78 ICs
1-1-4 Linear Regulator ICs
■Features
•Compact surface-mount package (TO263-5)
•Output current: 3.0A
•Low dropout voltage: VDIF ≤ 0.6V (at IO = 3.0A)
•
Low circuit current at output OFF: Iq (OFF) ≤ 1
µ
A
•Built-in overcurrent and thermal protection
circuits
■Applications
•Secondary stabilized power supply (local
power supply)
■Absolute Maximum Ratings
Unit
V
V
A
W
°C
°C
°C
°C/W
°C/W
Ratings
10
6
3.0
3
–30 to +125
–30 to +85
–40 to +125
33.3
3
Symbol
VIN*1
VC
IO*1
PD*3
Tj
Top
Tstg
θ
j-a
θ
j-c
Parameter
DC Input Voltage
Output Control Terminal Voltage
DC Output Current
Power Dissipation
Junction Temperature
Operating Ambient Temperature
Storage Temperature
Thermal Resistance (Junction to Ambient Air)
Thermal Resistance (Junction to Case)
(Ta=25°C)
■Recommended Operating Conditions
Parameter
Input Voltage
Output Current
Operating Ambient Temperature
Operating Junction Temperature
Output Voltage Variable Range
Symbol
VIN
IO
Top (a)
Top (j)
VOADJ
Unit
V
A
°C
°C
V
Remarks
Only for SI-3011ZD. Refer to the block diagram.
Ratings
*2 to 6*1
0 to 3
–20 to +85
–20 to +100
1.2 to 5
*1: VIN (max) and IO (max) are restricted by the relation PD = (VIN - VO) × IO.
*2: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower (SI-3011ZD).
*3: When mounted on glass-epoxy board of 40 × 40mm (copper laminate area 100%).
*1: Set the input voltage to 2.4V or higher when setting the output voltage to 2.0V or lower.
*2: IS1 is specified at the –5% drop point of output voltage VO under the condition of Output Voltage parameter.
*3: Output is OFF when the output control terminal (VC terminal) is open. Each input level is equivalent to LS-TTL level. Therefore, the device can be driven directly by LS-TTLs.
*4: These products cannot be used for the following applications because the built-in foldback-type overcurrent protection may cause errors during start-up stage.
(1) Constant current load (2) Positive and negative power supply (3) Series-connected power supply (4) VO adjustment by raising ground voltage
Surface-Mount, Low Dropout Voltage
SI-3000ZD Series
Unit
V
mV
mV
V
mA
µ
A
mV/°C
dB
A
V
µ
A
µ
A
Parameter
Output Voltage
(Reference Voltage V
ADJ
for SI-3011ZD)
Line Regulation
Load Regulation
Dropout Voltage
Quiescent Circuit Current
Circuit Current at Output OFF
Temperature Coefficient
of Output Voltage
Ripple Rejection
Overcurrent Protection Starting Current
*2
*4
Control Voltage (Output ON)
*3
Control Voltage (Output OFF)
*3
V
C
Control Current(Output ON)
Terminal
Control Current(Output OFF)
Symbol
VO (VADJ)
Conditions
∆VOLINE
Conditions
∆VOLOAD
Conditions
VDIF
Conditions
Iq
Conditions
Iq (OFF)
Conditions
∆VO/∆Ta
Conditions
RREJ
Conditions
IS1
Conditions
VC, IH
VC, IL
IC, IH
Conditions
IC, IL
Conditions
Ratings
SI-3011ZD (Variable type) SI-3033ZD
min. typ. max. min. typ. max.
1.078 1.100 1.122 3.234 3.300 3.366
VIN=VO+1V, IO=10mA VIN=5V, IO=10mA
10 10
V
IN
=3.3 to 5V, I
O
=10mA (V
O
=2.5V)
VIN=4.5 to 5.5V, IO=10mA
40 40
VIN=3.3V, IO=0 to 3A (VO=2.5V) VIN=5V, IO=0 to 3A
0.6 0.6
IO=3A (VO=2.5V) IO=3A
11.5 1 1.5
VIN=VO+1V, IO=0A, VC=2V VIN=5V, IO=0A, VC=2V
11
VIN=VO+1V, VC=0V VIN=5V, VC=0V
±0.3 ±0.3
Tj=0 to 100°CTj=0 to 100°C
60 60
VIN=VO+1V, f=100 to 120HZ, IO=0.1A VIN=5V, f=100 to 120HZ, IO=0.1A
3.2 3.2
VIN=VO+1V VIN=5V
22
0.8 0.8
100 100
VC=2.7V VC=2.7V
–5 0 –5 0
VC=0V VC=0V
■Electrical Characteristics (Ta=25°C, VC=2V, unless otherwise specified)
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79
ICs
SI-3000ZD Series
■External Dimensions (TO263-5) (Unit : mm)
Pin Assignment
qVC
wVIN
eGND (Common to the rear side of product)
rVO
tSense
(ADJ for SI-3011ZD)
Plastic Mold Package Type
Flammability: UL94V-0
Product Mass: Approx. 1.48g
(0.40)
2.54
±0.3
(4.6)
9.2±
±0.2
1.2
±0.2
4.9
±0.2
(0.75) 2.0
±0.1
15.3
±0.3
9.9
±0.2
(15°)
(0.5)
2-R0.3
0.1 10.0
±0.02
3-R0.3
(R0.3)
(R0.3)
0.88
±0.10
1.5 Dp:
±0.2
φ
(1.7
±0.25
)
12345
(1.7
±0.25
)
0.8
±0.1
4.5
±0.2
1.3
0.10
±0.15
2.4
±0.2
+0.10
–0.05
(3°)(3°)
(3°)
(3°)(3°)
0~6°
Case temperature
measurement point
15.30
±0.3
(6.8)
9.2
±0.2
4.9
±0.2
(1.75)
(2×R0.45)
(1.7
±0.25
)(1.7
±0.25
)0.8
±0.1
10.0
±0.2
(4.4)
(8.0)
■Block Diagram
CIN:Input capacitor (Approx. 10
µ
F)
CO:Output capacitor (47
µ
F or larger)
The output voltage may oscillate if a low ESR type capacitor
(such as a ceramic capacitor) is used for the output capacitor in
the SI-3000ZD Series.
R1, R2: Output voltage setting resistors
The output voltage can be set by connecting R1 and R2 as shown
at left.
The recommended value for R2 is 10kΩ or 11kΩ.
R1= (V
O
–V
ADJ
) / (V
ADJ
/R2)
*: Insert R3 in case of setting VO to VO ≤ 1.8V. The recommended
value for R3 is 10kΩ.
SI-3011ZD
SI-3033ZD
REF TSD
Drive
V
IN
C
IN
V
C
ON/
OFF
V
O
C
O
R1
R2
ADJ
GND
4
-
+
-
+
+
-
+
+
*
R3
2
5
3
1
OCP AMP1
REF TSD
Drive
V
IN
C
IN
ON/
OFF
V
O
SENSE
C
O
GND
4
-
+
-
+
+
-
+
+
2
5
3
1
OCP AMP1
V
C
■Reference Data
Copper Laminate Area (on Glass-Epoxy Board) vs.
Thermal Resistance (from Junction to Ambient Temperature) (Typical Value)
55
50
45
40
35
300 200 400 600 800 1000
Copper Laminate Area (mm
2
)
1200 1400 1600 1800
When Using Glass-Epoxy Board of 40 × 40 mm
Junction to Ambient Temperature
Thermal Resistance j-a (°C/W)
θ
•A higher heat radiation effect can be achieved by enlarging the copper laminate
area connected to the inner frame to which a monolithic IC is mounted.
•Obtaining the junction temperature
Measure GND terminal temperature TC with a thermocouple, etc. Then substitute
this value in the following formula to obtain the junction temperature.
T
j
=P
D
×θ
j–C+
T
C
P
D
= (V
IN–
V
O
)•I
OUT
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