2001-2014 Microchip Technology Inc. DS20001434K-page 1
TC54
Features:
±2.0% Detec ti on Thres ho lds
Small Packages: 3-Pin SOT-23A, SOT-89, and
TO-92
Low Current Drain: 1 µA, typical
Wide Detection Range: 1.1V to 6.0V
Wide Operating Voltage Range: 0.7V to 10V
Applications:
Battery Voltage Monitoring
Microprocessor Reset
System Brown-Out Protection
Switching Circuit in Battery Backup
Level Discriminator
Functional Block Diagram
General Description:
The TC54 series are CMOS voltage detectors espe-
cially well-suited for battery-powered applications
because of their extremely low 1 µA operating current
and small surface-mount packaging. Each part is laser-
trimmed to the de sired th reshol d volt age , which c an be
specified from 1.4V to 6.0V with a 2% tolerance.
The TC54 is availab le with either an open-drain or com-
plementary output stage. During operation, the output
(VOUT) remains in t he l ogi c-h igh state as long as VIN is
greater than the specified threshold voltage (VDET ).
When VIN falls below VDET , the output is driven to a
logic-low. VOUT remains low until VIN rises above
VDET by an amount VHYST, when it resets t o a logi c-
high state.
Package Types
Device Features
VOUT
VSS
+
VIN
VREF
TC54VC onl y
TC54VN has open-drain output.
TC54VC has complementary (push-pull) output.
1 32
VIN VSS
VOUT
TC54
3-Pin SOT-89
Note: 3-Pin SOT-23A is equivalent to the
EIAJ SC-59.
3-Pin TO-92
123
VSS
VIN
VOUT
VIN
VOUT VSS
3
12
TC54
3-Pin SOT-23A
VIN
Device Output Reset Delay Std. Trip Points(1) (typical)
Type State
TC54VN Open-Drain Active Low No 1.4V, 2.1V, 2.7V, 2.9V
TC54VC Push-Pull Active Low No 3.0V, 4.2V, 4.3V
Note 1: Custom Trip Points available. Minimum order requirement. Information available upon request.
Voltage Detector
TC54
DS20001434K-page 2 2001-2014 Mic rochip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage...................... .......................... ...................+12V
Output Cu rr e n t ............. ............. ............ ....... ............ .....50 mA
Output Voltage: CMOS................(VSS – 0.3V) to (VIN + 0.3V)
Open-Drain.....................(VSS – 0.3V) to 12V
Power Dissipation (TA 70°C):
3-Pin SOT-23A....... ...... ....... ...... ............. ...... ...... ....240 mW
3-Pin SOT-89.......... ............. ...... ...... ............. ...... ....500 mW
3-Pin T O-92................ ............. ...... ............. ...... ......300 mW
Operating Tem perat ure Range . ....................... - 40°C to +85°C
St orage Temperature Range.........................-65°C to +150°C
† Notice: Stress es above those listed under "Absolute Maxi-
mum Ratings" may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated
in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless other wis e noted, TA = +25°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions
Operati ng Voltage VIN 0.7 10.0 V (VDET ) 1.6V
0.7 6.0 V (VDET ) < 1.6V
Quiescent Current ISS —0.82.7µAV
IN = 2.0V
—0.93.0 V
IN = 3.0V
—1.03.2 V
IN = 4.0V
—1.13.6 V
IN = 5.0V
Threshold Voltage
(Note 1)VDET 1.37 1.4 1.43 V TC54VX14
2.06 2.1 2.14 TC54VX21
2.65 2.7 2.75 TC54VX27
2.84 2.9 2.96 TC54VX29
2.94 3.0 3.06 TC54VX30
4.12 4.2 4.28 TC54VX42
4.21 4.3 4.39 TC54VX43
N.M-2% N.M N.M+2% TC54VXNM (Note 2)
Hysteresis Voltage VHYST 28 70 112 mV VDET = 1.4V (typical)
42 105 168 VDET = 2.1V (typical)
54 135 216 VDET = 2.7V (typical)
58 145 232 VDET = 2.9V (typical)
60 150 240 VDET = 3.0V (typical)
84 210 336 VDET = 4.2V (typical)
86 215 344 VDET = 4.3V (typical)
Q-60% Q Q+60% VDET = (20*Q)V (typical) (Note 2)
Output Current IOUT 3.0 7.7 mA VOL = 0.5V, VIN = 2.0V
5.0 10.1 VOL = 0.5V, VIN = 3.0V
6.0 11.5 VOL = 0.5V, VIN = 4.0V
7.0 13.0 VOL = 0.5V, VIN = 5.0V
-10.0 -2.0 TC54VC Only:
VOH = VIN – 2.1V, VIN = 8.0V
Tempco of (VDET )T
C (VDET ) ±100 ppm/°C -40°C TA 85°C
Delay Time tDLY ——0.2msV
DET VOUT inversion
Note 1: For other voltage options, please contact your regional Microchip sales office.
2: Represents all other custom Threshold Voltage options.
2001-2014 Microchip Technology Inc. DS20001434K-page 3
TC54
FIGURE 1-1: Timing Diagram.
TE MP ERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise i ndi ca ted , al l li mi t s are speci fie d fo r: V DD =+1.8V to +5 .5V, VSS= GND.
Parameters Sym. Min. Typ. Max. Units Conditions
Temperature Ranges
Operati ng Temper atu re Ra nge TA-40 +85 °C
Storage Temperature Range TA-65 +150 °C
Thermal Package Resistances
Thermal Resistance, 3L-SOT-23A JA —308—°C/W
Thermal Resistance, 3L-SOT-89 JA 131.7 °C/W
Thermal Resistance, 3L-TO-92 JA —146—°C/W
VDD
OUTPUT VOH
tDLY
VDET +VHYST
OUTPUT
VDET
TC54
DS20001434K-page 4 2001-2014 Mic rochip Technology Inc.
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
2.1 Digital Output (VOUT)
VOUT goes low when VIN drops below VDET and
returns high when VIN rises above VDET + VHYST.
(See Figure 3-1).
2.2 Analog Input (VIN)
VIN can be used for power supply monitoring or a
voltage level that requires monitoring.
2.3 Ground Terminal (VSS)
VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.
TC54 Symbol Description
SOT-23A SOT-89 TO-92
11 1V
OUT Digital Output
32 2V
IN Analog Input
23 3V
SS Ground Terminal
—Tab V
IN Analog Input
2001-2014 Microchip Technology Inc. DS20001434K-page 5
TC54
3.0 DETAILE D DESCRIPTION
In normal steady-state operation when VIN >V
DET ,
the outp ut will be at a logic-hig h (see Figure 3-1). In the
case of the TC54VN, this is an open-drain condition. If
the input falls below VDET , the output will pull down
(Logic 0) to VSS. Generally, VOUT can pull down to
within 0.5V of VSS at rated output current and input
voltage. (See Section 1.0 “Electrical
Characteristics).
The output (VOUT) will stay valid until the input voltage
falls below the minimum operating voltage (VINMIN) of
0.7V. Below this minim um operat ing vol tage, the outp ut
is undefined. During power-up (or anytime VIN has
fallen below VINMIN), VOUT will remain undefined until
VIN rises above VINMIN. When this occurs, the output
will become valid. VOUT will be in its Active-low state,
while VINMIN <V
IN <V
DET+ (therefore, VDET+ = VDET
+ VHYST). If th e input rise s above V DET+, the outp ut will
assum e its I nactive st ate (h igh for TC54 VC, open -drain
for TC54VN).
FIGURE 3-1: Timing Diagram.
VIN
Detect Voltage VDET
Minimum Operating
Voltage
VHYST
VDET +
Output Voltage
Release Voltage
or Reset Voltage
Ground Level
Ground Level
VOUT
TC54
DS20001434K-page 6 2001-2014 Mic rochip Technology Inc.
4.0 APPLICATIONS INFORMATION
4.1 Modifying the Trip Point, VDET
Although th e TC54 has a pre -pro gram m ed VDET , it is
sometimes necessary to make adjustments during
prototyping. This can be accomplished by connecting
an external resistor divider to a TC54, which has a
VDET lower than that of VSOURCE (Figure 4-1).
To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 1 µA operating c urrent required by the TC54. A rea-
sonable value for this bleeder current is 100 µA (100
times the 1 µA required by the TC54). For example, if
VDET = 2V and the des ired trip point is 2.5 V , the v alue
of R1 + R2 is 25 k (2.5V/100 µA). The value of
R1+R
2 can be rounded to the nearest standard value
and plu gged into the equation of Figure 4-1 to ca lculate
values for R1 and R2. 1% tolerance resistors are
recommended.
FIGURE 4-1: Modify Trip-point of the
TC54 using External Resistor Divider.
4.2 Other Applications
Low o pera ting powe r an d sm al l physica l s iz e make th e
TC54 series ideal for many voltage detector applica-
tions, su ch as those sh own in Figure s 4-2, 4-3 and 4-4.
Figure 4-2 shows a low-voltage gate drive protection
circuit that prevents the overheating of the logic-level
MOSFET due to insufficient gate voltage. When the
input signal is below the threshold of the TC54VN, its
output grounds the gate of the MOSFET. Figure 4-3
and Figure 4-4 show the TC54 in conventional voltage
monitoring applications.
FIGURE 4-2: MOSFET Low Drive
Protection.
FIGURE 4-3: Battery Voltage Monitor.
FIGURE 4-4: Power Good Monitor.
Note: In this example, VSOURCE must be
greater than (V DET )
VSOURCE
R1
R1R2
+
--------------------
VDET-=
VIN VOUT
VSS
R1
VSOURCE
R2
Where:
VSOURCE = Voltage to be monitored
VDET = Threshold Voltage setting of TC54
TC54
VIN
VOUT
VSS
270
MTP3055EL
VCC
RL
4.3V
TC54VX
VIN
VOUT
VSS
BATLOW
+
TC54VX
VIN
VOUT
VSS
Power G ood
+
Pwr.
Sply. TC54VX
2001-2014 Microchip Technology Inc. DS20001434K-page 7
TC54
5.0 P ACKAGING INFORMATION
5.1 Package Marking Information
3-Lead SOT-23A
2NN
Example
C302
3-Lead SOT-89
XXXYYWW
@NNN
Example
E3
31
3-Lead TO-92
XXXXXX
XXXXXX
XXXXXX
YWWNNN
Example
54VN
3002
1256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanu meric tracea bil ity code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-fr ee. The Pb- fre e JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icroc hip p art numb er cann ot be mark ed on one line, it w ill
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
TC54
DS20001434K-page 8 2001-2014 Mic rochip Technology Inc.
)
Symbol Output Voltage
BCMOS1.
CCMOS2.
DCMOS3.
ECMOS4.
FCMOS5.
HCMOS6.
ICMOS7.
Symbol Output Voltage
L N-Channel 1.
M N-Channel 2.
N N-Channel 3.
P N-Channel 4.
R N-Channel 5.
S N-Channel 6.
T N-Channel 7.
Symbol Voltage Symbol Voltage
0.06.6
1.17.7
2.28.8
3.39.9
4.4
5.5
3-Pin SOT-23A 3-Pin SOT-89
11
2
2
43
4
3
1represents output configuration (CMOS or Nch)
and first integer of voltage
Ex: CMOS 3.x = D
2represents first decimal of output voltage (0-9)
Ex: CMOS 3.x = D4
4
3 represent assem bl y lot co de
and
Symbol Output
CCMOS
N N-Channel
Symbol Voltage
22.
33.
44.
55.
66.
Symbol Voltage Symbol Voltage
0.05.5
1.16.6
2.27.7
3.38.8
4.49.9
Symbol Delay Time
0No Delay
Symbol Accuracy
1 ±1.0% (custom)
2 ±2.0% (standard)
3-Pin TO-92
8
4
7
3
6
2
5
1
= 54X (fixed)
1 , 2 and 3
4represents output configuration (CMOS or N-Ch)
Ex: CMOS 3.x = C
5represents first integer of detect voltage
6represents first decimal of detect voltage
7represents the output delay time
represents the device accuracy8
2001-2014 Microchip Technology Inc. DS20001434K-page 9
TC54
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DS20001434K-page 10 2001-2014 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2001-2014 Microchip Technology Inc. DS20001434K-page 11
TC54
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DS20001434K-page 12 2001-2014 Microchip Technology Inc.
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2001-2014 Microchip Technology Inc. DS20001434K-page 13
TC54
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SILK SCREEN
Dimension Limits
Units
Y
Y1
X2
X1
MILLIMETERS
MIN
X
MAX
1.300
4.600
Y3
Y2
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing No. C04-2029B
Y4
NOM
X2 (2x)
X1
Y
C
X (3x)
Y2
Y4
Y3
1.50 (BSC)C
0.900
1.733
0.416
1.475
0.950
1.125
3-Lead Plastic Small Outline Transistor (MB) - [SOT-89]
Y1
TC54
DS20001434K-page 14 2001-2014 Microchip Technology Inc.
2001-2014 Microchip Technology Inc. DS20001434K-page 15
TC54
APPENDIX A: REVISION HISTORY
Revision K (July 2014)
The following is the list of modifications:
1. Updated the “DC Characteristics” table.
Revision J (June 2011)
The following is the list of modifications:
1. Updated temperature values in the
“Temperature Specifications” table.
2. Cor rec ted equ ati on in Figure 4-1.
3. Added new examples layout in Section 5.1,
Package Marking Information.
Revision H (December 2007)
The following is the list of modifications:
1. Updated Features section.
2. Removed 5-Pin SOT-23 related information.
3. Updated Output Current (IOUT) Electrical
Specification.
4. Removed 7.7V (typical) Voltage Trip Point
Option. Max Trip Point Voltage is now 6.0V.
5. Updated Pin Function Table.
6. Updated Packaging Specification Information.
7. Added Revision History section.
8. Updated Produ ct Identification System page.
Revision G (August 2004)
Undoc um ent ed cha nges.
Revision F (July 2004)
Undoc um ent ed cha nges.
Revision E (April 2003)
Undoc um ent ed cha nges.
Revision D (October 2002)
Undoc um ent ed cha nges.
Revision C (July 2002)
Undoc um ent ed cha nges.
Revision B (May 2002)
Undoc um ent ed cha nges.
Revision A (March 2001)
Original Release of this Document.
TC54
DS20001434K-page 16 2001-2014 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device: TC54V: Voltage Detector
Output
Configuration: N = N-Channel Open-Drain
C = CMOS Output
Dete cte d Voltage: 14 = 1.4V
21 = 2.1V
27 = 2.7V
29 = 2.9V
30 = 3.0V
42 = 4.2V
43 = 4.3V
Extra Feature Code: 0 = Fixed
Tolerance: 2=2%
Temperature: E = -40°C to +85°C
Package: CB = Plastic Small Outline Transistor, SOT-23A, 3-lead
MB = Plastic Small Outline Transistor, SOT-89, 3-lead
ZB = Plastic Transistor Outline, TO-92, 3-lead
Taping Direction: 713 = Standard Taping
PART NO. XXX
PkgOutput
Config.
Device
XX
Detected
Voltage
X
Extra
Feature
Code
X
Tolerance
X
Temp.
XX
Taping
Direction
Examples:
a) TC54VC1402ECB713: Tape and Reel,
1.4V Voltage
Detector, 2% Tol.,
SOT-23A-3
b) TC54VC1402EMB713: Tape and Reel,
1.4V Voltage
Detector, 2% Tol.,
SOT-89-3
c) TC54VC1402EZB: 1.4V Voltage
Detector, 2% Tol.,
TO-92
d) TC54VC2102ECB713: Tape and Reel,
2.1V Voltage
Detector, 2% Tol.,
SOT-23A-3
e) TC54VC2102EMB713 : Tape and Reel,
2.1V Voltage
Detector, 2% Tol.,
SOT-89-3
f) TC54VC2102EZB: 2.1V Voltage
Detector,
2% Tol., TO-92
g) TC54VC2702ECB713: Tape and Reel,
2.7V Voltage
Detector, 2% Tol.,
SOT-23A-3
h) TC54VC3002ECB713: Tape and Reel,
3.0V Voltage
Detector, 2% Tol.,
SOT-23A-3
i) TC54VN4202ECB713: Tape and Reel,
4.2V Voltage
Detector, 2% Tol.,
SOT-23A-3
2001-2014 Microchip Technology Inc. DS20001434K-page 17
Information contained in this publication regarding device
applications a nd the lik e is pro vid ed only for your c on ve nience
and may be supers eded by u pdates. It is y our res po ns i bil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer ,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoL yzer , PIC, PICSTART, PIC32 logo, RightTouch, S pyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsP ICDEM. net, ECA N, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPAS M, MPF, MPLA B Cert ified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2001-2014, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63276-422-5
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that it s family of products is one of the most secure families of its kind on the market today, when used in t he
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
products. Attempts to break Microchip’ s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperiph erals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS20001434K-page 18 2001-2014 Microchip Technology Inc.
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03/25/14