SN74LVC1G06
SINGLE INVERTER BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES295I – JUNE 2000 – REVISED SEPTEMBER 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Available in the Texas Instruments
NanoStarand NanoFreePackages
D
Supports 5-V VCC Operation
D
Input and Open-Drain Output Accept
Voltages up to 5.5 V
D
Max tpd of 4 ns at 3.3 V
D
Low Power Consumption, 10 µA Max ICC
D
±24-mA Output Drive at 3.3 V
D
Ioff Supports Partial-Power-Down Mode
Operation
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
D
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
description/ordering information
This single inverter buffer/driver is designed for 1.65-V to 5.5-V VCC operation.
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the
die as the package.
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING‡
NanoStar
WCSP (DSBGA) – YEA (Lead) Tape and reel SN74LVC1G06YEAR
–40°C to 85°CNanoFree
WCSP (DSBGA) – YZA (Lead-free) Tape and reel SN74LVC1G06YZAR _ _ _
_
SOT (SOT-23) – DBV Tape and reel SN74LVC1G06DBVR C06_
SOT (SC-70) – DCK Tape and reel SN74LVC1G06DCKR CT_
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
‡DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA: The actual top-side marking has three preceding characters to denote year , month, and sequence code, and one
following character to designate the assembly/test site.
Copyright 2002, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
4
NC
A
GND
VCC
Y
DNU – Do not use
3
2
1
4
5
GND
A
DNU
Y
VCC
YEA OR YZA PACKAGE
(BOTTOM VIEW)
NC – No internal connection
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.