Preliminary XTC7009G * Temperature Compensated Crystal Oscillator * Ultra-miniature 2.5 x 2.0 x 0.8 mm Package * Excellent Frequency Stability * Low Phase Noise * Complies with Directive 2002/95/EC (RoHS) 2 > 16.36800 MHz TCXO 4-Terminal SMD Case Electrical Characteristics Characteristic Nominal Frequency Sym Notes Minimum FO Typical Maximum 16.36800 Frequency Tolerance after Reflow Units MHz 2 ppm maximum @ 25 3 C Storage Temperature Range in Tape and Reel -40 +85 C Operating Temperature Range -40 +85 C Power Supply Voltage Range VCC Output Voltage with 10 pF || 10 K Load 2.70 2.85 3.00 Output Waveform V VP-P 0.8 Clipped Sinewave Duty Cycle 60 % 1.5 mA Temperature, -30 to 85 C 0.5 ppm Temperature, -40 to 30 C 2.0 ppm Load Variation, 10 pF || 10 K 10% 0.2 ppm Supply Voltage, 2.85 V 5% 0.2 ppm Power Supply Current 40 ICC Frequency Stability versus: Frequency Step, df/f 2.5 ppb Short Term Drift, df/f/s 2.5 ppb/s Start Up Time, 90% of Final RF Level in VP-P 2.0 ms Harmonics -5.0 dBc Frequency Slope, measured at least every 2 C, -30 to +85 C 0.1 ppm/C Static Temperature Hysteresis 0.6 ppm SSB Phase Noise @ 0.1 Hz Carrier Offset -23 dBc/Hz SSB Phase Noise @ 1 Hz Carrier Offset -53 dBc/Hz SSB Phase Noise @ 10 Hz Carrier Offset -78 dBc/Hz SSB Phase Noise @ 100 Hz Carrier Offset -93 dBc/Hz SSB Phase Noise @ 1 kHz Carrier Offset -103 dBc/Hz SSB Phase Noise @ 10 kHz Carrier Offset -108 dBc/Hz G Sensitivity, 3 axes, 30 to 1500 Hz, +25 C, VDD = 3V Aging @ 25 C Stanard Shipping Quantity on 180 mm (7") Reel Lid Symbolization 1000 2 ppb/G 1.0 ppm/yr units 3S Notes: 1. The design, manufacturing process, and specifications of this device are subject to change without notice. 2. CAUTION: Electrostatic sensitive device. Observe handling precautions. www.RFM.com E-mail: info@rfm.com (c)2010-2011 by RF Monolithics, Inc. Page 1 of 3 XTC7009G - 4/5/11 4 Terminal Surface Mount Seam Welded Case 2.5 x 2.0 mm Nominal Footprint D C A 4 E 3 3 F B 4 G 2 1 1 I Min 0.091 0.071 - Inches Nom 0.098 0.079 0.094 0.057 0.074 0.026 0.019 0.024 0.117 0.049 0.096 0.018 2 Top Bottom Side H Case and PCB Land Dimensions Dimension 4 M 3 A B C D E F G H I J K L M L 1 2 K J PCB Land Pattern (Top View) Min 2.30 1.80 - mm Nom 2.50 2.00 2.39 1.45 1.89 0.65 0.47 0.62 2.97 1.25 2.45 0.45 Max 2.70 2.20 0.80 - Max 0.106 0.087 0.031 - Case Materials Materials V D D Solder Pad Plating 0.3 to 1.0 m Gold over 1.27 to 8.89 m Nickel Lid Plating 2.0 to 3.0 m Nickel Body Al2O3 Ceramic Pb Free 1 2 T e m p C o m p C r O s c e ra tu re e n s a te d y s ta l illa to r 4 1 0 n F 3 O u tp u t TCXO Application Circuit www.RFM.com E-mail: info@rfm.com (c)2010-2011 by RF Monolithics, Inc. Page 2 of 3 XTC7009G - 4/5/11 Terminal Connections Connection Ground Terminals 1 Ground 2 TCXO Output 3 VDD 4 Reel Dimensions Tape Dimensions www.RFM.com E-mail: info@rfm.com (c)2010-2011 by RF Monolithics, Inc. Page 3 of 3 XTC7009G - 4/5/11