TBD62084AFG(Z) - TOSHIBA - Datasheet.Directory

TBD62083A series, TBD62084A series

2016-05-11

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TOSHIBA BiCD Integrated Circuit Silicon Monolithic

TBD62083APG, TBD62083AFG, TBD62083AFNG, TBD62083AFWG

TBD62084APG, TBD62084AFG, TBD62084AFNG, TBD62084AFWG

8channel sink type DMOS transistor array

TB62083A series and TB62084A series are DMOS transistor

array with 8 circuits. It has a clamp diode for switching

inductive loads built-in in each output. Please be careful

about thermal conditions during use.

Features

• 8 circuits built-in

• High voltage : VOUT = 50 V (MAX)

• High current : IOUT = 500 mA/ch (MAX)

• Input voltage(output on) : TBD62083A series 2.5 V (MIN)

TBD62084A series 7.0 V (MIN)

• Input voltage(output off) : TBD62083A series 0.6 V (MAX)

TBD62084A series 1.0 V (MAX)

• Package : PG type P-DIP18-300-2.54-001

FG type SOP18-P-375-1.27

FNG type SSOP18-P-225-0.65

FWG type P-SOP18-0812-1.27-001

Pin connection (top view)

Pin connection may be simplified for explanatory purpose.

TBD62083APG, TBD62084APG

P-DIP18-300-2.54-001

TBD62083AFG, TBD62084AFG

SOP18-P-375-1.27

TBD62083AFNG, TBD62084AFNG

SSOP18-P-225-0.65

TBD62083AFWG, TBD62084AFWG

P-SOP18-0812-1.27-001

Weight

P

-DIP18-300-2.54-001 : 1.3 g (Typ.)

SOP18

-P-375-1.27 : 0.41 g (Typ.)

SSOP18

-P-225-0.65 : 0.09 g (Typ.)

P-SOP18-0812-1.27-001 : 0.48 g (Typ.)

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Pin explanations

Pin No. Pin name Function

1

I1

Input pin

2

I2

Input pin

3

I3

Input pin

4

I4

Input pin

5

I5

Input pin

6

I6

Input pin

7

I7

Input pin

8

I8

Input pin

9

GND

GND pin

10

COMMON

Common pin

11

O8

Output pin

12

O7

Output pin

13

O6

Output pin

14

O5

Output pin

15

O4

Output pin

16

O3

Output pin

17

O2

Output pin

18

O1

Output pin

Equivalent circuit (each driver)

Equivalent circuit may be simplified for explanatory purpose.

Clamp

INPUT

COMMON

OUTPUT

Clamp diode

TBD62083A series, TBD62084A series

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Absolute Maximum Ratings (Ta = 25 °C)

Characteristics Symbol Rating Unit

Output voltage

VOUT

50

V

COMMON pin voltage

VCOM

−0.5 to 50

V

Output current

I

OUT

500

mA/ch

Input voltage

V

IN

−0.5 to 30

V

Clamp diode reverse voltage

VR

50

V

Clamp diode forward current

IF

500

mA

Power

dissipation

PG (Note1)

PD

1.47

W

FG (Note2)

0.96

FNG (Note3)

0.96

FWG (Note4)

1.31

Operating temperature

T

opr

−40 to 85

°C

Storage temperature

T

stg

−55 to 150

°C

Note1: Device alone. When Ta exceeds 25 °C, it is necessary to do the derating with 11.8 mW/°C.

Note2: Device alone. When Ta exceeds 25 °C, it is necessary to do the derating with 7.7 mW/°C.

Note3: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40 %, single-side glass epoxy).

When Ta exceeds 25 °C, it is necessary to do the derating with 7.7 mW/°C.

Note4: On PCB (Size: 75 mm × 114 mm × 1.6 mm, Cu area: 20 %, single-side glass epoxy).

When Ta exceeds 25 °C, it is necessary to do the derating with 10.48 mW/°C.

TBD62083A series, TBD62084A series

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Operating Ranges (Ta = −40 to 85 °C)

Characteristics Symbol Condition Min Typ. Max Unit

Output voltage

VOUT

―

50

V

COMMON pin voltage

V

COM

―

0

―

50

V

Output

current

PG

(Note1)

IOUT

1 circuits ON, Ta = 25°C 0 ― 400

mA/ch

tpw = 25 ms

8 circuits ON

Ta = 85°C

Tj = 120°C

Duty = 10% 0 ― 390

Duty = 50% 0 ― 170

FG

(Note1)

1 circuits ON, Ta = 25°C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85°C

Tj = 120°C

Duty = 10% 0 ― 320

Duty = 50% 0 ― 140

FNG

(Note2)

1 circuits ON, Ta = 25°C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85°C

Tj = 120°C

Duty = 10% 0 ― 320

Duty = 50% 0 ― 140

FWG

(Note3)

1 circuits ON, Ta = 25°C 0 ― 400

tpw = 25 ms

8 circuits ON

Ta = 85°C

Tj = 120°C

Duty = 10% 0 ― 370

Duty = 50% 0 ― 160

Input

voltage

(Output on)

TBD62083A

series VIN

(ON)

IOUT = 100 mA or upper, VOUT = 2 V

2.5 ― 25

V

TBD62084A

series IOUT = 100 mA or upper, VOUT = 2 V

7.0 ― 25

Input

voltage

(Output off)

TBD62083A

series VIN

(OFF)

IOUT = 100 μA or less, VOUT = 2 V 0 ― 0.6

V

TBD62084A

series IOUT = 100 μA or less, VOUT = 2 V 0 ― 1.0

Clamp diode forward

current IF ― ― ― 400 mA

Note1: Device alone.

Note2: On PCB (Size: 50 mm × 50 mm × 1.6 mm, Cu area: 40%, single-side glass epoxy).

Note3: On PCB (Size: 75 mm × 114 mm × 1.6 mm, Cu area: 20%, single-side glass epoxy).

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Electrical Characteristics (Ta = 25°C unless otherwise noted)

Characteristics Symbol

Test

Circuit

Condition Min Typ. Max Unit

Output leakage current Ileak 1 VOUT = 50V, Ta = 85°C

VIN = 0 V ― ― 1.0 μA

Output

voltage

(Output

ON-resistan

ce)

TBD62083A

series

VDS

(RON) 2

IOUT = 350 mA, VIN =5.0V ― 0.7

(2.0)

1.14

(3.25)

V

(Ω)

IOUT = 200 mA, VIN =5.0V ― 0.4

(2.0)

0.65

(3.25)

IOUT = 100 mA, VIN =5.0V ― 0.2

(2.0)

0.325

(3.25)

TBD62084A

series

IOUT = 350 mA, VIN =7.0V ― 0.7

(2.0)

1.14

(3.25)

IOUT = 200 mA, VIN =7.0V ― 0.4

(2.0)

0.65

(3.25)

IOUT = 100 mA, VIN =7.0V ― 0.2

(2.0)

0.325

(3.25)

Input

current

(Output on)

TBD62083A

series IIN (ON) 3

VIN = 2.5 V ― ― 0.1

mA

TBD62084A

series VIN = 7.0 V ― ― 0.5

Input current(Output off) IIN (OFF) 4 VIN = 0 V, Ta = 85°C ― ― 1.0 μA

Input

voltage

(Output on)

TBD62083A

series VIN (ON) 5 IOUT = 100 mA, VOUT = 2 V

― ― 2.5

V

TBD62084A

series ― ― 7.0

Clamp diode

reverse current

IR 6 VR = 50 V, Ta = 85°C ― ― 1.0 μA

Clamp diode

forward voltage

VF 7 IF = 350 mA ― ― 2.0 V

Turn−on delay

t

ON

8 VOUT = 50 V

RL = 125 Ω

CL = 15 pF

― 0.4 ―

μs

Turn−off delay tOFF ― 0.8 ―

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Test circuit

1. Ileak 2. VDS (RON)

3. IIN (ON) 4. IIN (OFF)

5. VIN (ON) 6. IR

7. VF

Test circuit may be simplified for explanatory purpose.

COMMON

OUTPUT

INPUT

GND

VOUT

COMMON

OUTPUT

INPUT

GND

IOUT

VIN

VDS

RON = VDS / IOUT

Ileak

COMMON

INPUT

GND

VIN

IIN(ON)

COMMON

INPUT

GND

IIN(OFF)

COMMON

OUTPUT

INPUT

GND

IOUT

VIN(ON)

VOUT

COMMON

OUTPUT

INPUT

GND

IR

VR

COMMON

OUTPUT

INPUT

GND

IF

VF

OUTPUT

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8. tON, tOFF

Note 1: Pulse width 50 μs, Duty cycle 10%

Output impedance 50 Ω, tr ≤ 5 ns, tf ≤ 10 ns

Please refer to the following table for the VIH condition.

Product

VIH

TBD62083A series

5.0 V

TBD62084A series

7.0 V

Note 2: CL includes the probe and the test board capacitance.

Test circuit and timing chart may be simplified for explanatory purpose.

Precautions for Using

This IC does not include built-in protection circuits for excess current or overvoltage.

If this IC is subjected to excess current or overvoltage, it may be destroyed.

Hence, the utmost care must be taken when systems which incorporate this IC are designed.

Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be

destroyed due to short−circuit between outputs, air contamination fault, or fault by improper grounding.

(Note 2)

(Note 1)

TBD62083A series, TBD62084A series

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Package Dimensions

P-DIP18-300-2.54-001 Unit: mm

Weight: 1.3 g (Typ.)

SOP18-P-375-1.27 Unit: mm

Weight: 0.41 g (Typ.)

TBD62083A series, TBD62084A series

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SSOP18-P-225-0.65 Unit: mm

Weight: 0.09 g (Typ.)

P-SOP18-0812-1.27-001 Unit: mm

Weight: 0.48 g (Typ.)

TBD62083A series, TBD62084A series

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Notes on Contents

1. Pin connection

Pin connection may be simplified for explanatory purpose.

2. Equivalent Circuits

Equivalent circuit may be simplified for explanatory purpose.

3. Test circuit

Test circuit may be simplified for explanatory purpose.

4. Timing chart

Timing charts may be simplified for explanatory purposes.

IC Usage Considerations

Notes on handling of ICs

(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for

a moment. Do not exceed any of these ratings.Exceeding the rating(s) may cause device breakdown, damage or

deterioration, and may result in injury by explosion or combustion.

(2) Do not insert devices in the wrong orientation or incorrectly.Make sure that the positive and negative terminals

of power supplies are connected properly.Otherwise, the current or power consumption may exceed the absolute

maximum rating, and exceeding the rating(s) may cause device breakdown, damage or deterioration, and may

result in injury by explosion or combustion.In addition, do not use any device inserted in the wrong orientation

or incorrectly to which current is applied even just once.

(3) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in the case of

overcurrent and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute

maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the

wiring or load, causing a large current to continuously flow and the breakdown can lead to smoke or ignition. To

minimize the effects of the flow of a large current in the case of breakdown, appropriate settings, such as fuse

capacity, fusing time and insertion circuit location, are required.

(4) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to

prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON

or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause

injury, smoke or ignition.Use a stable power supply with ICs with built-in protection functions. If the power

supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause

injury, smoke or ignition.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components

(such as speakers), for example, power amp and regulator.If there is a large amount of leakage current such as

from input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is

connected to a speaker with low input withstand voltage, overcurrent or IC failure may cause smoke or ignition.

(The overcurrent may cause smoke or ignition from the IC itself.) In particular, please pay attention when using

a Bridge Tied Load (BTL) connection-type IC that inputs output DC voltage to a speaker directly.

Points to remember on handling of ICs

Heat Radiation Design

When using an IC with large current flow such as power amp, regulator or driver, design the device so that heat is

appropriately radiated, in order not to exceed the specified junction temperature (TJ) at any time or under any condition.

These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life,

deterioration of IC characteristics or IC breakdown. In addition, when designing the device, take into consideration the

effect of IC heat radiation with peripheral components.

Back-EMF

When a motor rotates in the reverse direction,stops or slows abruptly, current flows back to the motor’s power supply

owing to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power

supply and output pins might be exposed to conditions beyond theabsolute maximum ratings. To avoid this problem, take

the effect of back-EMF into consideration in system design.

TBD62083A series, TBD62084A series

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RESTRICTIONS ON PRODUCT USE

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this document, and related hardware, software and systems (collectively "Product") without notice.

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responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

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or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or

incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant

TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product

and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the

application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or

applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b)

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applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.

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