S
OT2
2
3
EC103D1W
SCR
23 July 2014 Product data sheet
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1. General description
Planar passivated ultra sensitive gate Silicon Controlled Rectifier in a SOT223 surface
mountable plastic package.
2. Features and benefits
•Planar passivated for voltage ruggedness and reliability
•Ultra sensitive gate
•Surface mountable package
3. Applications
•Electronic ballasts
•Safety shut down and protection circuits
•Sensing circuits
•Smoke detectors
•Switched Mode Power Supplies
4. Quick reference data
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-
state voltage
- - 400 V
VRRM repetitive peak reverse
voltage
- - 400 V
ITSM non-repetitive peak on-
state current
half sine wave; Tj(init) = 25 °C;
tp = 10 ms; Fig. 4; Fig. 5
- - 8 A
Tjjunction temperature - - 125 °C
IT(RMS) RMS on-state current half sine wave; Tsp ≤ 114 °C; Fig. 2;
Fig. 3
- - 0.8 A
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 9 - 3 12 µA
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SCR
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Product data sheet 23 July 2014 2 / 13
Symbol Parameter Conditions Min Typ Max Unit
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 268 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
- 150 - V/µs
5. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 K cathode
2 A anode
3 G gate
4 mb mounting base; connected to
anode
1 32
4
SC-73 (SOT223)
sym037
A K
G
6. Ordering information
Table 3. Ordering information
PackageType number
Name Description Version
EC103D1W SC-73 plastic surface-mounted package with increased heatsink; 4
leads
SOT223
7. Marking
Table 4. Marking codes
Type number Marking code
EC103D1W WYM-103D1W
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SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 3 / 13
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 400 V
VRRM repetitive peak reverse voltage - 400 V
IT(AV) average on-state current half sine wave; Tsp ≤ 114 °C; Fig. 1 - 0.5 A
IT(RMS) RMS on-state current half sine wave; Tsp ≤ 114 °C; Fig. 2;
Fig. 3
- 0.8 A
half sine wave; Tj(init) = 25 °C;
tp = 10 ms; Fig. 4; Fig. 5
- 8 AITSM non-repetitive peak on-state
current
half sine wave; Tj(init) = 25 °C;
tp = 8.3 ms
- 9 A
I2t I2t for fusing tp = 10 ms; sine-wave pulse - 0.32 A2s
dIT/dt rate of rise of on-state current IT = 2 A; IG = 0.01 A; dIG/dt = 0.1 A/µs - 50 A/µs
IGM peak gate current - 1 A
VRGM peak reverse gate voltage - 5 V
PGM peak gate power - 2 W
PG(AV) average gate power over any 20 ms period - 0.1 W
Tstg storage temperature -40 150 °C
Tjjunction temperature - 125 °C
aaa-007698
0.4
0.2
0.6
0.8
0
0 0.60.40.20.1 0.50.3
Ptot
(W)
IT(AV)(A)
conduction
angle
(degrees)
form
factor
a
30
60
90
120
180
4
2.8
2.2
1.9
1.57
α
125
119
116
113
Tsp(max)
(°C)
122
a = 1.57
2.2
2.8
4
1.9
a = Form factor = IT(RMS)/IT(AV)
Fig. 1. Total power dissipation as a function of average on-state current; maximum values
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SCR
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Product data sheet 23 July 2014 4 / 13
Tsp (°C)
-50 1501000 50
aaa-007696
0.4
0.6
0.2
0.8
1
IT(RMS)
(A)
0
114°C
Fig. 2. RMS on-state current as a function of solder
point temperature; maximum values
aaa-007697
2
4
6
IT(RMS)
(A)
0
surge duration (s)
10-2 10110-1
f = 50 Hz; Tsp = 114 °C
Fig. 3. RMS on-state current as a function of surge
duration; maximum values
f = 50 Hz
Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
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SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 5 / 13
aaa-007700
tp (s)
10-5 10-1
10-2
10-4 10-3
102
10
103
ITSM
(A)
1
tp
Tj(init) = 25 °C max
ITITSM
t
tp ≤ 10 ms
Fig. 5. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values
NXP Semiconductors EC103D1W
SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 6 / 13
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-sp) thermal resistance
from junction to solder
point
Fig. 6 - - 15 K/W
printed circuit board mounted; minimum
pad area; in free air; Fig. 7
- 70 - K/WRth(j-a) thermal resistance
from junction to
ambient printed circuit board mounted; minimum
footprint; in free air; Fig. 8
- 156 - K/W
1
10-1
10
1
0
2
Zth(j-sp)
(K/W)
10-2
tp (s)
10-5 1 1010-1
10-2
10-4 10-3
aaa-007701
tp
P
t
Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width
NXP Semiconductors EC103D1W
SCR
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Product data sheet 23 July 2014 7 / 13
001aab509
7
4.6
15
36
9
10
18
4.5
60
50
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
(35 um thick)
Fig. 7. Printed circuit board pad area: SOT223
001aab508
3.8 min
1.5
min
1.5
min
(3×)
2.3
4.6
6.3
1.5
min
All dimensions are in mm
Fig. 8. Minimum footprint SOT223
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SCR
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Product data sheet 23 July 2014 8 / 13
10. Characteristics
Table 7. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; Tj = 25 °C; Fig. 9 - 3 12 µA
ILlatching current VD = 12 V; IG = 0.1 A; Tj = 25 °C;
Fig. 10
- 2 6 mA
IHholding current VD = 12 V; Tj = 25 °C; Fig. 11 - 2 5 mA
VTon-state voltage IT = 1 A; Tj = 25 °C; Fig. 12 - 1.2 1.35 V
VD = 12 V; IT = 0.1 A; Tj = 25 °C;
Fig. 13
- 0.5 0.8 VVGT gate trigger voltage
VD = 400 V; IT = 0.1 A; Tj = 125 °C;
Fig. 13
0.2 0.3 - V
IDoff-state current VD = 400 V; Tj = 125 °C - 0.05 0.1 mA
IRreverse current VR = 400 V; Tj = 125 °C - 0.05 0.1 mA
Dynamic characteristics
dVD/dt rate of rise of off-state
voltage
VDM = 268 V; Tj = 125 °C; (VDM = 67%
of VDRM); exponential waveform; gate
open circuit
- 150 - V/µs
Tj (°C)
-50 1501000 50
aaa-007702
1
2
3
0
IGT
IGT(25°C)
Fig. 9. Normalized gate trigger current as a function of
junction temperature
Tj (°C)
-50 1501000 50
aaa-007703
1
2
3
0
IL
IL(25°C)
Fig. 10. Normalized latching current as a function of
junction temperature
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SCR
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Product data sheet 23 July 2014 9 / 13
Tj (°C)
-50 1501000 50
aaa-007704
1
2
3
IH
IH(25°C)
0
Fig. 11. Normalized holding current as a function of
junction temperature
0 21.50.5 1
aaa-007705
1
1.5
0.5
2
2.5
0
VT (V)
IT
(A)
(2) (3)(1)
Vo = 0.987 V; Rs = 0.3125 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig. 12. On-state current as a function of on-state
voltage
Tj (°C)
-50 1501000 50
aaa-007706
0.8
1.2
1.6
0.4
VGT
VGT(25°C)
Fig. 13. Normalized gate trigger voltage as a function of junction temperature
NXP Semiconductors EC103D1W
SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 10 / 13
11. Package outline
UNIT A1bpc D E e1HELpQ ywv
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.10
0.01
1.8
1.5
0.80
0.60
b1
3.1
2.9
0.32
0.22
6.7
6.3
3.7
3.3 2.3
e
4.6 7.3
6.7
1.1
0.7
0.95
0.85 0.1 0.10.2
DIMENSIONS (mm are the original dimensions)
SOT223 SC-73 04-11-10
06-03-16
wM
bp
D
b1
e1
e
A
A1
Lp
Q
detail X
HE
E
vMA
AB
B
c
y
0 2 4 mm
scale
A
X
1 32
4
Plastic surface-mounted package with increased heatsink; 4 leads SOT223
Fig. 14. Package outline SC-73 (SOT223)
NXP Semiconductors EC103D1W
SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 11 / 13
12. Legal information
12.1 Data sheet status
Document
status [1][2]
Product
status [3]
Definition
Objective
[short] data
sheet
Development This document contains data from
the objective specification for product
development.
Preliminary
[short] data
sheet
Qualification This document contains data from the
preliminary specification.
Product
[short] data
sheet
Production This document contains the product
specification.
[1] Please consult the most recently issued document before initiating or
completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have
changed since this document was published and may differ in case of
multiple devices. The latest product status information is available on
the Internet at URL http://www.nxp.com.
12.2 Definitions
Preview — The document is a preview version only. The document is still
subject to formal approval, which may result in modifications or additions.
NXP Semiconductors does not give any representations or warranties as to
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is
intended for quick reference only and should not be relied upon to contain
detailed and full information. For detailed and full information see the
relevant full data sheet, which is available on request via the local NXP
Semiconductors sales office. In case of any inconsistency or conflict with the
short data sheet, the full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product
is deemed to offer functions and qualities beyond those described in the
Product data sheet.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed
to be accurate and reliable. However, NXP Semiconductors does not give
any representations or warranties, expressed or implied, as to the accuracy
or completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation -
lost profits, lost savings, business interruption, costs related to the removal
or replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to
make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their
applications and products using NXP Semiconductors products, and NXP
Semiconductors accepts no liability for any assistance with applications or
customer product design. It is customer’s sole responsibility to determine
whether the NXP Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should
provide appropriate design and operating safeguards to minimize the risks
associated with their applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those
given in the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
NXP Semiconductors EC103D1W
SCR
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Product data sheet 23 July 2014 12 / 13
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor
tested in accordance with automotive testing or application requirements.
NXP Semiconductors accepts no liability for inclusion and/or use of non-
automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards,
customer (a) shall use the product without NXP Semiconductors’ warranty
of the product for such automotive applications, use and specifications, and
(b) whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
12.4 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are the property of their respective owners.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-
CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight,
MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug,
TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP
Semiconductors N.V.
HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
NXP Semiconductors EC103D1W
SCR
EC103D1W All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved
Product data sheet 23 July 2014 13 / 13
13. Contents
1 General description ............................................... 1
2 Features and benefits ............................................1
3 Applications ........................................................... 1
4 Quick reference data ............................................. 1
5 Pinning information ............................................... 2
6 Ordering information .............................................2
7 Marking ................................................................... 2
8 Limiting values .......................................................3
9 Thermal characteristics .........................................6
10 Characteristics .......................................................8
11 Package outline ................................................... 10
12 Legal information .................................................11
12.1 Data sheet status ............................................... 11
12.2 Definitions ...........................................................11
12.3 Disclaimers .........................................................11
12.4 Trademarks ........................................................ 12
© NXP Semiconductors N.V. 2014. All rights reserved
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Date of release: 23 July 2014
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