CREAT BY ART
- Glass passivated junction chip
- Ideal for automated placement
- Super fast recovery time for high efficiency
- Built-in strain rellef
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - Green compound (halogen-free)
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
V
RRM
50 100 150 200 300 400 500 600 V
V
RMS
35 70 105 140 210 280 350 420 V
V
DC
50 100 150 200 300 400 500 600 V
I
F(AV)
A
Trr ns
Cj pF
T
JO
C
T
STG O
C
Document Number: DS_D1405052 Version:J14
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
MECHANICAL DATA
Case: DO-214AC (SMA) DO-214AC (SMA)
ES1A thru ES1J
Taiwan Semiconductor
Surface Mount Su
er Fast Rectifiers
FEATURES
- Moisture sensitivity level: level 1, per J-STD-020
Polarity: Indicated by cathode band
Weight: 0.06 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL ES
1A
ES
1B
ES
1C
ES
1D
ES
1F
ES
1G
ES
1H
ES
1J UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
18
O
C/W
Maximum DC blocking voltage
Maximum average forward rectified current 1
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
30
Maximum reverse current @ rated VR T
J
=25 ℃
T
J
=100℃I
R
A
Maximum instantaneous forward voltage (Note 1)
@ 1 A V
F
V
35
Operating junction temperature range
Storage temperature range - 55 to +150
- 55 to +150
Typical junction capacitance (Note 3)
Typical thermal resistance R
θJL
R
θJA
35
85
16
μA
Note 2: Reverse Recovery Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied V
R
=4.0 Volts
Note 1: Pulse test with PW=300μs, 1% duty cycle
0.95 1.3 1.7
5
100
Maximum reverse recovery time (Note 2)