SdA4H* on 0 HEWLETT PACKARD Le Surface Mount PIN Diodes Technical Data Features Package Lead Code Diodes Optimized for: Identification Low Current Switching 10 view Low Distortion Attenuating Ultra-Low Distortion #OSINGLE #1 SINGLE Switching al Microwave Frequency Operation Surface Mount SOT-23 = - = Package #2SERES . #1 COMMON ANODE Single and Dual Versions A A Tape and Reel Options Available Low Failure in Time (FIT) 3 se E me Rate* @4 COMMON CATHOOE a6 UNCONNECTED PAIR B A *For more information ace the Surface Mount PIN Reliability Data Sheet. @ A DUAL ANODE @8 DUAL CATHODE = a g & Ee GI b = a 3 Absolute Maximum Ratings** T, = 25C Symbol Parameter Value I, Forward Current (1 ps Pulse) 1 Amp P, Total Device Dissipation 250 mW! P, Peak Inverse Voltage Same as Vor T; Junction Temperature 150C Tag Storage Temperature -65 to 150C **Operation in excess of any one of these conditions may result in permanent damage to this device. . Note: 1, CW Power Dissipation at T,x4p = 25C. Derate to zero at maximum rated temperature. HSMP-38XX and HSMP-48XX Series Description/ Applications The HSMP-3800 and HSMP- 3810 series are specifically designed for low distortion attenuator applications. The HSMP-3820 and HSMP-3890 series are optimized for switch- ing applications where low resistance at low current, and low capacitance are required. The HSMP-3880 switching diode is an ultra low distortion device optimized for higher power applications from 50 MHz to 1.5 GHz. The HSMP-48XX series are special products featuring ultra low parasitic inductance in the SOT-23 package, specifically designed for use at frequencies which are much higher than the upper limit for conventional SOT-23 PIN diodes. The HSMP-4810 diode is a low distortion attenuating PIN designed for operation to 3 GHz. The HSMP- 4820 diode is ideal for limiting and low inductance switching applications up to 1.5 GHz. The HSMP-4890 is optimized for low current switching applications up to 3 GHz.PIN Attenuator Diodes Electrical Specifications T, = 25C (Each Diode) Nearest Minimum Maximum Part | Package Equivalent | Break- Maximum Total Minimum | Maximum Num- | Mark. Axial Lead down Serica Capac- High Low ber ing Lead | Configu- Part No. Voltage | Resistance itance | Resistance | Resistance HSMP-| Codel!] | Code | ration 50a2- Vey (VY) R, () Cy (pF) R,, (Q) R, (Q) 3800 DO 0 | Single 3080 100 2.8 0.35 1900 g 3801 D1 1 Single 8802 Da 2 Series 9804 Da 4 Common Cathode 3810 Eo 0 Single 3061 100 4.0 0.36 1500 10 3811 El 1 Single 8812 E2 2 Series 3813 E3 3 Common Anode 3814 Ea 4 Common Cathode Test Conditions Va=Vaqg | Ip= 100 mA] Vy=50V |Ip=0.01 mA] Ip=20 mA Measure | f= 100 MHz] f= 1 MHz | f= 100 MHz jf = 100 MHz Ips 10 pA PIN Switching Diodes Nearest Maximum Maximum Equivalent | Minimum | Maximum Total Shunt Mods Part | Package Axial Lead | Breakdown Series Capaec- Harmonic Number| Marking | Lead Part No. Voltage Resistance itance Distortion HSMP- | Code!) | Code} Configuration 5082- Van (V) R, (Q) C, @F) Hmd (dBc) 3820 Fo 0 Single 3188 a5 0.6" 1,0 - 3821 F1 1 Single 3822 F2 2 Series 3823 F3 3 Common Anode 3824 F4 4 Common Cathode 3880 so 0 | Single . 100 6.5 0.40 55 3881 81 L Single 3890 Go o | Single . 35 2.5 0.50** - 3891 Gl 1 Single 3892 G2 2 Series 9893 G3 a Common Anode 3894 G4 4 Common Cathode 3895 G5 5 Unconnected Pair Test Conditions Va=Van | Ip=5mA | Ves50V | 26, 22508 Measure | f=100MHz | f=1MHz | f, = 400 MHz Ips 10 pA Iy=10mA* | Vg=20V* | BP, = +30 dBm Vaabve OV bisa Note: 1. Package marking code is white. Package marking code is suffix "L for low profile.Nearest Equivalent Minimum Maximum Maximom Pert | Package Axial Lead Breakdown Beries Total Number | Marking | Lead Part No. Voltage Resistance | Capacitance HSMP- | Codel!] | Code Configuration 5082- Van (V) R, (Q) Cy (PF) 3830 Ko 0 Single 3077 200 15 03 3831 Ki 1 Single 3832 Ka 2 Series 3838 K3 8 Common Anode 3834 Ka 4 Common Cathode Test Conditions Va = Vig I, = 100 mA Vg = 50V Maasure f= 100 MHz f= 1 MHz Ip $10 pA Netat : 1. Package marking code is white. Package marking code is suffix "L" for low profile. High Frequency (Low Inductance, 500 MHz - 3 GHz) PIN Diodes Minimum | Maximum | Typical | Maximum Typical Break- Series Total Total Total Part | Package down Rasis- Capaci- Capaci- Indue- Number | Marking| Lead | Config- Voltage tance tance tance tance Appli- BSMP-| Code | Cede| uration Vim, (V) Rg (Q) Cc; @F) Cy @F) Ly (n=) cation 4810 EB B Dual 100 4.0 0.35 0.4 Lo Attenn- Cathode ator 4820 FA A Dual Anode 35 0.8* 0.75 1.0* 1,0* Limiter 4890 GA A Dual Anode 35 2.5 0.33 0.375 Lo Switch Ve= Vie Ip = 100 mA Va = 60V Vga 50V f = 500 MHx - Measure Ip=10 mA* |] f<1 MBs | f= 1MEs 3 GHz Ig S10 pA Vg=20V* | Vp=0V | f= 500 MHz - 1.6 GHz Note 1. Package marking onde is white. Package marking code ia euffix "1" for low profile. Typical Parameters at T, = 25C Part Number Series Resistance Carrier Lifetime Reverse Recovery Time HSMP- Bg (a) T (ns) Ty, (ns) 380X 55 1800 500 381X/4810 75 1500 300 382X/4820 15 70* 7 383X 20 500 80 388X 38 2500 550 389X/4890 38 200* - Test Conditions Ip=imA Ip =50 mA Vg=10V f= 100 MHz I, = 250 mA Ip = 20 mA Ip = 10 mA* I, = 10 mA* 90% Recovery I, = 6 mA*Typical Parameters at T, = 25C (unless otherwise noted), Single Diode 10000 | | | -HSMP-38 OH EMP-4810 0.01 0.1 1 10 100 Ip~ FORWARD BIAS CURRENT (mA) Figure 1. RF Resistance at 26C vs. Forward Bias Current. 1 10 wo ao o1 Ip ~ FORWARD BAB CURRENT (mA) a. RF Resistance vs. Forward Bias Current for HSMP-3810 and HSMP-4810. Dioda Mounted As A Seven Attenuator in A 50 Ohm Miferestrip Ard Tested A; 123 Mit: INPUT INTERCEPT POINT (am) 1000 " 100 10 DIODE RF RESIRTANCE (OHMS) Figure 5. 2nd Harmonic Input Intercept Point vs. Diode RF Resistance for Attenuator Diodea. 2000 S | 1000 i ~ . arr 3 s & | : 100 4 +2eC , = 1 ry x ws | 6.61 a1 1 10 100 \p- FORWARD BIAS CURRENT (rua) Figure 2. RF Resistance ve. Forward Bias Current for HSMP-3800. G, - CAPACITANCE (pF) Vp REVERSE VOLTAGE () Figure 4. Capacitance ve. Reverse Voltage. es, A B Sh / : a A/ ULES = | ( FORWARD BIAS CURRENT pa) Figure 6. 2nd Harmonic Input Intercept Point va. Forward Bias Current for Switch Diodes.Typical Parameters (continued) 700 TT HSMP-382X \ Vae2zVv Va= 5 V - a tv | Yrs - REVERSE RECOVERY TIME (n> s r aa io 20 Kt] FORWARD CURRENT (mA) Figure 7. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-3820 Series. vues ype [ee] REVEASE RECOVERY TIME (ns} 20 - Vaz 20V ol 100 0 16 20 2 x0 FORWARD CURRENT (mA} Figure 9. Typical Reverse Recovery Time va. Reverse Voltage. HSMP-3880 Series. Le 777 P3800 / / HSMP-3801 10 : y TOTGty iy Ss Ip FORWARD CURRENT {mA} - THT 4 t | AS r [ire asC hen 0.01 2 1 2 04 058 0.8 1 12 We qT Vp FORWARD VOLTAGE (V) Figure 11. Forward Current vs, Forward Voltage. HSMP- 3880 Beries. 1000 TTT HSMP-3830 HAMP- 3831 Va=6V NT Ve~ 10 100 Tre -REVERSE RECOVERY TIME (n&) 70 FORWARD CURRENT (mA) Figure 8. Reverse Recovery Time vs. Forward Current for Various Reverse Voltages. HSMP-3890 Series | zy 160 C z Vqe-2 = o | E in| > 3 La 8 w g 0 = = a z Vp 5 VL eer * La RS oe] oe LV n= OV 0 10 15 2 25 2 FORWARD CURRENT (ma) Figure 10. Typical Reverse Recovery Time vs. Reveres Voltage. HSMP-3890 Series. 100 HSMP-3810 _ i HSMP-3811 < HSMP-4510 ii x = 3 f a 2 y z xz & | l a arc phy 2 o4 O6 os 1 12 Ve - FORWARD VOLTAGE (Vv) Figure 12. Forward Current ve. Forward Voltage. HSMP-3810 and HSMP-4810 Series.Typical Parameters (continued) ) Lod | A/T | see Lf J / ll / A_| a1 A +e ~sarc 0.01 o 02 os os as 1 1.2 lp - FORWARD CURRENT (mA) Vp FORWARD VOLTAGE (Vv) Figure 13. Forward Current vs. Forward Voltage. HSMP.3820 and HSMP-4820 Series. tas /j\ 100 TT TM 2 EE TT y E F ~ 55C ao te 1T lf 7 - PE | Ad ot f= / 0.01 0 a2 a4 0s oe 1 12 FORWARD VOLTAGE (V) Figure 15. Typical Forward Current ve. Forward Voltage. HSMP-3890 Series. 100 NN o 10 =a a1 ip FORWARD CURRENT (mal 2sc f-50C i a2 o4 a6 os 1 12 0.01 0G Ve FORWAAD VOLTAGE (} Figure 14. Forward Current vs. Forward Voltage. HSMP-3830 Series. E ar i [ A I. Ta tlh! 10 TTT WWI. T lp = FORWARD CURRENT (mA) TT al o4 1.6 os 1 12 g Vp FORWARD VOLTAGE {V) Figure 16. Typical Forward Current vs. Forward Voltage. HSMP-3890 and HAMP-4890 Series.Typical Applications for Multiple Diode Products RE COMMON RF COMMON RFit { fu are Re 104 fo RF2 BIAS 2 Bias I ol Simple SPDT Switch, Using Only Positive Bias Current. _High Isolation SPDT Switch. ne 4-1 SPDT Switch Using Both Positive and Negative Bias Very High Isolation SPDT Switch. Current.Typical Applications for Multiple Diode Products (cont.) VARIABLE BLAS wwout o-| | + r{ AF OUT < - S > q > + AXED VOLTAGE Four Diode II Attenuator. mas } e_ ~ ~ a | High erie SPST Switch (Repeat Calle as Power Limiter Using HEMP-3822 Diode Pair.Typical Applications for HSMP-48XX Low Inductance Series + + = EB 8 / EB 1 2 t HSMP-4810 HSMP-4820 & HSMP-4890 Internal Connections Circuit Layout Microstrip Series Connection for HSMP- 48XX Series In order to take full advantage of the low inductance of the HSMP-48XX series when using them in a series application, both lead 1 and lead 2 should be connected together, as shown above. a5 nH ll ' 2 O.8 pF TYPICAL FOR hoMP-3820 Equivalent Circuit 0.4 pF TYPICAL FOR HSaP-3820 Equivalent Cireult" Ohm microstrip ee [ PAD CONNECTED TO GROUND BY TWO VIA HOLES Circuit Layout Microstrip Shunt Connection for HSMP- 48XX Series In the diagram above, the center conductor of the microstrip line is interrupted and leads 1 and 2 of the HSMP- Groundplane Groundplane jj Cireuit Layout Co-Planar Waveguide Shunt Connection for HSMP-48XX Series Co-Planar waveguide, with ground on the top side of the printed circuit board, is shown CoPianar Waveguide Center Conductor 38XX series diode are placed across the resulting gap. This forces the 0.5 nH lead inductance of leads 1 and 2 to appear as part of a low pass filter, reducing the shunt. parasitic inductance and { OS nH O.5 nH i 0.6 nH G3 nH * 0.8 pF TYPICAL FOR HSMP4820 Equivalent Circuit increasing the maximum available attenuation. The 0.3 nH of shunt inductance external to the diode is created by the via holes, and is a good estimate for 0.032 thick material. sonao eee ---H * O42 pF TYPICAL FOR HSMP-4620 Equivalent Circuit in the diagram above. Since it eliminates the need for via holes to pround, it offers lower shunt parasitic inductance and higher maximum attenuation when compared to a microstrip circuit. 10Package Dimensions TOP VIEW ( 45 ba? _ lH e PACKAGE MARK " TEE ELECTHOCAL SPECIFICATIONS TABLE) STARBOARD PROFILE MILLWHETERS Ew 1 |. ENO VI DiM| MIN MIN 8 ee 2.90 06 10.110 INCHES MAK A 0.120 @ | 12 0.047 10.055 c* | 0.68 0.0% 10.047 D0 | 037 0.01$ | 0.021 F | 0.086 9.003 | 0.006 G | 1.76 0.070 | 0.080 4] 0.45 0.018) 0.024 ]) 010 9.004 | 0.010 c | 2.10 0.083] 0.104 mM | 0.45 9.0191 0.027 N | 0.69 0.035 | 0.040 SIDE VIEW LOW PROFILE OPTION: Outline 23 (SOT-23) Package Characteristics Lead Material ..0.........cecccessscsssssecessssscersetenesesccssseerssssnssentaeeesaees Alloy 42 Lead Finish .............c:.ccc.ccccsssscessssserteersssnasenseneesascsessaseseenessess Tin-Lead Maximum Soldering Temperature ................:000 260C for 5 seconds Min. Lead Strength ... eset tasernesteccesseeieerserseeereeeee POUNGS pull Typical Package Inductance . beseaessessevapersacsaessaceeesstssenevseccuersrsensnense 2nH Typical Package Capacitance .............sccccsse 0.15 pF (opposite leads) 11 WITH C MIN/MAX OF 0.86/1.02 MILLIMETERS, 0.0330.061 INCHES; WITH K MIN/MAX OF 0.013/0. 10 MILLIME TERS, .00850.004 INCHES:Ordering Information Standard Profile Option T30 = Bulk Option T31 = Tape and Reel, See Figure 17 Option T32 = Tape and Reel, See Figure 18 Low Profile Option L30 = Bulk Option L31 = Tape and Reel, See Figure 17 Option L32 = Tape and Reel, See Figure 18 Conforms to Electronic Industries RS-481, "Taping of Surface Mounted Components for Automated Placement. Standard Quantity is 3,000 Devices/Reel. USER DIRECTION OF FEED GF HEWLETT PACKARD Specify Part Number followed by Option Number Example: H SMP-X8XX Option X XX Bulk or Tape and Reel Option Profile: Standard = T, or Low = L Part Number Surface Mount PIN HP TOP VIEW END viEW ton d 0 O | Figure 17. Options T31, L31. Figure 18. Options T32, L332. 12 For more information: United States: call your local HP sales office listed In your telephone directory. Aak for a Components representative. Canada: (416) 206-4725 Eurnpe: (49) 7031/14-0 Asia Pacific/Australia: (65) 290-6960 Japan: (81 3) 3331-6111 Data Subject to Change Copyright 1993 Hewlett-Packard Co. Obsoletes 6091-6211E (1/93) Printed in U.S.A. 5091-9184E (9/93)