ASMT-UWB1-Nxxxx Data Sheet OneWhite Surface-Mount PLCC-2 LED Indicator
Broadcom AV02-2936EN
10
Precautionary Notes
Handling Precautions
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant that is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Refer to Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions, for more information.
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and induce failures to the LED die or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of the silicone material attracts dust and
dirt easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting much
pressure on the silicone. Utrasonic cleaning is not
recommended.
For automated pick and place, Broadcom has tested
the following nozzle size to work well with this LED.
However, due to the possibility of variations in other
parameters, such as pick and place, machine maker/
model and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
Handling Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Before use
– An unopened moisture barrier bag (MBB) can be
stored at < 40°C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, it is safe to reflow the LEDs per the original
MSL rating.
– Do not open the MBB prior to assembly (for
example, for IQC).
Control after opening the MBB:
– Read the HIC immediately upon opening the MBB.
– Keep the LEDs at < 30°C / 60% RH at all times and
all high temperature-related processes, including
soldering, curing, or rework, must be completed
within 168 hours.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or
desiccator at <5% RH.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at <5% RH to
ensure that all LEDs have not exceeded their floor life of
168 hours.
Baking is required if the following conditions exist:
– The HIC indicator is not BROWN at 10% and is
AZURE at 5%.
– The LEDs are exposed to condition of > 30°C / 60%
RH at any time.
– The LED floor life exceeded 168 hours.
The recommended baking condition is: 60°C ± 5ºC for
20 hours.
Baking should only be done once.
Storage:
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed in an ambient
environment for too long, the silver plating might be
oxidized, thus affecting its solderability performance. As
such, keep unused LEDs in a sealed MBB with
desiccant or in desiccator at <5% RH.