Data Sheet
October 1, 2009
Austin MicrolynxTM II 12V SMT Non-isolated Power Modules:
8.3Vdc – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
CSA is a registered trademark of Canadian Standards Association.
VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS03-108 ver.1.43
PDF name: microlynx_II_12v_smt_ds.pdf
EZ-SEQUENCETM
Applications
Distributed power architectures
Intermediate bus voltage applications
Telecommunications equipment
Servers and storage applications
Networking equipment
Enterprise Networks
Latest generation IC’s (DSP, FPGA, ASIC) and
Microprocessor powered applications
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
Flexible output voltage sequencing
EZ-SEQUENCETM
Delivers up to 6A output current
High efficiency – 89% at 3.3V full load (VIN =
12.0V)
Small size and low profile:
27.9 mm x 11.4 mm x 7.24 mm
(1.10 in x 0.45 in x 0.285 in)
Low output ripple and noise
High Reliability:
Calculated MTBF = 15.3M hours at 25oC Full-load
Output voltage programmable from 0.75 Vdc to
5.5Vdc via external resistor
Line Regulation: 0.3% (typical)
Load Regulation: 0.4% (typical)
Temperature Regulation: 0.4 % (typical)
Remote On/Off
Output overcurrent protection (non-latching)
Wide operating temperature range (-40°C to 85°C)
UL* 60950-1Recognized, CSA C22.2 No.
60950-1-03 Certified, and VDE 0805:2001-12
(EN60950-1) Licensed
ISO** 9001 and ISO 14001 certified manufacturing
facilities
Description
Austin MicroLynxTM II 12V SMT (surface mount technology) power modules are non-isolated DC-DC converters that
can deliver up to 6A of output current with full load efficiency of 89% at 5.0V output. These modules provide
precisely regulated output voltage programmable via external resistor from 0.75Vdc to 5.5Vdc over a wide range of
input voltage (VIN = 8.3 - 14V). The Austin MicroLynxTM II 12V series has a sequencing feature, EZ-SEQUENCETM
that enable designers to implement various types of output voltage sequencing when powering multiple voltages on
a board.
RoHS Compliant
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are
absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in
excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for
extended periods can adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage All VIN -0.3 15 Vdc
Continuous
Sequencing voltage All Vseq -0.3 VIN,max Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage Vo,set 3.63 VIN 8.3 12 14 Vdc
Vo,set > 3.63 VIN 8.3 12 13.2 Vdc
Maximum Input Current All IIN,max 4.5 Adc
(VIN= VIN, min to VIN, max, IO=IO, max )
Input No Load Current VO,set = 0.75 Vdc IIN,No load 17 mA
(VIN = VIN, nom, Io = 0, module enabled) VO,set = 5.0Vdc IIN,No load 100 mA
Input Stand-by Current All IIN,stand-by 1.2 mA
(VIN = VIN, nom, module disabled)
Inrush Transient All I2t 0.4 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to
VIN, max, IO= IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 30 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being
part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to
achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-
acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in
this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be
used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Output Voltage Set-point All VO, set -2.0 VO, set +2.0 % VO, set
(VIN=VIN, min, IO=IO, max, TA=25°C)
Output Voltage All VO, set -2.5% +3.5% % VO, set
(Over all operating input voltage, resistive load,
and temperature conditions until end of life)
Adjustment Range All VO 0.7525 5.5 Vdc
Selected by an external resistor
Output Regulation
Line (VIN=VIN, min to VIN, max) All
0.3 % VO, set
Load (IO=IO, min to IO, max) All
0.4 % VO, set
Temperature (Tref=TA, min to TA, max) All
0.4 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom and IO=IO, min to IO, max
Cout = 1μF ceramic//10μFtantalum capacitors)
RMS (5Hz to 20MHz bandwidth) All 15 30 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All 30 75 mVpk-pk
External Capacitance
ESR 1 m All CO, max 1000 μF
ESR 10 m All CO, max 3000 μF
Output Current All Io 0 6 Adc
Output Current Limit Inception (Hiccup Mode ) All IO, lim 200 % Io
(VO= 90% of VO, set)
Output Short-Circuit Current All IO, s/c 2 Adc
(VO250mV) ( Hiccup Mode )
Efficiency VO, set = 1.2Vdc η 80.0 %
VIN= VIN, nom, TA=25°C VO,set = 1.5Vdc η 83.0 %
IO=IO, max , VO= VO,set V
O,set = 1.8Vdc η 83.5 %
V
O,set = 2.5Vdc η 86.5 %
V
O,set = 3.3Vdc η 89.0 %
V
O,set = 5.0Vdc η 91.0 %
Switching Frequency All fsw 300 kHz
Dynamic Load Response
(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk 200 mV
Load Change from Io= 50% to 100% of
Io,max; 1μF ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 25 μs
(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk 200 mV
Load Change from Io= 100% to 50%of Io,max:
1μF ceramic// 10 μF tantalum
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 25 μs
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 4
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Dynamic Load Response
(dIo/dt=2.5A/μs; V VIN = VIN, nom; TA=25°C) All Vpk 50 mV
Load Change from Io= 50% to 100% of Io,max;
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 50 μs
(dIo/dt=2.5A/μs; VIN = VIN, nom; TA=25°C) All Vpk 50 mV
Load Change from Io= 100% to 50%of Io,max:
Co = 2x150 μF polymer capacitors
Peak Deviation
Settling Time (Vo<10% peak deviation) All ts 50 μs
General Specifications
Parameter Min Typ Max Unit
Calculated MTBF (IO=IO, max, TA=25°C) 15,371,900 Hours
Telecordia SR-332 Issue 1: Method 1 Case 3
Weight 2.8 (0.1) g (oz.)
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 5
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
On/Off Signal interface
Device code with Suffix “4” – Positive logic
(On/Off is open collector/drain logic input;
Signal referenced to GND - See feature description
section)
Input High Voltage (Module ON) All VIH V
IN, max V
Input High Current All IIH 10 μA
Input Low Voltage (Module OFF) All VIL -0.2 0.3 V
Input Low Current All IIL 0.2 1 mA
Device Code with no suffix – Negative Logic
(On/OFF pin is open collector/drain logic input with
external pull-up resistor; signal referenced to GND)
Input High Voltage (Module OFF) All VIH 2.5 V
IN,max Vdc
Input High Current All IIH 0.2 1 mA
Input Low Voltage (Module ON) All VIL -0.2 0.3 Vdc
Input low Current All IIL 10 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN = VIN, nom, TA = 25 oC, )
Case 1: On/Off input is set to Logic Low (Module
ON) and then input power is applied (delay from
instant at which VIN =VIN, min until Vo=10% of Vo,set)
All Tdelay 3 msec
Case 2: Input power is applied for at least one second
and then the On/Off input is set to logic Low (delay from
instant at which Von/Off=0.3V until Vo=10% of Vo, set)
All Tdelay 3 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All Trise 4 6 msec
Output voltage overshoot – Startup 1 % VO, set
IO= IO, max; VIN =VIN, min to VIN, max, TA = 25 oC
Sequencing Delay time
Delay from VIN, min to application of voltage on SEQ pin All TsEQ-delay 10 msec
Tracking Accuracy (Power-Up: 2V/ms) All |VSEQ –Vo | 100 200 mV
(Power-Down: 1V/ms) All |VSEQ –Vo | 300 500 mV
(VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo)
Overtemperature Protection All Tref 140 °C
(See Thermal Consideration section)
Input Undervoltage Lockout
Turn-on Threshold All 7.9 V
Turn-off Threshold All 7.8 V
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 6
Characteristic Curves
The following figures provide typical characteristics for the Austin MicroLynxTM II 12V SMT modules at 25ºC.
72
74
76
78
80
82
84
86
0 123456
VIN=8.3V
VIN=12V
VIN=14V
70
73
76
79
82
85
88
91
0123456
VIN=8.3V
VIN=12V
VIN=14V
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
Figure 1. Converter Efficiency versus Output Current
(Vout = 1.2Vdc).
Figure 4. Converter Efficiency versus Output Current
(Vout = 2.5Vdc).
74
76
78
80
82
84
86
88
0 123456
VIN=8.3
V
VIN=12V
VIN=14V
72
75
78
81
84
87
90
93
0 123456
VIN=8.3V
VIN=12V
VIN=14V
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
Figure 2. Converter Efficiency versus Output Current
(Vout = 1.5Vdc).
Figure 5. Converter Efficiency versus Output Current
(Vout = 3.3Vdc).
74
76
78
80
82
84
86
88
0 1234 56
VIN=8.3V
VIN=12V
VIN=14V
75
78
81
84
87
90
93
96
0 123456
VIN=8.3V
VIN=12V
VIN=14V
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
Figure 3. Converter Efficiency versus Output Current
(Vout = 1.8Vdc).
Figure 6. Converter Efficiency versus Output Current
(Vout = 5.0Vdc).
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 7
Characteristic Curves (continued)
The following figures provide typical characteristics for the MicroLynxTM II 12V SMT modules at 25ºC.
0
0.5
1
1. 5
2
2.5
3
3.5
4
4.5
7 8 91011121314
Io = 6A
Io=3A
Io=0A
INPUT CURRENT, IIN (A)
INPUT VOLTAGE, VIN
(
V
)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
TIME
,
t
(
5
μ
s/div
)
Figure 7. Input voltage vs. Input Current
(Vout = 3.3Vdc).
Figure 10. Transient Response to Dynamic Load
Change from 50% to 100% of full load (Vo = 3.3Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
TIME, t (2μs/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (100mV/div)
TIME, t (5 μs/div)
Figure 8. Typical Output Ripple and Noise
(Vin = 12V dc, Vo = 2.5 Vdc, Io=6A).
Figure 11. Transient Response to Dynamic Load
Change from 100% to 50% of full load (Vo = 3.3 Vdc).
OUTPUT VOLTAGE
VO (V) (10mV/div)
TIME, t (2μs/div)
OUTPUT CURRENT, OUTPUT VOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
TIME, t (10μs/div)
Figure 9. Typical Output Ripple and Noise
(Vin = 12.0V dc, Vo = 3.3 Vdc, Io=6A).
Figure 12. Transient Response to Dynamic Load
Change from 50% to 100% of full load (Vo = 5.0 Vdc,
Cext = 2x150 μF Polymer Capacitors).
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 8
Characteristic Curves (continued)
The following figures provide typical characteristics for the Austin MicroLynxTM II 12V SMT modules at 25ºC.
OUTPUT CURRENT OUTPUTVOLTAGE
IO (A) (2A/div) VO (V) (50mV/div)
TIME, t (10μs/div)
OUTPUT VOLTAGE, INPUT VOLTAGE
Vo (V) (2V/div) VIN (V) (5V/div)
TIME, t (1 ms/div)
Figure 13. Transient Response to Dynamic Load
Change from 100% of 50% full load (Vo = 5.0 Vdc, Cext
= 2x150
μ
F Pol
y
mer Ca
p
acitors
)
.
Figure 16. Typical Start-Up with application of Vin with
(Vin = 12Vdc, Vo = 3.3Vdc, Io = 6A).
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (2V/div) VOn/off (V) (5V/div)
TIME, t (1 ms/div)
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (1V/div) VOn/off (V) (2V/div)
TIME, t (1 ms/div)
Figure 14. Typical Start-Up Using Remote On/Off
(Vin = 12Vdc, Vo = 3.3Vdc, Io = 6.0A).
Figure 17 Typical Start-Up using Remote On/off with
Prebias (Vin = 12Vdc, Vo = 1.8Vdc, Io = 1A, Vbias =1.0
Vdc).
OUTPUT VOLTAGE On/Off VOLTAGE
VOV) (1V/div) VOn/off (V) (2V/div)
TIME, t (1 ms/div)
OUTPUT CURRENT,
IO (A) (5A/div)
TIME, t (20ms/div)
Figure 15. Typical Start-Up Using Remote On/Off with
Low-ESR external capacitors (7x150uF Polymer)
Vin = 12Vdc
Vo = 3.3Vdc
Io = 6.0A
Co = 1050
μ
F
)
.
Figure 18. Output short circuit Current (Vin = 12Vdc,
Vo = 0.75Vdc).
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 9
Characteristic Curves (continued)
The following figures provide thermal derating curves for the Austin MicroLynxTM II 12V SMT modules.
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0 .5m/ s ( 100 LFM )
1.5m/s (300 LFM)
2.0m/s (400 LFM)
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0 .5m/ s ( 10 0 LFM )
1.5m/s (300 LFM)
2.0m/s (400 LFM)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 19. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 12Vdc,
Vo=0.75Vdc).
Figure 22. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 12Vdc,
Vo=3.3 Vdc).
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
1.5m/ s (3 0 0 LFM )
2.0m/s (400 LFM ) 0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
1.5m/s (300 LFM)
2.0m/s (400 LFM)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, TA OC
Figure 20. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 12Vdc,
Vo=1.8 Vdc).
Figure 23. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 12Vdc,
Vo=5.0 Vdc).
0
1
2
3
4
5
6
7
20 30 40 50 60 70 80 90
NC
1.0m/s (200 LFM)
0.5m/s (100 LFM)
1.5m/s (300 LFM)
2.0m/s (400 LFM)
OUTPUT CURRENT, Io (A)
AMBIENT TEMPERATURE, T
A
O
C
Figure 21. Derating Output Current versus Local
Ambient Temperature and Airflow (Vin = 12Vdc,
Vo=2.5 Vdc).
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 10
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTEST
1μH
BATTERY
CS 1000μF
Electrolytic
E.S.R.<0.1Ω
@ 20°C 100kHz
2x100μF
Tantalum
VIN(+)
COM
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 1μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
CIN
Figure 24. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
COM
1uF .
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
Figure 25. Output Ripple and Noise Test Setup.
VO
COM
VIN(+)
COM
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 26. Output Voltage and Efficiency Test Setup.
η =
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Filtering
The Austin MicroLynxTM II 12V SMT module should
be connected to a low-impedance source. A highly
inductive source can affect the stability of the module.
An input capacitance must be placed directly adjacent
to the input pin of the module, to minimize input ripple
voltage and ensure module stability.
In a typical application, 2x47 µF low-ESR tantalum
capacitors (AVX part #: TPSE476M025R0100, 47µF
25V 100 m ESR tantalum capacitor) will be sufficient
to provide adequate ripple voltage at the input of the
module. To minimize ripple voltage at the input, low
ESR ceramic capacitors are recommended at the input
of the module. Figure 27 shows input ripple voltage
(mVp-p) for various outputs with 2x47 µF tantalum
capacitors and with 2x 22 µF ceramic capacitor (TDK
part #: C4532X5R1C226M) at full load.
Input Ripple Voltage (mVp-p)
0
50
10 0
15 0
200
250
300
350
0 123456
Ceramic
Tant al um
Output Voltage (Vdc)
Figure 27. Input ripple voltage for various output
with 2x47 µF tantalum capacitors and with 2x22 µF
ceramic capacitors at the input (80% of Io,max).
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 11
Design Considerations (continued)
Output Filtering
The Austin MicroLynxTM II 12V module is designed for low
output ripple voltage and will meet the maximum output
ripple specification with 1 µF ceramic and 10 µF polymer
capacitors at the output of the module. However,
additional output filtering may be required by the system
designer for a number of reasons. First, there may be a
need to further reduce the output ripple and noise of the
module. Second, the dynamic response characteristics
may need to be customized to a particular load step
change.
To reduce the output ripple and improve the dynamic
response to a step load change, additional capacitance at
the output can be used. Low ESR polymer and ceramic
capacitors are recommended to improve the dynamic
response of the module. For stable operation of the
module, limit the capacitance to less than the maximum
output capacitance as specified in the electrical
specification table.
Safety Considerations
For safety agency approval the power module must be
installed in compliance with the spacing and separation
requirements of the end-use safety agency standards,
i.e., UL 60950-1, CSA C22.2 No. 60950-1-03, and VDE
0850:2001-12 (EN60950-1) Licensed.
For the converter output to be considered meeting the
requirements of safety extra-low voltage (SELV), the
input must meet SELV requirements. The power module
has extra-low voltage (ELV) outputs when all inputs are
ELV.
The input to these units is to be provided with a fast-
acting fuse with a maximum rating of 6A in the positive
input lead.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 12
Feature Description
Remote On/Off
Austin MicroLynxTM II 12V SMT power modules feature
an On/Off pin for remote On/Off operation. Two On/Off
logic options are available in the Austin MicroLynxTM II
12V series modules. Positive Logic On/Off signal, device
code suffix “4”, turns the module ON during a logic High
on the On/Off pin and turns the module OFF during a
logic Low. Negative logic On/Off signal, no device code
suffix, turns the module OFF during logic High and turns
the module ON during logic Low.
For positive logic modules, the circuit configuration for
using the On/Off pin is shown in Figure 28. The On/Off
pin is an open collector/drain logic input signal (Von/Off)
that is referenced to ground. During a logic-high (On/Off
pin is pulled high internal to the module) when the
transistor Q1 is in the Off state, the power module is ON.
Maximum allowable leakage current of the transistor
when Von/off = VIN,max is 10µA. Applying a logic-low
when the transistor Q1 is turned-On, the power module is
OFF. During this state VOn/Off must be less than 0.3V.
When not using positive logic On/off pin, leave the pin
unconnected or tie to VIN.
Q1
R2
R1
Q2
R3
R4
Q3 CSS
GND
VIN+
ON/OFF
PWM Enable
+
_
ON/OFF
V
ION/OFF
MODULE
Figure 28. Circuit configuration for using positive
logic On/OFF.
For negative logic On/Off devices, the circuit
configuration is shown is Figure 29. The On/Off pin is
pulled high with an external pull-up resistor (typical Rpull-up
= 68k, +/- 5%). When transistor Q1 is in the Off state,
logic High is applied to the On/Off pin and the power
module is Off. The minimum On/off voltage for logic High
on the On/Off pin is 2.5 Vdc. To turn the module ON,
logic Low is applied to the On/Off pin by turning ON Q1.
When not using the negative logic On/Off, leave the pin
unconnected or tie to GND.
Q1
R1
R2
Q2 CSS
GND
PWM Enable
ON/OFF
VIN+
ON/OFF
_
+
V
I
MODULE
pull-up
R
ON/OFF
Figure 29. Circuit configuration for using negative
logic On/OFF.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current limiting
continuously. At the point of current-limit inception, the
unit enters hiccup mode. The unit operates normally once
the output current is brought back into its specified range.
The typical average output current during hiccup is 2A.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, module operation is disabled. The module will begin
to operate at an input voltage above the undervoltage
lockout turn-on threshold.
Overtemperature Protection
To provide over temperature protection in a fault
condition, the unit relies upon the thermal protection
feature of the controller IC. The unit will shutdown if the
thermal reference point Tref2, (see Figure 33) exceeds
140oC (typical), but the thermal shutdown is not intended
as a guarantee that the unit will survive temperatures
beyond its rating. The module will automatically restarts
after it cools down.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 13
Feature Descriptions (continued)
Output Voltage Programming
The output voltage of the Austin MicroLynxTM II 12V can
be programmed to any voltage from 0.75Vdc to 5.5Vdc
by connecting a resistor (shown as Rtrim in Figure 30)
between Trim and GND pins of the module. Without an
external resistor between Trim and GND pins, the output
of the module will be 0.7525Vdc. To calculate the value
of the trim resistor, Rtrim for a desired output voltage, use
the following equation:
Ω
=1000
7525.0
10500
Vo
Rtrim
Rtrim is the external resistor in
Vo is the desired output voltage
For example, to program the output voltage of the Austin
MicroLynxTM 12V module to 1.8V, Rtrim is calculated as
follows:
=1000
7525.08.1
10500
Rtrim
Ω= kRtrim 024.9
V
O
(+)
TRIM
GND
R
trim
LOAD
V
IN
(+)
ON/OFF
Figure 30. Circuit configuration to program output
voltage using an external resistor
Table 1 provides Rtrim values for most common
output voltages.
Table 1
VO, set (V) Rtrim (K)
0.7525 Open
1.2 22.46
1.5 13.05
1.8 9.024
2.5 5.009
3.3 3.122
5.0 1.472
Using 1% tolerance trim resistor, set point tolerance of
±2% is achieved as specified in the electrical
specification. The POL Programming Tool, available at
www.lineagepower.com under the Design Tools
section, helps determine the required external trim
resistor needed for a specific output voltage.
The amount of power delivered by the module is
defined as the voltage at the output terminals multiplied
by the output current. When using the trim feature, the
output voltage of the module can be increased, which
at the same output current would increase the power
output of the module. Care should be taken to ensure
that the maximum output power of the module remains
at or below the maximum rated power (Pmax = Vo,set x
Io,max).
Voltage Margining
Output voltage margining can be implemented in the
Austin MicroLynxTM II modules by connecting a
resistor, Rmargin-up, from Trim pin to ground pin for
margining-up the output voltage and by connecting a
resistor, Rmargin-down, from Trim pin to Output pin.
Figure 31 shows the circuit configuration for output
voltage margining. The POL Programming Tool,
available at www.lineagepower.com under the Design
Tools section, also calculates the values of Rmargin-up
and Rmargin-down for a specific output voltage and %
margin. Please consult your local Lineage Power
technical representative for additional details
Vo
Austin Lynx or
Lynx II Series
GND
Trim
Q1
Rtrim
Rmargin-up
Q2
Rmargin-down
Figure 31. Circuit Configuration for margining
Output voltage.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 14
Feature Descriptions (continued)
Voltage Sequencing
Austin MicroLynxTM II 12V series of modules include a
sequencing feature, EZ-SEQUENCETM that enables
users to implement various types of output voltage
sequencing in their applications. This is accomplished
via an additional sequencing pin. When not using the
sequencing feature, either tie the SEQ pin to VIN or leave
it unconnected.
When an analog voltage is applied to the SEQ pin, the
output voltage tracks this voltage until the output reaches
the set-point voltage. The SEQ voltage must be set
higher than the set-point voltage of the module. The
output voltage follows the voltage on the SEQ pin on a
one-to-one volt basis. By connecting multiple modules
together, customers can get multiple modules to track
their output voltages to the voltage applied on the SEQ
pin.
For proper voltage sequencing, first, input voltage is
applied to the module. The On/Off pin of the module is
left unconnected (or tied to GND for negative logic
modules or tied to VIN for positive logic modules) so that
the module is ON by default. After applying input voltage
to the module, a minimum of 10msec delay is required
before applying voltage on the SEQ pin. During this time,
potential of 50mV (± 10 mV) is maintained on the SEQ
pin. After 10msec delay, an analog voltage is applied to
the SEQ pin and the output voltage of the module will
track this voltage on a one-to-one volt bases until output
reaches the set-point voltage. To initiate simultaneous
shutdown of the modules, the SEQ pin voltage is lowered
in a controlled manner. Output voltage of the modules
tracks the voltages below their set-point voltages on a
one-to-one basis. A valid input voltage must be
maintained until the tracking and output voltages reach
ground potential to ensure a controlled shutdown of the
modules.
When using the EZ-SEQUENCETM feature to control
start-up of the module, pre-bias immunity feature during
start-up is disabled. The pre-bias immunity feature of the
module relies on the module being in the diode-mode
during start-up. When using the EZ-SEQUENCETM
feature, modules goes through an internal set-up time of
10msec, and will be in synchronous rectification mode
when voltage at the SEQ pin is applied. This will result in
sinking current in the module if pre-bias voltage is present
at the output of the module. When pre-bias immunity
during start-up is required, the EZ-SEQUENCETM feature
must be disabled. For additional guidelines on using EZ-
SEQUENCETM feature of Austin MicroLynxTM II 12V,
contact Lineage Power technical representative for
preliminary application note on output voltage sequencing
using Austin Lynx II series.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 15
Thermal Considerations
Power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of the
module will result in an increase in reliability. The thermal
data presented here is based on physical measurements
taken in a wind tunnel. The test set-up is shown in Figure
33. Note that the airflow is parallel to the long axis of the
module as shown in figure 32. The derating data applies
to airflow in either direction of the module’s long axis.
Air Flow
Tref2
Top View
Bottom View
Tref1 (inductor winding)
Figure 32. Tref Temperature measurement location.
The thermal reference point, Tref 1 used in the
specifications of thermal derating curves is shown in
Figure 32. For reliable operation this temperature should
not exceed 125oC.
The output power of the module should not exceed the
rated power of the module (Vo,set x Io,max).
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device temperatures.
Figure 33. Thermal Test Set-up.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Thermal derating curves
showing the maximum output current that can be
delivered by various module versus local ambient
temperature (TA) for natural convection and up to 1m/s
(200 ft./min) are shown in the Characteristics Curves
section.
A
ir
flow
x
Power Module
W
ind Tunnel
PWBs
7.24_
(0.285)
76.2_
(3.0)
Probe Location
for measuring
airflow and
ambient
temperature
25.4_
(1.0)
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 16
Mechanical Outline
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Top View
Side View
Bottom View
PIN FUNCTION
1 On/Off
2 VIN
3 SEQ
4 GND
5 Trim
6 VOUT
Co-planarity (max): 0.102 [0.004]
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 17
Recommended Pad Layout
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Surface Mount Pad Layout – Component side view.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 18
Packaging Details
The Austin MicroLynxTM II 12V SMT versions are supplied in tape & reel as standard. Modules are shipped in
quantities of 400 modules per reel.
All Dimensions are in millimeters and (in inches).
Reel Dimensions
Outside Dimensions: 330.2 mm (13.00)
Inside Dimensions: 177.8 mm (7.00”)
Width 44.0 mm (1.73”)
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 19
Surface Mount Information
Pick and Place
The Austin MicroLynxTM II 12V SMT modules use an
open frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and placing. The label meets all the
requirements for surface mount processing, as well as
safety standards and is able to withstand maximum
reflow temperature. The label also carries product
information such as product code, serial number and
location of manufacture.
Figure 34. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 8 mm max.
Tin Lead Soldering
The Austin MicroLynxTM II 12V SMT power modules
are lead free modules and can be soldered either in a
lead-free solder process or in a conventional Tin/Lead
(Sn/Pb) process. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board
assembly. The following instructions must be
observed when soldering these units. Failure to
observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Co o ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 35. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX TEMP SOLDER (°C)
200
205
210
215
220
225
230
235
240
0 102030405060
Figure 36. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 20
Surface Mount Information (continued)
Lead Free Soldering
The –Z version Austin MicroLynx II 12V SMT modules
are lead-free (Pb-free) and RoHS compliant and are
both forward and backward compatible in a Pb-free
and a SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure. 37.
MSL Rating
The Austin MicroLynx II 12V SMT modules have a
MSL rating of 3.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Per J-STD-020 Rev. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Peak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Seconds
Cooling
Zone
Figure 37. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Data Sheet
October 1, 2009
Austin MicroLynxTM II 12V SMT Non-isolated Power Modules:
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 6A output current
LINEAGE POWER 21
Document No: DS03-108 ver.1.43
PDF name: microlynx_II_12v_smt_ds.pdf
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 2. Device Codes
Device Code
Input
Voltage
Ran
g
e
Output
Voltage
Output
Current
Efficiency
3.3V@ 6A
Connector
Type Comcodes
ATA006A0X-SR 8.3 – 14Vdc 0.75 – 5.5Vdc 6 A 89.0% SMT 108988374
ATA006A0X-SRZ 8.3 14Vdc
0.75 – 5.5Vdc 6 A 89.0% SMT CC109104510
ATA006A0X4-SR 8.3 14Vdc
0.75 – 5.5Vdc 6 A 89.0% SMT 108988382
ATA006A0X4-SRZ 8.3 14Vdc
0.75 – 5.5Vdc 6 A 89.0% SMT 108996682
-Z refers to RoHS-compliant versions.
World Wide Headquarters
Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-244-9428)
www.lineagepower.com
e-mail: techsupport1@lineagepower.com
Asia-Pacific Headquarters
Tel: +65 6593 7211
Europe, Middle-East and Africa Headquarters
Tel: +49 898 780 672 80
India Headquarters
Tel: +91 80 28411633
Lineage Power reserves the right to make change s to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
a
pplication. No rights under any patent accompany the sale of any such product(s) or information.
Lineage Power DC-DC products are protected under various patents. Information on these patents is available at www.lineagepo wer.com/paten ts.
©
2009 Linea
g
e Power Cor
p
oration
,
(
Plano
,
Texas
)
All Inte rnational Ri
g
hts Reserved.