PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-8670405PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-8670405XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8670406PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-8670406XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8670407PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-8670407XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
5962-8670408PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
5962-8670408XA ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1842AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1842AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1842AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1843AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1843AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1843AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1844AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1844AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1844AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1845AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1845AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1845AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC2842AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842AJ OBSOLETE CDIP JG 8 TBD Call TI Call TI
UC2842AN ACTIVE PDIP P 8 50 Green (RoHS & CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UC2842ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AJ OBSOLETE CDIP JG 8 TBD Call TI Call TI
UC2843AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843AQ ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2843AQG3 ACTIVE PLCC FN 20 46 Green (RoHS &
no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2844AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2844ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2844AQD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AQD8 ACTIVE SOIC D 8 75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
UC2844AQD8R ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AQDR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2845ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2845AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2845ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3842AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3842AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 3
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UC3842ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3842J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC3843AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3843ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3843ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3844AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3844ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3845AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 4
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
UC3845AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADTR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AN ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3845ANG4 ACTIVE PDIP P 8 50 Green (RoHS &
no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A,
UC3845A :
•Catalog: UC3842,UC3845AM
•Automotive: UC2843A-Q1
•Enhanced Product: UC1842A-EP,UC1843A-EP,UC1844A-EP,UC1845A-EP
•Space: UC1842A-SP,UC1843A-SP,UC1844A-SP,UC1845A-SP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 5
•Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
PACKAGE OPTION ADDENDUM
www.ti.com 29-Oct-2009
Addendum-Page 6
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2842AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2842ADWTR SOIC DW 16 2000 330.0 16.4 10.85 10.8 2.7 12.0 16.0 Q1
UC2843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3842AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Sep-2009
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2842AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2842ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2842ADWTR SOIC DW 16 2000 346.0 346.0 33.0
UC2843AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2843ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2844AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2844ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2845AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2845ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3842AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3842ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3843AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3843ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3844AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3844ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3845AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3845ADTR SOIC D 14 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Sep-2009
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA
MPLC004A – OCTOBER 1994
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
4040005/B 03/95
20 PIN SHOWN
0.026 (0,66)
0.032 (0,81)
D2/E2
0.020 (0,51) MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D2/E2
0.013 (0,33)
0.021 (0,53)
Seating Plane
MAX
D2/E2
0.219 (5,56)
0.169 (4,29)
0.319 (8,10)
0.469 (11,91)
0.569 (14,45)
0.369 (9,37)
MAX
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.008 (0,20) NOM
1.158 (29,41)
0.958 (24,33)
0.756 (19,20)
0.191 (4,85)
0.141 (3,58)
MIN
0.441 (11,20)
0.541 (13,74)
0.291 (7,39)
0.341 (8,66)
18
19
14
13
D
D1
13
9
E1E
4
8
MINMAXMIN
PINS
**
20
28
44
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
52
68
84 1.185 (30,10)
0.985 (25,02)
0.785 (19,94)
D/E
0.395 (10,03)
0.495 (12,57)
1.195 (30,35)
0.995 (25,27)
0.695 (17,65)
0.795 (20,19)
NO. OF D1/E1
0.350 (8,89)
0.450 (11,43)
1.150 (29,21)
0.950 (24,13)
0.650 (16,51)
0.750 (19,05)
0.004 (0,10)
M
0.007 (0,18)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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