA27 No Ball AB27 No Ball AC27 No Ball AD27 No Ball AA28 No Ball AB28 No Ball AC28 No Ball AD28 No Ball AA29 VDD AB29 MemVRef1B AC29 MemAddr13 AD29 SOVDD AA30 DQS3 AB30 SOVDD AC30 ECC1 AD30 ECC7 AA31 DQS3 AB31 MemData26 AC31 ECC0 AD31 ECC6 AA32 MemData25 AB32 MemData31 AC32 ECC5 AD32 DQS8 AA33 MemData24 AB33 MemData30 AC33 GND AD33 DQS8 AA34 MemData28 AB34 DM3 AC34 ECC4 AD34 DM8 AMCC Proprietary 57 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 7 of 9) Ball 58 Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AE01 GPIO05 * AF01 GPIO03 * AG01 GPIO00 * AH01 GPIO15 * AE02 GPIO04 * AF02 E1OVDD AG02 GPIO17 * AH02 GND AE03 GND AF03 GPIO19 * AG03 GPIO20 * AH03 GPIO13 * AE04 GPIO02 * AF04 GPIO16 * AG04 GPIO18 * AH04 GPIO08 * AE05 GND AF05 GND AG05 E1OVDD AH05 GMC0TxD6 AE06 USB2HClk48 AF06 USB2DClk AG06 GPIO10 * AH06 No ball AE07 No Ball AF07 No Ball AG07 No Ball AH07 No Ball AE08 No Ball AF08 No Ball AG08 No Ball AH08 No Ball AE09 No Ball AF09 No Ball AG09 No Ball AH09 No Ball AE10 No Ball AF10 No Ball AG10 No Ball AH10 No Ball AE11 No Ball AF11 No Ball AG11 No Ball AH11 No Ball AE12 No Ball AF12 No Ball AG12 No Ball AH12 No Ball AE13 No Ball AF13 No Ball AG13 No Ball AH13 No Ball AE14 No Ball AF14 No Ball AG14 No Ball AH14 No Ball AE15 No Ball AF15 No Ball AG15 No Ball AH15 No Ball AE16 No Ball AF16 No Ball AG16 No Ball AH16 No Ball AE17 No Ball AF17 No Ball AG17 No Ball AH17 No Ball AE18 No Ball AF18 No Ball AG18 No Ball AH18 No Ball AE19 No Ball AF19 No Ball AG19 No Ball AH19 No Ball AE20 No Ball AF20 No Ball AG20 No Ball AH20 No Ball AE21 No Ball AF21 No Ball AG21 No Ball AH21 No Ball AE22 No Ball AF22 No Ball AG22 No Ball AH22 No Ball AE23 No Ball AF23 No Ball AG23 No Ball AH23 No Ball AE24 No Ball AF24 No Ball AG24 No Ball AH24 No Ball AE25 No Ball AF25 No Ball AG25 No Ball AH25 No Ball AE26 No Ball AF26 No Ball AG26 No Ball AH26 No Ball AE27 No Ball AF27 No Ball AG27 No Ball AH27 No Ball AE28 No Ball AF28 No Ball AG28 No Ball AH28 No Ball AE29 ClkEn0 AF29 GND AG29 GND AH29 No ball AE30 GND AF30 GND AG30 SOVDD AH30 MemAddr04 AE31 ClkEn3 AF31 MemAddr11 AG31 MemAddr07 AH31 MemAddr05 AE32 ECC2 AF32 MemAddr14 AG32 MemAddr09 AH32 MemAddr06 AE33 ClkEn2 AF33 SOVDD AG33 MemAddr10 AH33 GND AE34 ECC3 AF34 ClkEn1 AG34 MemAddr12 AH34 MemAddr08 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 8 of 9) Ball Signal Name Ball Signal Name Ball Signal Name Ball Signal Name AJ01 GPIO14 * AK01 GMCMDIO * AL01 GMC0TxD3 AM01 GMC0TxD5 AJ02 GPIO11 * AK02 E1OVDD AL02 GMC0TxD2 AM02 GMC0TxD0 AJ03 GMCMDClk * AK03 GMC0TxD4 AL03 GMC0TxD7 AM03 GND AJ04 GPIO12 * AK04 GMC0TxD1 AL04 GND AM04 GND AJ05 GPIO09 * AK05 GND AL05 GND AM05 GMC0TxEn AJ06 GND AK06 GND AL06 GMC0RxDV AM06 GND AJ07 No ball AK07 GND AL07 GMC0CrS AM07 GMC0RxClk AJ08 GMC0TxER AK08 E1OVDD AL08 GMC0RxD5 AM08 GMC0RxD6 AJ09 GMC0RxD3 AK09 GMC0RxD1 AL09 GMC0RxD0 AM09 TherMonA AJ10 GMC0RxER AK10 GND AL10 TherMonB AM10 GND AJ11 E1OVDD AK11 SGMII1TxD AL11 SGMII1TxD AM11 SGMII0TxD AJ12 SGMIITxClk AK12 SGMIITxClk AL12 Reserved AM12 Reserved AJ13 GND AK13 E2OVDD AL13 Reserved AM13 Reserved AJ14 VDD AK14 GND AL14 SGMII1RxClk AM14 SGMII1RxClk AJ15 VDD AK15 SGMII0RxClk AL15 SGMII0RxClk AM15 Reserved AJ16 GND AK16 MemData63 AL16 MemData58 AM16 MemData62 AJ17 VDD AK17 DQS7 AL17 DQS7 AM17 DM7 AJ18 VDD AK18 MemData60 AL18 MemData50 AM18 MemData51 AJ19 MemVRef1A AK19 GND AL19 DQS6 AM19 DQS6 AJ20 VDD AK20 MemData52 AL20 MemData48 AM20 MemData49 AJ21 VDD AK21 MemData34 AL21 MemData47 AM21 MemData42 AJ22 MemVRef2A AK22 SOVDD AL22 GND AM22 DQS5 AJ23 GND AK23 MemData44 AL23 MemData40 AM23 MemData41 AJ24 SOVDD AK24 GND AL24 MemData38 AM24 MemData39 AJ25 GND AK25 GND AL25 GND AM25 DM4 AJ26 GND AK26 MemData37 AL26 MemData36 AM26 MemData32 AJ27 GND AK27 SOVDD AL27 MemODT3 AM27 MemODT1 AJ28 No ball AK28 GND AL28 BankSel0 AM28 MemODT2 AJ29 GND AK29 GND AL29 CAS AM29 BankSel2 AJ30 GND AK30 GND AL30 GND AM30 GND AJ31 GND AK31 MemClkOut1 AL31 GND AM31 BA2 AJ32 MemAddr02 AK32 MemClkOut1 AL32 GND AM32 GND AJ33 MemAddr01 AK33 SOVDD AL33 GND AM33 MemDCFdbkD AJ34 MemAddr03 AK34 MemAddr00 AL34 GND AM34 MemDCFdbkR AMCC Proprietary 59 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 6. Signals Listed by Ball Assignment (Part 9 of 9) Ball 60 Signal Name Ball Signal Name AN01 GND AP01 GND AN02 GND AP02 GND AN03 GND AP03 GND AN04 GMC0TxClk AP04 GND AN05 E1OVDD AP05 GMC0CD AN06 GMC0GTxClk AP06 GND AN07 GND AP07 GMC0RxD7 AN08 GMC0RxD4 AP08 GMC0RxD2 AN09 E1OVDD AP09 GMCRefClk AN10 Reserved AP10 Reserved AN11 SGMII0TxD AP11 EAVDD AN12 GND AP12 EAGND AN13 SGMII1RxD AP13 SGMII1RxD AN14 SGMII0RxD AP14 SGMII0RxD AN15 Reserved AP15 MemData59 AN16 E2OVDD AP16 GND AN17 MemData57 AP17 GND AN18 MemData61 AP18 MemData56 AN19 SOVDD AP19 MemData55 AN20 DM6 AP20 MemData54 AN21 MemData43 AP21 MemData53 AN22 DQS5 AP22 MemData46 AN23 GND AP23 DM5 AN24 MemData35 AP24 MemData45 AN25 DQS4 AP25 DQS4 AN26 SOVDD AP26 MemData33 AN27 MemClkOut0 AP27 MemClkOut0 AN28 GND AP28 MemODT0 AN29 BankSel3 AP29 BankSel1 AN30 SOVDD AP30 RAS AN31 GND AP31 BA1 AN32 BA0 AP32 WE AN33 GND AP33 GND AN34 GND AP34 GND Ball Signal Name Ball Signal Name AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Signal Descriptions The PPC460EX embedded controller is packaged in a 728-ball thermally enhanced plastic ball grid array (TEPBGA). The following tables describe the package level pin-out. Table 7. Pin Summary Group No. of Pins Total Signal Pins 430 VDD 37 OVDD 23 SOVDD 16 E1OVDD 10 E2OVDD 2 GND 160 PAVDD 2 AVDD 18 AGND 17 EAVDD 1 EAGND 1 SPAVDD 1 SPAGND 1 Total Power Pins 289 Reserved 9 Total Pins 728 In the table Table 9 on page 64, each I/O signal is listed along with a short description of its function. Active-low signals (for example, RAS) are marked with an overline. Please see Table 5 on page 25 for the pin (ball) number to which each signal is assigned. Multiplexed Signals Some signals are multiplexed on the same pin so that the pin can be used for different functions. In most cases, the signal names shown in the following table are not accompanied by signal names that might share the same pin. If you need to know what, if any, signals are multiplexed with a particular signal, look up the name in Table 5 on page 25. It is expected that in any single application a particular pin will always be programmed to serve the same function. The flexibility of multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible. Note: Signals multiplexed with GPIO default to GPIO receivers and float after reset. Initialization software must configure the GPIO registers for the desired function as described in the GPIO section of the user's manual. Any of these signals requiring a particular state prior to running initialization code must be terminated with pull-ups or pull-downs. AMCC Proprietary 61 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Multipurpose Signals In addition to multiplexing, some pins such as those carrying the EOTx/TCx signals are also multipurpose. Control of which function a multipurpose pin has is determined by direction, register settings, and so on. Both functions are shown separated by a slash (/). Multimode Signals In some cases (for example, Ethernet) the function of a pin may vary with different modes of operation. When a pin has multiple signal names assigned to distinguish different modes of operation, all of the names are shown separated by a comma. Strapping Pins One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs only during reset and are used for other functions during normal operation (see "Strapping" on page 102). Note that these are not multiplexed pins since the function of the pins is not programmable. Reserved Pins The balls marked Reserved on this chip are not functional. However, some of the reserved balls cannot be left unconnected. Connect the balls shown in the following table as indicated: Table 8. Non-Functional Ball Connections Ball Connection AM15 1k to GND AN15 1k to GND Unused Interfaces The following describes how to terminate the PCI, PCI Express, SATA, and GPIO signals that might not be used. PCI: When the PCI bridge is unused, configure the PCI controller to park on the bus by pulling the PCIReq0/GNT signal low. Parking forces the PLB4 to PCI bridge to actively drive PCI0AD0:31 and PCI0C0:3/BE0:3 greatly reducing the number of termination resistors required. The remaining PCI control signals must be terminated as follows: * Disable the internal PCI arbiter. (See the Bootstrap Operation chapter in the user's manual. Boot Options A-F automatically disable the PCI Arbiter.) * PCI0SErr - Pull up through a 3k resistor to +3.3V * PCI0TRDY - Pull up through a 3k resistor to +3.3V * PCI0Stop - Pull up through a 3k resistor to +3.3V. * PCI0Req0/Gnt - Pull down through a 1k resistor to GND. * PCI0Req1:3 - Individually pull up each signal through 3k resistors to +3.3V. * PCI0Clk - Requires a clock. The frequency must be between 1MHz and 66MHz. PCI-E/SATA: When the PCI Express 0/SATA interface is unused, terminate as follows: * PCIE0AVReg[SATA0AVReg] - Leave unconnected. * PCIE0CalRN[SATA0CalRN] - Leave unconnected. * PCIE0CalRP[SATA0CalRP] - Leave unconnected. * PCIE0RefClk[SATA0RefClk] - Pull down through a 1k resistor to GND. * PCIE0RefClk[SATA0RefClk] - Pull down through a 1k resistor to GND. * PCIE0Rx0[SATA0Rx0] - Pull down through a 1k resistor to GND. 62 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet * PCIE0Rx0[SATA0Rx0] - Pull down through a 1k resistor to GND. * PCIE0Tx0[SATA0Tx0] - Leave unconnected. * PCIE0Tx0[SATA0Tx0] - Leave unconnected. When the PCI Express 1 interface is unused terminate as follows: * PCIE1AVReg - Leave unconnected. * PCIE1CalRN - Leave unconnected. * PCIE1CalRP - Leave unconnected. * PCIE1RefClk - Pull-down through a 1k resistor to GND. * PCIE1RefClk - Pull-down through a 1k resistor to GND. * PCIE1Rx0:3 - Individually pull-down each signal through a 1k resistor to GND. * PCIE1Rx0:3 - Individually pull-down each signal through a 1k resistor to GND. * PCIE1Tx0:3 - Leave unconnected. * PCIE1Tx0:3 - Leave unconnected. Signals Multiplexed with GPIO: By default after reset, signals shared with GPIO pins are configured as GPIO receivers. Termination however, is not needed if the GPIO during initialization are configured as outputs. To configure as drivers, set and clear the appropriate bits in the GPIOn_ODR, GPIOn_TCR and GPIOn_OR registers as described in the GPIO chapter of the user's manual. AMCC Proprietary 63 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 9. Signal Functional Description (Part 1 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes PCI Interface PCIAD00:31 Address/Data bus (bidirectional). I/O 3.3V PCI PCIC0:3/BE0:3 PCI Command/Byte Enables. I/O 3.3V PCI PCI0Clk Provides timing to the PCI interface for PCI transactions. Note: A clock is required even when the PCI interface is not used. The frequency must be between 1MHz and 66MHz. I 3.3V PCI 1 PCI0DevSel Indicates the driving device has decoded its address as the target of the current access. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0Frame Driven by the current master to indicate beginning and duration of an access. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0IRdy Indicates initiating agent's ability to complete the current data phase of the transaction. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0TRdy Indicates the target agent's ability to complete the current data phase of the transaction. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0Stop Indicates the current target is requesting the master to stop the current transaction. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0PErr Reports data parity errors during all PCI transactions except a Special Cycle. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0SErr Reports address parity errors, data parity errors on the Special Cycle command, or other catastrophic system errors. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I/O 3.3V PCI 4 PCI0Req0/Gnt Indicates to the PCI arbiter that the specified agent wishes to use the bus. When the internal arbiter is enabled, input is Req0. When internal arbiter is disabled, input is Gnt. (PCI 2.2 specification requires an 8.2K pull-up on host system.) I 3.3V PCI 2 PCI0Req1:3 An indication to the PCI arbiter that the specified agent wishes to use the bus. Used only when internal PCI arbiter enabled. I 3.3V PCI 2 PCI0Gnt0/Req Indicates that the specified agent is granted access to the bus. When the internal arbiter is enabled, output is Gnt0. When the internal arbiter is disabled, output is Req. O 3.3V PCI PCI0Gnt1:3 Indicates that the specified agent is granted access to the bus. Used only when internal PCI arbiter enabled. O 3.3V PCI PCI0IDSel Used as a chip select during configuration read and write transactions. I 3.3V PCI PCI0INT Level sensitive PCI interrupt. O 3.3V PCI PCI0M66En Capable of 66MHz operation. I 3.3V PCI PCI0Par Even parity across PCIAD00:31 and PCIC0:3/BE0:3 buses. I/O 3.3V PCI 64 5 5 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 9. Signal Functional Description (Part 2 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name PCI0Reset Description Brings PCI device registers and logic to a consistent state. I/O Type O 3.3V PCI I 2.5V LVDS Rcvr w/term Notes PCI Express Interface (n = 0 and 1) PCIEnRefClk PCIEnRefClk Reference Clock: 100MHz differential pair. Note: AC coupling required. See "PCI-E and SATA Reference Clock AC Coupling Recommendations" on page 100. PCIEnAVReg Analog obvservation point for manufacturing test of internal voltage regulator. Note: For normal operation, do not terminate. na Analog PCIEnCalRN PCIEnCalRP Connect a 1.37k 1% external calibration resistor between these two pins. na Analog PCIEnRx0:3 PCIEnRx0:3 Differential receive signal pairs. PCIE0 is a single-channel (Rx0 only) interface. PCIE1 is a four-channel (Rx0:3) interface. Lane 0 is the LSB. I 2.5V LVDS Rcvr w/term PCIEnTx0:3 PCIEnTx0:3 Differential transmit signal pairs. PCIE0 is a single-channel (Tx0 only) interface. PCIE1 is a four-channel (Tx0:3) interface. Lane 0 is theLSB. Note: AC couple only. O 2.5V LVDS Drvr w/term AMCC Proprietary 65 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 9. Signal Functional Description (Part 3 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes DDR2/1 SDRAM Interface BA0:2 Bank Address supporting up to eight internal banks. O 2.5V (1.8V) SSTL2 Dr/Rcv BankSel0:3 Selects up to four external DDR SDRAM banks (a.k.a. ranks). O 2.5V (1.8V) SSTL2 Dr/Rcv CAS Column Address Strobe. O 2.5V (1.8V) SSTL2 Dr/Rcv ClkEn0:3 Clock Enable. O 2.5V (1.8V) SSTL2 Dr/Rcv DM0:7 DM8 Memory write data byte lane masks. DM8 is the byte lane mask for the ECC byte lane. O 2.5V (1.8V) SSTL2 Dr/Rcv I/O 2.5V (1.8V) SSTL2 Diff Dr/Rcv DQS0:7 DQS0:7 DQS8 DQS8 Differential byte lane data strobe. Differential byte lane data strobe for ECC. ECC0:7 ECC check bits 0:7. I/O 2.5V (1.8V) SSTL2 Dr/Rcv MemAddr00:14 Memory address bus. MemAddr14 is the most significant bit (msb). O 2.5V (1.8V) SSTL2 Dr/Rcv MemData00:63 Memory data bus (MemData32:63 available for DDR2 only). MemData00 is the most significant bit (msb). I/O 2.5V (1.8V) SSTL2 Dr/Rcv MemClkOut0:1 MemClkOut0:1 Subsystem clock outputs. O 2.5V (1.8V) SSTL2 Dr/Rcv Diff Driver MemODT0:3 DDR2 On-die termination enable (not used with DDR1). O 2.5V (1.8V) SSTL2 Dr/Rcv RAS Row Address Strobe. O 2.5V (1.8V) SSTL2 Dr/Rcv WE Write Enable. O 2.5V (1.8V) SSTL2 Dr/Rcv MemVRef1A:B Memory voltage reference 1, A and B input. I Volt ref receiver (1.25V or 0.9V) MemVRef2A:B Memory voltage reference 2, A and B input. I Volt ref driver (1.25V or 0.9V) MemDCFdbkD Feedback driver for I/O timing measurements. Note: Connect directly to MemDCFdbkR. Use the shortest trace length possible. Do not include series termination or parallel termination to Vtt. O 2.5V (1.8V) SSTL2 Dr/Rcv MemDCFdbkR Feedback receiver. Connect externally to MemDCFdbkD. I 2.5V (1.8V) SSTL2 Dr/Rcv HISRRst SDRAM hardware initiated self-refresh reset control. I 3.3V LVTTL 66 1, 2 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 9. Signal Functional Description (Part 4 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes Ethernet 0 Interface GMCMDClk GMII, MII, RGMII: Management data clock. O 3.3V tolerant 2.5V CMOS GMCMDIO GMII, MII, RGMII: Transfer command and status information between MII and PHY. I/O 3.3V tolerant 2.5V CMOS GMCRefClk GMII, SGMII, RGMII: 125MHz reference clock for 10/100/1000Mbps. I 3.3V tolerant 2.5V CMOS GMC0GTxClk, GMC0TxClk GMII 0: Transmit clock for 1000Mbps. RGMII 0: Transmit clock for 1000Mbps. O 3.3V tolerant 2.5V CMOS GMC0TxClk GMII/MII 0: Transmit clock for 10/100Mbps. I 3.3V tolerant 2.5V CMOS GMC0TxD1:0, GMC0TxD1:0 GMII/MII 0: Transmit data. RGMII 0: Transmit data. O 3.3V tolerant 2.5V CMOS GMC0TxD3:2, GMC0TxD3:2 GMII/MII 0: Transmit data. RGMII 0: Transmit data. O 3.3V tolerant 2.5V CMOS GMC0TxD7:4, GMC1TxD3:0 GMII 0: Transmit data. RGMII 1: Transmit data. O 3.3V tolerant 2.5V CMOS GMC0TxEn, GMC0TxCtl GMII/MII 0: Transmit enable. RGMII 0: Transmit control. O 3.3V tolerant 2.5V CMOS GMC0TxEr, GMC1TxCtl GMII/MII 0: Transmit error. RGMII 1: Transmit control. O 3.3V tolerant 2.5V CMOS GMC0CD, GMC1RxClk GMII/MII 0: Collision detection. RGMII 1: Receive clock. I 3.3V tolerant 2.5V CMOS GMC0CrS, GMC1GTxClk GMII/MII 0: Carrier sense. RGMII 1: Transmit clock for 1000 Mbps. I/O 3.3V tolerant 2.5V CMOS GMC0RxClk, GMC0RxClk GMII/MII 0: Receive clock. RGMII 0: Receive clock. I 3.3V tolerant 2.5V CMOS 1, 5 GMC0RxD1:0, GMC0RxD1:0 GMII/MII 0: Receive data. RGMII 0: Receive data. I 3.3V tolerant 2.5V CMOS 5 GMC0RxD3:2, GMC0RxD3:2 GMII/MII 0: Receive data. RGMII 0: Receive data. I 3.3V tolerant 2.5V CMOS 5 GMC0RxD7:4, GMC1RxD3:0 GMII/MII 0: Receive data. RGMII 1: Receive data. I 3.3V tolerant 2.5V CMOS 5 GMC0RxDV, GMC0RxCtl GMII/MII 0: Receive data valid. RGMII 0: Receive control. I 3.3V tolerant 2.5V CMOS 5 GMC0RxEr, GMC1RxCtl GMII/MII 0: Receive error. RGMII 1: Receive control. I 3.3V tolerant 2.5V CMOS 5 AMCC Proprietary 1, 5 1, 5 1, 5 67 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 9. Signal Functional Description (Part 5 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes Ethernet SGMII Gigabit Interface SGMIITxClk SGMIITxClk Differential transmit clock: Common 625MHz to PHYs. O 1.8V LVDS Drvr w/term SGMII0:1RxClk SGMII0:1RxClk Differential receive clock: 625MHz from PHY. The differential receiver clock is required for SGMII. Clock recovery from the differential SGMII0:2RxD signals is not supported. I 1.8V LVDS Rcvr w/term SGMII0:1RxD SGMII0:1RxD Differential receive data. I 1.8V LVDS Rcvr w/term SGMII0:1TxD SGMII0:1TxD Differential transmit data. O 1.8V LVDS Drvr w/term SATA0RefClk SATA0RefClk Reference Clock: 100 MHz differential clock pair. Note: AC coupling required. See "PCI-E and SATA Reference Clock AC Coupling Recommendations" on page 100. I 2.5V LVDS Rcvr w/term SATA0Rx0 SATA0Rx0 Data Receive differential signals. Note: Must be AC coupled. I 2.5V LVDS Rcvr w/term SATA0Tx0 SATA0Tx0 Data Transmit differential signals. Note: Must be AC coupled. O 2.5V LVDS Drvr w/term SATA0AVReg Analog obvservation point for manufacturing test of internal voltage regulator. Note: For normal operation, do not terminate. na Analog SATA0CalRP SATA0CalRN Connect a 1.37k 1% external calibration resistor between these two pins. na Analog SATA Interface 68 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 9. Signal Functional Description (Part 6 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes DMA Interface DMAAck0:3 External peripheral DMA acknowledge. Used by the PPC460EX to indicate that data transfers have occurred. O 3.3V LVTTL DMAReq0:3 External peripheral DMA request. Used by slave peripherals to indicate they are prepared to transfer data. I 3.3V LVTTL 5 EOT0:3/TC0:3 End Of Transfer/Terminal Count. I/O 3.3V LVTTL 5 PerAddr05:31 Peripheral address bus used by the PPC460EX. PerAddr05 is the most significant bit (msb) on this bus. I/O 3.3V LVTTL PerData00:31 Peripheral data bus used by the PPC460EX. PerData00 is the most significant bit (msb) on this bus. I/O 3.3V LVTTL PerPar0:3 Peripheral data bus parity used by the PPC460EX. I/O 3.3V LVTTL PerBLast Last burst transfer. Used by either the peripheral controller or DMA controller to indicates the last transfer of a memory access. I/O 3.3V LVTTL PerCS0:5 External peripheral device select. O 3.3V LVTTL PerOE Output enable. Used by either peripheral controller or DMA controller depending upon the type of transfer involved. When the PPC460EX is the bus master, it enables the selected device to drive the bus. O 3.3V LVTTL PerReady Used by a peripheral slave to indicate it is ready to transfer data. I 3.3V LVTTL Rcvr PerR/W Read/Write. Used by the PPC460EX as an output by either the peripheral controller or DMA controller depending upon the type of transfer involved. High indicates a read from memory, low indicates a write to memory. I/O 3.3V LVTTL PerWBE0:3 External peripheral data bus byte enables. I/O 3.3V LVTTL PerErr External Error. Used as an input to record external slave peripheral errors. I 3.3V LVTTL Rcvr ExtReset Peripheral Reset. Used by synchronous peripheral slaves. Note: The state of any external signals or clocks cannot be guaranteed until the ExtReset signal has been de-asserted. O 3.3V LVTTL PerClk Peripheral Clock. Used by synchronous peripheral slaves. O 3.3V LVTTL External Peripheral Interface AMCC Proprietary 1, 2 1, 5 69 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 9. Signal Functional Description (Part 7 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes 1 UART Peripheral Interface The UART interface can be configured as follows: 1. One 8-pin, where n = 0 2. Two 4-pin, where n = 0 & 1 3. Four 2-pin, where n = 0 & 1 & 2 & 3 UARTSerClk This input provides an alternative to the internally generated serial clock. It is used in cases where the allowable internally generated clock rates are not satisfactory. I 3.3V LVTTL w/pull-up UARTnRx Receive data. I 3.3V LVTTL UARTnTx Transmit data. O 3.3V LVTTL UARTnDCD Data Carrier Detect. I 3.3V LVTTL 6 UARTnDSR Data Set Ready. I 3.3V LVTTL 6 UARTnCTS Clear To Send. I 3.3V LVTTL 6 UARTnDTR Data Terminal Ready. O 3.3V LVTTL UARTnRTS Request To Send. O 3.3V LVTTL UARTnRI Ring Indicator. I 3.3V LVTTL IIC Peripheral Interface (n = 0 and 1) IICnSClk IIC0 Serial Clock. I/O 3.3V LVTTL 1, 2 IICnSData IIC0 Serial Data. I/O 3.3V LVTTL 2 I/O 3.3V tolerant 2.5V CMOS USB 2.0 OTG (Device or Host) Interface USB2DD7:0 Bidirectional Device data bus. USB2DDir Transfer direction. PHY has data to transfer. I 3.3V tolerant 2.5V CMOS 1 USB2DNext Next transfer. Input signal from the PHY: Receiving--ready to accept the next data transfer. Transmitting--a new byte is ready to send. I 3.3V tolerant 2.5V CMOS 1 USB2DStop Stop transfer. Output signal to the PHY: Receiving--stop transferring data. Transmitting--the last byte of data has been sent. O 3.3V tolerant 2.5V CMOS USB2DClk USB 2.0 OTG clock--60MHz. I 3.3V tolerant 2.5V CMOS 70 1, 5 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 9. Signal Functional Description (Part 8 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type I/O 3.3V tolerant 2.5V CMOS Notes USB 2.0 Host Interface USB2HD7:0 Bidirectional Host data bus. USB2HDir Transfer direction. PHY has data to transfer. I 3.3V tolerant 2.5V CMOS 1 USB2HNext Next transfer. Input signal from the PHY: Receiving--ready to accept the next data transfer. Transmitting--a new byte is ready to send. I 3.3V tolerant 2.5V CMOS 1, 5 USB2HStop Stop transfer. Output signal to the PHY: Receiving--stop transferring data. Transmitting--the last byte of data has been sent. O 3.3V tolerant 2.5V CMOS USB2HClk USB 2.0 Host clock--60MHz. I 3.3V tolerant 2.5V CMOS 1, 5 USB2HClk48 USB 2.0 Host clock--48MHz. I 3.3V tolerant 2.5V CMOS 1, 5 NFALE Address Latch Enable. O 3.3V LVTTL NFCLE Command Latch Enable. Latches operational commands into the NAND Flash. O 3.3V LVTTL NFRdyBusy Ready/Busy. Indicates status of device during program erase or page read. This signal is wire-OR connected from all NAND Flash devices. I 3.3V LVTTL NFREn Read Enable. Data is latched on the rising edge. O 3.3V LVTTL NFWEn Write Enable. Data is latched on the rising edge. O 3.3V LVTTL NFCE0:3 Chip enable. O 3.3V LVTTL SPIClkOut Clock output. O 3.3V LVTTL 1 SPIDI Data input. I 3.3V LVTTL w/pull-up 2 SPIDO Data output. O 3.3V LVTTL External interrupt requests 0 through 15. I 3.3V LVTTL NAND Flash Interface Serial Peripheral Interface Interrupts Interface IRQ0:15 AMCC Proprietary 1, 5 71 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 9. Signal Functional Description (Part 9 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type Notes 1 JTAG Interface TCK Test Clock. I 3.3V LVTTL w/pull-up TDI Test Data In. I 3.3V LVTTL w/pull-up TDO Test Data Out. O 3.3V LVTTL TMS Test Mode Select. I 3.3V LVTTL w/pull-up TRST Test Reset. During chip power-up, this signal must be low from the start of VDD ramp-up until at least 32 SysClk cycles after VDD is stable in order to initialize the JTAG controller. I 3.3V LVTTL w/pull-up 5 SysClk Main system clock input. I 3.3V tolerant 2.5V CMOS 1 SysErr Set to 1 when a machine check is generated. O 3.3V tolerant 2.5V CMOS SysReset Main system reset. External logic can drive this pin low (minimum of 32 SysClk cycles) to initiate a system reset. A system reset can also be initiated by software. I 3.3V tolerant 2.5V CMOS 1, 2 TmrClk Processor timer external input clock. I 3.3V LVTTL w/pull-up 1 Halt Halt from external debugger. I 3.3V LVTTL w/pull-up 1 FSOURCE0 Reserved, Manufacturing Test Signal Must connect to GND (no pull-down resistor required). I N/A TestEn Test enable. Note: Do not connect for normal operation. I 3.3V LVTTL w/pull-down GPIO00:21 General purpose I/O. I/O 3.3V tolerant 2.5V CMOS GPIO22:63 General purpose I/O. I/O 3.3V LVTTL TherMonA TherMonB On-chip thermal monitor (P diffusion). On-chip thermal monitor (N diffusion). I O Thermal monitor TrcBS0:2 Trace branch execution status. O 3.3V LVTTL TrcClk Trace data capture clock; runs at 1/4 the frequency of the processor. O 3.3V LVTTL TrcES0:4 Trace Execution Status is presented every fourth processor clock cycle. O 3.3V LVTTL TrcTS0:6 Additional information on trace execution and branch status. O 3.3V LVTTL System Interface Trace Interface 72 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 9. Signal Functional Description (Part 10 of 10) Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3k to OVDD or 8.2k for PCI to OVDD or equivalent. 3. Must pull down (recommended value is 1k to GND) 4. If not used, must pull up (recommended value is 3k for LVTTL or 8.2k for PCI to OVDD or equivalent. 5. If not used, must pull down (recommended value is 1k) 6. Strapping input during reset; pull-up (recommended value is 3k to OVDD) or pull-down (recommended value is 1k to GND) required Signal Name Description I/O Type To avoid noise pickup problems, some of these balls must be connected in the board design as shown Table 8 on page 62. Otherwise, do not connect voltage, ground, or any signals to these pins. na na Notes Other Reserved Power VDD +1.25V--Logic voltage. na na OVDD +3.3V--I/O voltage (except DDR SDRAM, Ethernet, and USB). na na SOVDD +1.8V (DDR2) or +2.5V (DDR1)-- I/O voltage for DDR SDRAM. na na E1OVDD +2.5V--I/O voltage for Ethernet (except SGMII) and USB. na na E2OVDD +1.8V--I/O Ethernet (SGMII). na na GND Ground for logic and I/O voltages. na na AVDD +1.25V--PCI-Express SerDes Analog Supply. na na PAVDD +2.5V--PCI-Express SerDes PLL Analog Supply. na na AGND Ground for AVDD and PAVDD. na na EAVDD +2.5V--Filtered analog voltage for Ethernet PLLs. na na EAGND Ground for EAVDD. na na SPAVDD +2.5V--Filtered analog voltage for system PLL. na na SPAGND Ground for SPAVDD. na na AMCC Proprietary 73 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Device Characteristics Table 10. Absolute Maximum Ratings The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device. None of the performance specification contained in this document are guaranteed when operating at these maximum ratings. Characteristic Symbol Value Unit VDD 0 to +1.6 V OVDD 0 to +3.6 V Ethernet I/O and USB supply voltage E1OVDD 0 to +2.7 V Ethernet SGMII supply voltage E2OVDD 0 to +1.9 V DDR2 (DDR1) SDRAM I/O supply voltage SOVDD 0 to +1.9 (+2.7V) V AVDD 0 to +1.6 V 1 System PLL analog supply voltage SPAVDD 0 to +2.7 V 1 Ethernet PLL analog supply voltage EAVDD 0 to +2.7 V 1 PCI-Express SerDes PLL analog supply voltage PAVDD 0 to +2.7 V 1 Storage Temperature Range TSTG -55 to +150 C Case temperature under bias TC -40 to +120 C Internal logic supply voltage I/O supply voltage PCI-Express SerDes analog supply voltage Notes 2 Notes: 1. The analog voltages (AVDD, EAVDD, SPAVDD, and PAVDD) used for the on-chip functions can be derived from the logic voltages, but must be filtered before entering the PPC460EX. A separate filter for each analog voltage, as shown below, is recommended: AVDD VDD L AVDD L - SMT ferrite bead chip, Murata BLM18AG121SN1D C - 0.1 F ceramic EAVDD, SPAVDD, and PAVDD C AGND L - SMT ferrite bead chip, Murata BLM15AG102SN1 C - 1 F ceramic 2. This value is not a specification of the operational temperature range; it is a stress rating only. 74 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 11. Recommended DC Operating Conditions (Part 1 of 2) Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability. Parameter Symbol Minimum Typical Maximum Unit Notes VDD +1.2 +1.25 +1.3 V 4 OVDD +3.15 +3.3 +3.45 V 4 Ethernet 1 I/O Supply Voltage E1OVDD +2.4 +2.5 +2.6 V 4 Ethernet 2 I/O Supply Voltage (SGMII) E2OVDD +1.7 +1.8 +1.9 V 4 DDR2 (DDR1) SDRAM I/O Supply Voltage SOVDD +1.7 (+2.4) +1.8 (+2.5) +1.9 (+2.6) V 4 AVDD +1.2 +1.25 +1.3 V 3 System PLL Analog Supply Voltage SPAVDD +2.4 +2.5 +2.6 V 3 Ethernet PLL analog supply voltage EAVDD +2.4 +2.5 +2.6 V 3 PCI-Express SerDes PLL analog supply voltage PAVDD +2.4 +2.5 +2.6 V 3 DDR2 (DDR1) SDRAM Reference Voltage SVREF 0.49SOVDD 0.50SOVDD 0.51SOVDD V 3 +2.0 +3.6 V 1 +1.7 +3.6 V SVREF + 0.125 (0.15) 2.2 (3.0) V +1.1 +2.2 V Input Logic Low 3.3V LVTTL and PCI 0 +0.8 V Input Logic Low 2.5V CMOS 0 +0.7 V -0.3 (-0.3) SVREF - 0.125 (0.18) V Input Logic Low (1.8V SGMII) +0.3 +0.8 V Output Logic High 3.3V LVTTL and PCI +2.4 +3.6 V +2.0 +2.7 V SOVDD - 0.95 (+1.95) SOVDD V +1.534 V 0 +0.4 V 0 +0.4 V 0 +0.45 V +1.081 V Logic Supply Voltage I/O Supply Voltage PCI-Express SerDes analog Supply Voltage Input Logic High 3.3V LVTTL and PCI Input Logic High 2.5V CMOS, 3.3V tolerant VIH Input Logic High 1.8V DDR2 (2.5V DDR1) Input Logic High (1.8V SGMII) VIL Input Logic Low 1.8V DDR2 (2.5V DDR1) Output Logic High 2.5V CMOS VOH Output Logic High 1.8V DDR2 (2.5V DDR1) +1.23 Output Logic High (1.8V SGMII) Output Logic Low 3.3V LVTTL and PCI Output Logic Low 2.5V CMOS +1.385 VOL Output Logic Low 1.8V DDR2 (2.5V DDR1) +0.841 Output Logic Low (1.8V SGMII) +0.961 2 1 2 1 1 Input Leakage Current (no pull-up or pull-down) IIL1 0 0 A Input Leakage Current for pull-down IIL2 0 (LPDL) 200 (MPUL) A 5 Input Leakage Current for pull-up IIL3 -150 (LPDL) 0 (MPUL) A 5 AMCC Proprietary 75 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 11. Recommended DC Operating Conditions (Part 2 of 2) Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability. Parameter Symbol Minimum Typical Maximum Unit Input Max Allowable Overshoot 2.5V CMOS VIMAO25 +3.9 V Input Max Allowable Overshoot 3.3V LVTTL VIMAO33 +3.9 V Input Max Allowable Undershoot 2.5V CMOS VIMAU25 -0.6 V Input Max Allowable Undershoot 3.3V LVTTL VIMAU33 -0.6 V Output Max Allowable Overshoot 2.5V CMOS VOMAO25 +3.9 V Output Max Allowable Overshoot 3.3V LVTTL VOMAO33 +3.9 V Output Max Allowable Undershoot 2.5V CMOS VOMAU25 -0.6 V Output Max Allowable Undershoot 3.3V LVTTL VOMAU33 -0.6 V TC -40 Case Temperature +85 C Notes 6 Notes: 1. PCI drivers meet PCI specifications. 2. SVREF = SOVDD/2. SOVDD = +1.8V for DDR2 memory or +2.5V for DDR1 memory. 3. The analog voltages used for the on-chip PLLs can be derived from the logic voltages, but must be filtered before entering the PPC460EX. See "Absolute Maximum Ratings" on page 74. 4. LPDL is least positive down level; MPUL is most positive up level. 5. Case temperature, TC, is measured at top center of case surface with device soldered to a circuit board. Table 12. 3.3V, 2.5V, and LVDS I/O Characteristics Interfaces Ethernet (MII, RGMII), SysClk, SysErr, GPIO00:21 I/O Output Impedance ( ) Input Capacitance (pF) 3.3V tolerant 2.5V CMOS 50 5.7 Ethernet (SGMII) 1.8V LVDS - 5.0 DMA, NAND Flash External Peripheral, UART, USB, Interrupt, JTAG, TmrClk, Halt , GPIO22:63, Trace 3.3V LVTTL 50 5.2 IIC, SPI 3.3V LVTTL 35 5.2 3.3V - 5.7 PCI Power Supply Sequencing All the PPC460EX I/O designs are power supply sequence independent. There is no requirement that the power supplies power up in any particular order. The following items are power sequence considerations: * Logic power (VDD) is applied before the I/O supply voltages: The I/Os include internal supply sequencing circuitry which ensures the output of the receiver connected to internal chip logic is 0 until the I/O power is applied. When the logic power is on and the I/O power supplies are off, the I/O logic connected to the associated ball neither sinks or sources significant current unless influenced by an internal pull-up or pull-down resistor. While the I/O supply is ramping, the state of the I/O ball is not predictable. This power sequence is not destructive to the I/Os or internal logic and does not cause any functional problems. * I/O power is applied before the logic power is applied: The output driver (connected the balls) comes up in an unknown state (driving 1, driving 0, or tri-state) until the internal logic voltage is stable within normal operating range. This power sequence is not destructive to the I/Os or internal logic and does not cause any functional problems. 76 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet * External voltage should not be applied to the chip I/O balls before the associated I/O power supply voltage is applied to the chip. * A chip power-down cycle must complete (all I/O supply voltages and VDD are below +0.4V) before a new power-up cycle is started * During a power-up cycle, SysReset and TRST inputs should be asserted low. SysReset and TRST should remain asserted until SysClock is stable and at least 32 SysClock times after all power supplies are stable within normal operating range. Failure to follow this reset sequence during the power-up cycle can result in unpredictable operation of the chip. Power Specifications The following tables contain measured power numbers. The measurement conditions are listed as Notes below each table. Table 13. Typical DC Power Supply Requirements Using DDR2 Memory Frequency (MHz) +1.25V Supply (VDD+AVDD) +1.8V Supply (SOVDD+E2OVDD) +2.5V Supply (E1OVDD+EAVDD+ SPAVDD+PAVDD) +3.3V Supply (OVDD) Total Unit Notes 600 2.90 0.33 0.31 0.37 3.91 W 1 800 3.06 0.34 0.31 0.37 4.08 W 1 1000 3.83 0.34 0.31 0.38 4.86 W 1 Notes: 1. Measured at TC = +85C, using a typical process part for each speed grade, while running Linux and test applications that exercise each function with representative traffic (RGMII Ethernet). 2. 600MHz, 800MHz, and 1000MHz parts use a nominal voltage of VDD = +1.25V, DDR2 running at 400MHz, and the PLB running at 200MHz. Table 14. Typical DC Power Supply Requirements Using DDR1 Memory Frequency (MHz) +1.25V Supply (VDD+AVDD) +1.8V Supply (E2OVDD) +2.5V Supply (E1OVDD+EAVDD+ SPAVDD+PAVDD +SOVDD) +3.3V Supply (OVDD) Total Unit Notes 600 2.90 0.01 1.18 0.37 4.46 W 1 800 3.06 0.01 1.18 0.37 4.63 W 1 1000 3.83 0.01 1.18 0.38 5.39 W 1 Notes: 1. Estimated and based on a nominal voltage of VDD = +1.25V, TC = 85C, while running Linux and a test application that exercises each function with representative traffic (RGMII Ethernet). 2. 600MHz, 800MHz, and 1000 MHz parts use a maximum voltage of VDD = +1.30V. AMCC Proprietary 77 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 15. Maxiumum DC Power Supply Requirements Using DDR2 Memory Frequency (MHz) +1.25V Supply (VDD+AVDD) +1.8V Supply (SOVDD+E2OVDD) +2.5V Supply (E1OVDD+EAVDD+ SPAVDD+PAVDD) +3.3V Supply (OVDD) Total Unit Notes 600 7.35 0.39 0.34 0.83 8.91 W 1, 2 800 7.66 0.39 0.34 0.83 9.22 W 1, 2 1000 7.87 0.39 0.34 0.85 9.45 W 1, 2 Notes: 1. Measured at TC = +85C, using a a best-case process (worst case power) part, while running Linux and test applications that exercise each function with representative traffic (RGMII Ethernet). 2. 600MHz, 800MHz, and 1000MHz parts use a nominal voltage of VDD = +1.30V, DDR2 running at 400MHz, and the PLB running at 200MHz. Table 16. Maxiumum DC Power Supply Requirements Using DDR1 Memory Frequency (MHz) +1.25V Supply (VDD+AVDD) +1.8V Supply (E2OVDD) +2.5V Supply (E1OVDD+EAVDD+ SPAVDD+PAVDD+ SOVDD) +3.3V Supply (OVDD) Total Unit Notes 600 7.35 0.01 1.22 0.83 9.41 W 1, 2 800 7.66 0.01 1.22 0.83 9.72 W 1, 2 1000 7.87 0.01 1.25 0.85 9.98 W 1, 2 Notes: 1. Measured at TC = +85C, using a a best-case process (worst case power) part, while running Linux and test applications that exercise each function with representative traffic (RGMII Ethernet). 2. 600MHz, 800MHz, and 1000MHz parts use a nominal voltage of VDD = +1.30V, DDR2 running at 400MHz, and the PLB running at 200MHz. 78 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 17. DC Power Supply Loads Symbol Typical 4 Maximum 3, 5 Unit VDD (+1.25V) active operating current IDD 3065 6055 mA OVDD (+3.3V) active operating current IODD 115 250 mA E1OVDD (+2.5V) active operating current IE1ODD 124 132 mA E2OVDD (+1.8V) active operating current IE2ODD 3 50 mA SOVDD (+1.8V) DDR2 active operating current 2 ISODD2 210 300 mA SOVDD (+2.5V) DDR1 active operating current 2 ISODD1 376 450 mA AVDD (+1.25V) input current 1 IADD 4 5 mA 1 EAVDD (+2.5V) active operating current 1 IEADD 1 2 mA 1 PAVDD (+2.5V) active operating current 1 IUADD 1 2 mA 1 SPAVDD (+2.5V) active operating current 1 IUADD 1 2 mA 1 Parameter Notes Notes: 1. See "Absolute Maximum Ratings" on page 74 for filter recommendations. 2. SOVDD will be either +2.5V or +1.8V but not both. 3. The maximum current values listed above are not guaranteed to be the highest obtainable. These values are dependent on many factors including the type of applications running, clock rates, use of internal functional capabilities, external interface usage, case temperature, and the power supply voltages. Your specific application can produce significantly different results. VDD (logic) current and power are primarily dependent on the applications running and the use of internal chip functions (DMA, PCI, Ethernet, and so on). OVDD (I/O) current and power are primarily dependent on the capacitive loading, frequency, and utilization of the external buses. 4. Typical current is estimated at 1.000GHz with VDD = +1.25V, OVDD = +3.3V, E1OVDD = +2.5V, SOVDD = +2.5V (DDR1) or +1.8V (DDR2), and TC = +85C with a typical process. 5. Maximum current is estimated at 1.000GHz with VDD = +1.3V, OVDD = +3.45V, E1OVDD = +2.6V, SOVDD = +2.6V (DDR1) or +1.9V (DDR2), and TC = +85C, and best-case process (which drives worst-case power). AMCC Proprietary 79 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Package Thermal Specifications Table 18. Package Thermal Specifications Thermal resistance values for the TE-PBGA package in a convection environment are as follows: Parameter Airflow ft/min (m/sec) Symbol Unit 0 (0) 100 (0.51) 200 (1.02) 300 (1.53 400 (2.04) 600 (2.55) Notes Junction-to-ambient thermal resistance without heat sink JA 13.1 11.7 10.9 10.5 10.3 10 3 Junction-to-ambient thermal resistance with heat sink JA 10.3 7.3 6.1 5.6 5.4 5.1 3, 6 Resistance Value Junction-to-case thermal resistance JC 3.5 C/W 3 Junction-to-board thermal resistance JB 7.3 C/W 3 Notes: 1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. 2. TA = TC - Px CA, where TA is ambient temperature and P is power consumption. 3. TC Max = TJMax - PxJC, where TJMax is maximum junction temperature (+125C) and P is power consumption. 4. The preceding equations assume that the chip is mounted on a board with at least one signal and two power planes. 5. Values in the table were achieved using a JEDEC standard board with the following characteristics: 114.5mm x 101.6mm x 1.6mm, 4 layers. The board has 100 thermal vias (same as the number of thermal balls on the TE-PBGA package). 6. Values for an attached heat sink were achieved with a 35mm x 35mm x 15mm unit (see Thermal Management below), attached with a 0.1mm thickness of adhesive having a thermal conductivity of 1.3W/mK. Heat Sink The following heat sink was used in the above thermal analysis: 35W x 35L x 15H (mm) Base thickness = 1.5mm Fin height = 13.5mm Fin thickness = 1.0mm Number of Fins: 11 aluminum 80 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Thermal Monitor Thermal monitoring of the chip is accomplished using the PNP transistor ( 2) provided on the chip. The collector of the transistor is connected to ground (GND). The emitter (TherMonA) and base (TherMonB) are connected to chip pins. A voltage measurement (VBE1 and VBE2) across the TherMonA and TherMonB pins at the two current values I1 and I2 provides the chip temperature in K according to the equation: T = (q/nk)(VBE2-VBE1)/ln(I2/I1) K where q = 1.602 176 53x10-19, n = 0.99 0.05, and k = 1.380 6505x10-23. Note: VBE2 and VBE1 should be specified in volts. I1 and I2 can be any units of measure provided they are the same. The small values require precision measurement and current sources. PPC460EX C E TherMonA I1, I2 (Max = 300A) VBE1, VBE2 B TherMonB Note: The bias voltage VEB should be between +0.5 V and +0.7V. AMCC Proprietary 81 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Clocking Specifications Table 19. Clocking Specifications Symbol Parameter Min Max Units Notes 66.66 100 MHz 1 SysClk Input FC Frequency TC Period 10 15 ns TCS Edge stability (cycle-to-cycle jitter) - 0.1 ns TCH High time 40% of nominal period 60% of nominal period ns TCL Low time 40% of nominal period 60% of nominal period ns Note: Input rising and falling edge slew rate 1V/ns 2 3 PLL VCO FC Frequency 600 2000 MHz TC Period 0.50 1.66 ns Processor (CPU) Clock FC Frequency 400 1000 MHz TC Period 1.00 2.5 ns 133.33 200 MHz 5 7.5 ns 4 MemClkOut and PLB Clock FC Frequency TC Period TCH High time 45% of nominal period 55% of nominal period ns FC Frequency 66.66 100 MHz TC Period 10 15 ns 66.66 200 MHz 5 15 ns OPB Clock 5 AHB Clock FC Frequency TC Period Notes: 1. SysClk supports spread spectrum clocking with a -1% down-spread and a 40 kHz or less modulation frequency. For a 66.66 MHz minimum SysClk, the modulation frequency range 66.00 MHz to 66.66 MHz is supported. 2. The modulation frequency of the input jitter should be lower than 100 kHz (to allow the PLL to track the jitter) or higher than 20 MHz (to allow the PLL to filter the jitter). Within the frequency range 100 kHz to 20 MHz, the cycle to cycle jitter must be +/- 100 ps or less. 3. Slew rate is measured between 0.7V and 1.7V. 4. The maximum supported processor clock frequency for any part is specified in the part number (see "Ordering and PVR Information" on page 5). 5. In order to support a 1-Gbps Ethernet data rate, the minimum OPB clock frequency is 66.66 MHz. If the Ethernet application is limited to 100 Mbps, the minimum OPB clock frequency is 33.33 MHz. 82 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Figure 4. Timing Waveform TCH TCL TC Spread Spectrum Clocking Care must be taken when using a spread spectrum clock generator (SSCG) with the PPC460EX. This controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When using an SSCG with the PPC460EX the following conditions must be met: * The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the PPC460EX with one or more internal clocks at their maximum supported frequency, the SSCG can only lower the frequency. * The maximum frequency deviation of SysClk cannot exceed -1%, and the modulation frequency cannot exceed 40kHz. In some cases, on-board PPC460EX peripherals impose more stringent requirements. * For the PCI Express Reference Clock, the maximum spread spectrum is -0.5%, modulated between 30kHz and 33kHz. The ports on the two ends of a link must transmit data at a rate that is within 600 parts per million (ppm) of each other at all times. This is specified to allow bit rate clock sources with a 300ppm tolerance. Notes: 1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that the connected device is running at precise baud rates. 2. Ethernet operation is unaffected. 3. IIC operation is unaffected. Important: It is up to the system designer to ensure that any SSCG used with the PPC460EX meets the above requirements and does not adversely affect other aspects of the system. AMCC Proprietary 83 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 20. Peripheral Interface Clock Timings (Part 1 of 2) Parameter Minimum Maximum Units PCI0Clk frequency - 66.66 MHz PCI0Clk period 15 - ns PCI0Clk high time 40% of nominal period 60% of nominal period ns PCI0Clk low time 40% of nominal period 60% of nominal period ns - 2.5 MHz GMCMDClk period 400 - ns GMCMDClk high time 160 - ns GMCMDClk low time 160 - ns GMCGTxClk frequency 2.5 125 MHz 8 400 ns GMCnTxClk frequency 2.5 25 MHz GMCnTxClk period 40 400 ns GMCnTxClk high time 35% of nominal period - ns GMCnTxClk low time 35% of nominal period - ns GMCnRxClk frequency 2.5 25 MHz GMCnRxClk period 40 400 ns GMCnRxClk high time 35% of nominal period - ns GMCnRxClk low time 35% of nominal period - ns GMCRefClk frequency 125 125 MHz 8 8 ns GMCRefClk high time 40% of nominal period 60% of nominal period ns 2 GMCRefClk low time 40% of nominal period 60% of nominal period ns 2 GMCRefClk rise time - 1 ns 4 SGMIIRxClk frequency 625 625 MHz PerClk frequency 33 100 MHz PerClk period 10 30 ns PerClk high time 50% of nominal period 66% of nominal period ns PerClk low time 33% of nominal period 50% of nominal period ns (OPB Fc) / 1024 (OPB Fc) / 4 MHz - 400 kHz GMCMDClk frequency GMCGTxClk period GMCRefClk period SPIClkOut frequency IICSClk frequency 84 Notes AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 20. Peripheral Interface Clock Timings (Part 2 of 2) Parameter Minimum Maximum Units TmrClk frequency - 100 MHz TmrClk period 10 - ns TmrClk high time 40% of nominal period 60% of nominal period ns TmrClk low time 40% of nominal period 60% of nominal period ns TrcClk frequency 100 300 MHz 3 - 1000/(2TOPB1 + 2ns) MHz 1 2TOPB1 + 2 - ns 1 UARTSerClk high time TOPB1 + 1 - ns 1 UARTSerClk low time TOPB1 + 1 - ns 1 USB2DClk frequency 60 60 MHz 16.66 16.66 ns USB2DClk high time 40% of nominal period 60% of nominal period ns USB2DClk low time 40% of nominal period 60% of nominal period ns 60 60 MHz 16.66 16.66 ns USB2HClk high time 40% of nominal period 60% of nominal period ns USB2HClk low time 40% of nominal period 60% of nominal period ns 48 48 MHz 20.8 20.8 ns USB2HClk48 high time 40% of nominal period 60% of nominal period ns USB2HClk48 low time 40% of nominal period 60% of nominal period ns UARTSerClk frequency UARTSerClk period USB2DClk period USB2HClk frequency USB2HClk period USB2HClk48 frequency USB2HClk48 period Notes Notes: 1. TOPB is the period in ns of the OPB clock. The minimum OPB clock frequency is Ethernet application dependant (see Table 19 on page 82). The maximum OPB clock frequency is 100 MHz. 2. An internal PLL improves this duty cycle to a worst case of 48% minimum, 52% maximum. 3. TrcClk is 1/4 CPU Clk. The maximum TrcClk supported by most instruction trace probes is 200MHz. 4. The rise time for GMCRefClk is measured between 0.7V and 1.7V. AMCC Proprietary 85 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet I/O Specifications Figure 5. Input Setup and Hold Waveform Clock TIS min TIH min Inputs Valid Figure 6. Output Delay and Float Timing Waveform Clock Outputs TOV max TOV max TOV max TOH min TOH min TOH min High (Drive) Float (High-Z) Valid Valid Low (Drive) 86 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet RGMII Timing Figure 7. Setup and Hold Timing Waveforms for RGMII Signals GMCnTxClk TskewT GMCnTxD/Ctl Valid Valid GMCnRxClk TskewR GMCnRxD/Ctl Valid Valid Table 21. RGMII I/O Timing Input (ns) Signal Output (ns) Output Current (mA) Clock Notes TskewR (min) TskewR (max) TskewT (min) TskewT (max) I/O H (min) I/O L (min) - - - - n/a n/a - GMCnRxD0:3 1.0 2.8 n/a n/a n/a n/a GMCnRxClk 1 GMCnRxCtl 1.0 2.8 n/a n/a n/a n/a GMCnRxClk 1 GMCnTxClk v - - - 5.51 7.23 - GMCnTxD0:3 n/a n/a -0.5 0.5 5.51 7.23 GMCnTxClk GMCnTxCtl n/a n/a -0.5 0.5 5.51 7.23 GMCnTxClk GMCnRxClk Notes: 1. Assumes GMCnRxClk is delayed either on the board or by the PHY to ensure adequate timing margin. Test Conditions AC specifications are characterized with VDD = +1.20V, OVDD = +3.15V, E1OVDD = +2.4V, TC = +85 C and a 50pF test load as shown in the figure to the right. AMCC Proprietary Output Pin 50pF 87 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 22. AC I/O Specifications (Part 1 of 3) Notes: 1. SGMII PHY recovers the SGMII Tx clock from the SGMII TxD0:1. 2. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Output (ns) Output Current (mA) Setup Time (TIS min) Hold Time (TIH min) Valid Delay (TOV max) Hold Time (TOH min) I/O H (minimum) I/O L (minimum) Clock PCI0Reset na na na na 0.5 1.5 async PCI0AD00:31 2.5 0 6 2 0.5 1.5 PCI0Clk PCI0C0:3/BE0:3 2.4 0 6 2 0.5 1.5 PCI0Clk PCI0Par 2.8 0 5.4 2 0.5 1.5 PCI0Clk PCI0Frame 2.8 0 6 2 0.5 1.5 PCI0Clk PCI0DevSel 2.1 0 6 2 0.5 1.5 PCI0Clk PCI0IRDY 2.7 0 6 2 0.5 1.5 PCI0Clk PCI0TRDY 2.5 0 6 2 0.5 1.5 PCI0Clk PCI0Stop 2.5 0 6 2 0.5 1.5 PCI0Clk PCI0PErr 2.4 0 6 2 0.5 1.5 PCI0Clk PCI0SErr 2.1 0 6 2 0.5 1.5 PCI0Clk PCI0IDSel 2.2 0 na na na na PCI0Clk PCI0Req0:3 3 0 na na na na PCI0Clk PCI0Gnt0:3 na na 6 2 0.5 1.5 PCI0Clk PCI0INT na na 5.8 2 0.5 1.5 async GMCMDClk na na na na 5.51 7.23 GMCMDIO 10 0 30 10 5.51 7.23 GMC0TxClk na na na na 5.51 7.23 GMC0TxD3:0 na na 7 1 5.51 7.23 GMC0TxClk GMC0TxEn na na 6 1 5.51 7.23 GMC0TxClk Notes PCI Interface Ethernet MII Interface GMCMDClk GMC0TxEr na na 6 1 5.51 7.23 GMC0TxClk GMC0CD 10 10 na na na na GMC0RxClk GMC0CrS 10 10 na na na na GMC0RxClk GMC0RxD3:0 6 10 na na na na GMC0RxClk GMC0RxDV 5 10 na na na na GMC0RxClk GMC0RxEr 6 10 na na na na GMC0RxClk GMCMDClk na na na na 5.51 7.23 GMCMDIO 10 0 30 10 5.51 7.23 GMC0GTxClk na na na na 5.51 7.23 GMC0TxD7:0 na na 2.3 2 5.51 7.23 GMC0GTxClk GMC0TxEn na na 2.3 2 5.51 7.23 GMC0GTxClk GMC0TxEr na na 2.2 2 5.51 7.23 GMC0GTxClk GMC0CD 2 0 na na na na GMC0RxClk GMC0CrS 2 0 na na na na GMC0RxClk GMC0RxD7:0 2 0 na na na na GMC0RxClk GMC0RxDV 1.9 0 na na na na GMC0RxClk GMC0RxEr 1.9 0 na na na na GMC0RxClk Ethernet GMII Interface 88 GMCMDClk AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 22. AC I/O Specifications (Part 2 of 3) Notes: 1. SGMII PHY recovers the SGMII Tx clock from the SGMII TxD0:1. 2. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Setup Time (TIS min) Output (ns) Output Current (mA) Hold Time (TIH min) Valid Delay (TOV max) Hold Time (TOH min) I/O H (minimum) I/O L (minimum) Clock Notes Ethernet SGMII Interface SGMII0:1RxD SGMII0:1RxD 0.1 0.1 na na na na SGMII0RxClk SGMII0:1TxD SGMII0:1TxD na na na na 3.35 3.35 SGMII0TxClk 1 Internal Peripheral Interface IIC0:1SClk na na na na 15.75 10.46 IIC0:1SData 5 1.5 5 0 15.75 10.46 SCPClkOut na na na na 15.75 10.46 SPIDI 5 1.5 na na na na SPIDO na na 7 0 15.75 10.46 SCPClkOut UARTnDCD na na na na na na UARTSerClk UARTnDSR na na na na na na UARTSerClk UARTnCTS na na na na na na UARTSerClk UARTnRTS na na na na 11.08 7.37 UARTSerClk UARTnDTR na na na na 11.08 7.37 UARTSerClk IIC0:1SClk SCPClkOut UARTnRI na na na na na na UARTSerClk UARTnRx na na na na na na UARTSerClk UARTnTx na na na na 11.08 7.37 UARTSerClk USB2DD7:0 4.9 0 6 2 5.51 7.23 USB2HClk USB2DDir 4.9 0 na na na na USB2HClk USB2DNext 4.9 0 na na na na USB2HClk USB2DStop na na 7 2 5.51 7.23 USB2HClk USB2HD7:0 5 0 6 2 5.51 7.23 USB2HClk USB2HDir 4.9 0 na na na na USB2HClk USB2HNext 4.9 0 na na na na USB2HClk USB2HStop na na 7 2 5.51 7.23 USB2HClk na na na na na na Interrupts Interface IRQ0:15 JTAG Interface TCK na na na na na na TDI 2 5.5 na na na na TCK TDO na na 9.5 1 11.08 7.37 TCK TMS 2 5.5 na na na na TCK TRST na na na na na na async SysReset na na na na na na async SysErr na na na na 11.08 7.37 async Halt na na na na na na async TrcClk na na na na 11.08 7.37 TrcBS0:2 na na 1.5 1 11.08 7.37 TrcClk TrcES0:4 na na 1.6 1 11.08 7.37 TrcClk TrcTS0:6 na na 1.7 1 11.08 7.37 TrcClk 2 System Interface Trace Interface AMCC Proprietary 89 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 22. AC I/O Specifications (Part 3 of 3) Notes: 1. SGMII PHY recovers the SGMII Tx clock from the SGMII TxD0:1. 2. TDO timing is referenced to the falling edge of TCK. Input (ns) Signal Setup Time (TIS min) Output (ns) Hold Time (TIH min) Output Current (mA) Valid Delay (TOV max) Hold Time (TOH min) I/O H (minimum) I/O L (minimum) Clock PerClk Notes External Slave Peripheral Interface DMAReq0:3 4 1 na na na na DMAAck0:3 na na 5.3 1 11.08 7.37 PerClk EOT0:3/TC0:3 4 1 5.3 1 11.08 7.37 PerClk PerClk na na na na 11.08 7.37 PerAddr02:31 na na 4.5 1 11.08 7.37 PerClk PerData00:31 2 1 4.9 1 11.08 7.37 PerClk PerPar0:3 2 1 4.9 1 11.08 7.37 PerClk PerWBE0:3 na na 4.8 1 11.08 7.37 PerClk PerCS0:5 na na 5.3 1 11.08 7.37 PerClk PerR/W na na 4.5 1 11.08 7.37 PerClk PerOE na na 4.5 1 11.08 7.37 PerClk PerReady 2 1 na na na na PerClk PerBLast na na 4.5 1 11.08 7.37 PerClk PerErr 2 1 na na na na PerClk ExtReset na na na na 11.08 7.37 async NAND Flash Interface NFCE0:3 na na 4.7 1 11.08 7.37 PerClk NFCLE na na 5.3 1 11.08 7.37 PerClk NFALE na na 5.3 1 11.08 7.37 PerClk NFREn na na 5.3 1 11.08 7.37 PerClk NFWEn na na 5.3 1 11.08 7.37 PerClk NFRdyBusy 2 1 na na na na PerClk 90 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet DDR2/1 SDRAM Interface Specifications The DDR SDRAM controller times its operation using the internal PLB clock signal and generates MemClkOut from the PLB clock. The PLB clock is an internal signal that cannot be directly observed. Note: MemClkOut can be advanced with respect to the PLB clock by means of the SDRAM0_CLKTR programming register. In a typical system, users advance MemClkOut by 90. This depends on the specific application and requires a thorough understanding of the memory system in general (refer to the DDR SDRAM Controller chapter in the PowerPC 460EX/EXr/GT Embedded Processor User's Manual). The signals are terminated as indicated in Figure 8 for the DDR timing data in the following sections. Programmable Timing When initializing the DDR controller at boot time, calibration of various programmable delays is required. The following parameters are programmable: * The internal delay of the DQS signals on a read is programmable. A single programmable delay globally affects all of the DQS signals. * The internal delay of the feedback signal on a read is programmable. The DDR controller drives and receives a pulse at the beginning of each read burst. The feedback pulse is driven and received by MemDCFbdkD and MemDCFbdkR. This pulse is used to adjust the sample cycle. * The phase between the internal PLB clock and MemClkOut is programmable. * The phase between the MemClkOut and the write DM, DQS, and data signals is programmable. Board Layout Recommendations The paths (traces) for the data and the associated data strobe signal should be routed with the same length between PPC460EX and the SDRAM devices, allowing the rising and falling edges of the strobe to arrive at the capture logic at the same time the data is in transition. Board designs must meet of the following criteria: * Skew between the signals within any byte lane (8 DQ, 1 DQS, and 1 DM) should not exceed 50ps. For example, traces that average 3.00 in. and 167ps/in., and meet the maximum 50ps skew requirement, have a maximum length difference of 0.3in. and are between 2.85in. and 3.15in. Clocking Clocking skew to all DRAMs must be minimized. The maximum recommended flight-time skew between clocks for different memory chips is 10ps. Because of the stringent requirements on DDR device clock inputs, it is expected that board designers use some type of external PLL suitable to redrive the clock to the DDR SDRAMs when more than two memory clocks are needed.. In such a system, the PLL acts as a zero-delay insertion buffer. The PPC460EX (PPC460GT) has two identical memory clocks, MemClkOut0:1, eliminating the need to redrive the memory clock for some board designs. Designs using a single registered DIMM or a single rank of directly attached 32-bit memory (2 x16 memory chips) does not require redriven clocks. Feedback Signal There are two options for handling the trace between the feedback driver and receiver, MemDCFbdkD to MemDCFbdkR. 1. The feedback trace can be length matched to the round-trip delay measured from the rising edge of MemClkOut0:1 to the resulting input DQS on a read operation. Matching the feedback trace to the round-trip delay, however, can negatively affect the sample cycle used by the DDR controller during reads. For this reason, matching the trace length is not recommended for typical applications. Even when trace lengths are matched to the round trip delay, software calibration of the feedback delay is still required. AMCC Proprietary 91 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet 2. The feedback trace can be made as short as possible such that MemDCFbdkD to MemDCFbdkR are directly connected to one another. When using a short trace, software must calibrate the feedback timing using MCIF0_RFDC[RFFD] . This method works well as long as the round trip flight time is less than half of a MemClkOut cycle. DDR I/O Characteristics The DDR I/O operate as either 2.5V (SSTL2_25) DDR1 or 1.8V (SSTL_18) DDR2 receiver/drivers. The following table lists the ODT termination supported, output driver impedance and input receiver capacitance. Table 23. DDR I/O Characteristics DDR2 ODT () Output Impedance () Input Capacitance (pF) MemData00:63, ECC0:7, MemDCFdbkD, MemDCFdbkR, MemAddr00:14, BA0:2, BankSel0:3, RAS, CAS, WE, ClkEn0:3, DM0:8, MemODT0:3 75 36 6.4 DQS0:8/ DQS0:8 75 18 or 36 6.4 MemClkOut0:1/ MemClkOut0:1 - 18 or 36 6.4 Signals Notes: 1. The output impedance (drive strength) for DQS0:8/ DQS0:8 and MemClkOut0:1/MemClkOut0:1 is programmable. 2. The 75-ohm internal termination for MemData00:63, DQS0:8/DQS0:8, and DM0:8 can be statically or dynamically enabled. 3. The 75-ohm internal termination is statically enabled for MemDCFdbkD, MemDCFdbkR, MemAddr00:14, BA0:2, BankSel0:3, RAS, CAS, WE, ClkEn0:3, and MemODT0:3. Table 24. DDR SDRAM Output Driver Specifications Signal Path Output Current (mA) I/O H (maximum) I/O L (maximum) MemData00:63 10 10 ECC0:7 10 10 DM0:8 10 10 MemClkOut 10 10 MemAddr00:14 10 10 BA0:2 10 10 RAS 10 10 CAS 10 10 WE 10 10 BankSel0:3 10 10 ClkEn0:3 10 10 DQS0:8/ DQS0:8 10 10 MemODT0:3 10 10 92 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet DDR SDRAM Timing Conditions The following timing values are generated by means of simulation and includes logic, driver, package RLC, and lengths. Values are calculated over best case and worst case processes with speed, junction temperature, and voltage as follows: Table 25. DDR SDRAM Operation Conditions Case Process Speed Case Temperature (C) SOVDD for DDR1 (V) SOVDD for DDR2 (V) Best Fast -40 +2.4 +1.9 Worst Slow +85 +2.6 +1.7 Figure 8. DDR SDRAM Simulation Signal Termination Model MemClkOut 10 pF 120 10 pF MemClkOut VTT = SOVDD/2 PPC460EX 50 Addr/Ctrl (DDR2) Addr/Ctrl/Data/DQS/DM (DDR1) 30pF Note: This diagram illustrates the model of the DDR SDRAM interface used when generating simulation timing data. It is not a recommended physical circuit design for this interface. An actual interface design will depend on many factors, including the type of memory used and the board layout. DDR SDRAM Write Operation The rising edge of MemClkOut aligns with the first rising edge of the DQS signal on writes. Note: In the following tables and timing diagrams, minimum values are measured under best case conditions and maximum values are measured under worst case conditions. The timing numbers in the following sections are obtained using a simulation that assumes a model as shown in Figure 8. AMCC Proprietary 93 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet The following diagram illustrates the relationship among the signals involved with a DDR write operation. Figure 9. DDR SDRAM Write Cycle Timing PLB Clk MemClkOut TSA THA Addr/Cmd TDS DQS TSD TSD MemData THD THD TSA = Setup time for address and command signals to MemClkOut THA = Hold time for address and command signals from MemClkOut TSD = Setup time for data signals (minimum time data is valid before rising/falling edge of DSQ) THD = Hold time for data signals (minimum time data is valid after rising/falling edge of DSQ) TDS = Delay from rising/falling edge of clock to the rising/falling edge of DQS Note: The timing data in the following tables is based on simulation runs using Einstimer. Table 26. I/O Timing--DDR SDRAM TDS for 200 MHz Notes: 1. All of the DQS signals are referenced to MemClkOut. 2. MemClkOut frequency is 200MHz. Signal Name DQS0:8/ DQS0:8 94 TDS (ns) Minimum Maximum 4.9 5.1 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Table 27. I/O Timing--DDR SDRAM TSA, and THA Notes: 1. The timing values in this table apply to MemClkOut frequency of 200MHz. 2. TSA and THA are referenced to MemClkOut rising edge. 3. DDR1 is supported up to 200MHz. (400Mbps data rate). Signal Name TSA (ns) THA (ns) Minimum Minimum MemAddr00:14 1.08 1.18 BA0:2 1.17 1.19 BankSel0:3 1.12 1.15 ClkEn0:3 1.11 1.15 CAS 1.16 1.14 RAS 1.17 1.13 WE 1.17 1.17 Table 28. I/O Timing--DDR SDRAM Write Timing TSD and THD Notes: 1. TSD and THD are measured under worst case conditions. 2. The timing values in this table apply to MemClkOut frequency of 200MHz. 3. The timing values in this table include 1/4 of a cycle at 200MHz. 4. To obtain adjusted TSD and THD values for clock frequencies less than 200MHz, subtract 1.5ns from the values in the table and add 1/4 of the cycle time for the lower clock frequency (for example, TSD - 1.5 + 0.25TCYC). 5. DDR1 is supported up to 200MHz. (400Mbps data rate). Reference Signal TSD (ns) THD (ns) MemData00:07, DM0 DQS0 0.96 0.995 MemData08:15, DM1 DQS1 0.97 0.990 MemData16:23, DM2 DQS2 0.98 0.980 MemData24:31, DM3 DQS3 0.98 0.980 MemData32:39, DM4 DQS4 0.98 0.980 MemData40:47, DM5 DQS5 0.97 0.983 MemData48:55, DM6 DQS6 0.96 0.982 MemData56:63, DM7 DQS7 0.96 0.985 ECC0:7, DM8 DQS8 0.96 0.980 Signal Names AMCC Proprietary 95 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet DDR SDRAM Read Operation The read of the incoming data from the SDRAM is done on the rising and falling edges of the differential DQS signal. The data must be centered to these edges for correct operation. DDR SDRAM Read Cycle Timing The following diagram illustrates the relationship of the signals involved with a DDR read operation. Figure 10. DDR SDRAM Memory Data and DQS DQS TSD MemData THD Table 29. I/O Timing--DDR SDRAM Read Timing TSD and THD for 200MHz 1. TSD and THD are measured under worst case conditions. 2. MemClkOut frequency is 200MHz. 3. The time values in this table include 1/4 of a cycle at 200MHz (5ns x 0.25 = 1.25ns). 4. To obtain adjusted TSD and THD values for lower clock frequencies, subtract 0.75ns from the values in the table and add 1/4 of the cycle time for the lower clock frequency (e.g., TSD - 1.25 + 0.25TCYC). 5. DDR1 is supported up to 200MHz. (400Mbps data rate). Reference Signal Read Data vs DQS Set up TSD (ns) Read Data vs DQS Hold THD (ns) MemData00:07 DQS0 0.393 0.311 MemData08:15 DQS1 0.388 0.314 MemData16:23 DQS2 0.397 0.307 MemData24:31 DQS3 0.396 0.309 MemData32:39 DQS4 0.394 0.291 MemData40:47 DQS5 0.395 0.291 MemData48:55 DQS6 0.393 0.295 MemData56:63 DQS7 0.394 0.308 ECC0:7 DQS8 0.389 0.306 Signal Names 96 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet PCI Express Interface Specification The following tables contain the PCI Express interface specification. Table 30. PCI Express Transmitter Specification Minimum Maximum Units Unit Interval (UI) Parameter 400 400 ps Differential Tx peak-to-peak voltage swing 800 1200 mV ppd Low power differential Tx peak-to-peak voltage swing 400 - mV ppd Tx de-emphasis level ratio -3.0 -4.0 dB Minimum Tx eye width 0.75 - UI - 0.125 UI Maximum time between the jitter median and maximum deviation from the median Transmitter rise and fall time 0.125 - UI Maximum Tx PLL bandwidth - 22 MHz Minimum Tx PLL BW for 3dB peaking 1.5 - MHz PCIEnTx/PCIEnTx Tx output rise/fall time 50 - ps Tx AC common mode voltage - 20 mV Absolute delta of DC common mode voltage during L0 and Electrical Idle 0 100 mV Absolute delta of DC common mode voltage between PCIEnTx and PCIEnTx 0 25 mV Electrical Idle differential peak output voltage 0 20 mV Amount of voltage change allowed during receiver detection - 600 mV Tx DC common mode voltage 0 3600 mV Tx short-circuit current limit - 90 mA Minimum time spent in Electrical Idle 50 - UI Maximum time to transition to a valid Electrical Idle after sending an Electrical Idle Ordered-Set - 20 UI Maximum transition time to valid differential signaling after leaving Electrical Idle - 20 UI -10 - dB dB Tx differential return loss Tx common mode return loss -6 - Tx DC differential impedance 80 120 Lane-to-Lane output skew - 1300 ps AMCC Proprietary Notes 97 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Table 31. PCI Express Receiver Specification Minimum Maximum Units Unit Interval (UI) Parameter 400 400 ps Frequency offset between transmit and receive clocks -300 +300 ppm Differential Rx peak-to-peak voltage 175 1200 mV - 150 mV 0.4 - UI - 0.3 UI Rx AC common mode voltage Receiver eye time opening Maximum time delta between median and deviation from median Total jitter tolerance 0.6 - UI Rx differential return loss -10 - dB Rx common mode return loss -6 - dB Rx DC differential impedance 80 120 Rx DC common mode impedance 40 60 Rx DC common mode impedance during reset or power down 200 - k Electrical Idle detect threshold 65 175 mV Unexpected Electrical Idle enter detect threshold integration time - 10 ms Lane-to-Lane output skew - 20 ns Notes Table 32. PCI Express Reference Clock Specification Minimum Maximum Units Notes Reference clock frequency Parameter 100 100 MHz 1 Accuracy -300 +300 ppm Duty cycle 45 55 % - 86 ps 3 - 108 ps 3 2 Peak-to-peak jitter for 1E-6 BER (1 x 10-6 bit error rate) Peak-to-peak jitter for 1E-6 BER (1 x 10 -12 bit error rate) Spread Spectrum Clock (SSC) frequency 30 33 kHz Differential signal amplitude 200 1600 mV Notes: 1. The reference clock frequency specification does not include 300ppm frequency offset specification. 2. The data rate can be modulated from +0% to -0.5% of the nominal data rate frequency, at a modulation rate in the range not exceeding 30kHz-33kHz. The 300ppm requirement remains which requires the two communcicating ports to be modulated so that they never exceed a total of 600ppm difference. For most implementations, this requires that both ports have the same bit rate clock source when the data is modulated with an SSC. 3. 1E-6 is the probability that the jitter is greater than 86ps peak-to-peak. 1E-12 is the probability that the jitter is greater than 108ps peakto-peak. 98 AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Serial ATA (SATA) Interface Specification The following tables contain the SATA interface specification. Table 33. SATA Transmitter Specification Parameter Minimum Maximum Units 333.3 666.6 ps Differential Tx peak-to-peak voltage swing 400 1600 mV ppd SATA0Tx/SATA0Tx Tx output rise/fall time 67 - ps Tx short-circuit current limit - 90 mA Tx differential return loss -10 - dB Tx common mode return loss -6 - dB Unit Interval (UI) Tx DC differential impedance 85 115 Tx DC single-ended impedance 40 - Tx OOB transmission voltage - 200 mV ppd Notes Table 34. SATA Receiver Specification Minimum Maximum Units Unit Interval (UI) Parameter 333.3 666.6 ps Frequency offset between transmit and receive clocks -5350 +350 ppm Differential Rx peak-to-peak voltage 240 - mV Total jitter tolerance 0.65 - UI Rx differential return loss -10 - dB Notes Rx common mode return loss -6 - dB Rx DC differential impedance 85 115 Rx DC common mode impedance 40 - Rx OOB voltage detection threshold - 240 mV Minimum Maximum Units Notes 1, 3 Table 35. SATA Reference Clock Specification Parameter Reference clock frequency 100 120 MHz Accuracy -350 +350 ppm Duty cycle 45 55 % Cycle-to-cycle jitter - 150 ps p-p Total jitter 1kHz-1MHz - 100 ps p-p Total jitter 1MHz-20MHz - 40 ps p-p Total jitter >20MHz - 100 ps p-p Spread Spectrum Clock (SSC) frequency 30 33 kHz 2 Spread Spectrum Clock (SSC) variation 0 5000 ppm 2 Notes: 1. The reference clock frequency specification does not include 5700ppm frequency offset specification. 2. The data rate can be modulated from +0% to -0.5% of the nominal data rate frequency, at a modulation rate in the range not exceeding 30kHz-33kHz. The 350ppm requirement remains which requires the two communcicating ports to be modulated so that they never exceed a total of 700ppm difference. For most implementations, this requires that both ports have the same bit rate clock source when the data is modulated with an SSC. 3. Only 100MHz or 120MHz is supported. AMCC Proprietary 99 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet PCI-E and SATA Reference Clock AC Coupling Recommendations AC coupling is recommended for the PCIe and SATA reference clock. The following figures illustrate how to implement AC coupling for the most common differential reference clocks. Note: C1 and C2 may be any value from 0.01F to 0.1F as long as C1 equals C2. All components should be in a 0603 or smaller package and should be placed to minimize the stub length to the traces. Figure 11. LVDS PCIe or SATA Reference Clock C1 PCIEnRefClk/ SATA0RefClk R1=100 C2 PCIEnRefClk/ SATA0RefClk LVDS clock driver C1=C2=0.01F to 0.1F PCIe or SATA RefClk receiver with internal biasing Figure 12. LVPECL PCIe or SATA Reference Clock 3.3V R1=130 C1 R2=82 3.3V R3=130 C2 R4=82 LVPECL clock driver 100 C1=C2=0.01F to 0.1F PCIe or SATA RefClk receiver with internal biasing AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Figure 13. CML PCIe or SATA Reference Clock C1 C2 CML clock driver PCIe or SATA RefClk receiver with internal biasing Figure 14. HCSL PCIe or SATA Reference Clock 3.3V R1=33 C1 R2=50 3.3V R3=33 C2 R4=50 HCSL clock driver AMCC Proprietary C1=C2=0.01F to 0.1F PCIe or SATA RefClk receiver with internal biasing 101 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Boot Configuration The PPC460EX supports several configurable boot parameters that must be initialized prior to booting. These parameters are configured by one of several default boot options or programmed by data read from an IIC serial EEPROM (see "Serial EEPROM" below). Strap signals sampled during reset select which method is used to initialize the boot parameters (see "Strapping" below). Strapping The Bootstrap Controller selects the boot options based on the state of the strap signals during reset. The strap signals are sampled on the rising edge of SysClk while SysReset is driven low. They must not change state until after SysReset is driven high in order to guarantee the correct boot option is selected. These pins are used for strap functions only during reset. Following reset, they are used for normal functions. The signal names assigned to the pins for normal operation are shown in parentheses following the pin number. The following table lists the strapping pins along with their functions and boot strap options: Table 36. Strapping Pin Assignments Strapping Pins Function Boot Option Serial device is disabled. Each of the six options (A- F) is a combination of boot source, boot-source width, and clock frequency specifications. Refer to the PPC460EX Embedded Processor User's Manual for details. Serial device is enabled. Boot Option G and H enable the Bootstrap Controller to program boot parameters using data read from an IIC serial EEPROM. Option G and H support different IIC addresses. E31 (UART0CTS) E34 (UART0DCD) E32 (UART0DSR) A 0 0 0 B 0 0 1 C 0 1 0 D 0 1 1 E 1 0 0 F 1 0 1 G (0xA8) 1 1 0 H (0xA4) 1 1 1 Serial EEPROM Boot Options G and H enable the Bootstrap Controller to read 16 bytes of configuration data from a serial EEPROM attached to the IIC0 bus after SysReset deasserts. The Bootstrap Controller stores the data in the SDR0_SDSTP0:3 registers. Note: The IIC serial EEPROM must have a one-byte base address. Multi-byte base addresses are not supported. The initialization settings and their default values are covered in detail in the PowerPC 460EX/EXr/GT Embedded Processor User's Manual User's Manual. 102 AMCC Proprietary 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Revision Log Date Version 04/20/2007 1.00 Initial creation of document. 05/17/2007 1.00 Update to initial creation of document. 07/18/2007 1.01 Update to initial creation of document. 08/03/2007 1.02 Update to initial creation of document. Eliminate SRIO, EMB, second RGMII, SMII, third and forth EMACs. 1.03 Change GPIOs to alternate to default signals. Add thermal monitor diagram. Corrected signal-to-pin (ball) assignments for nine pins. Misc. updates and corrections. 10/17/2007 1.04 Change all occurrences of PerDataPar to PerPar. Swap signals assigned to balls A20 and E19. Add updates from 460EX development which include changing the nine signal-to-pin changes made for 1.03 back to their original state. Restore TBI and RTBI to Features on first page. Correct ActiveLow indication on some SATA and PCIE signals. 10/18/2007 1.05 Correct ActiveLow indication on some SATA and PCIE signals. Remove all GMC1xxxx signals. Remove all TBI and RTBI signals. 12/21/2007 1.06 Add missing GMC1RxCtl signal to pin AJ10. Update I/O timing. Change PCIE calibration resistor from 1k to 1.37k. Add RMII signals. 01/14/2008 1.07 Misc. updates. Change maximum case temperature from +105C to +85C. 02/11/2008 1.08 Correct typograhical errors. Correct DDR SDRAM Read Data Path diagram. Update PCIEnRefClk signal description. 04/14/2008 1.09 Add block diagram from R/C engineering specification. Reference 802.3 Ethernet spec for GMCMDIO timing. Add KASUMI support to security. Change document status from Advanced to Preliminary and remove Confidential status. Update block diagram. Add power estimates. Flag SGMIIRefClk signals as not to be used. Update Contents to include L2 Cache/SRAM. 05/05/2008 1.10 Delete SAVDD voltage from analog voltage filter diagram (Doc Issue 503). Change Thermal Monitor parameters (Doc Issue 504). Misc. changes including Doc Issues 512, 524, and 526. 05/29/2008 1.11 Doc Issue 455. Add power sequence information. 07/17/2008 1.12 Doc Issues 530, 532, 536, 550. Update JTAG timing. 10/01/2007 AMCC Proprietary Contents of Modification 103 460EX - PPC460EX Embedded Processor Revision 1.19 - June 17, 2009 Preliminary Data Sheet Date Contents of Modification 1.13 Doc Issue 572. Update SysReset signal functional description. Security is no longer optional. Remove non-security part numbers. Doc Issue 589. PCI-E and SATA I/O specifications. Timing, power, and other misc. updates. New RGMII wave forms. Update Security features list. Doc Issue 595. Add pull-up and pull-down resistor values. Additional processor speed of 1.066GHz. New power values for 1.066GHz and lower speeds. Change bootstrap description. 11/14/2008 1.14 Doc Issue 4816. Change SysReset I/O designation. Doc Issue 4892. PCI clock required even when PCI is unused Doc Issue 4933. Change SATARefClk frequency range. Doc Issue 4960. Remove all references to SMII and RMII. Doc Issue 5031. PCI signal termination recommendation. Doc Issue 5032. Change PCI Express reference clock to 100MHz . Doc Issue 5045. Remove length constraint from DDR layout recommendation . Doc Issue 5205. Correct SysReset signal description. 12/18/2008 1.15 For Rev.A parts, removed 1066MHz CPU and 266MHz PLB/Memclk. 1.16 Doc Issue 5220: * In Table 9, updated description for SysReset; changed "32 cycles" to "32 SysClk cycles". Doc Issue 5440: * In Table 19, updated OPB Clock minimum frequency and maximum period, and added note. * In Table 20, updated SPIClkOut minimum and maximum frequency, and updated Note 1. 1.17 Added Revision B, Rev.B PVR, and No Security part number. Marked security as optional. Clarified signal names in Table 24, Table 26, and Table 27. Doc Issue 5857: * In Table 19, added notes regarding SysClk jitter and slew rate. Doc Issue 5885: * In Table 23, corrected errors: All of the signals with the exception of the MemClkOut signals have 75-ohm internal termination. Doc Issue 5973: * In Table 19, added note indicating the spread spectrum modulation range when SysClk is 66.66MHz. 1.18 Updated Table 17, DC Power Supply Loads. Doc Issue 6180: * Added requirement for AC coupling on PCIEnRefClk and SATA0RefClk in Table 9. * Added section "PCI-E and SATA Reference Clock AC Coupling Recommendations" on page 100. Doc Issue 6361: * Changed CGM to GCM under "Security Function (Optional)" on page 13. 1.19 Removed iSCSI CRC32 function from I2O/DMA. Added FSOURCE0 to signal list. This signal should be tied to ground if the SDR0_ECID0:3 (electronic chip ID) registers need to be read. Updated GMCMDIO TOV specification. 09/26/2008 1/16/2009 2/27/2009 4/30/09 6/17/09 104 Version AMCC Proprietary Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Printed in the United States of America, June 17, 2009 The following are trademarks of AMCC Corporation in the United States, or other countries, or both: AMCC Other company, product, and service names may be trademarks or service marks of others. Preliminary Edition (June 17, 2009) This document contains information on a new product under development by AMCC. AMCC reserves the right to change or discontinue this product without notice. This document is a preliminary edition of the PowerPC 460EX data sheet. Make sure you are using the correct edition for the level of the product. While the information contained herein is believed to be accurate, such information is preliminary, and should not be relied upon for accuracy or completeness, and no representations or warranties of accuracy or completeness are made. The information contained in this document is subject to change or withdrawal at any time without notice and is being provided on an "AS IS" basis without warranty or indemnity of any kind, whether express or implied, including without limitation, the implied warranties of non-infringement, merchantability, or fitness for a particular purpose. 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AMCC Proprietary 105 Revision 1.19 - June 17, 2009 460EX - PPC460EX Embedded Processor Preliminary Data Sheet Applied Micro Circuits Corporation 215 Moffett Park Drive, Sunnyvale, CA 94089 Phone: (408) 542-8600 -- (800) 840-6055 -- Fax: (408) 542-8601 http://www.amcc.com AMCC reserves the right to make changes to its products, its data sheets, or related documentation, without notice and warrants its products solely pursuant to its terms and conditions of sale, only to substantially comply with the latest available data sheet. Please consult AMCC's Term and Conditions of Sale for its warranties and other terms, conditions and limitations. AMCC may discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information is current. 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