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©2010-2011 by RF Monolithics, Inc. XTC7009G - 4/5/11
Electrical Characteristics
Characteristic Sym Notes Minimum Typical Maximum Units
Nominal Frequency FO16.36800 MHz
Frequency Tolerance after Reflow ±2 ppm maximum @ 25 ±3 °C
Storage Temperature Range in Tape and Reel -40 +85 °C
Operating Temperature Range -40 +85 °C
Power Supply Voltage Range VCC 2.70 2.85 3.00 V
Output Voltage with 10 pF || 10 KΩ Load 0.8 VP-P
Output Waveform Clipped Sinewave
Duty Cycle 40 60 %
Power Supply Current ICC 1.5 mA
Frequency Stability versus:
Temperature, -30 to 85 °C ±0.5 ppm
Temperature, -40 to 30 °C ±2.0 ppm
Load Variation, 10 pF || 10 KΩ ±10% ±0.2 ppm
Supply Voltage, 2.85 V ±5% ±0.2 ppm
Frequency Step, df/f ±2.5 ppb
Short Term Drift, df/f/s ±2.5 ppb/s
Start Up Time, 90% of Final RF Level in VP-P 2.0 ms
Harmonics -5.0 dBc
Frequency Slope, measured at least every 2 °C, -30 to +85 °C ±0.1 ppm/°C
S tatic Temperature Hysteresis ±0.6 ppm
SSB Phase Noise @ 0.1 Hz Carrier Offset -23 dBc/Hz
SSB Phase Noise @ 1 Hz Carrier Offset -53 dBc/Hz
SSB Phase Noise @ 10 Hz Carrier Offset -78 dBc/Hz
SSB Phase Noise @ 100 Hz Carrier Offset -93 dBc/Hz
SSB Pha se N o i s e @ 1 k H z C a rr i e r Offset -103 dBc/Hz
SSB Pha se N o i s e @ 1 0 k H z C a rr i e r Offset -108 dBc/Hz
G Sensitivity, 3 axes, 30 to 1500 Hz, +25 °C, VDD = 3V 2 ppb/G
Aging @ 25 °C ±1.0 ppm/yr
Stanard Shipping Quantity on 180 mm (7”) Reel 1000 units
Lid Symbolization 3S
• Temperature Compensated Crystal Oscillator
• Ultra-miniature 2.5 x 2.0 x 0.8 mm Package
• Excellent Frequency Stability
• Low Phase Noise
• Complies wit h Di rec ti ve 20 02/ 95/EC (RoHS )
16.36800 MHz
TCXO
XTC7009G
Notes:
1. The desig n, manufact uring process, and specifications of this device are subj ect to chang e without notice.
2. CAUTION: Electrostatic sensitive device. Observe handling precautions.
Preliminary
2 >
4-Terminal SMD Case
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©2010-2011 by RF Monolithics, Inc. XTC7009G - 4/5/11
V
D D
1 0 n F
O u t p u t
T e m p e r a t u r e
C o m p e n s a t e d
C r y s t a l
O s c i l l a t o r
1
2 3
4
A
B
C
D
E
FG
H
I
1 2
34
1
34
2
J
K
L
M
1
34
2
4 Terminal Surface Mount Seam Welded Case
2.5 x 2.0 mm Nominal Footprint
Case and PCB Land Dimensions
Case Materials
Dimension mm Inches
Min Nom Max Min Nom Max
A2.30 2.50 2.70 0.091 0.098 0.106
B1.80 2.00 2.20 0.071 0.079 0.087
C- - 0.80 - - 0.031
D-2.39- -0.094-
E-1.45- -0.057-
F-1.89- -0.074-
G-0.65- -0.026-
H-0.47- -0.019-
I-0.62- -0.024-
J-2.97- -0.117-
K-1.25- -0.049-
L-2.45- -0.096-
M-0.45- -0.018-
Materials
Solder Pad
Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel
Lid Plating 2.0 to 3.0 µm Nickel
Body Al2O3 Ceramic
Pb Free
TCXO Application Circuit
PCB Land Patter n
(Top View)
Top
Side Bottom
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©2010-2011 by RF Monolithics, Inc. XTC7009G - 4/5/11
Connection Terminals
Ground 1
Ground 2
TCXO Output 3
VDD 4
Reel Dimensions
Tape Dim ensions
Terminal Connections
