1White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
HI-RELIABILITY PRODUCT
EDI816256CA
256Kx16 MONOLITHIC SRAM
FEATURES
256Kx16 bit CMOS Static
Random Access Memory
Access Times of 17, 20, 25, 35ns
Data Retention Function (LPA version)
TTL Compatible Inputs and Outputs
Fully Static, No Clocks
44 lead JEDEC Approved Revolutionary Pinout
Ceramic SOJ (Package 322)
Ceramic Flatpack (Package 323)
Single +5V (±10%) Supply Operation
PIN CONFIGURATION
TOP VIEW
September 2000 Rev. 7
PIN DESCRIPTION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
A0
A1
A2
A3
A4
CS
I/O1
I/O2
I/O3
I/O4
V
CC
V
SS
I/O5
I/O6
I/O7
I/O8
WE
A5
A6
A7
A8
A9
A17
A16
A15
OE
UB
LB
I/O16
I/O15
I/O14
I/O13
V
SS
V
CC
I/O12
I/O11
I/O10
I/O9
NC
A14
A13
A12
A11
A10
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A0-17 Address Inputs
LB (I/O1-8) Lower-Byte Control (I/O1-8)
UB (I/O9-16) Upper-Byte Control (I/O9-16)
I/O1-16 Data Input/Output
CS Chip Select
OE Output Enable
WE Write Enable
VCC +5.0V Power
VSS Ground
NC No Connection
The EDI816256CA is a 4 megabit Monolithic CMOS Static RAM.
The EDI816256CA uses 16 common input and output lines and has
an output enable pin which operates faster than address access
time at read cycle. The device allows upper and lower byte access
by use of the data byte control pins (LB, UB).
The devices are available in a fully hermetic 44 lead ceramic SOJ
and a 44 lead Ceramic Flatpack. The Ceramic SOJ is pin for pin
compatible with the commercially available plastic SOJ. This
allows the user the luxury of designing a board that can be used
for both the commercial and military market.
A Low Power version with Data Retention (EDI816256LPA) is also
available for battery backed applications. Military product is
available compliant to Appendix A of MIL-PRF-38535.
2
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
ABSOLUTE MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
NOTE:
Stresses above those listed under "Absolute Maximum Ratings" may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect
device reliability.
Parameter Unit
Voltage on any pin relative to VSS -0.5 to 7.0 V
Operating Temperature TA (Ambient)
Commercial 0 to +70 °C
Industrial -40 to +85 °C
Military -55 to +125 °C
Storage Temperature, Plastic -65 to +125 °C
Power Dissipation 1.5 W
Output Current 20 mA
Junction Temperature, TJ175 °C
Parameter Sym Min Typ Max Units
Supply Voltage VCC 4.5 5.0 5.5 V
Supply Voltage VSS 000V
Input High Voltage VIH 2.2 Vcc +0.5 V
Input Low Voltage VIL -0.3 0.8 V
Parameter
Symbol
Condition Max Unit
Address Lines CI
V
IN
= Vcc or Vss, f = 1.0MHz
12 pF
Data Lines CD/Q
V
IN
= Vcc or Vss, f = 1.0MHz
14 pF
These parameters are sampled, not 100% tested.
CAPACITANCE
(TA = +25°C)
Parameter Symbol Conditions Units
Min Max
Input Leakage Current ILI VIN = 0V to VCC 10 µA
Output Leakage Current ILO VI/O = 0V to VCC 10 µA
Operating Power Supply Current ICC1 WE, CS = VIL, II/O = OmA, Min Cycle 300 mA
Standby (TTL) Power Supply Current ICC2 CS VIH, VIN VIL, VIN VIH 60 mA
Full Standby Power Supply Current ICC3 CS VCC -0.2V CA 25 mA
VIN Vcc -0.2V or VIN 0.2V LPA 16 mA
Output Low Voltage VOL IOL = 8.0mA 0.4 V
Output High Voltage VOH IOH = -4.0mA 2.4 V
NOTE: DC test conditions: VIL = 0.3V, VIH = Vcc -0.3V
DC CHARACTERISTICS
(VCC = 5V, VSS = 0V, TA = -55°C to +125°C)
Input Pulse Levels VSS to 3.0V
Input Rise and Fall Times 5ns
Input and Output Timing Levels 1.5V
Output Load Figure 1
NOTE: For tEHQZ, tGHQZ and tWLQZ, CL = 5pF Figure 2)
30pF
480
Vcc
Q
Figure 1 Figure 2
2555pF
480
Vcc
Q
255
AC TEST CONDITIONS
TRUTH TABLE
CS WE OE LB UB Mode Data I/O Supply
I/O1-8 I/O9-16 Current
H X X X X Not Select High Z High Z ICC2, ICC3
LH HXX Output
LX XHHDisable
L H Data Out High Z
L H L H L Read High Z Data Out ICC1
L L Data Out Data Out
L H Data In High Z
L L X H L Write High Z Data In ICC1
L L Data In Data In
3White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
AC CHARACTERISTICS – READ CYCLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Symbol 17ns 20ns 25ns 35ns
Parameter JEDEC Alt. Min Max Min Max Min Max Min Max Units
Read Cycle Time tAVAV tRC 17 20 25 35 ns
Address Access Time tAVQV tAA 17 20 25 35 ns
Chip Enable Access Time tELQV tACS 17 20 25 35 ns
Chip Enable to Output in Low Z (1) tELQX tCLZ 2555ns
Chip Disable to Output in High Z (1) tEHQZ tCHZ 07 07 08010ns
Output Hold from Address Change tAVQX tOH 0000ns
Output Enable to Output Valid tGLQV tOE 10 10 12 15 ns
Output Enable to Output in Low Z (1) tGLQX tOLZ 0000ns
Output Disable to Output in High Z(1) tGHQZ tOHZ 07 07 08010ns
LB, UB Access Time tUBLQV tBA 10 10 12 15 ns
tLBLQV
LB, UB Enable to Low Z Output tUBLQX tBLZ 00 0 0 0ns
tLBLQX
LB, UB Disable to High Z Output tUBHQZ tBHZ 07 07 08010ns
tLBHQZ
NOTE:
1. This parameter is guaranteed by design but not tested.
AC CHARACTERISTICS – WRITE CYCLE
(VCC = 5.0V, VSS = 0V, TA = -55°C to +125°C)
Symbol 17ns 20ns 25ns 35ns
Parameter JEDEC Alt. Min Max Min Max Min Max Min Max Units
Write Cycle Time tAVAV tWC 17 20 25 35 ns
Chip Enable to End of Write tELWH tCW 14 15 17 20 ns
tELEH tCW 14 15 17 20 ns
Address Setup Time tAVWL tAS 0000ns
tAVEL tAS 0000ns
tAVUBL tAS 0000ns
Address Valid to End of Write tAVWH tAW 14 15 17 20 ns
tAVEH tAW 14 15 17 20 ns
tAVUBH tAW 14 15 17 20 ns
Write Pulse Width tWLWH tWP 14 14 15 17 ns
tWLEH tWP 14 14 15 17 ns
Write Recovery Time tWHAX tWR 0000ns
tEHAX tWR 0000ns
Data Hold Time tWHDX tDH 0000ns
tEHDX tDH 0000ns
Write to Output in High Z (1) tWLQZ tWHZ 08 08 08010ns
Data to Write Time tDVWH tDW 10 10 12 15 ns
tDVEH tDW 10 10 12 15 ns
Output Active from End of Write (1) tWHQX tWLZ 0000ns
LB, UB Valid to End of Write tLBLLBH tBW 14 16 18 20 ns
tUBLUBH
NOTE:
1. This parameter is guaranteed by design but not tested.
4
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
WS32K32-XHX
WRITE CYCLE - CS CONTROLLED WRITE CYCLE - LB, UB CONTROLLED
TIMING WAVEFORM - READ CYCLE
WRITE CYCLE - WE CONTROLLED
ADDRESS
READ CYCLE 2 (WE HIGH)
t
AVQV
t
ELQV
t
GLQV
t
ELQX
t
GLQX
t
AVAV
t
EHQZ
t
GHQZ
OE
t
LBLQX
t
UBLQX
t
LBHQZ
t
UBHQZ
LB, UB
CS
t
LBLQV
t
UBLQV
DATA I/O
ADDRESS
DATA I/O
READ CYCLE 1 (WE HIGH; OE, CS LOW)
t
AVQX
t
AVQV
t
AVAV
DATA 2
ADDRESS 1 ADDRESS 2
DATA 1
ADDRESS
DATA IN
WRITE CYCLE 1, WE CONTROLLED
t
AVWH
t
ELWH
t
WHAX
t
WLWH
t
DVWH
t
WLQZ
t
WHQX
t
AVWL
t
WHDX
t
AVAV
DATA VALID
HIGH
WE
t
LBLLBH
t
UBLUBH
CS
DATA OUT
LB, UB
WRITE CYCLE 2, CS CONTROLLED
t
AVEH
t
ELEH
t
EHAX
t
WLEH
t
DVEH
t
EHDX
t
AVAV
DATA VALID
HIGH
t
LBLLBH
t
UBLUBH
t
AVEL
ADDRESS
DATA IN
WE
LB, UB
CS
DATA OUT
ADDRESS
DATA IN
DATA OUT
WRITE CYCLE 3, LB, UB CONTROLLED
t
AVWH
t
AVUBL
t
WHAV
t
AVUBH
t
WLWH
t
WLQX
t
AVAV
CS
WE
DATA UNDEFINED
DATA VALID
t
UBHAV
t
WHDX
t
DVWH
t
UBLUBH
LB, UB
HIGH ZHIGH Z
5White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
Characteristic Sym Conditions Min Typ Max Units
Low Power Version only
Data Retention Voltage VDD VDD = 2.0V 2 V
Data Retention Quiescent Current ICCDR CS VDD -0.2V 2.2 mA
Chip Disable to Data Retention Time (1) TCDR VIN VDD -0.2V 0 ns
Operation Recovery Time (1) TRor VIN 0.2V TAVAV ––ns
DATA RETENTION CHARACTERISTICS (EDI816256LPA ONLY)
(TA = -55°C to +125°C)
WS32K32-XHX
DATA RETENTION - CS CONTROLLED
DATA RETENTION
,
CS CONTROLLED
Data Retention Mode
t
R
Vcc
CS
t
CDR
CS = V
DD
-0.2V
V
DD
4.5V4.5V
NOTE:
1. This parameter is guaranteed by design but not tested.
* Read Cycle Time
6
White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
PACKAGE 322: 44 LEAD, CERAMIC SOJ
0.445
0.435
1.130
1.110
0.155
0.120
0.050 Typ
DIMENSIONS ARE IN INCHES
PACKAGE 323: 44 PIN, CERAMIC FLATPACK
Pin 1
0.019
0.015
0.038
0.032
0.395
0.385
0.115 Max.
0.050 Typ
0.515
0.505
1.00 Ref
0.045
0.015
0.007
0.003 0.370
0.250
1.130
1.110
DIMENSIONS ARE IN INCHES
7White Electronic Designs Corporation • Phoenix, AZ • (602) 437-1520
EDI816256CA
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS
SRAM
ORGANIZATION, 256Kx16
TECHNOLOGY:
CA = CMOS Standard Power
LPA = Low Power
ACCESS TIME (ns)
PACKAGE TYPE:
F44 = 44 pin Ceramic Flatpack (Package 323)
N44 = 44 lead Ceramic SOJ (Package 322)
DEVICE GRADE:
B = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
EDI 8 16 256 CA X X X