Not to scale
TO-92
3-Pin
DSBGA
8-Pin
SOIC
8-Pin
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3
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
SNVS754K –JANUARY 2000–REVISED DECEMBER 2016
LM78Lxx 100-mA Fixed Output Linear Regulator
1
1 Features
1• Input Voltage up to 30 V
• Output Voltage Tolerances of ±5% Over the
Temperature Range
• Available Output Voltages: 5 V, 6.2 V, 8.2 V, 9 V,
12 V, and 15 V
• Output Current of 100 mA
• Output Transistor Safe Area Protection
• Internal Thermal Overload Protection
• Internal Short-Circuit Current Limit
• No External Components
• Available in Tiny DSBGA Package
• Available in 3-Pin TO-92 and 8-Pin SOIC Low
Profile Packages
2 Applications
• Battery Chargers
• Portable Instrumentation
• LED Lighting
• Low Wattage Power Supplies
Package Options
3 Description
The LM78Lxx series of three terminal positive
regulators is available with several fixed output
voltages, making them useful in a wide range of
applications. Used as a Zener-diode and resistor
combination replacement, the LM78Lxx usually
provides an effective output impedance improvement
of two orders of magnitude and lower quiescent
current. These regulators can provide local, on-card
regulation, eliminating distribution problems
associated with single-point regulation. The available
voltages allow the LM78Lxx to be used in logic
systems, instrumentation, HiFi, and other solid-state
electronic equipment.
The LM78Lxx is available in the plastic TO-92 (LP)
package, the SOIC (D) package, and a chip-sized
package (8-Bump DSBGA) using TI's DSBGA
package technology. With adequate heat sinking, the
regulator can deliver 100-mA output current. Current
limiting is included to limit the peak output current to
a safe value. Safe area protection for the output
transistors is provided to limit internal power
dissipation. If internal power dissipation is too high for
the heat sinking provided, the thermal shutdown
circuit prevents the IC from overheating.
See AN-1112 DSBGA Wafer Level Chip Scale
Package (SNVA009) for DSBGA Considerations. For
more information on the TO-92 package, see TO-92
Packing Options / Ordering Instructions (SNOA072).
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM78L05, LM78L09 DSBGA (8) 1.30 mm × 1.30 mm
LM78L05, LM78L12,
LM78L15 SOIC (8) 3.90 mm × 4.90 mm
LM78L05, LM78L12,
LM78L15, LM78L62 TO-92 (3) 3.70 mm × 4.70 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Fixed Output Regulator Circuit
2
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics — LM78L05...................... 5
6.6 Electrical Characteristics — LM78L09...................... 5
6.7 Electrical Characteristics — LM78L12...................... 6
6.8 Electrical Characteristics — LM78L15...................... 6
6.9 Electrical Characteristics — LM78L62...................... 7
6.10 Typical Characteristics............................................ 8
7 Detailed Description............................................ 10
7.1 Overview................................................................. 10
7.2 Functional Block Diagram....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 11
8 Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Applications ................................................ 12
9 Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
11 Device and Documentation Support................. 17
11.1 Documentation Support ........................................ 17
11.2 Related Links ........................................................ 17
11.3 Receiving Notification of Documentation Updates 17
11.4 Community Resources.......................................... 17
11.5 Trademarks........................................................... 17
11.6 Electrostatic Discharge Caution............................ 17
11.7 Glossary................................................................ 17
12 Mechanical, Packaging, and Orderable
Information........................................................... 18
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision J (December 2013) to Revision K Page
• Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table,
Recommended Operating Conditions table, Detailed Description section, Application and Implementation section,
Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section.................................................................................................. 1
• Deleted LM78L82 from the data sheet................................................................................................................................... 1
• Added Thermal Information table........................................................................................................................................... 1
• Deleted Lead temperature (soldering) information................................................................................................................. 4
• Changed RθJA values for D (SOIC) From: 180 To: 128.8, LP (TO-92) from 230 to 158.7, and YPB (DSBGA) From:
230.9 To 108.4 ....................................................................................................................................................................... 4
• Changed RθJC values for LP (TO-92) From: 60 To 75.2......................................................................................................... 4
Changes from Revision I (April 2013) to Revision J Page
• Added the AI suffix ................................................................................................................................................................. 5
1 VOUT
2 GND
3 VIN
Not to scale
A B C
3
2
1
Not to scale
VOUT NC GND
VOUT GND
VIN VIN NC
1VOUT 8 VIN
2GND 7 GND
3GND 6 GND
4NC 5 NC
Not to scale
3
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,
LM78L09
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,
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,
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5 Pin Configuration and Functions
YPB Package
8-Pin DSBGA
Top View
D Package
8-Pin SOIC
Top View
LP Package
3-Pin TO-92
Bottom View
Pin Functions
PIN I/O DESCRIPTION
NAME DSBGA SOIC TO-92
GND C2, C3 2, 3, 6, 7 2 — Ground
NC B3, C1 4, 5 — — No connection
VIN A1, B1 8 3 I Input supply voltage pin
VOUT A2, A3 1 1 O Output voltage pin
4
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage 35 V
Power dissipation Internally limited
Operating junction temperature, TJ
LM78LxxACZ (TO-92) 0 125
°C
LM78LxxACM (SOIC) 0 125
LM78LxxAIM (SOIC) –40 125
LM78LxxITP (thin DSBGA) –40 85
Storage temperature, Tstg –65 150 °C
(1) Human body model, 1.5 kΩin series with 100 pF.
6.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM),(1) ±1000 V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT
Input voltage 30 V
Continuous output current 100 mA
TJJunction temperature
LM78LxxACZ (TO-92) 0 125
°C
LM78LxxACM (SOIC) 0 125
LM78LxxAIM (SOIC) –40 125
LM78LxxITP (DSBGA) –40 85
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC(1) LM78Lxx
UNITD (SOIC) LP (TO-92) YPB (DSBGA)
8 PINS 3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 128.8 158.7 108.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 76 75.2 1.3 °C/W
RθJB Junction-to-board thermal resistance 69.3 n/a 31.4 °C/W
ψJT Junction-to-top characterization parameter 26.3 30.2 4.5 °C/W
ψJB Junction-to-board characterization parameter 68.8 138.2 31.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — — °C/W
5
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
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(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation ≤0.75 W.
(4) Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.
6.5 Electrical Characteristics — LM78L05
Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the
package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 10 V (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage TJ= 25°C 4.8 5 5.2 VVIN = 7 V to 20 V, IO= 1 mA to 40 mA(3) 4.75 5.25
IO= 1 mA to 70 mA(3) 4.75 5.25
ΔVO
Line regulation VIN = 7 V to 20 V, TJ= 25°C 18 75
mV
VIN = 8 V to 20 V, TJ= 25°C 10 54
Load regulation IO= 1 mA to 100 mA, TJ= 25°C 20 60
IO= 1 mA to 40 mA, TJ= 25°C 5 30
IQQuiescent current TJ= 25°C 3 5 mA
ΔIQQuiescent current change VIN = 8 V to 20 V 1 mA
IO= 1 mA to 40 mA 0.1
VnOutput noise voltage f = 10 Hz to 100 kHz(4) 40 µV
ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 8 V to 16 V, TJ= 25°C 47 62 dB
IPK Peak output current 140 mA
ΔVO/ΔTAverage output voltage temperature
coefficient IO= 5 mA –0.65 mV/°C
VIN(MIN) Minimum value of input voltage
required to maintain line regulation TJ= 25°C 6.7 7 V
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation ≤0.75 W.
6.6 Electrical Characteristics — LM78L09
Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the
package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 15 V (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage TJ= 25°C 8.64 9 9.36 VVIN = 11.5 V to 24 V, IO= 1 mA to 40 mA(3) 8.55 9.45
IO= 1 mA to 70 mA(3) 8.55 9.45
ΔVO
Line regulation VIN = 11.5 V to 24 V, TJ= 25°C 100 200
mV
VIN = 13 V to 24 V, TJ= 25°C 90 150
Load regulation IO= 1 mA to 100 mA, TJ= 25°C 20 90
IO= 1 mA to 40 mA, TJ= 25°C 10 45
IQQuiescent current TJ= 25°C 2 5.5 mA
ΔIQQuiescent current change VIN = 11.5 V to 24 V 1.5 mA
IO= 1 mA to 40 mA 0.1
VnOutput noise voltage 70 µV
ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ= 25°C 38 44 dB
IPK Peak output current 140 mA
ΔVO/ΔTAverage output voltage temperature
coefficient IO= 5 mA –0.9 mV/°C
VIN(MIN) Minimum value of input voltage
required to maintain line regulation 10.7 V
6
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation ≤0.75 W.
6.7 Electrical Characteristics — LM78L12
Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the
package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 19 V (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage TJ= 25°C 11.5 12 12.5 VVIN = 14.5 V to 27 V, IO= 1 mA to 40 mA(3) 11.4 12.6
IO= 1 mA to 70 mA(3) 11.4 12.6
ΔVO
Line regulation VIN = 14.5 V to 27 V, TJ= 25°C 30 180
mV
VIN = 16 V to 27 V, TJ= 25°C 20 110
Load regulation IO= 1 mA to 100 mA, TJ= 25°C 30 100
IO= 1 mA to 40 mA, TJ= 25°C 10 50
IQQuiescent current TJ= 25°C 3 5 mA
ΔIQQuiescent current change VIN = 16 V to 27 V 1 mA
IO= 1 mA to 40 mA 0.1
VnOutput noise voltage 80 µV
ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ= 25°C 40 54 dB
IPK Peak output current 140 mA
ΔVO/ΔTAverage output voltage temperature
coefficient IO= 5 mA –1 mV/°C
VIN(MIN) Minimum value of input voltage
required to maintain line regulation TJ= 25°C 13.7 14.5 V
(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation ≤0.75 W.
6.8 Electrical Characteristics — LM78L15
Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the
package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 23 V (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage TJ= 25°C 14.4 15 15.6 VVIN = 17.5 V to 30 V, IO= 1 mA to 40 mA(3) 14.25 15.75
IO= 1 mA to 70 mA(3) 14.25 15.75
ΔVO
Line regulation VIN = 17.5 V to 30 V, TJ= 25°C 37 250
mV
VIN = 20 V to 30 V, TJ= 25°C 25 140
Load regulation IO= 1 mA to 100 mA, TJ= 25°C 35 150
IO= 1 mA to 40 mA, TJ= 25°C 12 75
IQQuiescent current TJ= 25°C 3 5 mA
ΔIQQuiescent current change VIN =20 V to 30 V 1 mA
IO= 1 mA to 40 mA 0.1
VnOutput noise voltage 90 µV
ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 18.5 V to 28.5 V, TJ= 25°C 37 51 dB
IPK Peak output current 140 mA
ΔVO/ΔTAverage output voltage temperature
coefficient IO= 5 mA –1.3 mV/°C
VIN(MIN) Minimum value of input voltage
required to maintain line regulation TJ= 25°C 16.7 17.5 V
7
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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(1) For the operating ranges of each package, see Absolute Maximum Ratings.
(2) Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
(3) Power dissipation ≤0.75 W.
(4) Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.
6.9 Electrical Characteristics — LM78L62
Typical values apply for TJ= 25°C, Minimum and Maximum limits apply for the entire operating temperature range of the
package(1)(2), IO= 40 mA, CI= 0.33 µF, CO= 0.1 µF, VIN = 12 V (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOOutput voltage TJ= 25°C 5.95 6.2 6.45 VVIN = 8.5 V to 20 V, IO= 1 mA to 40 mA(3) 5.9 6.5
IO= 1 mA to 70 mA(3) 5.9 6.5
ΔVO
Line regulation VIN = 8.5 V to 20 V, TJ= 25°C 65 175
mV
VIN = 9 V to 20 V, TJ= 25°C 55 125
Load regulation IO= 1 mA to 100 mA, TJ= 25°C 13 80
IO= 1 mA to 40 mA, TJ= 25°C 6 40
IQQuiescent current TJ= 25°C 2 5.5 mA
ΔIQQuiescent current change VIN = 8 V to 20 V 1.5 mA
IO= 1 mA to 40 mA 0.1
VnOutput noise voltage f = 10 Hz to 100 kHz(4) 50 µV
ΔVIN/ΔVORipple rejection f = 120 Hz, VIN = 10 V to 20 V, TJ= 25°C 40 46 dB
IPK Peak output current 140 mA
ΔVO/ΔTAverage output voltage temperature
coefficient IO= 5 mA –0.75 mV/°C
VIN(MIN) Minimum value of input voltage
required to maintain line regulation 7.9 V
8
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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6.10 Typical Characteristics
LP Package
Figure 1. Maximum Average Power Dissipation Figure 2. Peak Output Current
Figure 3. Dropout Voltage Figure 4. Ripple Rejection
Figure 5. Output Impedance Figure 6. Quiescent Current
9
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,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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Typical Characteristics (continued)
Figure 7. Quiescent Current
10
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,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
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7 Detailed Description
7.1 Overview
The LM78Lxx series of positive regulators is available in the following fixed output voltages: 5 V, 6.2 V, 8.2 V, 9
V, 12 V, and 15 V. The regulator can be configured to an adjustable output by connecting the GND pin to the
center of a resistive voltage divider as shown in Figure 10. In this configuration, the fixed output voltage acts as
the reference voltage across R1 allowing the output to be adjusted by changing the resistor.
7.2 Functional Block Diagram
11
LM78L05
,
LM78L09
LM78L12
,
LM78L15
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7.3 Feature Description
7.3.1 Load Regulation
These devices regulate the voltage between the VOUT and GND pins, and can be made adjustable by using a
resistive voltage divider. The output voltage tolerance is ±5% over temperature.
7.3.2 Protection
The LM78Lxx series of regulators has internal thermal overload protection that automatically shuts off the device
if the operating temperature becomes too high. There is also internal short-circuit current limit and output
transistor safe area protection that shuts down the device if the output current becomes too high.
7.4 Device Functional Modes
7.4.1 Normal Operation
The VOUT pin sources current necessary to set the voltage on VOUT at a fixed voltage above the GND pin. See
Specifications for VOof each device.
7.4.2 Shutdown
The device automatically shuts down if the output current or its internal temperature becomes too high.
12
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,
LM78L09
LM78L12
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LM78L15
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
These devices are versatile and high-performance regulators with a wide temperature range and tight line and
load regulation. An input capacitor is required if the regulator is placed more than 3 inches from the power supply
filter. TI recommends a minimum load capacitance of 0.01 µF to limit high frequency.
8.2 Typical Applications
8.2.1 Fixed Output Regulator
*Required if the regulator is located more than 3 inches from the power supply filter.
**Recommended minimum load capacitance of 0.01 µF to limit high-frequency noise.
Figure 8. Fixed Output Regulator Circuit
8.2.1.1 Design Requirements
The device component count is very minimal. No external components are usually required. However, TI
recommends input or output capacitors depending on the distance between the device and the power supply and
if extra filtering is needed at the output.
The output voltage is set based on the selection of the two resistors (R1 and R2), as shown in Figure 14.
8.2.1.2 Detailed Design Procedure
8.2.1.2.1 Input Capacitor
An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. A 0.33-µF
capacitor on the input is suitable for most applications.
8.2.1.2.2 Output Capacitor
TI recommends a minimum load capacitance of 0.01 µF to limit high-frequency noise.
13
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Typical Applications (continued)
8.2.1.3 Application Curve
Figure 9. LM78Lxx Dropout
8.2.2 Other Application Circuits
Figure 10 to Figure 14 show application circuit examples using the LM78Lxx devices. Customers must fully
validate and test these circuits before implementing a design based on these examples. Unless otherwise noted,
the design procedures in Fixed Output Regulator are applicable to these designs.
VO= 5 V + (5 V / R1 + IQ) × R2*
* The 5 V represents the fixed output voltage of the LM78L05. If using one of the other LM78Lxx devices, use that
fixed output voltage value when calculating VO.
IQ< 5 V / (3 × R1)
Load regulation (LR) of LM78L05 ≈(R1 + R2) / R1
Figure 10. Adjustable Output Regulator Circuit
14
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,
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LM78L12
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LM78L15
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Typical Applications (continued)
IOUT = (VO/ R1) + IQ
IQ= 1.5 mA over line and load changes
Figure 11. Current Regulator Circuit
*Solid tantalum
**Heat sink Q1
***Optional: Improves ripple rejection and transient response.
Load Regulation = 0.6%, IL= 0 mA to 250 mA pulsed with tON = 50 ms.
Figure 12. 5-V, 500-mA Regulator With Short-Circuit Protection Circuit
15
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Typical Applications (continued)
*Solid tantalum
Figure 13. ±15-V, 100-mA Dual Power Supply Circuit
*Solid tantalum
VO= VG+ 5 V, R1 = (–VIN / IQ(LM78L05))
VO= 5 V (R2 / R4) for (R2 + R3) = (R4 + R5)
A 0.5-V output will correspond to (R2 / R4) = 0.1, (R3 / R4) = 0.9
Figure 14. Variable Output Regulator Circuit (0.5 V to 18 V)
C1
U1
C2
VOUT
VIN
GND
16
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,
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LM78L15
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9 Power Supply Recommendations
The linear regulator input supply must be well regulated and kept at a voltage level to not exceed the maximum
input to output voltage differential allowed by the device. The minimum dropout voltage (VIN – VO) must be met
with extra headroom when possible to keep the output well regulated. A 0.33-µF or higher capacitor must be
placed at the input to bypass noise.
10 Layout
10.1 Layout Guidelines
For the best overall performance, some layout guidelines may be disregarded. Place all circuit components on
the same side of the circuit board and as near as practical to the respective linear regulator pins. Traces must be
kept short and wide to reduce the amount of parasitic elements in the system. The actual width and thickness of
traces depends on the current carrying capability and heat dissipation required by the end system.
10.2 Layout Example
Figure 15. LM78Lxx Example Circuit Layout
17
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
www.ti.com
SNVS754K –JANUARY 2000–REVISED DECEMBER 2016
Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62
Submit Documentation FeedbackCopyright © 2000–2016, Texas Instruments Incorporated
11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
For related documentation see the following:
•AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009)
•TO-92 Packing Options / Ordering Instructions (SNOA072).
11.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL
DOCUMENTS TOOLS &
SOFTWARE SUPPORT &
COMMUNITY
LM78L05 Click here Click here Click here Click here Click here
LM78L09 Click here Click here Click here Click here Click here
LM78L12 Click here Click here Click here Click here Click here
LM78L15 Click here Click here Click here Click here Click here
LM78L62 Click here Click here Click here Click here Click here
11.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.6 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.7 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
18
LM78L05
,
LM78L09
LM78L12
,
LM78L15
,
LM78L62
SNVS754K –JANUARY 2000–REVISED DECEMBER 2016
www.ti.com
Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62
Submit Documentation Feedback Copyright © 2000–2016, Texas Instruments Incorporated
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.