BT168GWF SCR 21 August 2018 Product data sheet 1. General description Planar passivated SCR with faster switching performance and sensitive gate in a SOT223 surface mounted plastic package. This SCR with enhanced commutation performance is also designed to be interfaced directly to microcontrollers, logic integrated circuits and other low power gate trigger circuits. 2. Features and benefits * * * * Fast commutation performance for higher frequency operation Full wave rectified AC applications Sensitive gate Direct triggering from microcontrollers, low power drivers and logic ICs 3. Applications * * Earth leakage circuit breakers (ELCB/GFI) Ignition circuits (gas appliances, small engines and HID lighting) 4. Quick reference data Table 1. Quick reference data Symbol Parameter VRRM repetitive peak reverse voltage IT(AV) average on-state current IT(RMS) RMS on-state current ITSM Tj Conditions Min Typ Max Unit - - 600 V half sine wave; Tsp 112 C; Fig. 1 - - 0.63 A half sine wave; Tsp 112 C; Fig. 2; Fig. 3 - - 1 A non-repetitive peak on- half sine wave; Tj(init) = 25 C; tp = 10 ms; Fig. 4; Fig. 5 state current - - 8 A half sine wave; Tj(init) = 25 C; tp = 8.3 ms - - 9 A - - 125 C VD = 12 V; IT = 10 mA; Tj = 25 C; Fig. 9 70 200 450 A VDM = 402 V; Tj = 125 C; RGK = 1 k; (VDM = 67% of VDRM); exponential waveform; Fig. 11 350 800 - V/s junction temperature Static characteristics IGT gate trigger current Dynamic characteristics dVD/dt rate of rise of off-state voltage BT168GWF WeEn Semiconductors SCR Symbol Parameter Conditions Min Typ Max Unit VDM = 402 V; Tj = 125 C; (VDM = 67% of VDRM); exponential waveform; gate open circuit; Fig. 11 - 25 - V/s Simplified outline Graphic symbol 4 A 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 K cathode K G 2 A anode 3 G gate 4 mb mb; connected to anode sym037 1 2 3 SC-73 (SOT223) 6. Ordering information Table 3. Ordering information Type number BT168GWF BT168GWF Product data sheet Package Name Description Version SC-73 plastic surface-mounted package with increased heatsink; 4 leads SOT223 All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 2 / 14 BT168GWF WeEn Semiconductors SCR 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM Min Max Unit repetitive peak off-state voltage - 600 V VRRM repetitive peak reverse voltage - 600 V IT(AV) average on-state current half sine wave; Tsp 112 C; Fig. 1 - 0.63 A IT(RMS) RMS on-state current half sine wave; Tsp 112 C; Fig. 2; Fig. 3 - 1 A ITSM non-repetitive peak onstate current half sine wave; Tj(init) = 25 C; tp = 10 ms; Fig. 4; Fig. 5 - 8 A half sine wave; Tj(init) = 25 C; tp = 8.3 ms - 9 A 2 Conditions 2 I t I t for fusing tp = 10 ms; SIN - 0.32 As dIT/dt rate of rise of on-state current IT = 2 A; IG = 10 mA; dIG/dt = 100 mA/s - 50 A/s IGM peak gate current - 1 A VRGM peak reverse gate voltage - 5 V PGM peak gate power - 2 W PG(AV) average gate power - 0.1 W Tstg storage temperature -40 150 C Tj junction temperature - 125 C Ptot (W) over any 20 ms period 001aab496 1 Tsp(max) (C) a = 1.57 0.8 2.2 1.9 113 2.8 0.6 116 4 0.4 conduction angle (degrees) form factor a 30 60 90 120 180 4 2.8 2.2 1.9 1.57 0.2 0 0 0.2 110 0.4 0.6 119 IT(AV) (A) 122 125 0.8 = conduction angle; a = form factor = IT(RMS) / IT(AV) Fig. 1. Total power dissipation as a function of average on-state current; maximum values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 3 / 14 BT168GWF WeEn Semiconductors SCR 001aab498 1.2 112 C IT(RMS) (A) 001aab500 2 IT(RMS) (A) 1.5 0.8 1 0.4 0.5 0 -50 0 50 100 Tsp (C) 0 10-2 150 Fig. 2. RMS on-state current as a function of solder point temperature; maximum values 10-1 1 10 surge duration (s) f = 50 Hz; Tsp = 112 C Fig. 3. RMS on-state current as a function of surge duration; maximum values 001aab497 103 IT ITSM (A) ITSM t tp Tj(init) = 25 C max 102 10 1 10-5 10-4 10-3 tp (s) 10-2 tp 10 ms Fig. 4. Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 4 / 14 BT168GWF WeEn Semiconductors SCR 001aab499 10 ITSM (A) 8 6 4 IT ITSM 2 0 t tp Tj(init) = 25 C max 1 102 10 number of cycles 103 f = 50 Hz Fig. 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 5 / 14 BT168GWF WeEn Semiconductors SCR 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-sp) thermal resistance from junction to solder point Fig. 6 - - 15 K/W Rth(j-a) thermal resistance from junction to ambient free air printed-circuit board mounted; minimum footprint; Fig. 7 - 156 - K/W printed-circuit board mounted; pad area; Fig. 8 - 70 - K/W 003aae245 102 Zth(j-sp) (K/W) 10 1 P 10-1 tp 10-2 10-5 10-4 10-3 10-2 10-1 1 tp (s) t 10 Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 6 / 14 BT168GWF WeEn Semiconductors SCR 3.8 min 36 1.5 min 18 6.3 1.5 min (3x) 60 9 4.5 4.6 2.3 10 1.5 min 4.6 001aab508 7 All dimensions are in mm 15 Fig. 7. Minimum footprint SOT223 50 001aab509 All dimensions are in mm Printed circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 um thick) Fig. 8. Printed circuit board pad area: SOT223 BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 7 / 14 BT168GWF WeEn Semiconductors SCR 9. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics IGT gate trigger current VD = 12 V; IT = 10 mA; Tj = 25 C; Fig. 9 70 200 450 A IL latching current VD = 12 V; IG = 0.5 mA; Tj = 25 C; RGK(ext) = 1 k 3 7.5 13 mA IH holding current VD = 12 V; Tj = 25 C; RGK(ext) = 1 k 0.5 4.1 10 mA VT on-state voltage IT = 1.2 A; Tj = 25 C; Fig. 10 - 1.35 1.7 V VGT gate trigger voltage VD = 12 V; IT = 10 mA; Tj = 25 C - 0.5 0.8 V VD = 600 V; IT = 10 mA; Tj = 125 C 0.2 0.3 - V ID off-state current VD = 600 V; RGK(ext) = 1 k; Tj = 125 C - 0.05 0.1 mA IR reverse current VR = 600 V; Tj = 125 C; RGK(ext) = 1 k - 0.05 0.1 mA VDM = 402 V; Tj = 125 C; RGK = 1 k; (VDM = 67% of VDRM); exponential waveform; Fig. 11 350 800 - V/s VDM = 402 V; Tj = 125 C; (VDM = 67% of VDRM); exponential waveform; gate open circuit; Fig. 11 - 25 - V/s Dynamic characteristics dVD/dt rate of rise of off-state voltage aaa-014022 6 001aab505 5 IT (A) IGT (1) 4 IGT(25C) (2) (3) 4 3 2 2 1 0 -50 0 50 100 Tj (C) 0 0.4 150 1.2 2 VT (V) 2.8 Vo = 1.0 V; Rs = 0.27 (1) Tj = 125 C; typical values (2) Tj = 125 C; maximum values (3) Tj = 25 C; maximum values Fig. 9. Normalized gate trigger current as a function of junction temperature Fig. 10. On-state current as a function of on-state voltage BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 8 / 14 BT168GWF WeEn Semiconductors SCR 001aab507 104 dVD/dt (V/s) (1) 103 102 (2) 10 0 50 100 Tj (C) 150 (1) RGK = 1 k (2) gate open circuit Fig. 11. Critical rate of rise of off-state voltage as a function of junction temperature; typical values BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 9 / 14 BT168GWF WeEn Semiconductors SCR 10. Package outline Plastic surface-mounted package with increased heatsink; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 e1 3 Lp bp w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E e e1 HE Lp Q v w y mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 4.6 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 OUTLINE VERSION REFERENCES IEC JEDEC SOT223 JEITA EUROPEAN PROJECTION ISSUE DATE 04-11-10 06-03-16 SC-73 Fig. 12. Package outline SC-73 (SOT223) BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 10 / 14 BT168GWF WeEn Semiconductors SCR 11. Soldering 7 3.85 3.6 3.5 0.3 1.3 1.2 (4x) (4x) solder lands 4 solder resist 3.9 6.1 7.65 solder paste occupied area 1 2 3 Dimensions in mm 2.3 2.3 1.2 (3x) 1.3 (3x) 6.15 sot223_fr Fig. 13. Reflow soldering footprint for SC-73 (SOT223) 8.9 6.7 1.9 solder lands 4 solder resist 6.2 1 2 8.7 Dimensions in mm 3 1.9 (3x) 2.7 occupied area preferred transport direction during soldering 2.7 1.1 1.9 (2x) sot223_fw Fig. 14. Wave soldering footprint for SC-73 (SOT223) BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 11 / 14 BT168GWF WeEn Semiconductors SCR Right to make changes -- WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 12. Legal information Suitability for use -- WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. Definitions Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 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In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. BT168GWF Product data sheet Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). WeEn does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors' standard warranty and WeEn Semiconductors' product specifications. All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 12 / 14 BT168GWF WeEn Semiconductors SCR Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 13 / 14 BT168GWF WeEn Semiconductors SCR 13. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 6 9. Characteristics..............................................................8 10. Package outline........................................................ 10 11. Soldering................................................................... 11 12. Legal information..................................................... 12 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 21 August 2018 BT168GWF Product data sheet All information provided in this document is subject to legal disclaimers. 21 August 2018 (c) WeEn Semiconductors Co., Ltd. 2018. All rights reserved 14 / 14