Notice for TAIYO YUDEN products 1 Please read this notice before using the TAIYO YUDEN products. Product information in this catalog is as of October 2008. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. INFORMATION ON THE GENERAL CATALOG REMINDERS Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. Should you have any question or inquiry on this matter, please contact our sales staff. 9 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 3 ARRAY TYPE MULTILAYER CERAMIC CAPACITOR Code Temp.characteristics Operating temp. range B -2585 BJ X5R* -5585 B7 X7R -55125 OPERATING TEMP. CH C0H -55125 CG C0G -55125 *X7R *We may provide X7R for some items according to the individual specification. FEATURES Ni High density and high efficiency mounting. Internal electrode is nickel for increased cost performance and reliability. APPLICATIONS PHSetc General electronic equipment Communication equipmentmobile phone, PHS, cordless phone, etc. ORDERING CODE 1 3 5 7 9 VDC J L E T U K 6.3 10 16 25 50 B7 CH CG 4 EIALxWmm 2 4 2 BJ 4 2 0960302 1100504 2120805 0.9x0.6 1.4x1.0 2.0x1.25 B X5R X7R C0H C0G T mm 6 P K V B A D 100,000 1,000,000 10 8 pF 104 105 20% 10% 1pF M K F 0.3 0.45 0.5 0.6 0.8 0.85 F 178mm 4mm 110, 212 178mm 2mm 096 11 E 4 K 2 1 2 B J 1 0 4 M D _ T 1 2 1 Rated voltageVDC J L E T U 6.3 10 16 25 50 2 Series name 4 2 4 3 4 circuit multilayer capacitors 2 circuit multilayer capacitors 6 5 8 7 10 9 3 5 7 9 End termination Temperature characteristics code Capacitance tolerance Special code K Plated 4 Dimensionscase size mm 0960302 1100504 2120805 0.9x0.6 1.4x1.0 2.0x1.25 BJ B7 CH CG B X5R X7R C0H C0G 20% 10% 1pF 8 Nominal capacitancepF 100,000 1,000,000 Standard products 10 Packaging Thicknessmm 6 example 104 105 M K F 11 P K V B A D 0.3 0.45 0.5 0.6 0.8 0.85 T F 178mm Taping 4mm pitch 0504, 0805Type 178mm Taping 2mm pitch 0302Type 11 Internal code Standard products Blank space 92 Please read the "Notice for TAIYO YUDEN products" before using this catalog. EXTERNAL DIMENSIONS E2 Type EIA L W E1 E2 P 2K096 0.90.05 0.60.05 0.230.10 0.1250.075 0.450.05 0302 0.0350.0020.0240.0020.0090.0040.0050.0030.0180.002 E1 E2 2K110 1.370.07 1.000.08 0.360.10 0.20.10 0.640.10 0504 0.0540.0030.0390.0030.0140.0040.0080.0040.0250.004 AVAILABLE CAPACITANCE RANGE CH / C0H/CG C0G BJ/ X7R, BJ/ X5R Cap [F] 0.001 0.0022 0.0047 0.01 0.022 0.047 0.1 0.22 0.47 1.0 2.2 4 CAPACITORS 4K212 2.000.10 1.250.10 0.250.10 0.250.15 0.500.10 0805 0.0790.0040.0490.0040.0100.0040.0100.0060.0200.004 2K212 2.000.10 1.250.10 0.500.20 0.250.15 1.000.10 0805 0.0790.0040.0490.0040.0200.0080.0100.0060.0390.004 E1 T 0.300.03 P 0.0120.001 0.450.05 K 0.0180.002 0.50.05 V 0.0200.002 0.600.06 B 0.0240.003 0.800.08 A 0.0310.003 0.850.10 D 0.0330.004 0.850.10 D 0.0330.004 Unit:mm inch Type 096 2 110 2 2K096 2K110 B/X7R B/X5R X5R Temp.Char B/X5R X5R VDC 10V 6.3V 50V 25V 16V 50V 25V 16V 10V 10V 6.3V [pF:3digits] B B 102 B B 222 B B 472 B B 103 P B B 223 B B 473 K B B B 104 K B 224 K A 474 V 105 A A 225 212 2 2K212 212 4 4K212 B/X5R X5R B/X7R B/X5R 25V 10V 16V 25V 16V 10V D D Type X5R 10V D D D D D D Letters in the table indicate thickness. 096 2 110 2 2K096 2K110 Temp.Char CH / CG CH / CG 25V 50V Cap VDC [pF] [pF:3digits] P B 10 100 P B 12 120 P B 15 150 P B 18 180 P B 22 220 P B 27 270 P B 33 330 P B 39 390 P B 47 470 P B 56 560 P B 68 680 P B 82 820 P B 100 101 Letters in the table indicate thickness. Temp.char.Code BJ B7 CH CG Temperature characteristics Applicable standard JIS EIA EIA JIS EIA JIS EIA B X5R X7R CH C0H CG C0G Temperature range Ref. Temp. Capacitance change -2585 -5585 -55125 -55125 -55125 -55125 -55125 20 25 25 20 25 20 25 10 15 15 60 ppm/ 60 ppm/ 30 ppm/ 30 ppm/ tan % Capacitance tolerance Dissipation factor 10 K 20 M 10 K 3.5, 5, 10 max.* 10 K 0.1 max.** 10 K 0.1 max.** * **27pF Q400+20C 30pF Q1000 *Different depending on the item. Please refer to the part numbers list for the differences. **27pF or over Q400+20C Selection Guide P.12 etc 30pF or over Q1000 Part Numbers Electrical Characteristics P.94 P.97 Packaging P.98 Reliability Data P.102 Precautions P.108 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 93 PART NUMBERS 096TYPE 0302 case size 2 2 circuit type Temp.char. Rated Voltage 10V BJ:B/X5R EHS Environmental Hazardous Substances Ordering code L2K096 BJ103P RoHS 0.01 1 RoHS 0.047 1 RoHS 0.1 1 RoHS 0.22 J2K096 BJ473K * 6.3V tan Dissipation Soldering method Temperature factor Capacitance R: Reflow soldering characteristics %Max. W: Wave soldering F J2K096 BJ104K * J2K096 BJ224MK * *1 1.5 Temp.char. Rated Voltage 25V Thickness mm inch 0.30.03 B/X5R 5 R X5R 10 10%K 0.0120.001 20%M 0.450.05 0.0180.002 20%M Please specify the capacitance tolerance code.i *1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage. CH:CH/C0H Ordering code EHS Environmental Hazardous Substances T2K096 100FP T2K096 120KP T2K096 150KP T2K096 180KP T2K096 220KP T2K096 270KP T2K096 330KP T2K096 390KP T2K096 470KP T2K096 560KP T2K096 680KP T2K096 820KP T2K096 101KP 94 Capacitance tolerance RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Temperature Capacitance characteristics pF 10 12 15 18 22 27 33 39 47 56 68 82 100 Q Symbol Soldering method R: Reflow soldering W: Wave soldering Capacitance tolerance Thickness mm inch 1F F 400+20C CH C0H/ CG C0G R 0.30.03 10%K 0.0120.001 1000 Please specify the temperature characteristic code. Please read the "Notice for TAIYO YUDEN products" before using this catalog. PART NUMBERS 110TYPE 0504 case size 2 2 circuit type Temp.char. Rated Voltage 50V 16V 10V EHS Environmental Hazardous Substances Ordering code U2K110 BJ102B U2K110 BJ222B U2K110 BJ472B T2K110 BJ103B T2K110 BJ223B T2K110 BJ104B E2K110 BJ473B E2K110 BJ104B L2K110 BJ224B L2K110 BJ474A RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS 1 RoHS 1 RoHS 1.0 1 RoHS 2.2 L2K110 BJ105A* J2K110 BJ105V * 6.3V tan Dissipation Soldering method Thickness Temperature factor mm Capacitance R: Reflow soldering Capacitance characteristics %Max. W: Wave soldering inch tolerance F 0.001 0.0022 2 B/X5R* 3.5 0.0047 0.01 0.60.06 0.022 0.0240.002 0.1 B/X5R 5 0.047 3.5 2 B/X5R* 10%K R 0.1 20%M 0.22 5 B/X5R 0.47 0.80.08 0.0310.003 1.0 J2K110 BJ225A* *1 1.5 *2 X7R Temp.char. Rated Voltage 50V 25V 16V EHS Environmental Hazardous Substances 50V Please specify the capacitance tolerance code.i *1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage. *2 We may provide X7R for some items according to the individual specification. U2K110 B7 102B U2K110 B7 222B U2K110 B7 472B T2K110 B7 103B T2K110 B7 223B E2K110 B7 473B E2K110 B7 104B RoHS RoHS RoHS RoHS RoHS RoHS RoHS tan Dissipation Soldering method Thickness Temperature Capacitance factor mm R: Reflow soldering Capacitance characteristics %Max. W: Wave soldering tolerance inch F 0.001 0.0022 0.0047 3.5 10%K 0.60.06 X7R 0.01 R 20%M0.0240.002 0.022 0.047 0.1 5 Please specify the capacitance tolerance code.i Rated Voltage 0.50.05 0.020.002 0.80.08 0.0310.003 10 B7:X7R Ordering code Temp.char. X5R 4 CAPACITORS 25V BJ:B/X5R CH:CH/C0H Ordering code EHS Environmental Hazardous Substances U2K110 100FB U2K110 120KB U2K110 150KB U2K110 180KB U2K110 220KB U2K110 270KB U2K110 330KB U2K110 390KB U2K110 470KB U2K110 560KB U2K110 680KB U2K110 820KB U2K110 101KB RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS Temperature Capacitance characteristics pF 10 12 15 18 22 27 33 39 47 56 68 82 100 Q Symbol Soldering method R: Reflow soldering W: Wave soldering Capacitance tolerance Thickness mm inch 1F F 400+20C CH C0H/ CG C0G R 0.60.06 10%K 0.0240.002 1000 Please specify the temperature characteristic code. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 95 PART NUMBERS 212TYPE 0805 case size 2 2 circuit type Temp.char. Rated Voltage BJ:B/X5R EHS Environmental Hazardous Substances Ordering code 25V T2K212 BJ105D 10V L2K212 BJ225MD* 1 tan Dissipation Soldering method Temperature factor Capacitance R: Reflow soldering characteristics %Max. W: Wave soldering F RoHS 1.0 B/X5R 5 RoHS 2.2 X5R 10 *1 1.5 R Capacitance tolerance Thickness mm inch 10%K 20%M 0.850.1 0.0330.004 20% M Please specify the capacitance tolerance code.i *1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage. 212TYPE 0805 case size 4 4 circuit type Temp.char. Rated Voltage BJ:B/X5R Ordering code EHS Environmental Hazardous Substances tan Dissipation Soldering method Temperature factor Capacitance R: Reflow soldering characteristics %Max. W: Wave soldering F 0.1 B/X5R 25V T4K212 BJ104D RoHS 16V E4K212 BJ104D L4K212 BJ224D L4K212 BJ474D 1 L4K212 BJ105D* RoHS RoHS RoHS 0.1 0.22 0.47 B/X5R* RoHS 1 X5R 10V *1 1.5 *2 X7R Temp.char. Rated Voltage 16V Thickness mm inch 2 5 B/X5R R 10%K 0.850.1 20%M0.0330.004 10 Please specify the capacitance tolerance code.i *1 Test voltage of loading at high temperature test is 1.5 time of the rated voltage. *2 We may provide X7R for some items according to the individual specification. B7:X7R Ordering code EHS Environmental Hazardous Substances E4K212 B7 104D 96 Capacitance tolerance RoHS tan Dissipation Soldering method Temperature factor Capacitance R: Reflow soldering characteristics %Max. W: Wave soldering F 0.1 X7R 5 R Capacitance tolerance Thickness mm inch 10%K 0.850.1 20%M0.0330.004 Please specify the capacitance tolerance code.i Please read the "Notice for TAIYO YUDEN products" before using this catalog. ELECTRICAL CHARACTERISTICS ESR- Example of Impedance ESR vs. Frequency characteristics (Taiyo Yuden multilayer ceramic capacitor) L2K096BJ103MP T2K096CH100FP J2K096BJ104MK 100000 100000 1000000 10000 10000 100000 1000 1000 100 100 10 10 1 1 0.1 0.1 1 10 100 0.01 0.1 1000 10000 100000 10000 4 1000 100 10 1 0.1 1 10 100 1000 10000 100000 0.01 1 10 100 1000 10000 MHz T2K110BJ103MB/T2K110B7103MB T2K096CH101KP 1000000 E2K110BJ104MB/E2K110B7104MB 1000000 100000 100000 10000 ESR Impedance 100000 10000 10000 1000 1000 1000 100 100 100 10 10 10 1 1 1 0.1 0.1 0.1 0.01 0.01 0.01 1 0.001 0.1 0.001 0.1 10 100 1000 10000 CAPACITORS 0.01 0.1 ESR Impedance 1 10 100 1000 10000 100000 1 10 100 1000 10000 100000 MHz 100 10 4K212BJ105KD J2K110BJ225MA L2K110BJ105MA 1000 10000 10000 1000 1000 100 100 10 10 1 1 0.1 0.1 0.01 0.01 1 0.1 0.01 0.001 0.1 1 10 100 1000 10000 100000 0.001 0.1 1 10 100 1000 10000 100000 0.001 0.1 1 10 100 1000 10000 100000 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 97 PACKAGING Minimum Quantity Taped packaging EIA Type Standard quantity [ pcs ] Thickness paper Embossed tape C 15000 P 15000 10000 10000 10000 mm inch code MK042 01005 0.2 0.008 MK063 0201 0.3 0.012 0.3 0.012 P 0.45 0.018 K 2K096 0302 WK105 0204 MK105 0402 VK1050402 0.3 0.012 0.5 0.020 P V, W W 0.45 0.018 K 4000 0.5 0.020 V 4000 0.8 0.031 A 4000 0.5 0.020 V 4000 0.8 0.031 A 4000 0.6 0.024 B 4000 0.45 0.018 K 4000 0.85 0.033 D 4000 1.25 0.049 G 3000 4K212 0805 0.85 0.033 D 4000 2K212 0805 0.85 0.033 D 4000 0.85 0.033 D 4000 1.15 0.045 F 1.25 0.049 G 3000 1.6 0.063 L 2000 0.85 0.033 D 2000 MK107 0603 WK107 0306 2K110 0504 MK212 0805 WK212 0508 MK316 1206 MK325 1210 MK432 1812 1.15 0.045 F 1.5 0.059 H 1.9 0.075 N 2.0max 0.079 Y Bulk Cassette 2000 2.5 0.098 M 500, 1000 2.5 0.098 M 500 Taping material WK Unitmminch 105, 107, 212 Please contact any of our offices for accepting your requirement according to dimensions 0402, 0603, 0805.(inch) WK 98 Please read the "Notice for TAIYO YUDEN products" before using this catalog. PACKAGING Taping dimensions Paper Tape8mm 0.315inches wide Embossed tape8mm 0.315inches wide 4 2.00.05 Insertion Pitch Tape Thickness Chip Cavity Type T1 0.25 MK042 01005 0.010 2.00.05 0.36max. 0.27max. 0.45 0.018 0.0790.002 0.014 0.011 0.37 MK063 0201 0.016 2.00.05 0.45max. 0.42max. 0.67 0.027 0.0790.002 0.018 0.017 0.65 WK105 0204 0.026 2.00.05 0.45max 0.42max 1.15 0.045 0.0790.0020.018max0.017max Type WK1070306 MK2120805 Unitmminch MK3161206 MK3251210 Insertion Pitch Tape Thickness Chip cavity EIA CAPACITORS T1 2.00.05 A B 1.0 1.8 F 1.3max. 0.250.1 K T 0.039 0.071 0.051max. 0.010.004 1.655 2.4 0.065 0.094 2.0 3.6 0.079 0.142 2.8 3.6 0.110 0.142 4.00.1 0.1570.0043.4max. 0.6max. 0.134max.0.024max. Unitmminch 2.00.05 Embossed tape12mm 0.472inches wide 2.00.05 Type EIA 2K096 0302 Chip Cavity Insertion Pitch Tape Thickness A B 0.72 1.02 0.028 MK105 0402 0.655 VK105 0402 0.026 F T 52.00.05 0.45max.(0.018max) 0.040 0.0790.0020.6max.(0.024max) 1.155 52.00.05 0.8max. 0.045 0.0790.0020.031max. Unitmminch Type EIA MK4321812 A 3.7 0.146 Insertion Pitch Tape Thickness Chip cavity B F 4.9 8.00.1 K T 4.0max. 0.6max. 0.193 0.3150.004 0.157max.0.024max. Unitmminch Type EIA Chip Cavity Insertion Pitch Tape Thickness A MK107 0603 1.0 0306 0.039 WK107 2K110 0504 1.15 0.045 B F T 1.8 4.00.1 1.1max. 0.071 0.1570.004 0.043max. 1.55 4.00.1 1.0max. 0.061 0.1570.004 0.039max. MK212 0805 WK212 0508 1.655 2.4 4K212 0805 0.065 0.094 4.00.1 1.1max. 0.1570.004 0.043max. 2K212 0805 MK316 1206 2.0 3.6 0.079 0.142 Unitmminch Please read the "Notice for TAIYO YUDEN products" before using this catalog. 99 PACKAGING Leader and Blank portion 160mm 6.3inches or more 100mm 3.94inches or more Direction of tape feed 400mm 15.7inches or more Reel size Top Tape Strength 0.10.7N The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as illustrated below. 100 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 1/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Item Standard 1.Operating Temperature High PermitivityClass 2 Temperature CompensatingClass 1 High Frequency Type Standard Note1 BJ-55 to 125 -55 to 125 Test Methods and Remarks High Value -25 to 85 High Capacitance Type BJX7R -55125, BJX5R -5585 -25 to 85 High Capacitance Type BJX7R -55125, BJX5R -5585 F-25 to 85 Range 2. S t o r a g e Te m p e r a t u r e BJ-55 to 125 -55 to 125 EY5U-3085, FY5V-3085 F-25 to 85 Range 50VDC,25VDC, 16VDC 16VDC 50VDC No breakdown or No abnormality 50VDC,25VDC EY5U-3085, FY5V-3085 50VDC,35VDC,25VDC 16VDC,10VDC,6.3VDC 4DVC, 2.5VDC 4.Withstanding Voltage Between terminals Applied voltage: Rated voltagex3 Class 1 No breakdown or damage Rated voltagex2.5Class 2 damage Duration: 1 to 5 sec. Charge/discharge current: 50mA max.Class 1,2 5.Insulation Resistance 500 MF. or 10000 M., whichever is the Applied voltage: Rated voltage 10000 M min. Duration: 605 sec. smaller. Charge/discharge current: 50mA max. Note 5 6.CapacitanceTolerance 0.5 to 5 pF: 0.25 pF 0.5 to 2 pF : 0.1 pF BJ: 10%, 20% BJ1020 1 to 10pF: 0.5 pF 2.2 to 5.1 pF : 5% F80% F-2080 5 to 10 pF: 1 pF -20 11 pF or over: 5% 10% 105TYPER, S, T, U only 0.52pF: 0.1pF 2.220pF: 5% 7.Q or Tangent of Loss Angle Under 30 pF R e f e r t o d e t a i l e d BJ: 2.5% max.50V, 25V BJ2.5 max. tan : Q400 20C specification F: 5.0% max.50V, 25V F7 max. Note 4 30 pF or over : Q1000 Note 4 C= Nominal capacitance Measuring frequency Class1 1Hz10%C1000pF 1Hz10%C1000pF Class2 1Hz10%C10F 120Hz10HzC10F Measuring voltage Note 4 Class10.55VrmsC1000pF 10.2VrmsC1000pF Class2 10.2VrmsC10F 0.50.1VrmsC10F Bias application: None Multilayer: Measuring frequency Class1 1Hz10%C1000pF 1Hz10%C1000pF Class2 1Hz10%C10F 120Hz10HzC10F Measuring voltage Note 4 Class10.55VrmsC1000pF 10.2VrmsC1000pF Class2 10.2VrmsC10F 0.50.1VrmsC10F Bias application: None HighFrequencyMultilayer: Measuring frequency: 1GHz Measuring equipment: HP4291A Measuring jig: HP16192A 8.Temperature Without CK0250 CH060 BJ10-2585 BJ10 According to JIS C 5102 clause 7.12. Characteristic voltage ap- CJ0120 RH-22060 F 30-2585 Temperature compensating: of Capacitance plication CH060 4 CAPACITORS 3.Rated Voltage ppm/ -80 BJX7R 15 FY5V 22 CG030 -82 RH-22060 -2585 F30-80 -2585 BJX7RX5R FY5V SJ-330120 22-82 SH-33060 made to calculate temperature characteristic by the following equation. C85 C20 x 106 ppm/ C20xT 15 SK-330250 Measurement of capacitance at 20 and 85 shall be High permitivity: TK-470250 Change of maximum capacitance deviation in step 1 to 5 TJ-470120 Temperature at step 1: 20 UK-750250 Temperature at step 2: minimum operating temperature UJ-750120 Temperature at step 3: 20Reference temperature S L 350 t o 1000 Temperature at step 4: maximum operating temperature Temperature at step 5: 20 ppm/ Reference temperature for X7R, X5R, Y5U and Y5V shall be 25 9.Resistance to Flexure of Substrate Appearance: Appearance: Appearance: No abnormality No abnormality No abnormality Capacitance change: Capacitance change: Capacitance change: Within 5% or 0.5 pF, Within0.5 pF BJWithin 12.5% whichever is larger. Warp: 1mm Testing board: glass epoxyresin substrate Thickness: 1.6mm063 TYPE : 0.8mm The measurement shall be made with board in the bent position. FWithin 30% Please read the "Notice for TAIYO YUDEN products" before using this catalog. 103 2/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Temperature CompensatingClass 1 Item Standard 10.Body Strength High Frequency Type High PermittivityClass 2 Standard Note1 Test Methods and Remarks High Value No mechanical dam- High Frequency Multilayer: age. Applied force: 5N 4 Duration: 10 sec. A 11.Adhesion of Electrode No separation or indication of separation of electrode. A LW Reverse Applied force: 5N 01005, 0201, 0302 TYPE 2N Duration: 305 sec. 12.Solderability At least 95% of terminal electrode is covered by new solder. Solder temperature: 2305 13.Resistance to soldering Appearance: No ab- Appearance: No ab- Appearance: No abnormality normality Capacitance change: Within 7.5%BJ CAPACITORS A Duration: 41 sec. normality Preconditioning: Thermal treatmentat 150 for 1 hr Within 20%F Capacitance change: Capacitance change: W i t h i n 2 . 5 % o r Within 2.5% tan : Initial value 0.25pF, whichever is Q: Initial value Insulation resistance: Initial value larger. Insulation resistance: Withstanding voltagebetween terminals : No Q: Initial value Initial value abnormality Note 4 Duration: 30.5 sec. Preheating conditions: 80 to 100, 2 to 5 min. or 5 to 10 min. 150 to 200, 2 to 5 min. or 5 to 10 min. Recovery: Recovery for the following period under the Insulation resistance: Withstanding voltage standard condition after the test. 624 hrsClass 1 between terminals: Initial value Applicable to Class 2. Solder temperature: 2705 242 hrsClass 2 Withstanding voltage No abnormality between terminals: No abnormality 14.Thermal shock Appearance: No ab- Appearance: No abnormality normality Preconditioning: Thermal treatmentat 150 for 1 hr Appearance: No abnormality Capacitance change: Within 7.5%BJ Within 20%F Capacitance change: Capacitance change: Applicable to Class 2. Conditions for 1 cycle: 0 303 min. Step 1: Minimum operating temperature -3 W i t h i n 2 . 5 % o r Within 0.25pF tan : Initial value 0.25pF, whichever is Q: Initial value Insulation resistance: Initial value Step 2: Room temperature larger. Insulation resistance: Withstanding voltagebetween terminals : No 0 303 min. Step 3: Maximum operating temperature - Q: Initial value Initial value abnormality Step 4: Room temperature Note 4 2 to 3 min. Number of cycles: 5 times Insulation resistance: Withstanding voltage Recovery after the test: 624 hrsClass 1 between terminals: Initial value 2 to 3 min. 3 242 hrsClass 2 Withstanding voltage No abnormality between terminals: No abnormality 15.Damp Heatsteady state Appearance: No ab- Appearance: No ab- Multilayer normality normality Preconditioning: Thermal treatmentat 150 for 1 hr Capacitance change: Capacitance change: Capacitance change: Capacitance change: Within 5% or 0.5pF, Within 0.5pF, BJ: Within 12.5% BJ:Within 12.5% Temperature: 402 whichever is larger. Insulation resistance: F: Within 30% Note 4 Humidity: 90 to 95% RH Q: 1000 M min. tan : BJ: 5.0% max. tan : Duration: 500 24 -0 hrs BJ: 5.0% max. Note 4. Recovery: Recovery for the following period under the standard condition after the removal from test chamber. Appearance: No ab- Appearance: No abnormality normality C30 pF F: 7.5% max. : Q350 10 C 30 p F : Q Note 4 F: 11.0% max. 275 2.5C Insulation resistance: Insulation resistance: C10 pF : Q200 50 MF or 1000 M 50 MF or 1000 M Applicable to Class 2. 624 hrsClass 1 242 hrsClass 2 10C whichever is smaller. whichever is smaller. HighFrequency Multilayer: C: Nominal capacitance Note 5 Note 5 Temperature: 602 Insulation resistance: Humidity: 90 to 95% RH 1000 M min. 24 hrs Duration: 500 - 0 Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 624 hrsClass 1 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 105 3/3 RELIABILITY DATA Multilayer Ceramic Capacitor Chips Specified Value Item 16.Loading under Damp Heat High PermittivityClass 2 Test Methods and Remarks Standard High Frequency Type Standard Note1 High Value Appearance: No abnormality Capacitance change: Within 7.5% or 0.75pF, whichever is larger. Q: C30 pF: Q200 C30 pF: Q100 10C/3 C Nominal capacitance Insulation resistance: 500 M min. Appearance: No abnormality Capacitance change: C2 pF: Within 0.4 pF C2 pF: Within 0.75 pF C Nominal capacitance Insulation resistance: 500 M min. Appearance: No abnormality Capacitance change: BJ: Within 12.5% F: Within 30% Note 4 tan : BJ: 5.0% max. F: 7.5% max. Note 4 Insulation resistance: 25 MF or 500 M, whichever is the smaller. Note 5 Appearance: No abnormality Capacitance change: BJWithin12.5 FWithin30 Note 4 tan BJ5.0max. F11max. Note 4 Insulation resistance: 25 MF or 500 M, whichever is the smaller. Note 5 According to JIS C 5102 Clause 9. 9. Multilayer: Preconditioning: Voltage treatmentClass 2 Temperature: 402 Humidity: 90 to 95% RH Duration: 500 24 hrs -0 Applied voltage: Rated voltage Charge and discharge current: 50mA max.Class 1,2 Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 624 hrsClass 1 242 hrsClass 2 HighFrequency Multilayer: Temperature: 602 Humidity: 90 to 95% RH 24 Duration: 500 - hrs 0 Applied voltage: Rated voltage Charge and discharge current: 50mA max. Recovery: 624 hrs of recovery under the standard condition after the removal from test chamber. Appearance: No abnormality Capacitance change: Within 3% or 0.3pF, whichever is larger. Q: C30 pF : Q350 10C30 pF: Q275 2.5C C10 pF: Q200 10C CNominal capacitance Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: Within 3% or 0.3pF, whichever is larger. Insulation resistance: 1000 M min. Appearance: No abnormality Capacitance change: BJWithin12.5 Within20 Within25 FWithin30 Note 4 tan BJ5.0max. F11max. Note 4 Insulation resistance: 50 MF or 1000 M, whichever is smaller. Note 5 According to JIS C 5102 clause 9.10. Multilayer: Preconditioning: Voltage treatmentClass 2 Temperature:1253Class 1, Class 2: B, BJX7R 852Class 2: BJ,F 48 Duration: 1000 - 0 hrs Applied voltage: Rated voltagex2 Note 6 Recovery: Recovery for the following period under the standard condition after the removal from test chamber. 624 hrsClass 1 242 hrsClass 2 HighFrequency Multilayer: Temperature: 1253Class 1 Duration: 100048 hrs -0 Applied voltage: Rated voltagex2 Recovery: 624 hrs of recovery under the standard condition after the removal from test chamber. Appearance: No abnormality Capacitance change: BJ: Within 12.5% F: Within 30% Note 4 tan : BJ: 4.0% max. F: 7.5% max. Note 4 Insulation resistance: 50 MF or 1000 M, whichever is smaller. Note 5 4 CAPACITORS 17.Loading at High Temperature Temperature CompensatingClass 1 Note 1 :For 105 type, specified in "High value". Note 2 :Thermal treatmentMultilayer : 1 hr of thermal treatment at 150 0 /-10 followed by 242 hrs of recovery under the standard condition shall be performed before the measurement. Note 3 :Voltage treatmentMultilayer: 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 242 hrs of recovery under the standard condition shall be performed before the measurement. Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications. Note 6 :Some of the parts are applicable in rated voltagex1.5. Please refer to individual specifications. Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." Please read the "Notice for TAIYO YUDEN products" before using this catalog. 107 1/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 1.Circuit Design Precautions Technical considerations Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear 4 reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any capacitors to be CAPACITORS used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Operating VoltageVerification of Rated voltage 1. The operating voltage for capacitors must always be lower than their rated values. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages should be lower than the rated value of the capacitor chosen. For a circuit where both an AC and a pulse voltage may be present, the sum of their peak voltages should also be lower than the capacitor's rated voltage. 2. Even if the applied voltage is lower than the rated value, the reliability of capacitors might be reduced if either a high frequency AC voltage or a pulse voltage having rapid rise time is present in the circuit. 2.PCB Design Pattern configurations Design of Land-patterns 1. When capacitors are mounted on a PCB, the amount of solder usedsize of filletcan directly affect capacitor per- 1.The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amourts.larger fillets which extend above the component end terminations Examples of improper pattern designs are also shown. formance. Therefore, the following items must be carefully considered in the design of solder land patterns: 1Recommended land dimensions for a typical chip capacitor land patterns for PCBs 1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. Recommended land dimensions for wave-soldering unit: mm 2When more than one part is jointly soldered onto the Type 107 212 316 L 1.6 2.0 3.2 3.2 W 0.8 51.25 1.6 2.5 same land or pad, the pad must be designed so that each component's soldering point is separated by solder-resist. Size 325 A 0.81.0 1.01.4 1.82.5 1.82.5 B 0.50.8 0.81.5 0.81.7 0.81.7 C 0.60.8 0.91.2 1.21.6 1.82.5 Recommended land dimensions for reflow-soldering unit: mm Type Size 042 063 105 107 212 316 325 L 0.4 0.6 1.0 1.6 2.0 3.2 3.2 432 4.5 W 0.2 0.3 0.5 0.8 51.25 1.6 2.5 3.2 A 0.150.25 0.200.30 0.450.55 0.81.0 0.81.2 1.82.5 1.82.5 2.53.5 B 0.100.20 0.200.30 0.400.50 0.60.8 0.81.2 1.01.5 1.01.5 1.51.8 C 0.150.30 0.250.40 0.450.55 0.60.8 0.91.6 1.22.0 1.83.2 2.33.5 Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Size Type 2.0 W 1.25 a 0.50.6 b 0.50.6 c 0.20.3 d 0.5 Type 2122 circuits 1102 circuits0962 circuits L 2.0 1.37 W 1.25 1.0 0.6 a 0.50.6 0.350.45 0.250.35 b 0.50.6 0.550.65 0.150.25 c 0.50.6 0.30.4 0.150.25 d 1.0 0.64 0.45 Size 2124 circuits L 0.9 Please read the "Notice for TAIYO YUDEN products" before using this catalog. 109 2/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages Precautions Technical considerations LWDC Recommended land dimensions for reflow-soldering 4 Size L 107 212 50.8 1.25 1.0 1.6 2.0 W A 0.180.22 0.250.3 0.50.7 B 0.20.25 0.30.4 C 0.91.1 1.51.7 CAPACITORS 105 0.52 Type 0.40.5 1.92.1 unit: mm 2Examples of good and bad solder application 2.PCB Design Not recommended Items Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement Pattern configurations Capacitor layout on panelized [breakaway] PC boards 1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be located to minimize any possible mechanical stresses from board warp or deflection. 1. After capacitors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent Not recommended Recommended manufacturing processesPCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc. For this reason, Deflection of planning pattern configurations and the position of SMD ca- the board pacitors should be carefully performed to minimize stress. 1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on capacitor layout. The example below shows recommendations for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting procedure. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 111 3/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 3.Considerations for automatic placement Precautions Adjustment of mounting machine 1. Excessive impact load should not be imposed on the capacitors when mounting onto the PC boards. 2. The maintenance and inspection of the mounters should be conducted periodically. Technical considerations 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the capacitors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: 1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. 2The pick-up pressure should be adjusted between 1 and 3 N static loads. nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Not recommended Recommended Single-sided 4 CAPACITORS 3To reduce the amount of deflection of the board caused by impact of the pick-up mounting Double-sided mounting 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between 1. Mounting capacitors with adhesives in preliminary assembly, the shrinkage percentage of the adhesive and that of the capacitors may result in before the soldering stage, may lead to degraded capacitor stresses on the capacitors and lead to cracking. Moreover, too little or too much characteristics unless the following factors are appropriately adhesive applied to the board may adversely affect component placement, so the fol- checked; the size of land patterns, type of adhesive, amount lowing precautions should be noted in the application of adhesives. applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. 1 Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. 2 The recommended amount of adhesives is as follows; Figure 212/316 case sizes as examples a 0.3mm min b 100 120 m c Adhesives should not contact the pad Please read the "Notice for TAIYO YUDEN products" before using this catalog. 113 4/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 4. Soldering Precautions Technical considerations 1-1. When too much halogenated substanceChlorine, etc.content is used to activate Selection of Flux 1. Since flux may have a significant effect on the performance the flux, or highly acidic flux is used, an excessive amount of residue after soldering of capacitors, it is necessary to verify the following condi- may lead to corrosion of the terminal electrodes or degradation of insulation resis- tions prior to use; tance on the surface of the capacitors. 1Flux used should be with less than or equal to 0.1 wt% 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a equivelent to chrolineof halogenated content. Flux large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the flux applied should be controlled at the optimum level. air, the residue on the surface of capacitors in high humidity conditions may cause a 3When using water-soluble flux, special care should be degradation of insulation resistance and therefore affect the reliability of the compo- taken to properly clean the boards. nents. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering 1-1. Preheating when soldering Temperature, time, amount of solder, etc. are specified in ac- Heating: Ceramic chip components should be preheated to within 100 to 130 of the CAPACITORS having a strong acidity content should not be applied. 2When soldering capacitors on the board, the amount of 4 soldering. cordance with the following recommended conditions. Cooling: The temperature difference between the components and cleaning process should not be greater than 100. Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with great care so as to prevent malfunction of the components due to excessive thermal shock. Recommended conditions for soldering Sn-Zn solder paste can affect MLCC reliability performance. [Reflow soldering] Please contact us prior to usage. 300 Temperature profile Peak 260 max 10 sec max 200 200 Gradually cooling Preheating 100 100 0 150 60 230 40 0 100 300 Caution 150 60 sec min Heating above 230 40 sec max Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Pb free soldering Temperature 300 1. The ideal condition is to have solder mass fillet controlled tomax 1/2 to 1/3 of the Peak 260 260 10 sec max 10 thickness of the capacitor, as shown below: 200 Pb free soldering Temperature 300 260 10 150 200 Gradually cooling Preheating 150 100 Pb free soldering Temperature 300 Capacitor 120 Peak 260 260 120 sec min max 10 sec max 10 0 0 Solder 200 Ceramic chip components should be preheated to 200 100 300 100 PC board 100 within 100 to 130 of the soldering. Gradually Assured to be wave soldering for 1 time. cooling Except for reflow soldering type. Preheating 2. Because dwell times can detrimentally affect solderability, soldering 150 150 excessive Heating abovedu230 230 60 sec min Pb free 60 40 sec max 40 soldering Temperature 0 0 ration should be kept as close to recommended as possible. 400 times 400 100 Ceramic chip components should be preheated to 350 3 [Wave soldering] 300 Temperature 200 100 300 profile 350 max within 100 to 130 of the soldering. 3 sec max Assured to be reflow soldering for 2 times. Gradually cooling 300 200 Pb free soldering Temperature 100 300 260 60 10 60 secmax min Peak 260 10 sec max 0 20019032161303225 0 2001903216Type max, 1303225 100 100 The soldering iron should not directly touch the 0 20W1 150 1 120 400 Caution Gradually Type min Preheating cooling It is recommended to use 20W soldering iron and 150 the tip is 1 or less. 0 components. secsoldering min Assured120 to be iron for 1 time. Ceramic chip components should be preheated to Note: The above profiles are the maximum allowable within 100 to condition, 130 of the soldering. soldering therefore these profiles are Assured to be wave soldering for 1 time. not always recommended. Except for reflow soldering type. Pb free soldering Temperature 400 350 1. Make sure the capacitors are preheated sufficiently. 350 max 3 sec max 3 300 and melted solder should not be 2. The temperature difference between the capacitor Gradually 300 200 100 greater than 100 to 130 200 cooling 3. Cooling after soldering should be as gradual as 100possible. 60 sec min 0 4. Wave60 soldering must not be applied to the capacitors designated as for reflow sol0 130 3225 190 3216 dering only. 20W1 1 , 1303225 1903216Type max Type min It is recommended to use 20W soldering iron and the tip is 1 or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 115 Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. 100 300 PRECAUTIONS Peak 260 max 10 sec max 200 200 Precautions on the use of Multilayer Ceramic Capacitors Stages 150 100 120 0 4. Soldering 5/6 Gradually cooling Preheating 150 100 Precautions Pb free soldering Temperature 300 260 10 Technical considerations 0 [Hand soldering] Temperature profile 400 300 200 Pb free soldering Temperature 400 350 3 300 120 sec min Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be wave soldering for 1 time. Except for reflow soldering type. 350 max 3 sec max 200 Gradually cooling 60 sec min 60 0 0 130 3225 190 3216 20W1 1 , 1303225 1903216Type max Type min It is recommended to use 20W soldering iron and the tip is 1 or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. CAPACITORS 100 100 4 Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the capacitor. 5.Cleaning Cleaning conditions 1. When cleaning the PC board after the capacitors are all 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a mounted, select the appropriate cleaning solution according degradation of the capacitor's electrical propertiesespecially insulation resistance . to the type of flux used and purpose of the cleaninge.g. 2. Inappropriate cleaning conditionsinsufficient or excessive cleaningmay detrimen- to remove soldering flux or other materials from the produc- tally affect the performance of the capacitors. tion process. 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the capacitor's characteristics. 1 Excessive cleaning In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the capacitor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20 W/ Ultrasonic frequency Below 40 kHz Ultrasonic washing period 5 min. or less 6.Post cleaning processes 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than the capacitor's operating temperature, the stresses generated by the excess heat may lead to capacitor damage or destruction. The use of such resins, molding materials etc. is not recommended. 7.Handling Breakaway PC boardssplitting along perforations 1. When splitting the PC board after mounting capacitors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations 1. Be careful not to subject the capacitors to excessive mechanical shocks. 1If ceramic capacitors are dropped onto the floor or a hard surface, they should not be used. 2When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 117 6/6 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors Stages 8.Storage conditions Precautions Technical considerations 1. If the parts are stored in a high temperature and humidity environment, problems Storage 1. To maintain the solderability of terminal electrodes and to such as reduced solderability caused by oxidation of terminal electrodes and dete- keep the packaging material in good condition, care must rioration of taping/packaging materials may take place. For this reason, components be taken to control temperature and humidity in the storage should be used within 6 months from the time of delivery. If exceeding the above area. Humidity should especially be kept as low as possible. period, please check solderability before using the capacitors. Recommended conditions Below 30 Humidity Below 70% RH 4 CAPACITORS Ambient temperature The ambient temperature must be kept below 40. Even under ideal storage conditions capacitor electrode solderability decreases as time passes, so should be used within 6 months from the time of delivery. Ceramic chip capacitors should be kept where no chlorine or sulfur exists in the air. 2. The capacitance value of high dielectric constant capacitors type 2 &3will gradually decrease with the passage of time, so this should be taken into consideration in the circuit design. If such a capacitance reduction occurs, a heat treatment of 150 for 1hour will return the capacitance to its initial level. Please read the "Notice for TAIYO YUDEN products" before using this catalog. 119