BAS70-07S / BAS70-08S (R) RF DETECTION DIODE FEATURES AND BENEFITS LOW DIODE CAPACITANCE LOW SERIES INDUCTANCE AND RESISTANCE SURFACE MOUNT PACKAGE DESCRIPTION Dual and Triple Schottky diode in SOT323-6L package. This diode is intented to be used in RF application for signal detection and temperature compensation. SOT323-6L BAS70-08S SCHEMATIC DIAGRAM BAS70-07S SCHEMATIC DIAGRAM 1 6 1 6 2 5 2 5 3 4 3 4 ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VR Continuous reverse voltage 70 V IF Continuous forward current 70 mA IFRM Repetitive peak forward current 70 mA IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 1 A Power Dissipation Ta = 55C 250 mW - 65 to +150 C P Tstg Storage temperature range Tj Maximum junction temperature 150 C TL Maximum temperature for soldering 260 C December 2001 - Ed: 2A 1/4 BAS70-07S / BAS70-08S THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to ambient on printed circuit board FR4 with recommended pad layout Value Unit 500 C/W STATIC ELECTRICAL CHARACTERISTICS (Tj = 25C otherwise specified) Symbol VF IR VBR Parameter Max. Unit IF = 1 mA 0.41 V IF = 10 mA 0.75 V IF = 15 mA 1 V Reverse leakage current VR = 70 V 10 A Breakdown voltage IR = 10 A Forward voltage drop Tests Conditions Min. Typ. 70 V ELECTRICAL CHARACTERISTICS Symbol 2/4 Parameter Tests Conditions C Junction capacitance VR = 0 V F = 1 MHz RF Differential forward resistance IF = 10 mA F = 100 MHz Ls Series inductance Min. Typ. Max. Unit 2 pF 30 Ohm 1.5 nH BAS70-07S / BAS70-08S Fig. 1: Forward voltage drop versus forward current (typical values). Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). IR(A) IFM(mA) 1.E+02 1.E+02 Tj = 150C 1.E+01 1.E+01 Tj = 85C 1.E+00 Tj=150C 1.E-01 Tj=125C 1.E+00 Tj=85C Tj = 25C 1.E-02 Tj=25C VFM(V) Tj=-40C VR(V) 1.E-01 1.E-03 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Fig. 3: Differential forward resistance versus forward current (typical values). 0 10 20 30 40 50 60 70 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). Rf() C(pF) 1000 1.5 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 F = 10kHz Tj = 25C 100 IF(mA) 10 0.1 1.0 VR(V) 0 10.0 Fig. 5: Variation of thermal impedance junction to ambient versus pulse duration (printed circuit board, epoxy FR4). F = 1MHz Vosc = 30mVRMS Tj = 25C 10 20 30 40 50 60 70 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board, epoxy FR4). Rth(j-a) Zth(j-a)(C/W) 1000.0 600 550 500 100.0 450 400 350 tp(s) 10.0 1.E-02 S(mm) 300 1.E-01 1.E+00 1.E+01 1.E+02 0 5 10 15 20 25 30 35 40 45 50 3/4 BAS70-07S / BAS70-08S PACKAGE MECHANICAL DATA SOT323-6L DIMENSIONS A2 A REF. A1 D e e E HE c b Inches Max. Min. Max. A 0.8 1.1 0.031 0.043 A1 0 0.1 0 0.004 A2 0.8 1 0.031 0.039 b 0.15 0.3 0.006 0.012 c 0.1 0.18 0.004 0.007 D 1.8 2.2 0.071 0.086 E 1.15 1.35 0.045 0.053 e Q1 Millimeters Min. 0.65 Typ. 0.025 Typ. HE 1.8 2.4 0.071 0.094 Q1 0.1 0.4 0.004 0.016 FOOTPRINT DIMENSIONS (millimeters) 0.3mm 1mm 2.9mm 1mm 0.35mm MARKING Type Marking BAS70-07S D32 BAS70-08S D33 Package Weight Base qty Delivery mode SOT323-6L 0.006g 3000 Tape & reel Epoxy meets UL94, V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2001 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 4/4