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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
Technical Data Sheet
Reverse Package Top View LEDs
67-21SYGC/S530-XX/TR10
Features
P-LCC-2 package.
White package.
Optical indicator.
Colorless clear window.
Wide viewing angle.
Suitable for vapor-phase reflow, Infrared reflow
and wave solder processes.
Computable with automatic placement equipment.
Available on tape and reel (8mm Tape).
Pb-free.
The product itself will remain within RoHS compliant version.
Descriptions
The 67-21 series is available in soft orange,
green,blue and yellow. Due to the package design,
the LED has wide viewing angle and optimized
light coupling by inter reflector. This feature
makes the SMT TOP LED ideal for light pipe
application. The low current requirement makes
this device ideal for portable equipment or any
other application where power is at a premium.
Applications
Automotive: backlighting in dashboard and switch.
Telecommunication: indicator and backlighting in
telephone and fax.
Flat backlight for LCD, switch and symbol.
Light pipe application.
General use.
Device Selection Guide
Chip
Material Emitted Color Lens Color
AlGaInP Brilliant Yellow Green Water Clear
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Package Dimensions
-
+Polarity
For reflow soldering (propose)
L
C
Tolerances dimension ±0.1 unless otherwise noted
Unit : mm
Note :
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Absolute Maximum Ratings (Ta=25)
Parameter Symbol Rating Unit
Reverse Voltage VR 5 V
Forward Current IF 25 mA
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Electrostatic Discharge ESD 2000 V
Power Dissipation Pd 60 mW
Peak Forward Current
(Duty 1/10 @1KHz) IFP 60 mA
Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Electro-Optical Characteristics (Ta=25)
Parameter Symbol
*Chip
Rank Min. Typ. Max. Unit Condition
E2 16 22 -----
E3 25 37 -----
E4 32 51 -----
Luminous Intensity IV
E5 40 63 -----
mcd IF=20mA
Viewing Angle 2θ1/2 ----- ----- 120 ----- deg IF=20mA
Peak Wavelength λp ----- ----- 575 ----- nm IF=20mA
Dominant
Wavelength λd ----- ----- 573 ----- nm IF=20mA
Spectrum Radiation
Bandwidth △λ ----- ----- 20 ----- nm IF=20mA
Forward Voltage VF ----- ----- 2.0 2.4 V IF=20mA
Reverse Current IR ----- ----- ----- 10 μA VR=5V
*67-21SYGC/S530-XX/TR10
Chip Rank
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Typical Electro-Optical Characteristics Curves
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Label explanation
CAT: Luminous Intensity Rank
HUE: Dom. Wavelength Rank
REF: Forward Voltage Rank
Reel Dimensions
Note: Tolerances Unless Dimension ±0.1mm , Unit = mm
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel
Note: Tolerances Unless Dimension ±0.1mm ,Unit = mm
Moisture Resistant Packaging
Label Desiccant Label
Aluminum moisture-proof bag
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below.
Confidence level90%
LTPD10%
No. Items Test Condition
Test
Hours/Cycles Sample
Size Ac/Re
1 Reflow Soldering
Temp. : 260±5
Min. 5sec. 6 Min. 22 PCS. 0/1
2 Temperature Cycle
H : +100 15min
5 min
L : -40 15min
300 Cycles 22 PCS. 0/1
3 Thermal Shock
H : +100 5min
10 sec
L : -10 5min
300 Cycles 22 PCS. 0/1
4 High Temperature
Storage Temp. : 100 1000 Hrs. 22 PCS. 0/1
5 Low Temperature
Storage Temp. : -40 1000 Hrs. 22 PCS. 0/1
6 DC Operating Life IF = 20 mA 1000 Hrs. 22 PCS. 0/1
7 High Temperature /
High Humidity 85/ 85%RH 1000 Hrs. 22 PCS. 0/1
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
Precautions For Use
1. Over-current-proof
Customer must apply resistors for protection, otherwise slight voltage shift will cause big
current change ( Burn out will happen ).
2. Storage
2.1 Do not open moisture proof bag before the products are ready to use.
2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less.
2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less.
If unused LEDs remain, it should be stored in moisture proof packages.
2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5 for 24 hours.
3. Soldering Condition
3.1 Pb-free solder temperature profile
3.2 Reflow soldering should not be done more than two times.
3.3 When soldering, do not put stress on the LEDs during heating.
3.4 After soldering, do not warp the circuit board.
4.Soldering Iron
Each terminal is to go to the tip of soldering iron temperature less than 350 for 3
seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more
intervals, and do soldering of each terminal. Be careful because the damage of the product is often
started at the time of the hand solder.
EVERLIGHT ELECTRONICS CO.,LTD.
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Device No. : prepared date: 29-Jul-2005 Prepared by: Forrest Chen
67-21SYGC/S530-XX/TR10
5.Repairing
Repair should not be done after the LEDs have been soldered. When repairing is
unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed
beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
E
VERLIGHT ELECTRONICS CO., LTD. Tel: 886-2-2267-2000, 2267-9936
Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: 886-2267-6244, 2267-6189, 2267-6306
Tucheng, Taipei 236, Taiwan, R.O.C http://www.everlight.com