IMH20TR1G Dual Bias Resistor Transistor NPN Surface Mount * Low VCC (sat) 80 mV max at IC/IB = 50 mA/2.5 mA * High Current: IC = 600 mA max * This is a Pb-Free Device http://onsemi.com MAXIMUM RATINGS (TA = 25C) Rating Symbol Value Unit V(BR)CBO 30 Vdc Collector-Emitter Voltage V(BR)CEO 15 Vdc Emitter-Base Voltage V(BR)EBO 5.0 Vdc IC 600 mAdc Collector-Base Voltage (6) (4) Collector Current - Continuous (5) Q1 R1 (2) (1) (3) THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Power Dissipation* PD 300 mW Junction Temperature TJ 150 C Storage Temperature Tstg -55 to +150 C R1 Q2 SC-74 MARKING DIAGRAM *Total for both Transistors. 6 Q1 + Q2: NPN 1 ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) V(BR)CEO 15 - Vdc Collector-Base Breakdown Voltage (IC = 50 Adc, IE = 0) V(BR)CBO 30 - Vdc Emitter-Base Breakdown Voltage (IE = 50 Adc, IC = 0) V(BR)EBO 5.0 - Vdc Collector-Base Cutoff Current (VCB = 20 Vdc, IE = 0) ICBO - 0.5 Adc Emitter-Base Cutoff Current (VEB = 4.0 V, IC = 0) IEBO - 0.5 Adc DC Current Gain (Note 1) (VCE = 5.0 Vdc, IC = 50 mAdc) hFE 100 600 - VCE(sat) - 80 mV R1 1.54 2.86 k Collector-Emitter Saturation Voltage (IC = 50 mAdc, IB = 2.5 mAdc) Input Resistance H20 M SC-74R 318AA Style 21 H20 = Specific Device Code M = Date Code ORDERING INFORMATION Device Package Shipping IMH20TR1G SC-74R 3000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1. Pulse Test: Pulse Width 300 s, D.C. 2%. Semiconductor Components Industries, LLC, 2004 January, 2004 - Rev. 0 Publication Order Number: IMH20TR1G/D IMH20TR1G PACKAGE DIMENSIONS SC-74R CASE 318AA-01 ISSUE A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. A L 4 5 6 B S 3 2 1 D G M J C 0.05 (0.002) K H INCHES MIN MAX 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0649 0 10 0.0985 0.1181 DIM A B C D G H J K L M S MILLIMETERS MIN MAX 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.05 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.65 0 10 2.50 3.00 STYLE 21: PIN 1. COLLECTOR 1 2. EMITTER 2 3. BASE 2 4. COLLECTOR 2 5. EMITTER 1 6. BASE 1 SOLDERING FOOTPRINT* 2.4 0.094 0.95 0.037 1.9 0.074 0.95 0.037 0.7 0.028 1.0 0.039 SCALE 10:1 SC-74R mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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American Technical Support: 800-282-9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 http://onsemi.com 2 For additional information, please contact your local Sales Representative. IMH20TR1G/D